CC1200
Low Power, High Performance RF Transceiver
Applications
Low power, high performance, wireless systems with
up to 1250 kbit/s data rate
169 / 433 / 868 / 915 / 920 MHz ISM/SRD bands
Possible support for additional frequency bands:
137 – 158.3, 205 – 237.5, and 274 – 316.6 MHz
Smart Metering (AMR/AMI)
Home and building automation
Wireless alarm and security systems
Industrial monitoring and control
Wireless healthcare applications
Wireless sensor networks and Active RFID
IEEE 802.15.4g applications
Wireless M-Bus, all modes
Regulations
Suitable for systems targeting compliance with:
Europe
US
Japan
ETSI EN 300 220, EN 54-25
FCC CFR47 Part 15
FCC CFR47 Part 90
ARIB STD-T30, T67, T108
Key Features
RF performance and analog features
High performance single chip transceiver
o Excellent receiver sensitivity:
-123 dBm at 1.2 kbps
-110 dBm at 50 kbps
o Blocking performance: 86 dB at 10 MHz
o Adjacent channel selectivity: up to 60 dB at
12.5 kHz offset
o Very low phase noise: -114 dBc/Hz at 10 kHz
offset (169 MHz)
Programmable output power up to +16 dBm with
0.4 dB step size
Automatic output power ramping
Supported modulation formats: 2-FSK, 2-GFSK,
4-FSK, 4-GFSK, MSK, OOK
Supports up to 1.25 Mbps data rate in transmit and
receive
Low current consumption:
Enhanced Wake-On-Radio functionality for automatic
low-power receive polling
Power down: 0.3 μA (0.5 μA with sleep timer active)
- RX: 2 mA in RX Sniff Mode
- RX: 19 mA peak current in low power mode
- RX: 23 mA peak current in high performance mode
- TX: 46 mA at +14 dBm
Digital features
WaveMatch: Advanced digital signal processing for
improved sync detect performance
Security: Hardware AES128 accelerator
Data FIFOs: Separate 128-byte RX and TX
Includes functions for antenna diversity support
Support for re-transmissions
Support for auto-acknowledge of received packets
Automatic Clear Channel Assessment (CCA) for listenbefore-talk (LBT) systems
Built in coding gain support for increased range and
robustness
Digital RSSI measurement
Support for seamless integration with the CC1190 for
increased range giving up to 3 dB improvement in RX
sensitivity and up to +27 dBm TX output power
Improved OOK shaping for less occupied bandwidth,
enabling higher output power whilst meeting regulatory
requirements
Dedicated packet handling for 802.15.4g
CRC 16/32
FEC, dual sync detection (FEC and non-FEC
packets)
Whitening
General
RoHS compliant 5x5mm QFN 32 package
Pin compatible with the CC1120
Description
25 AVDD_PFD_CHP
27 AVDD_SYNTH2
26 DCPL_PFD_CHP
DCPL_XOSC
28 AVDD_XOSC
29
XOSC_Q2
30 XOSC_Q1
32 EXT_XOSC
CC1200 is optimized towards wideband applications but can
also cover narrowband down to 12.5 kHz channels well.
31
The CC1200 is a fully integrated single-chip radio
transceiver designed for high performance at very low
power and low voltage operation in cost effective wireless
systems. All filters are integrated, removing the need for
costly external SAW and IF filters. The device is mainly
intended for the ISM (Industrial, Scientific and Medical)
and SRD (Short Range Device) frequency bands at 164190 MHz, 410-475 MHz and 820-950 MHz.
VDD_GUARD
1
24
RESET_N
2
23
LPF0
GPIO3
3
22
AVDD_SYNTH1
21
DCPL_VCO
20
LNA_N
4
DVDD
5
DCPL
6
SI
7
SCLK
8
CC1200
LPF1
19 LNA_P
GND
GROUND PAD
13
14
15
16
AVDD_IF
RBIAS
AVDD_RF
N.C.
CSn
DVDD
GPIO0
12
SO (GPIO1)
11
9
The CC1200 and the CC1120 are both part of the high
performance transceiver family. The CC1120 is more
optimized towards narrowband applications, while the
GPIO2
10
The CC1200 provides extensive hardware support for
packet handling, data buffering, burst transmissions, clear
channel assessment, link quality indication and Wake-OnRadio. The CC1200 main operating parameters can be
controlled via an SPI interface. In a typical system, the
CC1200 will be used together with a microcontroller and
only few external passive components.
