PR22MA11NTZ Series PR32MA11NTZ Series PR22MA11NTZ Series PR32MA11NTZ Series IT(rms)≤0.15A, Non-Zero Cross type DIP 6pin SSR ■ Description ■ Agency approvals/Compliance PR22MA11NTZ Series and PR32MA11NTZ Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 5.0kV isolation (V iso (rms) ) from input to output. 1. Package resin : UL flammability grade (94V-0) ■ Applications 1. Isolated interface between high voltage AC devices and lower voltage DC control circuitry. 2. Switching small capacity motors, fans, heaters, solenoids, and valves. 3. Phase or power control in applications such as lighting and temperature control equipment. ■ Features 1. Output current, IT(rms)≤0.15A 2. Non-zero crossing functionary 3. 6 pin DIP package, (SMT gullwing also available) 4. High repetitive peak off-state voltage (VDRM : 600V, PR32MA11NTZ Series) (VDRM : 400V, PR22MA11NTZ Series) 5. Superior noise immunity (dV/dt : MIN. 100V/µs) 6. Response time, ton : MAX. 100µs 7. Lead-free components are also available (see Model Line-up section in this datasheet) 8. Double transfer mold construction (Ideal for Flow Soldering) 9. High isolation voltage between input and output (Viso(rms) : 5.0kV) Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D4-A00201EN Date Mar. 31. 2004 © SHARP Corporation PR22MA11NTZ Series PR32MA11NTZ Series ■ Internal Connection Diagram 1 6 2 5 1 2 3 4 3 5 4 6 Anode Cathode NC Anode/Cathode No external connection Cathode/Anode ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PR22MA11NTZF] 2. SMT Gullwing Lead-Form [ex. PR22MA11NXPF] ±0.3 1.2 0.6±0.2 5 6 4 SHARP mark "S" R22MA1 Anode mark 1 2 5 Model No. 4 R22MA1 6.5±0.5 6 6.5±0.5 SHARP mark "S" 1.2±0.3 0.6±0.2 Model No. Anode mark Date code (2 digit) 3 Date code (2 digit) Factory identification mark 1 2 3 Factory identification mark 7.12±0.5 7.12±0.5 0.26±0.1 3.25±0.5 0.5±0.1 2.54±0.25 θ 2.54±0.25 1.0+0.4 −0 θ Epoxy resin 1.0+0.4 −0 10.0+0 −0.5 θ : 0 to 13˚ Product mass : approx. 0.35g 0.26±0.1 Epoxy resin 0.35±0.25 7.62±0.3 3.5±0.5 0.5TYP. 2.9±0.5 3.5±0.5 7.62±0.3 Product mass : approx. 0.33g 3. Through-Hole [ex. PR32MA11NTZF] 4. SMT Gullwing Lead-Form [ex. PR32MA11NXPF] ±0.3 1.2 0.6±0.2 5 6 4 SHARP mark "S" R32MA1 Anode mark 1 2 3 5 Model No. 4 R32MA1 6.5±0.5 6 6.5±0.5 SHARP mark "S" 1.2±0.3 0.6±0.2 Model No. Anode mark Date code (2 digit) Date code (2 digit) Factory identification mark 1 2 3 Factory identification mark 7.62±0.3 7.12±0.5 0.5±0.1 3.25±0.5 Product mass : approx. 0.35g ∗Pin 5 0.26±0.1 θ 2.54±0.25 θ 0.35±0.25 0.26±0.1 Epoxy resin 2.54±0.25 7.62±0.3 3.5±0.5 0.5TYP. 3.5±0.5 2.9±0.5 7.12±0.5 1.0+0.4 −0 Epoxy resin 1.0+0.4 −0 10.0+0 −0.5 θ : 0 to 13˚ Product mass : approx. 0.33g is not allowed external connection Sheet No.: D4-A00201EN 2 PR22MA11NTZ Series PR32MA11NTZ Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark There is no rank mark indicator and currently there are no rank offered for this device. Sheet No.: D4-A00201EN 3 PR22MA11NTZ Series PR32MA11NTZ Series (Ta=25˚C) Parameter Symbol Rating Unit *3 IF 50 mA Forward current Input VR 6 V Reverse voltage *3 I (rms) 150 mA RMS ON-state current T Isurge 1.2 *4 A Peak one cycle surge current Output PR22MA11NTZ 400 Repetitive VDRM V 600 peak OFF-state voltage PR32MA11NTZ *1 5.0 kV Viso(rms) Isolation voltage ˚C Topr −30 to +85 Operating temperature ˚C Tstg −40 to +125 Storage temperature *2 ˚C Tsol 270 *5 Soldering temperature 1mm ■ Absolute Maximum Ratings Soldering area *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 Refer to Fig.1, Fig.2 *4 f=50Hz sine wave *5 Lead solder plating models: 260˚C ■ Electro-optical Characteristics Parameter Forward voltage Input Reverse current Repetitive peak OFF-state current ON-state voltage Output Holding current Critical rate of rise of OFF-state voltage Transfer Minimum trigger current charac- Isolation resistance teristics Turn-on time (Ta=25˚C) Symbol VF IR IDRM VT IH dV/dt IFT RISO ton Conditions IF=20mA VR=3V VD=VDRM IT=150mA VD=6V − VD=1/√2 ·VDRM VD=6V, RL=100Ω DC500V,40 to 60%RH VD=6V, RL=100Ω, IF=20mA MIN. TYP. 1.2 − − − − − − − − 0.1 − 100 − − 10 1011 5×10 − − MAX. 1.4 10 2.0 3.0 3.5 − 10 − 100 Unit V µA µA V mA V/µs mA Ω µs Sheet No.: D4-A00201EN 4 PR22MA11NTZ Series PR32MA11NTZ Series ■ Model Line-up (1) (Lead-free components) Lead Form Shipping Package Model No. Through-Hole Sleeve 50pcs/sleeve SMT Gullwing Taping 1 000pcs/reel VDRM [V] IFT[mA] (VD=6V, RL=100Ω) PR22MA11NTZF PR32MA11NTZF PR22MA11NXPF PR32MA11NXPF 400 600 MAX.10 ■ Model Line-up (2) (Lead solder plating components) Lead Form Shipping Package Model No. Through-Hole Sleeve 50pcs/sleeve