SEMIKRON P8/180

P8
$
/0 1 2&32+
1 2&86 9
/0 1 2&32+
Heatsink
&'
34 5 3
/6 5 /
5 /
72 5 /
34 5 3
/6 5 /
5 /
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+!3 /++-"
+!+ /++-"
+!+ /++-"
72 5 /
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,&+!+46
+!+88
+!+8
+!+66
+!3+4
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.
!76
8
+!+
For capsule devices
Dimensions in mm
P8
Features
! "
# 1 2 * 4! .&"
Dimensions in mm
1 2 1
17-03-2005 ADR
© by SEMIKRON
P8
Fig.1 Thermal resistance vs.dissipated power
Fig.5aThermal resistance and pressure drop vs.air flow
Fig.5bThermal resistance and pressure drop vs.air flow
Fig.9a Transient thermal impedance vs.time
Fig.9b Transient thermal impedance vs.time
Fig.9c Transient thermal impedance vs.time
2
17-03-2005 ADR
© by SEMIKRON
P8
Fig.11a Transient thermal impedance vs.time
Fig.11b Transient thermal impedance vs.time
Fig.11c Transient thermal impedance vs.time
Fig.11d Transient thermal impedance vs.time
3
17-03-2005 ADR
© by SEMIKRON
P8
Dimensions in mm
3 $ 0 /0 . 12&32+ :;:
4
17-03-2005 ADR
© by SEMIKRON