18
TRX_SW
17
PA
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 1 of 23
CC1200
Table of Contents
1
ELECTRICAL SPECIFICATIONS ..................................................................................................... 3
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
ABSOLUTE MAX RATINGS................................................................................................................. 3
GENERAL CHARACTERISTICS ............................................................................................................ 3
RF CHARACTERISTICS....................................................................................................................... 3
REGULATORY STANDARDS ............................................................................................................... 4
CURRENT CONSUMPTION, STATIC MODES ........................................................................................ 5
CURRENT CONSUMPTION, TRANSMIT MODES ................................................................................... 5
CURRENT CONSUMPTION, RECEIVE MODES ...................................................................................... 6
RECEIVE PARAMETERS...................................................................................................................... 6
TRANSMIT PARAMETERS ................................................................................................................. 10
PLL PARAMETERS .......................................................................................................................... 11
WAKE-UP AND TIMING.................................................................................................................... 12
40 MHZ CRYSTAL OSCILLATOR ...................................................................................................... 13
40 MHZ CLOCK INPUT (TCXO) ...................................................................................................... 13
32 KHZ CLOCK INPUT ..................................................................................................................... 13
40 KHZ RC OSCILLATOR ................................................................................................................. 13
I/O AND RESET ................................................................................................................................ 14
TEMPERATURE SENSOR ................................................................................................................... 14
2
TYPICAL PERFORMANCE CURVES ............................................................................................ 15
3
PIN CONFIGURATION ..................................................................................................................... 18
4
BLOCK DIAGRAM ............................................................................................................................ 19
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
FREQUENCY SYNTHESIZER .............................................................................................................. 19
RECEIVER........................................................................................................................................ 19
TRANSMITTER ................................................................................................................................. 20
RADIO CONTROL AND USER INTERFACE ......................................................................................... 20
ENHANCED WAKE-ON-RADIO (EWOR).......................................................................................... 20
SNIFF MODE .................................................................................................................................... 20
ANTENNA DIVERSITY ...................................................................................................................... 21
WAVEMATCH ................................................................................................................................. 21
5
TYPICAL APPLICATION CIRCUIT ............................................................................................... 22
6
CONFIGURATION SOFTWARE ..................................................................................................... 23
7
REFERENCES ..................................................................................................................................... 23
8
HISTORY ............................................................................................................................................. 23
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 2 of 23
CC1200
1
Electrical Specifications
All measurements performed on CC1200EM_868_930 rev.1.0.0, CC1200EM_420_470 rev.1.0.1 or CC1200EM_169
rev.1.2
1.1
Absolute Max Ratings
Parameter
Min
Typ
Max
Unit
Condition
Supply Voltage ("VDD")
-0.3
3.9
V
Storage Temperature Range
-40
125
°C
ESD
2000
V
HBM
ESD
500
V
CDM
Input RF level
+10
dBm
VDD+0.3
Voltage on Any Digital Pin
-0.3
V
max 3.9
Voltage on Analog Pins (including
“DCPL” pins)
1.2
-0.3
2.0
V
Max
Unit
General Characteristics
Parameter
Min
Typ
Voltage Supply Range
2.0
3.6
V
Temperature Range
-40
85
°C
1.3
Condition
RF Characteristics
Parameter
Min
Typ
Max
Unit
820
950
MHz
410
475
MHz
164
190
MHz
(274)
(316.6)
MHz
(205)
(237.5)
MHz
(137)
(158.3)
MHz
Condition
Frequency Bands
Frequency Resolution
Please contact TI for more
information about the use of these
frequency bands
30
Hz
In 820-950 MHz band
15
Hz
In 410-475 MHz band
6
Hz
In 164-190 MHz band
0
1250
kbps
Packet mode
0
625
kbps
Transparent mode
Data Rate
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 3 of 23
CC1200
1.4
Regulatory Standards
Performance Mode
Frequency Band
Suitable for compliance with
Comments
ARIB STD-T108
ETSI EN 300 220 receiver
categories 2 and 3
ETSI EN 54-25
820 – 950 MHz
FCC PART 15.247
FCC PART 15.249
Performance also suitable for systems
targeting maximum allowed output
power in the respective bands, using a
range extender such as the CC1190
FCC PART 90 MASK G
FCC PART 90 MASK J
High Performance
Mode
ARIB STD-T67
ARIB RCR STD-T30
410 – 475 MHz
ETSI EN 300 220 receiver
categories 2 and 3
FCC PART 90 MASK D
Performance also suitable for systems
targeting maximum allowed output
power in the respective bands, using a
range extender
FCC PART 90 MASK G
164 – 190 MHz
ETSI EN 300 220 receiver
category 1
FCC PART 90 MASK D
Performance also suitable for systems
targeting maximum allowed output
power in the respective bands, using a
range extender
ETSI EN 300 220 receiver
categories 2 and 3
820 – 950 MHz
FCC PART 15.247
FCC PART 15.249
Low Power Mode
410 – 475 MHz
ETSI EN 300 220 receiver
categories 2 and 3
164 – 190 MHz
ETSI EN 300 220
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 4 of 23
CC1200
1.5
Current Consumption, Static Modes
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
1
µA
0.3
Condition
Power Down with Retention
0.5
µA
Low-power RC oscillator running
XOFF Mode
180
µA
Crystal oscillator / TCXO disabled
IDLE Mode
1.5
mA
Clock running, system waiting with
no radio activity
Unit
Condition
1.6
Current Consumption, Transmit Modes
868/915/920 MHz bands (High Performance Mode)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
TX Current Consumption +14 dBm
46
mA
TX Current Consumption +10 dBm
36
mA
433 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
TX Current Consumption +15 dBm
49
mA
TX Current Consumption +14 dBm
46
mA
TX Current Consumption +10 dBm
35
mA
Condition
169 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
TX Current Consumption +15 dBm
54
mA
TX Current Consumption +14 dBm
50
mA
TX Current Consumption +10 dBm
39
mA
Condition
Low Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
TX Current Consumption +10 dBm
Typ
33.6
Max
Unit
Condition
mA
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 5 of 23
CC1200
1.7
Current Consumption, Receive Modes
High Performance Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
Using RX Sniff Mode, where the
receiver wakes up at regular
intervals looking for an incoming
packet
RX Wait for Sync
1.2 kbps, 3 Byte Preamble
3.4
mA
38.4 kbps, 12 Byte Preamble
3.4
mA
38.4 kbps, 4 byte preamble
10.7
mA
50 kbps, 24 byte Preamble
2.1
mA
RX Peak Current
1.2kbps
23.5
mA
8
uA
Sniff Mode configured to terminate
on Carrier Sense, and is measured
using RSSI_VALID _COUNT = 11
Peak current consumption during
packet reception
Average Current Consumption
Check for Data Packet Every 1 Second
Using Wake on Radio
50 kbps, 5 byte preamble, 40 kHz
RC oscillator used as sleep timer
Low Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
mA
Peak current consumption during
packet reception at the sensitivity
limit
Unit
Condition
RX Peak Current Low power RX mode
1.2 kbps
1.8
19
Receive Parameters
2
General Receive Parameters (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
Saturation
Typ
Max
+10
Digital Channel Filter Programmable
Bandwidth
IIP3
9.5
dBm
1600
kHz
-14
dBm
At maximum gain
±14
%
With carrier sense detection enabled
±1600
ppm
With carrier sense detection disabled
1 - 13 GHz (VCO leakage at 3.5 GHz)
< -56
dBm
30 MHz to 1 GHz
< -57
dBm
Radiated emissions measured
according to ETSI EN 300 220, fc =
869.5 MHz
Datarate Offset Tolerance
Spurious Emissions
Optimum Source Impedance
868 / 915 / 920 MHz bands
433 MHz band
169 MHz band
1
60 + j60 / 30+j30
100 + j60 / 50+ j30
140 + j40 / 70 + j20
Ω
Ω
Ω
(Differential / Single Ended RX
Configurations)
Please see the Sniff Mode design note for more information ([7])
2
All RX measurements made at the antenna connector, to a bit error rate (BER) limit of 1%.
