P9
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. !6('
(( 0 ,
65 0 ,
(( 0 ,
7 ,- .!,/'
65 0 ,
,- . !,/'
#
)!*
'1,/2 3('' *4
'1,/2 3('' *4
#
$! % &'' (!
)!*
'1'&2
'1'2(
'1'
+
51,
/&1
'1'&,
Heatsink
Dimensions in mm
For capsule devices
P9
Features
. 3 % /15 +!4
Dimensions in mm
. 1
17-03-2005 ADR
© by SEMIKRON
P9
Fig.5a Thermal resistance and pressure drop vs.air flow
Fig.5b Thermal resistance and pressure drop vs.air flow (per device)
Fig.1 Thermal resistance vs.dissipated power
Fig.9 Transient thermal impedance vs.time
Fig.11a Transient thermal impedance vs.time
Fig.11b Transient thermal impedance vs.time
2
17-03-2005 ADR
© by SEMIKRON
P9
Dimensions in mm
/8 - ,- + .!,/' 9 :;<:
3
17-03-2005 ADR
© by SEMIKRON