TI TSB43EA42

TI IEEE 1394a-2000
Consumer Electronics Solution
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
SLLA275A – April 2008 – Revised July 2008
TSB43EA/EB/EC42
TSB43EA/EB/EC43
IEEE Std 1394a-2000
Consumer Electronics Solution
Data Sheet Extract
Rev 1.1
No duplication of this document is allowed without written consent from Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in
critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at
the end of this data sheet extract.
NOTE
Designing with this device may require extensive support. Before incorporating this device into
a design, customers should contact TI or an Authorized TI Distributor.
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
1
TI IEEE 1394a-2000
Consumer Electronics Solution
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
SLLA275A – April 2008 – Revised July 2008
Table of Contents
1
2
3
4
5
6
7
Revision History .............................................................................................................................. 3
Overview.......................................................................................................................................... 4
Features .......................................................................................................................................... 5
3.1 1394 Features............................................................................................................................ 5
3.2 DTCP and AES Encryption Support for MPEG-DVB and DSS (TSB43EA42/43 and
TSB43EC42/43 Only) ......................................................................................................................... 5
3.3 Video Interfaces......................................................................................................................... 5
3.4 External CPU Interfaces ............................................................................................................ 5
3.5 DMA........................................................................................................................................... 5
3.6 Data Buffers............................................................................................................................... 5
3.7 Hardware Packet Formatting for the Following Standards........................................................ 6
3.8 Additional Features.................................................................................................................... 6
General Information......................................................................................................................... 7
4.1 Disclaimer .................................................................................................................................. 7
4.2 Package Size/Ordering information........................................................................................... 7
4.3 Operating Voltage...................................................................................................................... 7
4.4 Operating Temperature ............................................................................................................. 7
Application Diagram ........................................................................................................................ 8
Block Diagram ............................................................................................................................... 10
Mechanical Data............................................................................................................................ 11
7.1 MicroStar™ BGA Package Information.................................................................................... 11
List of Figures
Figure 1. TSB43EC42 in HDTV Application ........................................................................................... 8
Figure 2. TSB43EC2/43 in STB Application........................................................................................... 9
Figure 3. TSB43EA/EB/EC42, TSB43EA/EB/EC43 Block Diagram .................................................... 10
MicroStar BGA is a trademark of Texas Instruments.
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
2
TI IEEE 1394a-2000
Consumer Electronics Solution
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
1
SLLA275A – April 2008 – Revised July 2008
Revision History
Version
1.0 - Released
1.1 - Released
Date
April 2008
July 2008
Notes
Initial release
Modification on operating ambient temperature
range(section 4.4)
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
3
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
2
TI IEEE 1394a-2000
Consumer Electronics Solution
SLLA275A – April 2008 – Revised July 2008
Overview
The TSB43Ex42/43 is high-performance consumer electronics 1394 link layer and integrated physical
layer device designed for digitally interfacing advanced video consumer electronics applications. It
supports formatting and transmission of IEC61883 data, including IEC61883-1 (general), IEC61883-2
(SD-DVCR), IEC61883-4 (MPEG2-TS), and IEC61883-7 (ITU-R BO.1294 SystemB-DSS).
TSB43Ex42/43 also supports standard 1394 data types, such as asynchronous, asynchronous
streams, and PHY packets.
The TSB43EAxx/ECxx version incorporates DTCP (M6) baseline per the DTLA (5C) specification to
support transmit and receive of up to two MPEG2 transport streams with encryption and decryption.
The TSB43EAxx/ECxx version also includes hardware acceleration for content key generation.
The TSB43EBxx devices are identical to the TSB43EAxx/ECxx devices, except without
implementation of the encryption/decryption features. The TSB43EB42xx/43xx devices allow
customers that do not require the encryption/decryption features to incorporate the TSB43Ex42/43
function without becoming DTLA licensees.