Selectivity and blocking is measured with the wanted signal 3 dB above the sensitivity level.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 6 of 23
CC1200
RX performance in 868/915/920 MHz bands (High Performance Mode)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Unit
Condition
-122
dBm
1.2 kbps 2-FSK, DEV=4 kHz
CHF=11 kHz
-113
dBm
4.8 kbps OOK
-108
dBm
32.768 kbps 2-GFSK, DEV=50 kHz
CHF=208 kHz
-110
dBm
38.4 kbps 2-GFSK, DEV=20 kHz
CHF=104 kHz
-109
dBm
50 kbps 2-GFSK, DEV=25 kHz,
CHF=104 kHz
-97
dBm
500 kbps 2-GMSK, CHF=833 kHz
-97
dBm
1 Mbps 4-GFSK, DEV=400 kHz,
CHF=1.66 MHz
54
dB
± 12.5 kHz (adjacent channel)
55
dB
± 25 kHz (alternate channel)
77
dB
± 2 MHz
82
dB
± 10 MHz
38
dB
± 200 kHz
46
dB
± 400 kHz
66
dB
± 2 MHz
70
dB
± 10 MHz
44
dB
+ 100 kHz (adjacent channel)
44
dB
± 200 kHz (alternate channel)
64
dB
± 2 MHz
72
dB
± 10 MHz
Blocking and Selectivity
41
dB
± 200 kHz (adjacent channel)
50 kbps 2-GFSK, 200 kHz channel
separation, 25 kHz deviation, 104 kHz
channel filter
46
dB
± 400 kHz (alternate channel)
65
dB
± 2 MHz
(Same modulation format as 802.15.4g
Mandatory Mode)
71
dB
± 10 MHz
45
dB
± 400 kHz (adjacent channel)
54
dB
± 800 kHz (alternate channel)
63
dB
± 2 MHz
68
dB
± 10 MHz
Blocking and Selectivity
42
dB
+ 1 MHz (adjacent channel)
500 kbps GMSK,
833 kHz channel filter
42
dB
± 2 MHz (alternate channel)
57
dB
± 10 MHz
Blocking and Selectivity
46
dB
± 2 MHz (adjacent channel)
1 Mbps 4-GFSK, 400kHz deviation,
1.6MHz channel filter
52
dB
± 4 MHz (alternate channel)
59
dB
± 10 MHz
56
dB
1.2 kbps, DEV=4 kHz, CHF=10 kHz,
image at -125 kHz
Blocking and Selectivity
1.2 kbps 2-FSK, 12.5 kHz channel
separation, 4 kHz deviation, 11 kHz
channel filter
Blocking and Selectivity
32.768 kbps 2-GFSK, 200 kHz channel
separation, 50 kHz deviation, 208 kHz
channel filter
Blocking and Selectivity
38.4 kbps 2-GFSK, 100 kHz channel
separation, 20 kHz deviation, 104 kHz
channel filter
Blocking and Selectivity
100 kbps 2-GFSK, 50 kHz deviation,
208 kHz channel filter
Typ
Max
Image Rejection
(Image compensation enabled)
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 7 of 23
CC1200
RX performance in 433 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
-123
dBm
1.2 kbps 2-FSK, DEV=4 kHz
CHF=11 kHz
-111
dBm
38.4 kbps 2-GFSK, DEV=20 kHz
CHF=104 kHz
60
dB
± 12.5 kHz (adjacent channel)
61
dB
± 25 kHz (alternate channel)
82
dB
± 2 MHz
85
dB
± 10 MHz
49
dB
+ 100 kHz (adjacent channel)
48
dB
± 200 kHz (alternate channel)
66
dB
± 2 MHz
74
dB
± 10 MHz
Sensitivity
Blocking and Selectivity
1.2 kbps 2-FSK, 12.5 kHz channel
separation, 4 kHz deviation, 11 kHz
channel filter
Blocking and Selectivity
38.4 kbps 2-GFSK, 100 kHz channel
separation, 20 kHz deviation, 104 kHz
channel filter
RX performance in 169 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Sensitivity
Blocking and Selectivity
1.2 kbps 2-FSK, 12.5 kHz channel
separation, 4 kHz deviation, 11 kHz
channel filter
Typ
Max
Unit
Condition
-122
dBm
1.2 kbps 2-FSK, DEV=4 kHz
CHF=11 kHz
59
dB
± 12.5 kHz (adjacent channel)
64
dB
± 25 kHz (alternate channel)
84
dB
± 2 MHz
86
dB
± 10 MHz
68
dB
Spurious at +/- 40 MHz from carrier
68
dB
1.2 kbps, DEV=4 kHz, CHF=10 kHz,
image at -125 kHz
Spurious Response Rejection
1.2 kbps 2-FSK, 12.5 kHz channel
separation, 4 kHz deviation, 11 kHz
channel filter
Image Rejection
(Image compensation enabled)
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 8 of 23
CC1200
RX performance in Low Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
Unit
Condition
-110
dBm
1.2 kbps 2-FSK, DEV=4 kHz
CHF=11 kHz
-96
dBm
50 kbps 2-GFSK, DEV=25 kHz,
CHF=119 kHz
Blocking and Selectivity
41
dB
+ 200 kHz (adjacent channel)
50 kbps 2-GFSK, 200 kHz channel
separation, 25 kHz deviation, 104 kHz
channel filter
45
dB
+ 400 kHz (alternate channel)
62
dB
± 2 MHz
(Same modulation format as 802.15.4g
Mandatory Mode)
60
dB
± 10 MHz
Saturation
