□□1102W Surface Mount IRED/Inner Lens Type Features Package Product features 3015 type, Water clear epoxy ・Outer Dimension 3.0 x 1.5 x 1.5mm ( L x W x H ) ・Inner Lenz type ・Radiant Intensity DNK ： 2.2mW/sr TYP. (IF=20mA) TAN ： 1.4mW/sr TYP. (IF=20mA) AN ： 0.8mW/sr TYP. (IF=20mA) ・Lead–free soldering compatible ・RoHS compliant Peak Wavelength DNK TAN AN : 865nm : 940nm : 950nm Half Intensity Angle DNK TAN AN : θx = 60 deg., θy = 80 deg. : θx = 80 deg., θy = 90 deg. : θx = 60 deg., θy = 90 deg. Die materials GaAlAs（DNK） GaAs（TAN,AN） Rank grouping parameter Sorted by radiant intensity per rank taping Assembly method Auto pick & place machine (Auto Mounter) Soldering methods Reflow soldering ※Please refer to Soldering Conditions about soldering. Taping and reel 2,500pcs per reel in a 8mm width tape. (Standard) Reel diameter:φ180mm ESD-withstand voltage 2kV (HBM) Recommended Applications Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications 2010.03.30 Page 1 □□1102W Surface Mount IRED/Inner Lens Type Color and Luminous Intensity Part No. 2010.03.30 Material DNK1102W GaAlAs TAN1102W GaAs AN1102W GaAs Lens Color Water Clear (Ta=25℃) Peak Wavelength Radiant Intensity λ ｐ (nm) IE (ｍ W/sr) TYP. I F (mA) MIN. TYP. I F (mA) 865 20 1.1 2.2 20 940 20 0.7 1.4 20 950 20 0.5 0.8 20 Page 2 □□1102W Surface Mount IRED/Inner Lens Type Absolute Maximum Ratings Item Symbol Power Dissipation Forward Current (Ta=25℃) Absolute Maximum Ratings Unit DNK TAN AN Pd 80 70 75 mW IF 50 50 50 mA IFRM 300 300 300 mA ⊿ IF 0.67 0.67 0.67 mA/℃ ⊿ IFRM 4.00 4.00 4.00 mA/℃ Reverse Voltage VR 5 5 5 V Operating Temperature Topr -30～ +85 ℃ Storage Temperature Tstg -40～ +100 ℃ Pulse Forward Current ※1 Derating (Ta=25℃ or higher) ※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100 Electro-Optical Characteristics Item Conditions (Ta=25℃) Characteristics Symbol DNK TAN AN TYP. 1.40 1.20 1.22 MAX. 1.65 1.40 1.40 MAX. 100 10 10 MIN. 1.1 0.7 0.5 TYP. 2.2 1.4 0.8 Unit Forward Voltage IF =20mA VF V Reverse Current VR =5V IR Radiant Intensity IF =20mA IE Total Output Power IF =20mA Po TYP. 8.5 5.7 2 mW Peak Wavelength IF =20mA λp TYP. 865 940 950 nm Spectral Half-width IF =20mA ⊿λ TYP. 45 50 45 nm Half Intensity Angle IF =20mA 2θ1/2 TYP. 60(θx) 80(θx) 60(θx) 80(θy) 90(θy) 90(θy) Cut-off Frequency IF =20mADC ±5mA, -3db from 0.1MHz fc MIN. - - - TYP. 50 - 0.5 Response Time IF =20mA tr/tf TYP. 7 1000 700 μA mW/sr deg. MHz ns ※ θx：Product long side axis,θｙ：Product short side axis 2010.03.30 Page 3 □□1102W Surface Mount IRED/Inner Lens Type Radiant Intensity Rank R a nk IE(mW/sr) TAN IF=20mA DNK IF=20mA MIN. A B C D E (Ta=25℃) 1.1 1.6 2.2 3.2 4.4 MAX. 2.2 3.2 4.4 6.4 8.8 MIN. 0.7 1.0 1.4 2.0 2.8 AN IF=20mA MAX. 1.4 2.0 2.8 4.0 5.6 MIN. 0.5 MAX. 1.0 0.7 1.0 1.4 2.0 1.4 2.0 2.8 - ※Please contact our sales staff concerning rank designation. 