The TSB43Ex42/43 features an integrated 2-port/3-port PHY. The PHY operates at 100 Mbps, 200
Mbps, or 400 Mbps. They follow all requirements as stated in IEEE Std 1394-1995 and
IEEE Std 1394a-2000.
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
4
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
3
3.1
1394 Features
•
•
•
Motorola 68K-style 16-bit asynchronous interface
SRAM-like 16-bit asynchronous interface
PCI interface (33 MHz) compliant to PCI specification version 3.0 (supports PCI slave
and master functions)
DMA
•
•
3.6
Two configurable high-speed data ports for video data
o One port configurable as parallel or serial
o One port serial only
Pass-through modes for HSDI0 and HSDI1
Packet Insertion – Two insertion buffers per HSDI for PAT, PMT, SIT, and DIT packets
PID filtering (32 PID filters per HSDI port)
External CPU Interfaces
•
•
•
3.5
DTCP encryption support on 1394 bus
AES128 encryption support on HSDI path (TSB43EC42/43 only)
Support for up to two encrypted/decrypted streams at one time
Full or restricted AKE performed with hardware assist
Secure method for loading DTCP and AES128 information using Ex-CPU interface
Localization support compliant with DTCP draft revision 1.51.
Video Interfaces
•
3.4
Integrated 400/200/100-Mbps 2-port/3-port PHY
Compliant with IEEE Std 1394-1995 and IEEE Std 1394a-2000
Supports bus manager functions and automatic 1394 self-id verification
Separate asynchronous acknowledgement (Ack) buffers decrease Ack-tracking burden
on external CPU
DTCP and AES Encryption Support for MPEG-DVB and DSS
(TSB43EA42/43 and TSB43EC42/43 Only)
•
•
•
•
•
•
3.3
SLLA275A – April 2008 – Revised July 2008
Features
•
•
•
•
3.2
TI IEEE 1394a-2000
Consumer Electronics Solution
Higher asynchronous throughput with DMA hardware enhancements (available in PCI
mode only)
Internal DMA controller – Asynchronous, asynchronous Stream TX/RX
o General DMA
o Auto-response DMA for SBP2 transactions
Data Buffers
•
•
•
•
•
•
Two 4-KByte isochronous buffers for video data
Two 2-KByte asynchronous/asynchronous stream transmit buffers
Two 2-KByte asynchronous/asynchronous stream receive buffers
One 1-KByte self-ID buffer
Insertion buffers for MPEG-DVB/DSS packet insertion
Programmable data/space available indicators for buffer flow control
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
5
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
3.7
SLLA275A – April 2008 – Revised July 2008
Hardware Packet Formatting for the Following Standards
•
•
•
•
•
•
•
•
•
3.8
TI IEEE 1394a-2000
Consumer Electronics Solution
IEC61883-1 (general)
IEC61883-2 (SD-DVCR)
IEC61883-4 (MPEG2-TS)
IEC61883-7 (ITU-R BO.1294 System B) – DSS
Generic 61883 mode
Asynchronous packets
Asynchronous streams
PHY packets (including self-IDs)
MPEG4 supported under IEC61883-4 (no new requirement for MPEG4 over 1394)
Additional Features
•
•
•
JTAG interface to support post-assembly scan of device I/O – boundary scan
Unique “binding” method for protecting sensitive data on the circuit board traces at the
Ex-CPU interface
Unique “EMI-AES Binding” method to prevent protected data from being transmitted in
the clear.
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
6
TI IEEE 1394a-2000
Consumer Electronics Solution
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
4
4.1
SLLA275A – April 2008 – Revised July 2008
General Information
Disclaimer
Any operations not described by this data sheet are undefined. TI is not responsible for the
results if the user operates TSB43Ex42/43 in a manner not described by this document.
4.2
Package Size/Ordering information
Only the devices in the green rows are available for order. Other devices are previews and are
scheduled to be released.
