□□1111C Surface Mount IRED/1608 ( t = 0.7 mm) Type Features Package Product features 1608 ( h = 0.7 mm) type, Water clear epoxy ・Outer Dimension 1.6 x 0.8 x 0.7mm ( L x W x H ) ・Small Size ・Total Output Power DNK ： 6.5mW TYP. (IF=20mA) TAN ： 4.3mW TYP. (IF=20mA) AN ： 2.0mW TYP. (IF=20mA) ・Lead–free soldering compatible ・RoHS compliant Peak Wavelength DNK TAN AN : 865nm : 940nm : 950nm Half Intensity Angle DNK TAN AN : θx = 145 deg., θy =145 deg. : θx = 145 deg.,θy = 145 deg. : θx = 125 deg.,θy = 150 deg. Die materials GaAlAs（DNK） GaAs（TAN,AN） Rank grouping parameter Sorted by radiant intensity per rank taping Assembly method Auto pick & place machine (Auto Mounter) Soldering methods Reflow soldering ※Please refer to Soldering Conditions about soldering. Taping and reel 4,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:φ180mm ESD-withstand voltage 2kV (HBM) Recommended Applications Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications 2010.03.30 Page 1 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Color and Luminous Intensity Part No. 2010.03.30 Material DNK1111C GaAlAs TAN1111C GaAs AN1111C GaAs Lens Color Water Clear (Ta=25℃) Peak Wavelength Radiant Intensity λ ｐ (nm) IE (ｍ W/sr) TYP. I F (mA) MIN. TYP. I F (mA) 865 20 0.7 1.4 20 940 20 0.3 0.6 20 950 20 0.2 0.28 20 Page 2 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Absolute Maximum Ratings Item Symbol Power Dissipation Forward Current (Ta=25℃) Absolute Maximum Ratings Unit DNK TAN AN Pd 80 70 75 mW IF 50 50 50 mA IFRM 300 300 300 mA ⊿ IF 0.67 0.67 0.67 mA/℃ ⊿ IFRM 4.00 4.00 4.00 mA/℃ Reverse Voltage VR 5 5 5 V Operating Temperature Topr -30～ +85 ℃ Storage Temperature Tstg -40～ +100 ℃ Pulse Forward Current ※1 Derating (Ta=25℃ or higher) ※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100 Electro-Optical Characteristics Item Conditions (Ta=25℃) Characteristics Symbol DNK TAN AN TYP. 1.40 1.20 1.22 MAX. 1.65 1.40 1.40 MAX. 100 10 10 MIN. 0.7 0.3 0.2 TYP. 1.4 0.6 0.28 Unit Forward Voltage IF =20mA VF Reverse Current VR =5V IR Radiant Intensity IF =20mA IE Total Output Power IF =20mA Po TYP. 6.5 4.3 2 mW Peak Wavelength IF =20mA λp TYP. 865 940 950 nm Spectral Half-width IF =20mA ⊿λ TYP. 45 50 45 nm Half Intensity Angle IF =20mA 2θ1/2 TYP. Cut-off Frequency IF =20mADC ±5mA, -3db from 0.1MHz fc Response Time IF =20mA tr/tf 145(θx) 145(θx) 125(θx) 145(θy) 145(θy) 150(θy) MIN. - - - TYP. 50 - 0.5 TYP. 7 1000 700 V μA mW/sr deg. MHz ns ※ θx：Product long side axis,θｙ：Product short side axis 2010.03.30 Page 3 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Radiant Intensity Rank R a nk IE(mW/sr) TAN IF=20mA DNK IF=20mA MIN. A B C D E (Ta=25℃) 0.7 1.0 1.4 2.0 2.8 MAX. 1.4 2.0 2.8 4.0 5.6 MIN. 0.3 0.4 0.6 0.8 1.2 AN IF=20mA MAX. 0.6 0.8 1.2 1.6 2.4 MIN. 0.20 MAX. 0.40 0.28 0.40 - 0.56 0.80 - ※Please contact our sales staff concerning rank designation. 2010.03.30 Page 4 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（DNK） Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA 条件/Condition : Ta = 25℃ y 1.2 Relative Intensity 1.0 x 0.8 １ 0.6 0.4 0.2 0.0 700 800 Wavelength [nm] 900 1000 Forward Voltage vs. Forward Current Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Condition : Ta = 25℃ 1000 Pulse Forward Current IFRM(mA) Forward Current IF(mA) 100 10 1 10 1.2 1.3 1.4 Forward Voltage : VF(V) 2010.03.30 100 1.5 1.6 0.001 0.01 0.1 1 Duty Ratio Page 5 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（DNK） Power Dissipation vs. Ambient Temperature Derating Ambient Temperature vs. Maximum Forward Curren Pulse Width tw≦100μsec 90 350 Duty=1% 80 Maximum Forward Current : IF MAX. (mA) Power Dissipation : Pd (mW) 300 70 60 50 40 30 20 10 0 -30 -10 10 30 50 70 250 200 Duty=5% 150 Duty=10% Duty=20% 100 Duty=50% 50 DC 0 90 -30 -10 Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage 50 70 90 Condition : Ta=25℃, tw≦100μs, Duty≦1/100 1.8 Pulse Forward Current IFRM(mA) 1000 1.6 Forward Voltage VF(V) 30 Pulse Forward Voltage vs. Pulse Forward Current Condition : IF = 20mA 1.4 1.2 100 10 1 1.0 -40 -20 0 20 40 60 Ambient Temperature : Ta (℃) 2010.03.30 10 Ambient Temperature : Ta(℃) 80 100 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Pulse Forward Voltage : VFM(V) Page 6 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（DNK） Forward Current vs. Relative Total Power Forward Current vs. Relative Total Power Condition : tw≦100μs, Duty≦1/100, Ta = 25℃ Condition : Ta = 25℃ 100.0 Relative Total Power Relative Total Power 10.0 1.0 0.1 10.0 1.0 0.1 1 10 100 1 10 100 1000 Forward Current : IF (mA) Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Relative Total Power 10 1 0.1 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) 2010.03.30 Page 7 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（TAN） Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA 条件/Condition : Ta = 25℃ y 1.2 x Relative Intensity 1.0 0.8 １ 0.6 0.4 0.2 0.0 700 800 900 1000 1100 Wavelength [nm] Forward Voltage vs. Forward Current Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Condition : Ta = 25℃ 1000 Pulse Forward Current IFRM(mA) Forward Current IF(mA) 100 10 10 1 1.0 1.1 1.2 Forward Voltage : VF(V) 2010.03.30 100 1.3 0.001 0.01 0.1 1 Duty Ratio Page 8 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（TAN） Power Dissipation vs. Ambient Temperature Derating 90 350 80 300 Duty=1% Maximum Forward Current : IF MAX. (mA) Power Dissipation : Pd (mW) Ambient Temperature vs. Maximum Forward Curren Pulse Width tw≦100μsec 70 60 50 40 30 20 10 0 250 200 Duty=5% 150 Duty=10% Duty=20% 100 Duty=50% 50 DC 0 -30 -10 10 30 50 70 90 -30 Ambient Temperature vs. Forward Voltage 30 50 70 90 Pulse Forward Voltage vs. Pulse Forward Current Condition : IF = 20mA Condition : Ta=25℃, tw≦100μs, Duty≦1/100 1000 Pulse Forward Current IFRM(mA) 1.4 1.3 Forward Voltage VF(V) 10 Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) 1.2 1.1 1.0 100 10 1 -40 -20 0 20 40 60 Ambient Temperature : Ta (℃) 2010.03.30 -10 80 100 1.0 1.2 1.4 1.6 1.8 2.0 Pulse Forward Voltage : VFM(V) Page 9 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（TAN） Forward Current vs. Relative Total Power Forward Current vs. Relative Total Power Condition : tw≦100μs, Duty≦1/100, Ta = 25℃ Condition : Ta = 25℃ 100 10 10 Relative Total Power Relative Total Power 1 0.1 0.01 1 0.1 0.01 1 10 100 Forward Current : IF (mA) 1 10 100 1000 Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Relative Total Power 10 1 0.1 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) 2010.03.30 Page 10 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（AN） Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA 条件/Condition : Ta = 25℃ y Relative Intensity x １ Wavelength [nm] Forward Voltage vs. Forward Current Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Forward Current IF(mA) Pulse Forward Current IFRM(mA) Condition : Ta = 25℃ Forward Voltage : VF(V) 2010.03.30 Duty Ratio Page 11 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（AN） Ambient Temperature vs. Forward Current Ambient Temperature vs. Pulse Forward Current Forward Current : IF (mA) Pulse Forward Current IFRM(mA) Condition : tw≦100μs, Duty≦1/100 Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Pulse Forward Voltage vs. Pulse Forward Current Forward Voltage VF(V) Ambient Temperature : Ta (℃) 2010.03.30 Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Pulse Forward Current IFRM(mA) Condition : IF = 20mA Pulse Forward Voltage : VFM(V) Page 12 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（AN） Ambient Temperature vs. Peak Wavelength Forward Current vs. Relative Total Power Condition : - - Pulse, tw≦100μs, Duty≦1/100, Ta = 25℃ Relative Total Power Peak Wavelength λp (nm) Condition : IF = 20mA Ambient Temperature : Ta(℃) Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Relative Total Power Condition : IF = 20mA Ambient Temperature : Ta (℃) 2010.03.30 Page 13 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Package Dimensions (Unit: mm) Weight: (1.40)mg Recommended Soldering Pattern Taping Specification (Unit: mm) (Unit: mm) Quantity: 4,000pcs/ reel (standard) 2010.03.30 Page 14 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Reflow Soldering Conditions 1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 2010.03.30 350 ℃ 3 s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.) Page 15 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Reliability Testing Result Reliability Testing Result Applicable Standard Room Temp. Operating Life EIAJ ED4701/100(101) Ta = 25℃, IF = Maxium Rated Current Resistance to Soldering Heat EIAJ ED4701/300(301) (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150℃～180℃ 120s Operating Heating 230℃ Min. Peak temperature 260℃ Temperature Cycling EIAJ ED4701/100(105) Wet High Temp. Storage Life EIAJ ED4701/100(103) High Temp. Storage Life Low Temp. Storage Life EIAJ ED4701/200(201) EIAJ ED4701/200(202) Vibration, Variable Frequency EIAJ ED4701/400(403) Testing Conditions Duration Failure 1,000 h 0/25 Twice 0/25 Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) 5 cycles 0/25 Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Ta = Minimum Rated Storage Temperature 1,000 h 0/25 2h 0/10 2 98.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction Failure Criteria Items Symbols Radiant Intensity IE Forward Voltage VF Reverse Current IR 2010.03.30 2010.12.30 Conditions IF Value of each product Radiant Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V Failure criteria Testing Min. Value ＜ Initial Value x 0.5 Testing Max. Value ＞ Spec. Max. Value x 1.2 Testing Max. Value ≧ Spec. Max. Value x 2.5 Page 16 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2010.03.30 Page 17