SSC MB2S

MB2S thru MB10S
Surface Mount Bridge Rectifiers
PRODUCT SUMMARY
Miniature Glass Passivated Single-Phase
Reverse Voltage 200 to 1000 Volts
FEATURES
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
Glass passivated chip junctions
High surge overload rating: 35A peak
Saves space on printed circuit boards
High temperature soldering guaranteed: 260oC/10 seconds
MECANICAL DATA
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight: 0.078 oz., 0.22 g
Package outline dimensions in inches (millimeters)
Pb-free; RoHS-compliant
12/23/2007 Rev.1.00
www.SiliconStandard.com
1
MB2S thru MB10S
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
o
(TA=25 C unless otherwise noted)
Parameter
Symbols
MB2S
MB4S
MB6S
MB8S
MB10S
Units
Maximum repetitive peak reverse voltage
VRRM
200
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
140
280
420
560
700
Volts
200
400
600
800
1000
Volts
Maximum DC blocking voltage
VDC
Maximum average forward output rectified current
(see Fig.1)
on glass-epoxy P.C.B.
on aluminum substrate
IF(AV)
0.5
0.8
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC Method)
IFSM
35.0
Amps
I2t
5.0
A 2 se c
VF
1.0
Volt
IR
5.0
100
uA
Rating for fusing (t < 8.3ms)
Maximum instantaneous forward voltage drop per leg at 0.4A
Maximum DC reverse current at
rated DC blocking voltage per leg
TA = 25oC
TA = 125oC
Typical thermal resistance per leg
Typical junction capacitance per leg at 4.0V, 1.0MHz
Operating junction and storage temperature range
Notes:
RθJA
RθJA
RθJL
85
70
20
(1)
Amp
(2)
(1)
(2)
o
C/W
(1)
CJ
13
TJ, TSTG
-55 to +150
pF
o
C
1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
12/23/2007 Rev.1.00
www.SiliconStandard.com
2
MB2S thru MB10S
RATINGS AND CHARACTERISTIC CURVES
o
(TA=25 C unless otherwise noted)
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
12/23/2007 Rev.1.00
www.SiliconStandard.com
3