Ordering
Number
Availability
Number of
PHY Ports
5C/Non-5C
Voltage
TSB43EA42
Available
2
5C only
3.3 V/1.5 V
TSB43EB42
Preview
2
Non-5C
3.3 V/1.5 V
TSB43EC42
Preview
2
5C + AES
3.3 V/1.5 V
TSB43EB43
Preview
3
Non-5C
3.3 V/1.5 V
TSB43EA43
Preview
3
5C only
3.3 V/1.5 V
TSB43EC43
Preview
3
5C + AES
3.3 V/1.5 V
4.3
Package
MicroStar
BGA™ 144
MicroStar
BGA144
MicroStar
BGA 144
MicroStar
BGA 144
MicroStar
BGA 144
MicroStar
BGA 144
Package
Type
ZGU
ZGU
ZGU
ZGU
ZGU
ZGU
Operating Voltage
Nominal voltage
1.5 V
3.3 V
MIN
1.35
3
MAX
1.65
3.6
UNIT
V
V
NOM
MAX
70
85
UNIT
°C
°C
150
°C
Note: I/Os are not 5-V tolerant (including PCI interface)
4.4
Operating Temperature
Operating ambient
temperature
Commercial
Industrial
(To be released)
Storage temperature
MIN
0
-40
-65
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
7
TI IEEE 1394a-2000
Consumer Electronics Solution
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
5
SLLA275A – April 2008 – Revised July 2008
Application Diagram
Figure 1. TSB43EC42 in HDTV Application
In the HDTV application, the TSB43EC42/43 receives the MPEG2 transport stream, decrypts it using
the M6 cipher, and outputs it to the application over the HSDI port AES encrypted. The MPEG2
demultiplex and decode device separates the audio and video streams, decodes them, and outputs
the 2-channel audio to an audio DAC for listening and the video to an NTSC/PAL encoder for display.
The HDTV receives on-screen display (OSD) information from the video source, such as a set top
box, using the EIA775 standard. The system processor receives the OSD data through the
TSB43EC42/43 asynchronous receive buffer. The system graphics controller controls the OSD and
mixes it with the video data for display.
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
8
TI IEEE 1394a-2000
Consumer Electronics Solution
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
PHY
HSDI
SLLA275A – April 2008 – Revised July 2008
Figure 2. TSB43EC2/43 in STB Application
The set top box receives the MPEG2 transport stream from either satellite or cable sources. The
MPEG2 transport stream is input to the TSB43EC42/43 HSDI port in AES encrypted format. The
TSB43EC42/43 decrypts the packets received over the HSDI port, performs any PID filtering or
packet insertion, encrypt the stream using M6 cipher, and transmit the stream over 1394.
The set top box also creates on-screen display (OSD) graphics to transmit to the sink device. The
system inputs the OSD data to the TSB43Ex42/43 asynchronous transmit buffer. The TSB43EC42/43
transmits the OSD using asynchronous packets to the sink device.
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
9
TSB43EA/EB/EC42
TSB43EA/EB/EC43
Released – v1.1
6
TI IEEE 1394a-2000
Consumer Electronics Solution
SLLA275A – April 2008 – Revised July 2008
Block Diagram
Note: Blocks with the checked and shaded pattern are available only in selected versions of the
device.
Figure 3. TSB43EA/EB/EC42, TSB43EA/EB/EC43 Block Diagram
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
10
TSB43EA/EB/EC42
TSB43EA/EB/EC43
TI IEEE 1394a-2000
Consumer Electronics Solution
Released – v1.1
7
7.1
SLLA275A – April 2008 – Revised July 2008
Mechanical Data
MicroStar™ BGA Package Information
PRODUCTION DATA Information is current as of
publication date. Products conform to specifications per the
terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all
parameters.
Copyright
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2008, Texas Instruments Incorporated
11
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TSB43EA42ZGU
ACTIVE
BGA
ZGU
144
160
Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TSB43EC42ZGU
ACTIVE
BGA
ZGU
144
126
Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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