+10
dBm
Sensitivity
Typ
Max
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 9 of 23
CC1200
1.9
Transmit Parameters
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
+14
dBm
At 915/920 MHz
+15
dBm
At 915/920 MHz with VDD = 3.6 V
+15
dBm
At 868 MHz
+16
dBm
At 868 MHz with VDD = 3.6 V
+15
dBm
At 433 MHz
+16
dBm
At 433 MHz with VDD = 3.6 V
+15
dBm
At 169 MHz
+16
dBm
At 169 MHz with VDD = 3.6 V
-12
dBm
Within fine step size range
Within coarse step size range
Max Output Power
Min Output Power
-38
dBm
Output Power Step Size
0.4
dB
Within fine step size range
Adjacent Channel Power
-60
dBc
4-GFSK 9.6 kbps in 12.5 kHz
channel, measured in 8.75 kHz
bandwidth (ETSI 300 220 compliant)
Spurious Emissions
Transmission at +14 dBm
(Excluding harmonics)
30 MHz – 1 GHz
< -57
dBm
Suitable for systems targeting
compliance with ETSI EN 300-220,
ETSI EN 54-25, FCC part 15, FCC
part 90, ARIB STD-T108, ARIB STDT67, ARIB RCR STD-30
1 GHz – 12.75 GHz
< -50
dBm
Measured in 1 MHz bandwidth
2nd Harm, 169 MHz
3rd Harm, 169 MHz
4th Harm, 169 MHz
-43
-57
-63
dBm
dBm
dBm
2nd Harm, 433 MHz
3rd Harm, 433 MHz
4th Harm, 433 MHz
-59
-51
-63
dBm
dBm
dBm
2nd Harm, 868 MHz
3rd Harm, 868 MHz
4th Harm, 868 MHz
-50
-44
-56
dBm
dBm
dBm
2nd Harm, 915 MHz
3rd Harm, 915 MHz
4th Harm, 915 MHz
-58
-46
-62
dBm
dBm
dBm
2nd Harm, 920 MHz
3rd Harm, 920 MHz
Optimum Load Impedance
-65
-60
dBm
dBm
868 / 915 / 920 MHz bands
433 MHz band
169 MHz band
35 + j35
55 + j25
80 + j0
Ω
Ω
Ω
Harmonics
Transmission at +14 dBm (or
maximum allowed in applicable band
where this is less than +14 dBm)
using TI reference design
Suitable for systems targeting
compliance with ETSI EN 300-220,
ETSI EN 54-25, FCC part 15, FCC
part 90, ARIB STD-T108, ARIB STDT67, ARIB RCR STD-30
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 10 of 23
CC1200
1.10 PLL Parameters
High Performance Mode
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
-94
dBc/Hz
± 10 kHz offset
Phase Noise in 868/915/920 MHz Bands
-96
dBc/Hz
± 100 kHz offset
200 kHz Loop Bandwidth Setting
-123
dBc/Hz
± 1 MHz offset
-137
dBc/Hz
± 10 MHz offset
-100
dBc/Hz
± 10 kHz offset
Phase Noise in 868/915/920 MHz Bands
-102
dBc/Hz
± 100 kHz offset
300 kHz Loop Bandwidth Setting
-121
dBc/Hz
± 1 MHz offset
-136
dBc/Hz
± 10 MHz offset
-103
dBc/Hz
± 10 kHz offset
Phase Noise in 868/915/920 MHz Bands
-104
dBc/Hz
± 100 kHz offset
400 kHz Loop Bandwidth Setting
-119
dBc/Hz
± 1 MHz offset
-133
dBc/Hz
± 10 MHz offset
-104
dBc/Hz
± 10 kHz offset
Phase Noise in 868/915/920 MHz Bands
-106
dBc/Hz
± 100 kHz offset
500 kHz Loop Bandwidth Setting
-116
dBc/Hz
± 1 MHz offset
-130
dBc/Hz
± 10 MHz offset
-106
dBc/Hz
± 10 kHz offset
Phase Noise in 433 MHz Band
-107
dBc/Hz
± 100 kHz offset
300 kHz Loop Bandwidth Setting
-127
dBc/Hz
± 1 MHz offset
-141
dBc/Hz
± 10 MHz offset
-114
dBc/Hz
± 10 kHz offset
Phase Noise in 169 MHz Band
-114
dBc/Hz
± 100 kHz offset
300 kHz Loop Bandwidth Setting
-132
dBc/Hz
± 1 MHz offset
-142
dBc/Hz
± 10 MHz offset
Low Power Mode
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
-99
dBc/Hz
± 10 kHz offset
Phase Noise in 868/915/920 MHz Bands
-101
dBc/Hz
± 100 kHz offset
200 kHz Loop Bandwidth Setting
-121
dBc/Hz
± 1 MHz offset
-135
dBc/Hz
± 10 MHz offset
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 11 of 23
CC1200
1.11 Wake-up and Timing
3
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
Powerdown to IDLE
Typ
Max
Unit
Condition
0.24
ms
Depends on crystal
133
µs
Calibration disabled
369
µs
Calibration enabled
43
µs
369
µs
With PLL calibration
0
µs
Without PLL calibration
369
µs
With PLL calibration
0
µs
Without PLL calibration
237
µs
Calibrate when leaving RX/TX
enabled
0
µs
Calibrate when leaving RX/TX
disabled
0.3
ms
When using SCAL strobe
IDLE to RX/TX
RX/TX Turnaround
RX to RX turnaround
TX to TX turnaround
RX/TX to IDLE time
Frequency Synthesizer Calibration
Required for RF front end gain
