ABC AL16086N8DL

SPECIFICATION FOR APPROVAL
PAGE: 1
REF : 20080424-A
PROD.
ABC'S DWG NO.
THIN FILM CHIP INDUCTOR
NAME
AL1608□□□□L□-□□□
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
C
H
D
G
I
B
I
( PCB Pattern )
Unit : m/m
Series
A
B
C
D
G
H
I
AL1608
1.60±0.10
0.80±0.10
0.45±0.10
0.30±0.20
0.9
0.9
0.6
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a
b
c
a﹒Body：Ceramic
b﹒Internal conductor：Cu
c﹒Terminal electrode：Cu/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
c﹒Terminal strength：
F
Type
F ( kgf )
Time ( sec )
Temperature
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200 ℃ / 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
250
AL1608
0.5
30±5
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
Temperature ( ℃ )
50sec max.
230℃
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PAGE: 2
PROD.
NAME
ABC'S DWG NO.
THIN FILM CHIP INDUCTOR
AL1608□□□□L□-□□□
ABC'S ITEM NO.
Ⅴ﹒ELECTRICAL CHARACTERISITCS：
DWG No.
AL16081N0DL□-□□□
AL16081N2DL□-□□□
AL16081N5DL□-□□□
AL16081N8DL□-□□□
AL16082N2DL□-□□□
AL16082N7DL□-□□□
AL16083N3DL□-□□□
AL16083N9DL□-□□□
AL16084N7DL□-□□□
AL16085N6DL□-□□□
AL16086N8DL□-□□□
AL16088N2DL□-□□□
AL160810NJL□-□□□
AL160812NJL□-□□□
AL160815NJL□-□□□
AL160818NJL□-□□□
AL160822NJL□-□□□
AL160827NJL□-□□□
AL160833NJL□-□□□
AL160839NJL□-□□□
AL160847NJL□-□□□
AL160856NJL□-□□□
AL160868NJL□-□□□
AL1608R10JL□-□□□
Inductance
Q
Test Freq.
( nH )
1.0±0.3
1.2±0.3
1.5±0.3
1.8±0.3
2.2±0.3
2.7±0.3
3.3±0.3
3.9±0.3
4.7±0.3
5.6±0.3
6.8±0.3
8.2±0.3
10.0±5 %
12.0±5 %
15.0±5 %
18.0±5 %
22.0±5 %
27.0±5 %
33.0±5 %
39.0±5 %
47.0±5 %
56.0±5 %
68.0±5 %
100.0±5 %
min
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
( MHz )
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
1). □：Packaging Information… A：Bulk B：Taping Reel
2)."":Reference code
3). Tolerance：B：±0.1 C±0.2 D：±0.3 G：±2% J：±5%
□□□
AR-001A
SRF
( GHz )
min
13.0
13.0
10.0
10.0
8.0
6.0
6.0
6.0
5.0
5.0
5.0
4.0
4.0
3.0
3.0
2.0
2.0
2.0
1.5
1.5
1.5
1.0
1.0
1.0
DC Resistance
(Ω)
max
0.35
0.35
0.35
0.35
0.35
0.45
0.45
0.45
0.55
0.65
0.75
0.95
0.95
1.05
1.35
1.65
1.95
2.35
2.75
3.00
3.00
5.00
5.00
7.50
Rated Current
( mA )
max
800
800
800
300
300
300
300
300
300
300
300
300
300
300
300
300
250
250
250
200
200
150
150
100
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PAGE: 3
PROD.
ABC'S DWG NO.
THIN FILM CHIP INDUCTOR
NAME
AL1608□□□□L□-□□□
ABC'S ITEM NO.
Ⅵ﹒PACKAGING INFORMATION：
( 1 ) Configuration
T
Cover Tape
N
A
B
2.0±0.5
∮C
∮C
D
G
Emobossed Carrier
※Carrier tape width : D
P:4 m/m
4 m/m
End
Start
Leader
no component
200 m/m min.
Trailer
no component
400 m/m min.
Components
User direction of feed
Unit:m/m
( 2 ) Dimensions
Style
A
07 - 08
178
B
21±0.8
C
D
13
8
G
10 +0
N
50 -0
T
12.5
( 3 ) Q'TY & G.W. Per pcakage
Inner : Reel
Series
AL1608
AR-001A
Outer : Carton
Q'TY (pcs)
G.W. (gw)
Style
Q'TY (pcs)
G.W. (Kg)
Size (cm)
5,000
90
07 - 08
250,000
7.0
41 x 39 x 22
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PAGE: 4
PROD.
ABC'S DWG NO.
THIN FILM CHIP INDUCTOR
NAME
AL1608□□□□L□-□□□
ABC'S ITEM NO.
Ⅶ﹒DWGING NUMBER EXPRESSION：
A
L
1
6
0
8
Reference code
Appendix code 2 : Package
Appendix code 1 : Classification
Tolerance code
Electrical code
Dimension code
Type code
Appendix code 1：Product Classification
L：Lead Free Standard products comply with RoHS' requirements
1 ~ 9：Lead Free Special products comply with RoHS' requirements
Appendix code 2：Package Information
Code
AR-001A
Inner package
Inner package Q'TY
A
T.B.D.
T.B.D.
B
T / R ( Reel package )
5000
pcs
Remark
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PAGE: 5
PROD.
ABC'S DWG No.
THIN FILM CHIP INDUCTOR
NAME
AL1608□□□□L□-□□□
ABC'S ITEM No.
Ⅷ﹒RELIABILITY TEST：
Test item
Solderability
Thermal shock test
( Temp. cycle )
Specification
Test condition
More than 95% of the
terminal electrode
Shall be covered
With fresh solder.
Preheat : 155℃ / 4 hours.
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent
Solder temp. : 235±5℃
Flux : Rosin
Dip time : 5±0.5 seconds
Electrical oharacteristics shall
not change more
than ±20%
Room temp.
15 minutes
-55 ℃
30 minutes
Room temp.
15 minutes
+125 ℃
Total : 50 cycles
Humidity Test
Temperature : 40±2℃
Humidity : 90±5%
Time : 1000 hours
High temp.
Resistance test
Temperature : 125±5℃
Applied current : Per spec.
Time : 96 hours
AR-001A
30 minutes