SMT Gullwing Taping 1 000pcs/reel VDRM [V] IFT[mA] (VD=6V, RL=100Ω) PR22MA11NTZ PR32MA11NTZ − − 400 600 MAX.10 Please contact a local SHARP sales representative to see the actual status of the production. Sheet No.: D4-A00201EN 5 PR22MA11NTZ Series PR32MA11NTZ Series Fig.2 RMS ON-state Current vs. Ambient Temperature 70 175 60 150 RMS ON-state current IT (rms) (mA) Forward current IF (mA) Fig.1 Forward Current vs. Ambient Temperature 50 40 30 20 10 0 −30 0 50 Resistance load, f=60Hz AC200V(PR32MA11NTZ) AC100V(PR22MA11NTZ) 125 100 75 50 25 0 −30 100 0 50 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs. Ambient Temperature 12 VD=6V RL=100Ω Ta=75˚C 50 50˚C Minimum trigger current IFT (mA) Forward current IF (mA) 100 25˚C 0˚C −25˚C 10 5 0.5 1 1.5 2 2.5 8 6 4 2 0 −40 1 0 10 3 −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Forward voltage VF (V) Fig.5 ON-state Voltage vs. Ambient Temperature Fig.6 Holding Current vs. Ambient Temperature 2.0 10 VD=6V IT=0.15A 1.9 Holding current IH(mA) ON-state voltage VT (V) 1.8 1.7 1.6 1.5 1.4 1.3 1 1.2 1.1 1.0 −40 −20 0 20 40 60 80 0.1 −40 100 −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Sheet No.: D4-A00201EN 6 PR22MA11NTZ Series PR32MA11NTZ Series Fig.7 ON-state Current vs. ON-state Voltage Fig.8 Turn-on Time vs. Forward Current 200 100 VD=6V RL=100Ω Ta=25˚C 150 Turn-on time ton (µs) ON-state current IT (mA) IF=20mA Ta=25˚C 100 50 0 0 0.5 1.0 1.5 10 1 2.0 1 ON-state voltage VT (V) 10 100 Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference. Sheet No.: D4-A00201EN 7 PR22MA11NTZ Series PR32MA11NTZ Series ■ Design Considerations ● Recommended Operating Conditions Input Output Parameter Symbol Input signal current at ON state IF(ON) Input signal current at OFF state IF(OFF) PR22MA11NTZ Load supply voltage VOUT(rms) PR32MA11NTZ Load supply current Frequency Operating temperature IOUT(rms) f Topr Conditions − − MIN. 20 0 − − Locate snubber circuit between output terminals − (Cs=0.01µF, Rs=100Ω) 50 − −20 − MAX. 25 0.1 120 240 Unit mA mA IT(rms)×80%(∗) mA 60 70 Hz ˚C V (∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature). ● Design guide In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less. In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width is a minimum of 1ms. When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation, please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can merely recommend some circuit values to start with : Cs=0.01µF and Rs=100Ω. The operation of the SSR and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit component values accordingly. When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops in current are not accompanied by large instantaneous changes in voltage across the Triac. This fast change in voltage is brought about by the phase difference between current and voltage. Primarily, this is experienced in driving loads which are inductive such as motors and solenods. Following the procedure outlined above should provide sufficient results. Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. All pins shall be used by soldering on the board. (Socket and others shall not be used.) ● Degradation In general, the emission of the IRED used in SSR will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least twice the minimum required triggering current from initial operation. Sheet No.: D4-A00201EN 8 PR22MA11NTZ Series PR32MA11NTZ Series ● Recommended Foot Print (reference) SMT Gullwing Lead-form 1.7 2.54 2.54 8.2 2.2 (Unit : mm) ● Standard Circuit R1 +VCC 1 SSR D1 2 V1 Load 6 ZS AC Line 4 Tr1 ZS : Surge absorption circuit (Snubber circuit) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D4-A00201EN 9 PR22MA11NTZ Series PR32MA11NTZ Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D4-A00201EN 10 PR22MA11NTZ Series PR32MA11NTZ Series ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D4-A00201EN 11 PR22MA11NTZ Series PR32MA11NTZ Series ■ Package specification ● Sleeve package Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D4-A00201EN 12 PR22MA11NTZ Series PR32MA11NTZ Series ● Tape and Reel package SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D J G I 5˚ X. MA H H A B C E K Dimensions List A B ±0.3 16.0 7.5±0.1 H I ±0.1 10.4 0.4±0.05 C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 7.8±0.1 E 2.0±0.1 F 4.0±0.1 (Unit:mm) G +0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.5±1.5 e f 23±1.0 2.0±0.5 f a b (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D4-A00201EN 13 PR22MA11NTZ Series PR32MA11NTZ Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D4-A00201EN 14