settling only. Digital demodulation
does not require preamble for
settling
Minimum Required Number of Preamble
Bytes
0.5
bytes
Time From Start RX Until Valid RSSI4
4.2
ms
12.5 kHz channels
Including gain settling (function of channel
bandwidth. Programmable for trade-off
between speed and accuracy)
0.25
ms
120 kHz channels
3
The turnaround behavior to and from RX and/or TX is highly configurable, and the time it takes
will depend on how the device is set up. Please see the CC120X user guide ([1]) for more
information.
Please see the design note on RSSI and response time. It is written for the CC120X, but the same
principles apply for the CC120X.
4
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 12 of 23
CC1200
1.12 40 MHz Crystal Oscillator
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Crystal Frequency
Typ
Max
38.4
Load Capacitance (CL)
40
Unit
Condition
MHz
Note: It is recommended that the
crystal frequency is chosen so that
the RF channel(s) are >1 MHz away
from multiples of XOSC in TX and
XOSC/2 in RX
10
pF
ESR
Ω
Simulated over operating conditions
ms
Depends on crystal
60
Start-up Time
0.24
1.13 40 MHz Clock Input (TCXO)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Clock Frequency
38.4
40
MHz
Clock input amplitude (peak-to-peak)
0.8
VDD
V
Condition
Simulated over operating conditions
1.14 32 kHz Clock Input
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Clock Frequency
Max
Unit
32
32 kHz Clock Input Pin Input High Voltage
Condition
kHz
0.8×VDD
V
32 kHz Clock Input Pin Input Low Voltage
0.2×VDD
V
1.15 40 kHz RC Oscillator
TA = 25°C, VDD = 3.0 V if nothing else stated.
Parameter
Min
Unit
Condition
40
kHz
After calibration (frequency
calibrated against the 40 MHz crystal
or TCXO)
Frequency Accuracy After Calibration
±0.1
%
Relative to frequency reference (i.e.
40 MHz crystal or TCXO)
Initial Calibration Time
1.32
ms
Frequency
Typ
Max
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 13 of 23
CC1200
1.16 I/O and Reset
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Logic Input High Voltage
0.8×VDD
Typ
Unit
Condition
V
Logic Input Low Voltage
Logic Output High Voltage
Max
0.2×VDD
V
0.8×VDD
V
At 4 mA output load or less
Logic Output Low Voltage
0.2×VDD
Power-on Reset Threshold
V
1.3
V
Voltage on DVDD pin
1.17 Temperature Sensor
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Temperature Sensor Range
-40
Typ
Max
Unit
85
Condition
°C
Temperature Coefficient
2.66
mV / °C
Typical Output Voltage
794
mV
VDD Coefficient
1.17
mV / V
Change in sensor output voltage vs
change in temperature
Typical sensor output voltage at
TA = 25°C, VDD = 3.0 V
Change in sensor output voltage vs
change in VDD
The CC1200 can be configured to provide a voltage proportional to temperature on GPIO1. Using
the information above, the temperature can be estimated by measuring this voltage. Please see
the temperature sensor design note ([6]) for more information.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 14 of 23
CC1200
2
Typical Performance Curves
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Sensitivity vs Temperature (434 MHz)
1.2 kbps, 4 kHz deviation, 11 kHz ch. filter bw
Sensitivity vs Voltage (434 MHz)
1.2 kbps, 4 kHz deviation, 11 kHz ch. filter bw
-120
-121
Sensitivity (dBm)
Sensitivity (dBm)
-120
-122
-123
-124
-125
-121
-122
-123
-124
-40
0
40
80
2
2.5
Temperature (ºC)
80
Selectivity (dB)
RSSI
60
40
20
0
-20
-90
-70
-50
Selectivity vs Offset frequency (100 kHz channels)
50 kbps, 25 kHz deviation, 104 kHz ch. filter bw
Image frequency at -0.28 MHz offset (compensation enabled)
-30
-10
80
70
60
50
40
30
20
10
0
-10
-20
-2
-1
0
1
2
Offset Frequency (MHz)
Selectivity vs Offset Frequency (12.5 kHz channels)
1.2 kbps, 4 kHz deviation, 11kHz ch. filter bw
Image frequency at -0.21 MHz offset
RX Current vs Input Level
1.2 kbps FSK, 4 kHz deviation, 11 kHz channel filter bandwidth
24.5