2010.03.30 Page 4 □□1102W Surface Mount IRED/Inner Lens Type Technical Data （DNK） Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Condition : Ta = 25℃ y 1.2 x Relative Intensity 1.0 0.8 0.6 0.4 0.2 0.0 700 800 900 1000 Wavelength [nm] Forward Voltage vs. Forward Current Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta = 25℃ Condition : Ta=25℃, tw≦100μs, Duty≦1/100 1000 Pulse Forward Current IFRM(mA) Forward Current IF(mA) 100 10 1 10 1 1.2 1.3 1.4 Forward Voltage : VF(V) 2010.03.30 100 1.5 1.6 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Pulse Forward Voltage : VFM(V) Page 5 □□1102W Surface Mount IRED/Inner Lens Type Technical Data （DNK） Derating Power Dissipation vs. Ambient Temperature Ambient Temperature vs. Maximum Forward Curren Pulse Width tw≦100μsec 90 Duty=1% 300 Power Dissipation : Pd (mW) Maximum Forward Current : IF MAX. (mA) 350 250 200 Duty=5% 150 Duty=10% Duty=20% Duty=50% 100 50 80 70 60 50 40 30 20 10 DC 0 0 -30 -10 10 30 50 70 -30 -20 -10 0 90 Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Condition : IF =20mA 1.8 Pulse Forward Current IFRM(mA) 1000 Forward Voltage VF(V) 1.6 1.4 1.2 100 10 1.0 -40 -20 0 20 40 60 Ambient Temperature : Ta (℃) 2010.03.30 10 20 30 40 50 60 70 80 90 100 80 100 0.001 0.01 0.1 1 Duty Ratio Page 6 □□1102W Surface Mount IRED/Inner Lens Type Technical Data （DNK） Pulse Forward Current vs. Relative Total Power Forward Current vs. Relative Total Power Condition : tw≦100μs, Duty≦1/100, Ta = 25℃ Condition : Ta = 25℃ 100.0 Relative Total Power Relative Total Power 10.0 1.0 0.1 10.0 1.0 0.1 1 10 100 1 10 100 1000 Pulse Forward Current : IFRM (mA) Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Relative Total Power 10 1 0.1 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) 2010.03.30 Page 7 □□1102W Surface Mount IRED/Inner Lens Type Technical Data （TAN） Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Condition : Ta = 25℃ y 1.2 x Relative Intensity 1.0 0.8 0.6 0.4 0.2 0.0 700 800 900 1000 1100 Wavelength [nm] Forward Voltage vs. Forward Current Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta = 25℃ Condition : Ta=25℃, tw≦100μs, Duty≦1/100 1000 Pulse Forward Current IFRM(mA) Forward Current IF(mA) 100 10 1 10 1 1.0 1.1 1.2 Forward Voltage : VF(V) 2010.03.30 100 1.3 1.0 1.2 1.4 1.6 1.8 2.0 Pulse Forward Voltage : VFM(V) Page 8 □□1102W Surface Mount IRED/Inner Lens Type Technical Data （TAN） Derating Power Dissipation vs. Ambient Temperature Ambient Temperature vs. Maximum Forward Curren Pulse Width tw≦100μsec 350 90 80 300 Power Dissipation : Pd (mW) Maximum Forward Current : IF MAX. (mA) Duty=1% 250 200 Duty=5% 150 Duty=10% Duty=20% 100 Duty=50% 50 70 60 50 40 30 20 10 DC 0 0 -30 -10 10 30 50 70 -30 90 Ambient Temperature : Ta(℃) 30 50 70 90 Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Condition : IF = 20mA 1000 Pulse Forward Current IFRM(mA) 1.4 1.3 Forward Voltage VF(V) 10 Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage 1.2 1.1 100 10 1.0 -40 -20 0 20 40 60 Ambient Temperature : Ta (℃) 2010.03.30 -10 80 100 0.001 0.01 0.1 1 Duty Ratio Page 9 □□1102W Surface Mount IRED/Inner Lens Type Technical Data （TAN） Pulse Forward Current vs. Relative Total Power Forward Current vs. Relative Total Power Condition : tw≦100μs, Duty≦1/100, Ta = 25℃ Condition : Ta = 25℃ 100 10 10 Relative Total Power Relative Total Power 1 0.1 0.01 1 0.1 0.01 1 10 100 Forward Current : IF (mA) 1 10 100 1000 Pulse Forward Current : IFRM (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Relative Total Power 10 1 0.1 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) 2010.03.30 Page 10 □□1102W Surface Mount IRED/Inner Lens Type Technical Data（AN） Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Condition : Ta = 25℃ y Relative Intensity x Wavelength [nm] Forward Voltage vs. Forward Current Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Forward Current IF(mA) Pulse Forward Current IFRM(mA) Condition : Ta = 25℃ Forward Voltage : VF(V) 2010.03.30 2009.1.26 Duty Ratio Page 11 4 Page □□1102W Surface Mount IRED/Inner Lens Type Technical Data（AN） Ambient Temperature vs. Forward Current Ambient Temperature vs. Pulse Forward Current Forward Current : IF (mA) Pulse Forward Current IFRM(mA) Condition : tw≦100μs, Duty≦1/100 Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Pulse Forward Voltage vs. Pulse Forward Current Forward Voltage VF(V) Ambient Temperature : Ta (℃) 2010.03.30 2004.11.17 Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Pulse Forward Current IFRM(mA) Condition : IF = 20mA Pulse Forward Voltage : VFM(V) Page 12 5 Page □□1102W Surface Mount IRED/Inner Lens Type Technical Data（AN） Ambient Temperature vs. Peak Wavelength Forward Current vs. Relative Total Power Condition : - - Pulse, tw≦100μs, Duty≦1/100, Ta = 25℃ Relative Total Power Peak Wavelength λp (nm) Condition : IF = 20mA Ambient Temperature : Ta(℃) Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Relative Total Power Condition : IF = 20mA Ambient Temperature : Ta (℃) 2010.03.30 2004.11.17 Page 13 6 Page □□1102W Surface Mount IRED/Inner Lens Type Package Dimensions (Unit: mm) Weight: (7.80)mg Recommended Soldering Pattern Taping Specification (Unit: mm) (Unit: mm) Quantity: 2,500pcs/ reel (standard) 2010.03.30 Page 14 □□1102W Surface Mount IRED/Inner Lens Type Reflow Soldering Conditions 1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 2010.03.30 350 ℃ 3 s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.) Page 15 □□1102W Surface Mount IRED/Inner Lens Type Reliability Testing Result Reliability Testing Result Applicable Standard Room Temp. Operating Life EIAJ ED4701/100(101) Ta = 25℃, IF = Maxium Rated Current Resistance to Soldering Heat EIAJ ED4701/300(301) (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150℃～180℃ 120s Operating Heating 230℃ Min. Peak temperature 260℃ Temperature Cycling EIAJ ED4701/100(105) Wet High Temp. Storage Life EIAJ ED4701/100(103) High Temp. Storage Life Low Temp. Storage Life EIAJ ED4701/200(201) EIAJ ED4701/200(202) Vibration, Variable Frequency EIAJ ED4701/400(403) Testing Conditions Duration Failure 1,000 h 0/25 Twice 0/25 Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) 5 cycles 0/25 Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Ta = Minimum Rated Storage Temperature 1,000 h 0/25 2h 0/10 2 98.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction Failure Criteria Items Symbols Radiant Intensity IE Forward Voltage VF Reverse Current IR 2010.03.30 2010.12.30 Conditions IF Value of each product Radiant Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V Failure criteria Testing Min. Value ＜ Initial Value x 0.5 Testing Max. Value ＞ Spec. Max. Value x 1.2 Testing Max. Value ≧ Spec. Max. Value x 2.5 Page 16 □□1102W Surface Mount IRED/Inner Lens Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2010.03.30 Page 17