IQ compensation disabled
IQ compensation enabled
-0.3
-0.1
0.1
0.3
0.5
RX Current (mA)
Selectivity (dB)
Input Level (dBm)
70
60
50
40
30
20
10
0
-10
-20
-0.5
3.5
Supply Voltage (V)
RSSI vs Input Level
50 kbps GFSK, 25 kHz deviation, 104 kHz ch. filter bw
-40
-110
3
24
23.5
23
22.5
-130
Offset Frequency (MHz)
-110
-90
-70
-50
Input Level (dBm)
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 15 of 23
-30
-10
CC1200
Output Power vs Supply Voltage
Maximum Output Power Setting (0x7F)
Output Power vs Temperature
Maximum Power Setting (0x7F)
16
16
Output Power (dBm)
Output Power (dBm)
15
14
13
12
11
10
15
14
13
12
2
2.5
3
3.5
-40
Supply Voltage (V)
40
Temperature (ºC)
Output Power at 868MHz
vs PA power setting
TX Current at 868MHz
vs PA power setting
20
60
10
50
TX Current (mA)
Output Power (dBm)
0
0
-10
-20
-30
40
30
20
-40
10
-50
0
PA power setting
PA power setting
Eye Diagram
1 Mbps 4-GFSK, 400 kHz deviation
500 kHz loop bandwidth
Eye Diagram
1 Mbps 4-GFSK, 400 kHz deviation
300 kHz loop bandwidth
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 16 of 23
80
CC1200
Eye Diagram
50 kbps GFSK, 25 kHz deviation
200 kHz loop bandwidth
3.1
1.4
2.9
1.2
2.7
1
2.5
0.8
Output High Voltage
Output Low Voltage
2.3
0.6
2.1
0.4
1.9
0.2
1.7
1.5
0
0
5
10
15
20
25
Current (mA)
Phase Noise 869.5 MHz (10 kHz - 100 MHz offset)
200 kHz Loop Bandwidth
Phase Noise 869.5 MHz (10 kHz - 100 MHz offset)
300 kHz Loop Bandwidth
Phase Noise 869.5 MHz (10 kHz - 100 MHz offset)
400 kHz Loop Bandwidth
Phase Noise 869.5 MHz (10 kHz - 100 MHz offset)
500 kHz Loop Bandwidth
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 17 of 23
30
GPIO Output Low Voltage (V)
GPIO Output high Voltage (V)
GPIO Output High / Low Voltage
vs Current Being Sourced / Sinked
CC1200
3
Pin Configuration
The CC1200 pin-out is shown in the table below.
Pin #
Pin name
Type / direction
Description
1
VDD_GUARD
Power
2.0 - 3.6 V VDD
2
RESET_N
Digital Input
Asynchronous, active-low digital reset
3
GPIO3
Digital Input/Output
General purpose IO
4
GPIO2
Digital Input/Output
General purpose IO
5
DVDD
Power
2.0 - 3.6 VDD to internal digital regulator
6
DCPL
Power
Digital regulator output to external decoupling capacitor
7
SI
Digital Input
Serial data in
8
SCLK
Digital Input
Serial data clock
9
SO(GPIO1)
Digital Input/Output
Serial data out (General purpose IO)
10
GPIO0
Digital Input/Output
General purpose IO
11
CSn
Digital Input
Active-low chip-select
12
DVDD
Power
2.0 - 3.6 V VDD
13
AVDD_IF
Power
2.0 - 3.6 V VDD
14
RBIAS
Analog
External high precision resistor
15
AVDD_RF
Power
2.0 - 3.6 V VDD
16
N.C.
17
PA
Analog
Single-ended TX output
18
TRX_SW
Analog
TX/RX switch. Connected internally to GND in TX and floating
(high-impedance) in RX.
19
LNA_P
Analog
Differential RX input
20
LNA_N
Analog
Differential RX input
21
DCPL_VCO
Power
Pin for external decoupling of VCO supply regulator
22
AVDD_SYNTH1
Power
2.0 - 3.6 V VDD
23
LPF0
Analog
External loopfilter components
24
LPF1
Analog
External loopfilter components
25
AVDD_PFD_CHP
Power
2.0 - 3.6 V VDD
26
DCPL_PFD_CHP
Power
Pin for external decoupling of PFD and CHP regulator
27
AVDD_SYNTH2
Power
2.0 - 3.6 V VDD
28
AVDD_XOSC
Power
2.0 - 3.6 V VDD
29
DCPL_XOSC
Power
Pin for external decoupling of XOSC supply regulator
30
XOSC_Q1
Analog
Crystal oscillator pin 1 (must be grounded if a TCXO or other
external clock connected to EXT_XOSC is used)
31
XOSC_Q2
Analog
Crystal oscillator pin 2 (must be left floating if a TCXO or other
external clock connected to EXT_XOSC is used)
32
EXT_XOSC
Digital Input
Pin for external clock input (must be grounded if a regular crystal
connected to XOSC_Q1 and XOSC_Q2 is used)
-
GND
Ground Pad
The ground pad must be connected to a solid ground plane
Not connected
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 18 of 23
CC1200
4
Block Diagram
A system block diagram of CC1200 is shown Figure 4.1.
CC120x
4 kbyte
ROM
MARC
Main Radio Control unit
ADC
256 byte
FIFO RAM
buffer
FREQ
SYNTH
0
90
RF and DSP frontend
PA out
PA
Output power ramping and OOK / ASK modulation
I
+16 dBm high
efficiency PA
Fully integrated fractional-N
frequency synthesizer
XOSC
BIAS
LFC1
LFC0
High linearity
LNA
IF amp
LNA_N
SCLK
SO (serial output)
SCLK (serial clock)
SO (GPIO0)
SI
(optional GPIO3/2/0)
CS_N
GPIO1
GPIO2
GPIO3
(optional auto detected
external XOSC / TCXO)
XOSC_Q1
Data interface with
signal chain access
XOSC
XOSC_Q2
90 dB dynamic
range ADC
(optional bit clock)
Channel
filter
IF amp
EXT_XOSC
XOSC_Q1
LNA_P
XOSC_Q2
RBIAS
Q
Packet handler
and FIFO control
Cordic
Configuration and
status registers
Battery sensor /
temp sensor
Interrupt and
IO handler
DIGITAL INTERFACE TO MCU
LNA_N
TXFIFO
LNA
PACKET HANDLER
ADC
RXFIFO
SI (serial input)
DEMODULATOR
System bus
LNA_P
PA
CSn (chip select)
MCU
AES-128
accelerator
eWOR
Enhanced ultra low power
Wake On Radio timer
SPI
Serial configuration
Ultra low power
16 bit
RADIO CONTROL & POWER
MANAGEMENT
and data interface
Modulator
Power on reset
MODULATOR
Ultra low power 40 kHz
auto-calibrated RC oscillator
(optional 40 kHz
clock input)
Highly flexible FSK / OOK
demodulator
90 dB dynamic
range ADC
(optional low jitter serial
data output for legacy
protocols)
AGC
Automatic Gain Control, 60dB VGA range
RSSI measurements and carrier sense detection
(optional GPIO for
antenna diversity)
Figure 4.1 : System Block Diagram
4.1
Frequency Synthesizer
At the heart of CC1200 there is a fully integrated, fractional-N, ultra high performance frequency
synthesizer. The frequency synthesizer is designed for excellent phase noise performance,
providing very high selectivity and blocking performance. The system is designed to comply with
the most stringent regulatory spectral masks at maximum transmit power.
Either a crystal can be connected to XOSC_Q1 and XOSC_Q2, or a TCXO can be connected to
the EXT_XOSC input. The oscillator generates the reference frequency for the synthesizer, as
well as clocks for the ADC and the digital part. To reduce system cost, CC1200 has high accuracy
frequency estimation and compensation registers to measure and compensate for crystal
inaccuracies, enabling the use of lower cost crystals. If a TCXO is used, the CC1200 will
automatically turn the TCXO on and off when needed to support low power modes and Wake-OnRadio operation.
4.2
Receiver
CC1200 features a highly flexible receiver. The received RF signal is amplified by the low-noise
amplifier (LNA) and down-converted in quadrature (I and Q) to the intermediate frequency (IF). At
IF, the I/Q signals are digitized by the high dynamic range ADCs.
An advanced Automatic Gain Control (AGC) unit adjusts the front-end gain, and enables the
CC1200 to receive both strong and weak signals, even in the presence of strong interferers. High
attenuation channel and data filtering enable reception with strong neighbor channel interferers.
The I/Q signal is converted to a phase / magnitude signal to support both FSK and OOK
modulation schemes.
A novel I/Q compensation algorithm removes any problem of I/Q mismatch and hence avoids time
consuming and costly I/Q / image calibration steps in production or in the field.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 19 of 23
CC1200
4.3
Transmitter
The CC1200 transmitter is based on direct synthesis of the RF frequency (in-loop modulation). To
achieve effective spectrum usage, CC1200 has extensive data filtering and shaping in TX to
support high throughput data communication in narrowband channels. The modulator also
controls power ramping to remove issues such as spectral splattering when driving external high
power RF amplifiers.
4.4
Radio Control and User Interface
The CC1200 digital control system is built around MARC (Main Radio Control) implemented using
an internal high performance 16 bit ultra low power processor. MARC handles power modes, radio
sequencing and protocol timing.
A 4-wire SPI serial interface is used for configuration and data buffer access. The digital baseband
includes support for channel configuration, packet handling, and data buffering. The host MCU
can stay in power down until a valid RF packet has been received, and then burst read the data,
greatly reducing the power consumption and computing power required from the host MCU.
The CC1200 radio control and user interface is based on the widely used CC1101 transceiver to
enable easy SW transition between the two platforms. The command strobes and the main radio
states are the same for the two platforms.
For legacy formats CC1200 also includes support for two serial modes. In synchronous serial mode
CC1200 performs bit synchronization and provides the MCU with a bit clock with associated data. In
transparent mode CC1200 outputs the digital baseband signal using a digital interpolation filter to
eliminate jitter introduced by digital filtering and demodulation.
4.5
Enhanced Wake-On-Radio (eWOR)
eWOR, using a flexible integrated sleep timer, enables automatic receiver polling with no
intervention from the MCU. The CC1200 will enter RX, listen and return to sleep if a valid RF packet
is not received. The sleep interval and duty cycle can be configured to make a trade-off between
network latency and power consumption. Incoming messages are time-stamped to simplify timer
re-synchronization.
The eWOR timer runs off an ultra low power 32 kHz RC oscillator. To improve timing accuracy,
the RC oscillator can be automatically calibrated to the RF crystal in configurable intervals.
4.6
Sniff Mode
The CC1200 supports very quick start up times, and requires very few preamble bits. Sniff Mode
uses this to dramatically reduce the current consumption while the receiver is waiting for data.
Since the CC1200 is able to wake up and settle much faster than the length of most preambles, it is
not required to be in RX continuously while waiting for a packet to arrive. Instead, the enhanced
wake-on-radio feature can be used to put the device into sleep periodically. By setting an
appropriate sleep time, the CC1200 will be able to wake up and receive the packet when it arrives
with no performance loss. This removes the need for accurate timing synchronization between
transmitter and receiver, and allows the user to trade off current consumption between the
transmitter and receiver.
Please see the Sniff Mode design note for more information ([7]).
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 20 of 23
CC1200
4.7
Antenna Diversity
Antenna diversity can increase performance in a multi-path environment. An external antenna
switch is required. The switch can be automatically controlled by CC1200 using one of the GPIO
pins (also support for differential output control signal typically used in RF switches).
If antenna diversity is enabled, the GPIO will alternate between high and low states until a valid
RF input signal is detected. An optional acknowledge packet can be transmitted without changing
GPIO state.
An incoming RF signal can be validated by received signal strength, by using the automatic
preamble detector, or a combination of the two. Using the preamble detector will ensure a more
robust system and avoid the need to set a defined signal strength threshold, as this threshold will
set the sensitivity limit of the system.
4.8
WaveMatch
A sophisticated pattern recognition algorithm locks onto the synchronization word without need for
preamble settling bytes. Receiver settling time is therefore reduced to the settling time of the AGC,
typically 4 bits.
The advanced pattern recognition also greatly reduces the problem of false sync triggering on
noise, further reducing power consumption and improving sensitivity and reliability. The pattern
recognition logic can also be used as a high performance preamble detector to reliably detect a
valid preamble in the channel.
Figure 4.2 : Receiver Configurator in SmartRF Studio ([8])
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 21 of 23
CC1200
5
Typical Application Circuit
Very few external components are required for the operation of CC1200. A typical application circuit
is shown below. Note that it does not show how the board layout should be done, which will
greatly influence the RF performance of CC1200.
This section is meant as an introduction only. Note that decoupling capacitors for power pins are
not shown in the figure below.
Optional
VDD
25
AVDD_PFD_CHP
VDD
VDD_GUARD
DCPL_PFD_CHP 26
VDD
AVDD_SYNTH2 27
DCPL_XOSC 29
LPF1 24
2 RESET_N
VDD
LPF0 23
3 GPIO3
AVDD_SYNTH1 22
4 GPIO2
DCPL_VCO 21
CC1200
5 DVDD
6 DCPL
LNA_N 20
LNA_P 19
7 SI
TRX_SW 18
16 N.C.
15 AVDD_RF
VDD
VDD
13 AVDD_IF
14 RBIAS
12 DVDD
VDD
11 CSn
10 GPIO0
PA 17
9 SO (GPIO1)
8 SCLK
MCU connection
SPI interface and
optional gpio pins
VDD
VDD
1
AVDD_XOSC 28
VDD
XOSC_Q1 30
EXT_XOSC 32
(optional control pin
from CC1200)
XOSC_Q2 31
40 MHz
crystal
XOSC/
TCXO
Figure 5.1 : Typical Application Circuit
Please see the reference designs available for the CC1200 for more information ([2], [3], [4], [5]).
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 22 of 23
CC1200
6
Configuration Software
CC1200 can be configured using the SmartRF Studio software [8]. The SmartRF Studio software
is highly recommended for obtaining optimum register settings, and for evaluating performance
and functionality.
TM
7
References
[1] CC120X Low-Power High Performance Sub-1 GHz RF Transceivers (swru346)
[2] CC112x IPC 868/915MHz 2 layer Reference Design (swrr106)
[3] CC112x IPC 868/915MHz 4 layer Reference Design (swrr107)
[4] CC1200EM 420-470 MHz Reference Design (swrr122)
[5] CC1200EM 868-930 MHz Reference Design (swrr121)
[6] DN403 – CC112x/CC120x On-Chip Temperature Sensor (swra415)
[7] DN511 – RX Sniff Mode (swra428)
[8] SmartRF Studio (swrc046)
[9] DN510 – CC112X RSSI and CS Response Time (swra413)
8
History
Revision
Date
Description / Changes
SWRS123B
June 2013
Initial release
SWRS123
April 2013
Preliminary Data Sheet
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS123B – REVISED JUNE 2013
Page 23 of 23
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
CC1200RHBR
ACTIVE
VQFN
RHB
32
3000
Green (RoHS CU NIPDAUAG Level-3-260C-168 HR
& no Sb/Br)
-40 to 85
CC1200
CC1200RHBT
ACTIVE
VQFN
RHB
32
250
Green (RoHS CU NIPDAUAG Level-3-260C-168 HR
& no Sb/Br)
-40 to 85
CC1200
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CC1200RHBR
VQFN
RHB
32
3000
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
CC1200RHBT
VQFN
RHB
32
250
180.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC1200RHBR
VQFN
RHB
32
3000
338.1
338.1
20.6
CC1200RHBT
VQFN
RHB
32
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated