TI DAC34SH84IZAY

DAC34SH84
www.ti.com
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
Quad-Channel, 16-Bit, 1.5 GSPS Digital-to-Analog Converter (DAC)
FEATURES
DESCRIPTION
•
The DAC34SH84 is a very low-power, high-dynamic
range,
quad-channel,
16-bit
digital-to-analog
converter (DAC) with a sample rate as high as
1.5 GSPS.
1
•
•
•
•
•
•
•
•
•
•
Low Power: 1.8 W at 1.5 GSPS, Full Operating
Condition
Multi-DAC Synchronization
Selectable 2×, 4×, 8×, 16× Interpolation Filter
– Stop-Band Attenuation > 90 dBc
Flexible On-Chip Complex Mixing
– Two Independent Fine Mixers With 32-Bit
NCOs
– Power-Saving Coarse Mixers: ±n × fS / 8
High-Performance, Low-Jitter ClockMultiplying PLL
Digital I and Q Correction
– Gain, Phase and Offset
Digital Inverse Sinc Filters
32-Bit DDR Flexible LVDS Input Data Bus
– 8-Sample Input FIFO
– Supports Data Rates up to 750 MSPS
– Data Pattern Checker
– Parity Check
Temperature Sensor
Differential Scalable Output: 10 mA to 30 mA
196-Ball, 12-mm × 12-mm BGA
APPLICATIONS
• Cellular Base Stations
• Diversity Transmit
• Wideband Communications
Space
Space
Space
Space
Space
Space
The device includes features that simplify the design
of complex transmit architectures: 2× to 16× digital
interpolation filters with over 90 dB of stop-band
attenuation simplify the data interface and
reconstruction filters. Independent complex mixers
allow flexible carrier placement. A high-performance
low-jitter clock multiplier simplifies clocking of the
device without significant impact on the dynamic
range. The digital quadrature modulator correction
(QMC) enables complete IQ compensation for gain,
offset and phase between channels in direct
upconversion applications.
Digital data is input to the device through a 32-bit
wide LVDS data bus with on-chip termination. The
wide bus allows the processing of high-bandwidth
signals. The device includes a FIFO, data pattern
checker, and parity test to ease the input interface.
The interface also allows full synchronization of
multiple devices.
The device is characterized for operation over the
entire industrial temperature range of –40°C to 85°C
and is available in a 196-ball, 12-mm × 12-mm, 0.8mm pitch BGA package.
The DAC34SH84 low-power, high-bandwidth support,
superior crosstalk, high dynamic range, and features
are an ideal fit for next-generation communication
systems.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ADVANCE INFORMATION concerns new products in the sampling
or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice.
Copyright © 2012, Texas Instruments Incorporated
ADVANCE INFORMATION
Check for Samples: DAC34SH84
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
ISTR/PARITYABP
ISTR/PARITYABN
100
11 taps
11 taps
x2
x2
x2
x2
16
8 Sample FIFO
De-interleave
16
DACVDD
VFUSE
AB-QMC
Gain and Phase
23 taps
Complex Mixer
(FMIX or CMIX)
59 taps
BIASJ
x
sin(x)
16-b
DACA
IOUTA1
IOUTA2
9 taps
x
sin(x)
16-b
DACB
IOUTB1
IOUTB2
QMC
B-offset
CMIX Control
(±n*Fs/8)
2x–16x Interpolation
FIR0
FIR1
FIR2
DAC
Gain
FIR3
x2
QMC
C-offset
FIR4
x2
x2
x2
59 taps
23 taps
11 taps
11 taps
x2
x2
x2
x2
LVDS
CD-Channel
LVDS
LVDS
cos
x
sin(x)
16-b
DACC
IOUTC1
IOUTC2
9 taps
x
sin(x)
16-b
DACD
IOUTD1
IOUTD2
QMC
D-offset
sin
CD
32-Bit NCO
OSTRP
Temp
Sensor
Control Interface
LVPECL
TESTMODE
SLEEP
ALARM
TXENB
RESETB
SCLK
SDIO
SDENB
SDO
IOVDD2
OSTRN
AVDD
IOVDD
PARITYCDN
x2
GND
PARITYCDP
x2
FIR4
x2
EXTIO
QMC
A-offset
sin
FIR3
CD-QMC
Gain and Phase
SYNCN
LVDS
•
•
•
FIR2
x2
100
SYNCP
Pattern Test
100
•
•
•
FIR1
AB-Channel
16
100
DCD0P
•
•
•
LVDS
•
•
•
DCD0N
16
Programmable Delay
DCD15P
DCD15N
LVDS
100
DAB0N
CD-Data Bus
•
•
•
•
•
•
DAB0P
cos
FIR0
LVDS
Pattern Test
DAB15N
Programmable
Delay
100
ADVANCE INFORMATION
AB-Data Bus
DAB15P
1.2-V
Reference
AB
32-Bit NCO
LVDS
100
DATACLKN
Clock Distribution
100
DATACLKP
DIGVDD
Low Jitter
PLL
LVPECL
DACCLKN
Complex Mixer
(FMIX or CMIX)
DACCLKP
LPF
CLKVDD
PLLAVDD
FUNCTIONAL BLOCK DIAGRAM
B0460-01
2
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DAC34SH84
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14
GND
IOUT
AP
IOUT
AN
GND
IOUT
BN
IOUT
BP
GND
GND
IOUT
CP
IOUT
CN
GND
IOUT
DN
IOUT
DP
GND
13
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
12
DAC
CLKP
GND
CLK
VDD
LPF
GND
GND
EXTIO
BIASJ
GND
CLK
VDD
IO
VDD2
GND
ALARM
SDO
11
DAC
CLKN
GND
PLL
AVDD
PLL
AVDD
AVDD
AVDD
AVDD
AVDD
AVDD
AVDD
TEST
MODE
GND
SLEEP
SDIO
10
GND
GND
GND
AVDD
DAC
VDD
DAC
VDD
DAC
VDD
DAC
VDD
DAC
VDD
DAC
VDD
AVDD
GND
RESET
SDENB
B
9
OSTR
P
OSTR
N
GND
DAC
VDD
DAC
VDD
GND
GND
GND
GND
DAC
VDD
DAC
VDD
GND
TXENA
8
SYNC
P
SYNC
N
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
PARITY PARITY
CDP
CDN
7
DAB
15P
DAB
15N
GND
VFUSE
DIG
VDD
GND
GND
GND
GND
DIG
VDD
VFUSE
GND
DCD
0P
DCD
0N
6
DAB
14P
DAB
14N
GND
IO
VDD
DIG
VDD
GND
GND
GND
GND
DIG
VDD
IO
VDD
GND
DCD
1P
DCD
1N
5
DAB
13P
DAB
13N
GND
IO
VDD
DIG
VDD
DIG
VDD
IO
VDD
IO
VDD
DIG
VDD
DIG
VDD
IO
VDD
GND
DCD
2P
DCD
2N
4
DAB
12P
DAB
12N
DAB
8P
DAB
6P
DAB
4P
DAB
2P
DAB
0P
DCD
15P
DCD
14P
DCD
12P
DCD
10P
DCD
8P
DCD
3P
DCD
3N
3
DAB
11P
DAB
11N
DAB
8N
DAB
6N
DAB
4N
DAB
2N
DAB
0N
DCD
15N
DCD
14N
DCD
12N
DCD
10N
DCD
8N
DCD
4P
DCD
4N
2
DAB
10P
DAB
10N
DAB
7P
DAB
5P
DAB
3P
DAB
1P
ISTR/
DATA
PARITY
CLKP
ABP
DCD
13P
DCD
11P
DCD
9P
DCD
7P
DCD
5P
DCD
5N
1
DAB
9P
DAB
9N
DAB
7N
DAB
5N
DAB
3N
DAB
1N
ISTR/
DATA
PARITY
CLKN
ABN
DCD
13N
DCD
11N
DCD
9N
DCD
7N
DCD
6P
DCD
6N
DAC Output
Data Input
3.3V Supply
Clock Input
CMOS Pins
1.2V Supply
(except for IOVDD2)
Sync/Parity Input
Miscellaneous
Ground
ADVANCE INFORMATION
PINOUT
ZAY Package
(Top View)
SCLK
P0134-01
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DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
PIN FUNCTIONS
PIN
NAME
NO.
I/O
DESCRIPTION
ADVANCE INFORMATION
AVDD
D10, E11,
F11, G11,
H11, J11,
K11, L10
I
Analog supply voltage. (3.3 V)
ALARM
N12
O
CMOS output for ALARM condition. The ALARM output functionality is defined through the config7
register. Default polarity is active-high, but can be changed to active-low via the config0
alarm_out_pol control bit.
BIASJ
H12
O
Full-scale output current bias. For 30-mA full-scale output current, connect 1.28 kΩ to ground.
Change the full-scale output current through coarse_dac(3:0) in config3, bit<15:12>.
CLKVDD
C12, K12
I
Internal clock buffer supply voltage. (1.35 V). It is recommended to isolate this supply from DIGVDD
and DACVDD.
DAB[15..0]P
A7, A6, A5,
A4, A3, A2,
A1, C4, C2,
D4, D2, E4,
E2, F4, F2,
G4
I
DAB[15..0]N
B7, B6, B5,
B4, B3, B2,
B1, C3, C1,
D3, D1, E3,
E1, F3, F1,
G3
I
DCD[15..0]P
H4, J4, J2,
K4, K2, L4,
L2, M4, M2,
N1, N2, N3,
N4, N5, N6,
N7
I
DCD[15..0]N
H3, J3, J1,
K3, K1, L3,
L1, M3, M1,
P1, P2, P3,
P4, P5, P6,
P7
I
LVDS negative input data bits 0 through 15 for the CD-channel path. (See the preceding DCD[15:0]P
description.)
DACCLKP
A12
I
Positive external LVPECL clock input for DAC core with a self-bias
DACCLKN
A11
I
Complementary external LVPECL clock input for DAC core. (See the DACCLKP description.)
DACVDD
D9, E9, E10,
F10, G10,
H10, J10,
K10, K9, L9
I
DAC core supply voltage. (1.35 V). It is recommended to isolate this supply from CLKVDD and
DIGVDD.
DATACLKP
G2
I
LVDS positive input data clock. Internal 100-Ω termination resistor. Input data DAB[15:0]P/N and
DCD[15:0]P/N are latched on both edges of DATACLKP/N (double data rate).
DATACLKN
G1
I
LVDS negative input data clock. (See the DATACLKP description.)
DIGVDD
E5, E6, E7,
F5, J5, K5,
K6, K7
I
Digital supply voltage. (1.3 V). It is recommended to isolate this supply from CLKVDD and DACVDD.
EXTIO
G12
LVDS positive input data bits 0 through 15 for the AB-channel path. Internal 100-Ω termination
resistor. Data format relative to DATACLKP/N clock is double data rate (DDR).
DAB15P is the most-significant data bit (MSB).
DAB0P is the least-significant data bit (LSB).
The order of the bus can be reversed via the config2 revbus bit.
LVDS negative input data bits 0 through 15 for the AB-channel path. (See the preceding DAB[15:0]P
description.)
LVDS positive input data bits 0 through 15 for the CD-channel path. Internal 100-Ω termination
resistor. Data format relative to DATACLKP/N clock is double data rate (DDR).
DCD15P is the most-significant data bit (MSB).
DCD0P is the least-significant data bit (LSB).
The order of the bus can be reversed via the config2 revbus bit.
I/O
Used as an external reference input when the internal reference is disabled through config27
extref_ena = 1. Used as an internal reference output when config27 extref_ena = 0 (default).
Requires a 0.1-μF decoupling capacitor to AGND when used as a reference output.
ISTRP/
PARITYABP
H2
I
LVDS input strobe positive input. Internal 100-Ω termination resistor
The main functions of this input are to sync the FIFO pointer, to provide a sync source to the digital
blocks, and/or to act as a parity input for the AB-data bus.
These functions are captured with the rising edge of DATACLKP/N. This signal should be edgealigned with DAB[15:0]P/N and DCD[15:0]P/N.
The PARITY, SYNC, and ISTR inputs are rotated to allow complete reversal of the data interface
when setting the rev_interface bit in register config1.
ISTRN/
PARITYABN
H1
I
LVDS input strope negative input. (See the ISTRP/PARITYABP description.)
4
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
PIN FUNCTIONS (continued)
NO.
I/O
DESCRIPTION
GND
A10, A13,
A14, B10,
B11, B12,
B13, C5, C6,
C7, C8, C9,
C10, C13,
D8, D13,
D14, E8,
E12, E13,
F6, F7, F8,
F9, F12, F13,
G6, G7, G8,
G9, G13,
G14, H6, H7,
H8, H9, H13,
H14, J6, J7,
J8, J9, J12,
J13, K8, K13,
L8, L13, L14,
M5, M6, M7,
M8, M9,
M10, M11,
M12, M13,
N13, P13,
P14
I
These pins are ground for all supplies.
IOUTAP
B14
O
A-channel DAC current output. Connect directly to ground if unused.
IOUTAN
C14
O
A-channel DAC complementary current output. Connect directly to ground if unused.
IOUTBP
F14
O
B-channel DAC current output. Connect directly to ground if unused.
IOUTBN
E14
O
B-channel DAC complementary current output. Connect directly to ground if unused.
IOUTCP
J14
O
C-channel DAC current output. Connect directly to ground if unused.
IOUTCN
K14
O
C-channel DAC complementary current output. Connect directly to ground if unused.
IOUTDP
N14
O
D-channel DAC current output. Connect directly to ground if unused.
IOUTDN
M14
O
D-channel DAC complementary current output. Connect directly to ground if unused.
IOVDD
D5, D6, G5,
H5, L5. L6
I
Supply voltage for all LVDS I/O. (3.3 V)
IOVDD2
L12
I
Supply voltage for all CMOS I/O. (1.8 V to 3.3 V) This supply can range from 1.8 V to 3.3 V to change
the input and output levels of the CMOS I/O.
LPF
D12
I/O
PLL loop filter connection. If not using the clock-multiplying PLL, the LPF pin can be left unconnected.
OSTRP
A9
I
Optional LVPECL output strobe positive input. This positive-negative pair is captured with the rising
edge of DACCLKP/N. It is used to sync the divided-down clocks and FIFO output pointer in dualsync-sources mode. If unused it can be left unconnected.
OSTRN
B9
I
Optional LVPECL output strobe negative input. (See the OSTRP description.)
PARITYCDP
N8
I
Optional LVDS positive input parity bit for the CD-data bus. The PARITYCDP/N LVDS pair has an
internal 100-Ω termination resistor. If unused, it can be left unconnected.
The PARITY, SYNC, and ISTR inputs are rotated to allow complete reversal of the data interface
when setting the rev_interface bit in register config1.
PARITYCDN
P8
I
Optional LVDS negative input parity bit for the CD-data bus.
PLLAVDD
C11, D11
I
PLL analog supply voltage (3.3 V)
SCLK
P9
I
Serial interface clock. Internal pulldown
SDENB
P10
I
Active-low serial data enable, always an input to the DAC34SH84. Internal pullup
SDIO
P11
I/O
Serial interface data. Bidirectional in 3-pin mode (default) and unidirectional 4-pin mode. Internal
pulldown
SDO
P12
O
Unidirectional serial interface data in 4-pin mode. The SDO pin is in the high-impedance state in 3-pin
interface mode (default).
SLEEP
N11
I
Active-high asynchronous hardware power-down input. Internal pulldown
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ADVANCE INFORMATION
PIN
NAME
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
PIN FUNCTIONS (continued)
PIN
NAME
I/O
NO.
DESCRIPTION
SYNCP
A8
I
LVDS SYNC positive input. Internal 100-Ω termination resistor. If unused it can be left unconnected.
The PARITY, SYNC, and ISTR inputs are rotated to allow complete reversal of the data interface
when setting the rev_interface bit in register config1.
SYNCN
B8
I
LVDS SYNC negative input
RESETB
N10
I
Active-low input for chip RESET. Internal pullup
TXENA
N9
I
Transmit enable active-high input. Internal pulldown
To enable analog output data transmission, set sif_txenable in register config3 to 1 or pull the CMOS
TXENA pin to high.
To disable analog output, set sif_txenable to 0 and pull the CMOS TXENA pin to low. The DAC
output is forced to midscale.
TESTMODE
L11
I
This pin is used for factory testing. Internal pulldown. Leave unconnected for normal operation
VFUSE
D7, L7
I
Digital supply voltage. This supply pin is also used for factory fuse programming. Connect to
DACVDD or DIGVDD for normal operation
ORDERING INFORMATION (1)
ADVANCE INFORMATION
TA
–40°C to 85°C
(1)
ORDER CODE
PACKAGE DRAWING/TYPE
DAC34SH84IZAY
TRANSPORT MEDIA
ZAY / 196 NFBGA
DAC34SH84IZAYR
QUANTITY
Tray
160
Tape and reel
1000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
UNIT
MIN
MAX
DACVDD, DIGVDD, CLKVDD
–0.5
1.5
V
VFUSE
–0.5
1.5
V
IOVDD, IOVDD2
–0.5
4
V
AVDD, PLLAVDD
–0.5
4
V
DAB[15..0]P/N, DCD[15..0]P/N, DATACLKP/N, ISTRP/N, PARITYCDP/N,
SYNCP/N
–0.5
IOVDD + 0.5
V
DACCLKP/N, OSTRP/N
–0.5
CLKVDD + 0.5
V
ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TESTMODE,
TXENA
–0.5
IOVDD2 + 0.5
V
IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N
–1.0
AVDD + 0.5
V
EXTIO, BIASJ
–0.5
AVDD + 0.5
V
LPF
–0.5
PLLAVDD + 0.5
V
Peak input current (any input)
20
mA
Peak total input current (all inputs)
–30
mA
150
°C
150
°C
Supply voltage
range (2)
Pin voltage range (2)
Absolute maximum junction temperature, TJ
Storage temperature range, Tstg
(1)
(2)
6
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of these or any other conditions beyond those indicated under Recommended Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Measured with respect to GND
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
THERMAL INFORMATION
DAC34SH84
THERMAL METRIC (1)
BGA
UNIT
Junction-to-ambient thermal resistance (2)
θJA
37.6
°C/W
(3)
θJCtop
Junction-to-case (top) thermal resistance
6.8
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance (4)
N/A
°C/W
θJB
Junction-to-board thermal resistance (5)
16.8
°C/W
0.2
°C/W
16.4
°C/W
(6)
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter (7)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
MIN
TJ
TA
(1)
NOM
Recommended operating junction temperature
MAX
105
Maximum rated operating junction temperature (1)
125
Recommended free-air temperature
–40
25
85
UNIT
°C
°C
Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate.
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ADVANCE INFORMATION
(196 ball) PINS
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
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ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS (1)
over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP MAX
16
UNIT
Bits
DC ACCURACY
DNL
Differential nonlinearity
INL
Integral nonlinearity
1 LSB = IOUTFS / 216
±2
LSB
±4
LSB
ANALOG OUTPUT
Coarse gain linearity
Offset error
Gain error
Gain mismatch
±0.04
LSB
±0.001
%FSR
With external reference
±2
%FSR
With internal reference
±2
%FSR
With internal reference
±2
%FSR
Mid-code offset
Full-scale output current
10
Output compliance range
20
–0.5
Output resistance
ADVANCE INFORMATION
Output capacitance
30
0.6
mA
V
300
kΩ
5
pF
REFERENCE OUTPUT
VREF
Reference output voltage
1.2
V
Reference output current (2)
100
nA
REFERENCE INPUT
VEXTIO
Input voltage range
Input resistance
0.6
External reference mode
1.2
1.25
V
1
MΩ
Small-signal bandwidth
472
kHz
Input capacitance
100
pF
±1
ppm / °C
With external reference
±15
ppm / °C
With internal reference
±30
ppm / °C
±8
ppm / °C
TEMPERATURE COEFFICIENTS
Offset drift
Gain drift
Reference voltage drift
POWER SUPPLY
(3)
AVDD, IOVDD, PLLAVDD
3.14
3.3
3.46
V
DIGVDD
1.25
1.3
1.35
V
1.3
1.35
1.4
V
1.71
3.3
3.45
CLKVDD, DACVDD
IOVDD2
PSRR
Power-supply rejection ratio
DC tested
±0.25
V
%FSR / V
POWER CONSUMPTION
I(AVDD)
Analog supply current (4)
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
(1)
(2)
(3)
(4)
8
Mode 1
fDAC = 1.5 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL enabled, 20-mA FS output, IF = 200 MHz
135
165
mA
885
950
mA
45
60
mA
127
145
mA
1828 2056
mW
Measured differentially across IOUTP/N with 25 Ω each to GND.
Use an external buffer amplifier with high-impedance input to drive any external load.
To ensure power supply accuracy and to account for power supply filter network loss at operating conditions, the use of the ATEST
function in register config27 to check the internal power supply nodes is recommended.
Includes AVDD, PLLAVDD, and IOVDD
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS (continued)
over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted)
TEST CONDITIONS
I(AVDD)
Analog supply current
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
I(AVDD)
Analog supply current (4)
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
I(AVDD)
Analog supply current (4)
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
I(AVDD)
Analog supply current (4)
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
I(AVDD)
Analog supply current (5)
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
I(AVDD)
Analog supply current(4)
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
I(AVDD)
Analog supply current
I(DIGVDD)
Digital supply current
I(DACVDD)
DAC supply current
I(CLKVDD)
Clock supply current
P
Power dissipation
(5)
MIN
(4)
Mode 2
fDAC = 1.47456 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL disabled, 20-mA FS output, IF = 7.3 MHz
Mode 3
fDAC = 737.28 MSPS, 2x interpolation,
mixer on, QMC on, invsinc off,
PLL disabled, 20-mA FS output, IF = 7.3 MHz
Mode 4
fDAC = 1.47456 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL enabled, IF = 7.3 MHz, channels A/B/C/D
output sleep
Mode 5
Power-down mode: no clock, DAC on sleep
mode (clock receiver sleep),
channels A/B/C/D output sleep, static data
pattern
Mode 6
fDAC = 1 GSPS, 2x interpolation,
mixer off, QMC off, invsinc off,
PLL enabled, 20-mA FS output, IF = 7.3 MHz
Mode 7
fDAC = 1 GSPS, 2x interpolation,
mixer off,QMC off, invsinc off,
PLL disabled, 20-mA FS output, IF = 7.3 MHz
Mode 8
fDAC = 1.47456 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL disabled, IF = 7.3 MHz, channels A/B/C/D
output sleep
TYP MAX
UNIT
115
mA
770
mA
40
mA
95
mA
1562
mW
115
mA
470
mA
21
mA
55
mA
1093
mW
40
mA
710
mA
50
mA
90
mA
1160
mW
28
mA
17
mA
0
mA
20
mA
142
mW
130
mA
570
mA
25
mA
98
mA
1336
mA
115
mA
335
mA
23
mA
70
mA
940
mW
45
mA
655
mA
30
mA
95
mA
1169
mW
ADVANCE INFORMATION
PARAMETER
Includes AVDD, PLLAVDD, and IOVDD
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DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
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ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
LVDS INPUTS: DAB[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, ISTRP/N, SYNCP/N, PARITYCDP/N
TYP
MAX
UNIT
(1)
VA,B+
Logic-high differential
input voltage
threshold
VA,B–
Logic-low differential
input voltage
threshold
VCOM
Input common mode
1
1.2
1.6
V
ZT
Internal termination
85
110
135
Ω
CL
LVDS input
capacitance
fINTERL
Interleaved LVDS
data transfer rate
fDATA
Input data rate
200
mV
–200
2
mV
pF
1500 MSPS
750 MSPS
CLOCK INPUT (DACCLKP/N)
ADVANCE INFORMATION
Duty cycle
Differential voltage (2)
40%
|DACCLKP - DACCLKN|
0.4
Internally biased
common-mode
voltage
Single-ended swing
level
60%
1
V
0.2
V
–0.4
V
DACCLKP/N input
frequency
1500
MHz
fDACCLK /
(8×
interp)
MHz
OUTPUT STROBE (OSTRP/N)
fOSTR
Frequency
fOSTR = fDACCLK / (n × 8 × interp) where n is any positive
integer,
fDACCLK is DACCLK frequency in MHz
Duty cycle
Differential voltage
50%
|OSTRP-OSTRN|
0.4
Internally biased
common-mode
voltage
Single-ended swing
level
1.0
V
0.2
V
–0.4
V
0.7 ×
IOVDD2
V
CMOS INTERFACE: ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TXENA
VIH
High-level input
voltage
VIL
Low-level input
voltage
IIH
High-level input
current
IIL
Low-level input
current
CI
CMOS input
capacitance
ALARM, SDO, SDIO
Iload = –2 mA
VOL
(1)
(2)
10
ALARM, SDO, SDIO
V
–40
40
µA
–40
40
µA
2
Iload = –100 μA
VOH
0.3 ×
IOVDD2
pF
IOVDD2 –
0.2
V
0.8 ×
IOVDD2
V
Iload = 100 μA
0.2
V
Iload = 2 mA
0.5
V
See LVDS INPUTS section for terminology.
Driving the clock input with a differential voltage lower than 1 V may result in degraded performance.
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT TIMING SPECIFICATIONS
Timing LVDS inputs: DAB[15:0]P/N, DCD[15:0]P/N, ISTRP/N, SYNCP/N, PARITYCDP/N, double edge latching
Config36 Setting
ISTRP/N and SYNCP/N reset latched
only on rising edge of DATACLKP/N
clkdly
0
0
30
0
1
–10
0
2
–50
0
3
–90
0
4
–130
0
5
–170
0
6
–210
0
7
–250
1
0
50
2
0
90
3
0
130
4
0
170
5
0
210
6
0
250
7
0
290
ps
ADVANCE INFORMATION
ts(DATA)
Setup time,
DAB[15:0]P/N,
DCD[15:0]P/N,
ISTRP/N, SYNCP/N,
and PARITYCDP/N,
valid to either edge of
DATACLKP/N
datadly
Config36 Setting
th(DATA)
t(ISTR_SYNC)
Hold time,
DAB[15:0]P/N,
DCD[15:0]P/N,
ISTRP/N, SYNCP/N
and PARITYCDP/N
valid after either edge
of DATACLKP/N
ISTRP/N and
SYNCP/N pulse
duration
ISTRP/N and SYNCP/N reset latched
only on rising edge of DATACLKP/N
datadly
clkdly
0
0
200
0
1
240
0
2
280
0
3
320
0
4
360
0
5
400
0
6
440
0
7
480
1
0
190
2
0
150
3
0
110
4
0
70
5
0
30
6
0
–10
7
0
–50
fDATACLK is DATACLK frequency in MHz
1/
2fDATACLK
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ps
ns
11
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TIMING OUTPUT STROBE INPUT: DACCLKP/N rising edge LATCHING
MIN
TYP
MAX
UNIT
(3)
ts(OSTR)
Setup time, OSTRP/N
valid to rising edge of
DACCLKP/N
–80
ps
th(OSTR)
Hold time, OSTRP/N
valid after rising edge
of DACCLKP/N
220
ps
TIMING SYNC INPUT: DACCLKP/N rising edge LATCHING
(4)
ts(SYNC_PLL)
Setup time, SYNCP/N
valid to rising edge of
DACCLKP/N
150
ps
th(SYNC_PLL)
Hold time, SYNCP/N
valid after rising edge
of DACCLKP/N
250
ps
TIMING SERIAL PORT
ADVANCE INFORMATION
ts(SDENB)
Setup time, SDENB to
rising edge of SCLK
20
ns
ts(SDIO)
Setup time, SDIO
valid to rising edge of
SCLK
10
ns
th(SDIO)
Hold time, SDIO valid
to rising edge of
SCLK
5
ns
t(SCLK)
Period of SCLK
1
µs
100
ns
td(Data)
Data output delay
after falling edge of
SCLK
10
ns
tRESET
Minimum RESETB
pulsewidth
25
ns
(3)
(4)
12
Register config6 read (temperature sensor read)
All other registers
OSTR is required in dual-sync-sources mode. In order to minimize the skew, it is recommended to use the same clock distribution
device such as Texas Instruments CDCE62005 to provide the DACCLK and OSTR signals to all the DAC34SH84 devices in the system.
Swap the polarity of the DACCLK outputs with respect to the OSTR ones to establish proper phase relationship.
SYNC is required to synchronize the PLL circuit in mulitple devices. The SYNC signal must meet the timing relationship with respect to
the reference clock (DACCLKP/N) of the on-chip PLL circuit.
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
ELECTRICAL CHARACTERISTICS – AC SPECIFICATIONS
over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS / COMMENTS
MIN
TYP
MAX
UNIT
ANALOG OUTPUT (1)
Maximum DAC rate
ts(DAC)
Output settling time to 0.1%
Transition: code 0x0000 to 0xFFFF
tpd
Output propagation delay
DAC outputs are updated on the falling edge of the DAC
clock. Does not include digital latency (see following).
tr(IOUT)
tf(IOUT)
MSPS
10
ns
2
ns
Output rise time 10% to 90%
220
ps
Output fall time 90% to 10%
220
ps
Digital latency
Power-up
time
1500
No interpolation, FIFO on, mixer off, QMC off, inverse
sinc off
128
2× interpolation
216
4× interpolation
376
8× interpolation
726
16× interpolation
1427
Fine mixer
24
QMC
16
Inverse sinc
20
DAC wake-up time
IOUT current settling to 1% of IOUTFS from output sleep
2
DAC sleep time
IOUT current settling to less than 1% of IOUTFS in output
sleep
2
DAC clock
cycles
μs
AC PERFORMANCE (2)
SFDR
IMD3
NSD
Spurious-free dynamic range,
(0 to fDAC / 2) tone at 0 dBFS
Third-order two-tone intermodulation
distortion,
each tone at –12 dBFS
78
fDAC = 1.5 GSPS, fOUT = 50 MHz
74
fDAC = 1.5 GSPS, fOUT = 70 MHz
71
fDAC = 1.5 GSPS, fOUT = 30 ± 0.5 MHz
87
fDAC = 1.5 GSPS, fOUT = 50 ± 0.5 MHz
85
fDAC = 1.5 GSPS, fOUT = 100 ± 0.5 MHz
78
Noise spectral density, (3)
tone at 0 dBFS
fDAC = 1.5 GSPS, fOUT = 10 MHz
160
fDAC = 1.5 GSPS, fOUT = 80 MHz
158
Adjacent-channel leakage ratio, single
carrier
fDAC = 1.47456 GSPS, fOUT = 30 MHz
76
fDAC = 1.47456 GSPS, fOUT = 153 MHz
75
Alternate-channel leakage ratio, single
carrier
fDAC = 1.47456 GSPS, fOUT = 30 MHz
86
Channel isolation
fDAC = 1.5 GSPS, fOUT = 40 MHz
ACLR (3)
(1)
(2)
(3)
fDAC = 1.5 GSPS, fOUT = 20 MHz
fDAC = 1.47456 GSPS, fOUT = 153 MHz
dBc
dBc
dBc / Hz
dBc
82
101
dBc
Measured single-ended into 50-Ω load.
4:1 transformer output termination, 50-Ω doubly terminated load
Single carrier, W-CDMA with 3.84-MHz BW, 5-MHz spacing, centered at IF, PAR = 12 dB. TESTMODEL 1, 10 ms
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13
ADVANCE INFORMATION
fDAC
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
TYPICAL CHARACTERISTICS
6
5
5
4
Differential Nonlinearity Error (LSB)
Integral Nonlinearity Error (LSB)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
4
3
2
1
0
−1
−2
−3
−4
−5
−6
0
10k
20k
ADVANCE INFORMATION
30k
Code
40k
50k
3
2
1
0
−1
−2
−3
−4
−5
60k
0
Figure 1. Integral Nonlinearity
SFDR (dBc)
Second Order Harmonic Distortion (dB)
0dBFS
−6dBFS
−12dBFS
70
60
50
40
30
20
10
0
100
200
300
400
Output Frequency (dB)
500
600
50k
60k
0dBFS
−6dBFS
−12dBFS
90
80
70
60
50
40
30
20
0
100
200
300
400
Output Frequency (MHz)
500
600
G004
110
0dBFS
−6dBFS
−12dBFS
100
90
90
80
70
60
80
70
60
50
50
40
40
0
100
200
300
400
Output Frequency (MHz)
500
FDAC = 750 MSPS, 1x interpolation
FDAC = 1500 MSPS, 2x interpolation
FDAC = 1500 MSPS, 4x interpolation
FDAC = 1500 MSPS, 8x interpolation
FDAC = 1500 MSPS, 16x interpolation
100
SFDR (dBc)
Third−Order Harmonic Distortion (dB)
40k
Figure 4. Second-Harmonic Distortion vs Output Frequency
Over Input Scale
110
600
30
0
G005
Figure 5. Third Harmonic Distortion vs Output Frequency
Over Input Scale
14
30k
Code
100
G003
Figure 3. SFDR vs Output Frequency Over Input Scale
30
20k
Figure 2. Differential Nonlinearity
90
80
10k
100
200
300
400
Output Frequency (MHz)
500
600
G006
Figure 6. SFDR vs Output Frequency Over Interpolation
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
100
100
fDAC = 800 MSPS
fDAC = 1000 MSPS
fDAC = 1200 MSPS
fDAC = 1500 MSPS
80
SFDR (dBc)
SFDR (dBc)
80
70
60
50
60
50
40
30
30
0
100
200
300
Output Frequency (MHz)
400
20
500
−10
400
500
G008
−10
−20
−30
−40
−50
−30
−40
−50
−60
−60
−70
−70
−80
−80
10
110
210
310
410
510
Frequency (MHz)
610
710
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 70 MHz
0
Power (dBm)
−20
−90
800
10
110
210
G009
Figure 9. Single-Tone Spectral Plot
310
410
510
Frequency (MHz)
610
710
800
G010
Figure 10. Single-Tone Spectral Plot
10
10
fDAC = 1500 MSPS
fout = 150 MHz
0
−10
−10
−20
−20
−30
−40
−50
−30
−40
−50
−60
−60
−70
−70
−80
−80
10
110
210
310
410
510
Frequency (MHz)
610
710
fDAC = 1500 MSPS
fout = 200 MHz
0
Power (dBm)
Power (dBm)
200
300
Output Frequency (MHz)
10
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 20 MHz
0
−90
100
Figure 8. SFDR vs Output Frequency Over IOUTFS
10
−90
0
G007
Figure 7. SFDR vs Output Frequency Over fDAC
Power (dBm)
70
40
20
Iout FS = 10 mA, 4:1 Transformer
Iout FS = 20 mA, 4:1 Transformer
Iout FS = 30 mA, 2:1 Transformer
90
ADVANCE INFORMATION
90
800
−90
10
G011
Figure 11. Single-Tone Spectral Plot
110
210
310
410
510
Frequency (MHz)
610
710
Product Folder Link(s): DAC34SH84
G012
Figure 12. Single-Tone Spectral Plot
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800
15
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
100
10
PLL enabled w/ PFD of 46.875 MHz
fDAC = 1500 MSPS
fout = 200 MHz
0
−10
80
SFDR (dBc)
Power (dBm)
−20
−30
−40
−50
−60
10
110
210
310
410
510
Frequency (MHz)
610
710
200
300
400
Output Frequency (MHz)
500
600
G014
ADVANCE INFORMATION
100
80
90
80
IMD3 (dB)
70
60
50
70
60
50
40
40
30
30
0
100
200
300
400
Output Frequency (MHz)
500
20
600
90
90
80
80
70
70
IMD3 (dBc)
100
60
50
fDAC = 800 MSPS
fDAC = 1000 MSPS
fDAC = 1200 MSPS
fDAC = 1500 MSPS
30
0
100
200
300
Output Frequency (MHz)
0
100
200
300
400
Output Frequency (MHz)
500
600
G016
Figure 16. IMD3 vs Output Frequency Over Interpolation
100
40
FDAC = 750 MSPS, 1x interpolation
FDAC = 1500 MSPS, 2x interpolation
FDAC = 1500 MSPS, 4x interpolation
FDAC = 1500 MSPS, 8x interpolation
FDAC = 1500 MSPS, 16x interpolation
G015
Figure 15. IMD3 vs Output Frequency Over Input Scale
20
100
Figure 14. SFDR vs Output Frequency Over Clocking
Options
0dB FS
−6dB FS
−12dB FS
90
20
0
G013
100
IMD3 (dBc)
50
20
800
Figure 13. Single-Tone Spectral Plot
IMD3 (dB)
60
30
−80
Iout FS = 10 mA, 4:1 Transformer
Iout FS = 20 mA, 4:1 Transformer
Iout FS = 30 mA, 2:1 Transformer
60
50
40
30
400
500
20
0
G017
Figure 17. IMD3 vs Output Frequency Over fDAC
16
70
40
−70
−90
PLL disabled
PLL enabled w/ PFD of 46.875 MHz
90
100
200
300
Output Frequency (MHz)
400
500
G018
Figure 18. IMD3 vs Output Frequency Over IOUTFS
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
0
Power (dBm)
−30
−40
−50
−60
−70
−80
−90
−100
−110
64
66
68
70
72
Frequency (MHz)
74
76
10
0
−10
−20
−30
−40
−50
−60
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 200 MHz
Tone spacing = 1 MHz
−70
−80
−90
−100
−110
194
196
G019
Figure 19. Two-Tone Spectral Plot
198
200
202
Frequency (MHz)
206
G020
Figure 20. Two-Tone Spectral Plot
100
170
PLL disabled
PLL enabled w/ PFD of 46.875 MHz
90
0dBFS
−6dBFS
−12dBFS
160
NSD (dBc/Hz)
80
IMD3 (dBc)
204
ADVANCE INFORMATION
−20
Power (dBm)
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 70 MHz
Tone spacing = 1 MHz
−10
70
60
50
150
140
130
40
120
30
20
0
100
200
300
Output Frequency (MHz)
400
110
500
170
170
160
160
150
140
120
FDAC = 750 MSPS, 1x interpolation
FDAC = 1500 MSPS, 2x interpolation
FDAC = 1500 MSPS, 4x interpolation
FDAC = 1500 MSPS, 8x interpolation
FDAC = 1500 MSPS, 16x interpolation
0
100
200
300
400
Output Frequency (MHz)
100
600
600
G022
140
fDAC = 800 MSPS
fDAC = 1000 MSPS
fDAC = 1200 MSPS
fDAC = 1500 MSPS
120
0
G023
Figure 23. NSD vs Output Frequency Over Interpolation
500
150
130
500
200
300
400
Output Frequency (dB)
Figure 22. NSD vs Output Frequency Over Input Scale
NSD (dBc/Hz)
NSD (dBc/Hz)
Figure 21. IMD3 vs Output Frequency Over Clocking
Options
130
0
G021
100
200
300
Output Frequency (MHz)
400
500
G024
Figure 24. NSD vs Output Frequency Over fDAC
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
180
170
Iout FS = 10 mA, 4:1 Transformer
Iout FS = 20 mA, 4:1 Transformer
Iout FS = 30 mA, 2:1 Transformer
160
NSD (dBc)
NSD (dBc/Hz)
170
PLL disabled
PLL enabled w/ PFD of 46.875 MHz
160
150
140
130
140
130
0
100
200
300
Output Frequency (MHz)
400
120
500
0
500
600
G026
ADVANCE INFORMATION
−30
PLL disabled
PLL enabled w/ PFD of 46.08 MHz
−30
PLL disabled
PLL enabled w/ PFD of 46.08 MHz
−40
−50
ACLR (dBc)
−40
−50
−60
−70
−60
−70
−80
−80
−90
fDAC = 1474.56 MSPS
18
200
300
400
Output Frequency (MHz)
Figure 26. NSD vs Output Frequency Over Clocking Options
−20
−90
100
G025
Figure 25. NSD vs Output Frequency Over IOUTFS
ACLR (dBc)
150
0
100
200
300
Output Frequency (MHz)
fDAC = 1474.56 MSPS
400
500
−100
0
G027
100
200
300
Output Frequency (MHz)
400
500
G028
Figure 27. Single-Carrier WCDMA ACLR (Adjacent) vs
Output Frequency Over Clocking Options
Figure 28. Single-Carrier WCDMA ACLR (Alternate) vs
Output Frequency Over Clocking Options
Figure 29. Single-Carrier WCDMA Test Mode1
Figure 30. Single-Carrier WCDMA Test Mode1
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TYPICAL CHARACTERISTICS (continued)
Figure 31. Single-Carrier WCDMA Test Mode1
ADVANCE INFORMATION
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
Figure 32. Four-Carrier WCDMA Test Mode1
vs
Figure 33. Four-Carrier WCDMA Test Mode1
Figure 34. Four-Carrier WCDMA Test Mode1
Figure 35. 10-MHz Single-Carrier LTE Test Mode3.1
Figure 36. 10-MHz Single-Carrier LTE Test Mode3.1
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
Figure 37. 20-MHz Single-Carrier LTE Test Mode3.1
Figure 38. 20-MHz Single-Carrier LTE Test Mode3.1
1800
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
1600
Power (mW)
1400
1400
1200
1000
800
1200
1000
800
Baseband input = 10 MHz
NCO disabled
QMC disabled
600
400
300
500
700
900
1100
1300
fDAC (MHz)
400
300
1500
500
700
900
1100
1300
fDAC (MHz)
G039
1500
G040
Figure 40. Power vs fDAC Over Interpolation
200
QMC enabled
NCO enabled
180
DIGVDD current (mA)
Power consumption (mW)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
300
Baseband input = 0 MHz
NCO enabled w/ 10 MHz mixing
QMC enabled
600
Figure 39. Power vs fDAC Over Interpolation
QMC enabled
NCO enabled
160
140
120
100
80
60
40
20
500
700
900
fDAC (dB)
1100
1300
1500
0
300
500
700
900
fDAC (dB)
G041
Figure 41. Power Consumption vs fDAC Over Digital
Processing Functions
20
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
1600
Power (mW)
ADVANCE INFORMATION
1800
1100
1300
1500
G042
Figure 42. DIGVDD Current vs fDAC Over Digital Processing
Functions
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
800
500
400
300
Baseband input = 10 MHz
NCO disabled
QMC disabled
200
100
300
500
700
900
1100
1300
fDAC (MHz)
600
500
400
300
Baseband input = 0 MHz
NCO enabled w/ 10 MHz mixing
QMC enabled
200
100
300
1500
500
700
900
1100
1300
1500
fDAC (MHz)
G043
Figure 43. DIGVDD Current vs fDAC Over Interpolation
G044
Figure 44. DIGVDD Current vs fDAC Over Interpolation
ADVANCE INFORMATION
600
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
700
DIGVDD current (mA)
DIGVDD current (mA)
700
800
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
100
40
CLKVDD current (mA)
DACVDD current (mA)
90
30
20
10
80
70
60
50
40
30
0
300
500
700
900
1100
1300
fDAC (MHz)
20
300
1500
130
110
120
100
Isolation (dBc)
AVDD current (mA)
120
110
100
90
50
1300
fDAC (MHz)
1500
1500
G046
NCO Enabled
Channel AB and CD Outputs Are 1 MHz Apart
Measured With TSW30SH84 EVM
70
70
1100
1300
80
60
900
1100
90
80
700
900
Figure 46. CLKVDD Current vs fDAC
140
500
700
fDAC (MHz)
Figure 45. DACVDD Current vs fDAC Over Interpolation
60
300
500
G045
40
Channel AB Suppressing Channel CD
Channel CD Suppressing Channel AB
0
G047
Figure 47. AVDD Current vs fDAC
100
200
300
IF (MHz)
400
500
G048
Figure 48. Channel Isolation vs IF
DEFINITION OF SPECIFICATIONS
Adjacent-Carrier Leakage Ratio (ACLR): Defined for a 3.84-Mcps 3GPP W-CDMA input signal measured in a
3.84-MHz bandwidth at a 5-MHz offset from the carrier with a 12-dB peak-to-average ratio
Analog and Digital Power Supply Rejection Ratio (APSSR, DPSSR): Defined as the percentage error in the
ratio of the delta IOUT and delta supply voltage normalized with respect to the ideal IOUT current
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Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1-LSB
change in the digital input code
Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the
value at ambient (25°C) to values over the full operating temperature range
Gain Error: Defined as the percentage error (in FSR%) for the ratio between the measured full-scale output
current and the ideal full-scale output current
Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output,
determined by a straight line drawn from zero scale to full scale
Intermodulation Distortion (IMD3): The two-tone IMD3 is defined as the ratio (in dBc) of the third-order
intermodulation distortion product to either fundamental output tone.
Offset Drift: Defined as the maximum change in dc offset, in terms of ppm of full-scale range (FSR) per °C, from
the value at ambient (25°C) to values over the full operating temperature range
Offset Error: Defined as the percentage error (in FSR%) for the ratio between the measured mid-scale output
current and the ideal mid-scale output current
ADVANCE INFORMATION
Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the
current-output DAC. Exceeding this limit may result in reduced reliability of the device or adversely affect
distortion performance.
Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius
from the value at ambient (25°C) to values over the full operating temperature range
Spurious-Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the
output signal and the peak spurious signal within the first Nyquist zone
Noise Spectral Density (NSD): Defined as the difference of power (in dBc) between the output tone signal
power and the noise floor of 1-Hz bandwidth within the first Nyquist zone
SERIAL INTERFACE
The serial port of the DAC34SH84 is a flexible serial interface which communicates with industry-standard
microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the
operating modes of the DAC34SH84. It is compatible with most synchronous transfer formats and can be
configured as a three- or four-pin interface by sif4_ena in register config2. In both configurations, SCLK is the
serial-interface input clock and SDENB is serial-interface enable. For the three-pin configuration, SDIO is a
bidirectional pin for both data in and data out. For the four-pin configuration, SDIO is data-in only and SDO is
data-out only. Data is input into the device with the rising edge of SCLK. Data is output from the device on the
falling edge of SCLK.
Each read/write operation is framed by the serial-data enable bar (SDENB) signal asserted low. The first frame
byte is the instruction cycle which identifies the following data transfer cycle as read or write as well as the 7-bit
address to be accessed. Table 1 indicates the function of each bit in the instruction cycle and is followed by a
detailed description of each bit. The data transfer cycle consists of two bytes.
Table 1. Instruction Byte of the Serial Interface
MSB
Bit
Description
7
R/W
LSB
6
A6
5
A5
4
A4
3
A3
2
A2
1
A1
0
A0
R/W
Identifies the following data transfer cycle as a read or write operation. A high indicates a read
operation from the DAC34SH84 and a low indicates a write operation to the DAC34SH84.
[A6 : A0]
Identifies the address of the register to be accessed during the read or write operation.
22
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Figure 49 shows the serial interface timing diagram for a DAC34SH84 write operation. SCLK is the serial interface clock input to DAC34SH84. Serial data
enable SDENB is an active low input to DAC34SH84. SDIO is serial data in. Input data to DAC34SH84 is clocked on the rising edges of SCLK.
Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
rwb
A6
A5
A4
tS(SDENB)
A3
A2
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
ADVANCE INFORMATION
SDIO
t(SCLK)
SDENB
SCLK
SDIO
tH(SDIO)
tS(SDIO)
T0521-01
Figure 49. Serial-Interface Write Timing Diagram
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Figure 50 shows the serial interface timing diagram for a DAC34SH84 read operation. SCLK is the serial interface clock input to the DAC34SH84. Serialdata enable SDENB is an active-low input to the DAC34SH84. SDIO is serial data-in during the instruction cycle. In the three-pin configuration, SDIO is
data out from the DAC34SH84 during the data transfer cycle, whereas SDO is in a high-impedance state. In the four-pin configuration, SDO is data-out
from the DAC34SH84 during the data transfer cycle. At the end of the data transfer, SDIO and SDO output low on the final falling edge of SCLK until the
rising edge of SDENB, when SDO goes into the high-impedance state.
Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
ADVANCE INFORMATION
SDIO
rwb
A6
A5
A4
A3
A2
A1
SDO
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDENB
SCLK
SDIO
SDO
Data n
Data n – 1
td(Data)
T0522-01
Figure 50. Serial-Interface Read Timing Diagram
24
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Table 2. Register Map (1)
Name
Address
Default
(MSB)
Bit 15
Bit 14
Bit 13
Bit 12
config0
0x00
0x049C
qmc_
offsetAB_
ena
qmc_
offsetCD_
ena
qmc_
corrAB_
ena
qmc_
corrCD_
ena
config1
0x01
0x040E
iotest_
ena
reserved
reserved
64cnt_en
a
oddeven_
parity
parity_
ena
single_
dual_
parity
config2
0x02
0x7000
reserved
dacclk
gone_ena
dataclk
gone_ena
collision_
gone_ena
reserved
reserved
reserved
config3
0x03
0xF000
config4
0x04
NA
config5
0x05
NA
config6
0x06
NA
config7
0x07
0xFFFF
config8
0x08
0x0000
config9
0x09
0x8000
config10
0x0A
0x0000
reserved
config11
0x0B
0x0000
config12
0x0C
0x0400
config13
0x0D
0x0400
config14
0x0E
0x0400
config15
0x0F
0x0400
config16
0x10
0x0000
config17
0x11
0x0000
reserved
config18
0x12
0x0000
phase_offsetAB(15:0)
config19
0x13
0x0000
phase_offsetCD(15:0)
config20
0x14
0x0000
phase_addAB(15:0)
config21
0x15
0x0000
phase_addAB(31:16)
config22
0x16
0x0000
phase_addCD(15:0)
config23
0x17
0x0000
phase_addCD(31:16)
config24
0x18
NA
config25
0x19
0x0440
config26
0x1A
Bit 11
Bit 9
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
(LSB)
Bit 0
fifo_ena
reserved
reserved
alarm_out_
ena
alarm_out
pol
clkdiv_sync_
ena
invsincAB_
ena
invsincCD_
ena
rev_
interface
dacA_
complement
dacB_
complement
dacC_
complement
dacD_
complement
alarm_
2away_
ena
alarm_
1away_
ena
alarm_
collision_
ena
reserved
reserved
sif4_ena
mixer_ena
mixer_gain
nco_ena
revbus
reserved
twos
reserved
Bit 8
interp(3:0)
coarse_dac(3:0)
reserved
reserved
sif_txenable
alarm_
from_
zerochk
reserved
alarms_from_fifo(2:0)
alarm_
dacclk_
gone
alarm_
dataclk_
gone
alarm_
from_
iotest
alarm_
output_
gone
reserved
alarm_
from_pll
tempdata(7:0)
alarm_
Aparity
alarm_
Bparity
alarm_
Cparity
reserved
alarm_
Dparity
reserved
reserved
reserved
alarms_mask(15:0)
reserved
reserved
reserved
qmc_offsetA(12:0)
reserved
reserved
qmc_offsetC(12:0)
reserved
reserved
reserved
reserved
reserved
reserved
fifo_offset(2:0)
qmc_offsetB(12:0)
qmc_offsetD(12:0)
reserved
cmix(3:0)
reserved
qmc_gainA(10:0)
reserved
qmc_gainB(10:0)
reserved
reserved
qmc_gainC(10:0)
output_delayAB(1:0)
output_delayCD(1:0)
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
pll_reset
qmc_gainD(10:0)
qmc_phaseAB(11:0)
qmc_phaseCD(11:0)
pll_
ndivsync_
ena
pll_ena
reserved
pll_cp(1:0)
pll_m(7:0)
0x0020
reserved
reserved
0x1B
0x0000
config28
0x1C
0x0000
reserved
config29
0x1D
0x0000
reserved
config30
0x1E
0x1111
syncsel_qmoffsetAB(3:0)
reserved
fuse_
sleep
pll_lfvolt(2:0)
pll_n(3:0)
pll_vco(5:0)
extref_
ena
pll_p(2:0)
reserved
reserved
reserved
bias_
sleep
reserved
reserved
reserved
tsense_
sleep
reserved
pll_sleep
pll_vcoitune(1:0)
clkrecv_
sleep
sleepA
sleepB
reserved
sleepC
sleepD
reserved
reserved
reserved
syncsel_qmoffsetCD(3:0)
syncsel_qmcorrAB(3:0)
syncsel_qmcorrCD(3:0)
Unless otherwise noted, all reserved registers should be programmed to default values.
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ADVANCE INFORMATION
iotest_results(15:0)
config27
(1)
Bit 10
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Table 2. Register Map (continued)
(MSB)
Bit 15
ADVANCE INFORMATION
Name
Address
Default
Bit 14
Bit 13
Bit 12
Bit 11
config31
0x1F
0x1140
syncsel_mixerAB(3:0)
syncsel_mixerCD(3:0)
config32
0x20
0x2400
syncsel_fifoin(3:0)
syncsel_fifoout(3:0)
config33
0x21
0x0000
config34
0x22
0x1B1B
config35
0x23
0xFFFF
config36
0x24
0x0000
config37
0x25
0x7A7A
iotest_pattern0
config38
0x26
0xB6B6
iotest_pattern1
config39
0x27
0xEAEA
iotest_pattern2
config40
0x28
0x4545
iotest_pattern3
config41
0x29
0x1A1A
iotest_pattern4
config42
0x2A
0x1616
iotest_pattern5
config43
0x2B
0xAAAA
iotest_pattern6
config44
0x2C
0xC6C6
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
syncsel_nco(3:0)
Bit 3
Bit 2
syncsel_fifo_input
Bit 1
(LSB)
Bit 0
sif_sync
reserved
clkdiv_
sync_sel
reserved
reserved
pathA_in_set(1:0)
pathB_in_set(1:0)
pathC_in_set(1:0)
pathD_in_set(1:0)
DACA_out_set(1:0)
DACB_out_set(1:0)
DACC_out_set(1:0)
DACD_out_set(1:0)
sleep_cntl(15:0)
datadly(2:0)
clkdly(2:0)
reserved
iotest_pattern7
reserved
ostrtodig_
sel
config45
0x2D
0x0004
config46
0x2E
0x0000
grp_delayA(7:0)
config47
0x2F
0x0000
grp_delayC(7:0)
config48
0x30
0x0000
version
0x7F
0x5409
26
Bit 10
ramp_ena
reserved
sifdac_ena
grp_delayB(7:0)
grp_delayD(7:0)
sifdac(15:0)
reserved
reserved
reserved
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reserved
deviceid(1:0)
versionid(2:0)
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REGISTER DESCRIPTIONS
Register name: config0 – Address: 0x00, Default: 0x049C
Register
Name
Address
Bit
Name
config0
0x00
15
qmc_offsetAB_ena
When set, the digital quadrature modulator correction (QMC) offset
correction for the AB data path is enabled.
0
14
qmc_offsetCD_ena When set, the digital QMC offset correction for the CD data path is
enabled.
0
13
qmc_corrAB_ena
When set, the QMC phase and gain correction circuitry for the AB
data path is enabled.
0
12
qmc_corrCD_ena
When set, the QMC phase and gain correction circuitry for the CD
data path is enabled.
0
interp(3:0)
These bits define the interpolation factor.
0100
interp
Interpolation Factor
0000
1×
0001
2×
0010
4×
0100
8×
1000
16×
7
fifo_ena
When set, the FIFO is enabled. When the FIFO is disabled.
DACCCLKP/N and DATACLKP/N must be aligned (not
recommended).
1
6
Reserved
Reserved for factory use
0
5
Reserved
Reserved for factory use
0
4
alarm_out_ena
When set, the ALARM pin becomes an output. When cleared, the
ALARM pin is in the high-impedance state.
1
3
alarm_out_pol
This bit changes the polarity of the ALARM signal.
MM 0: Negative logic
MM 1: Positive logic
1
2
clkdiv_sync_ena
When set, enables the syncing of the clock divider and the FIFO
output pointer using the sync source selected by register config32.
The internal divided-down clocks are phase-aligned after syncing.
See the Power-Up Sequence section for more detail.
1
1
invsincAB_ena
When set, the inverse sinc filter for the AB data path is enabled.
0
0
invsincCD_ena
When set, the inverse sinc filter for the CD data path is enabled.
0
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ADVANCE INFORMATION
11:8
Default
Value
Function
27
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Register name: config1 – Address: 0x01, Default: 0x040E
Address
Bit
config1
0x01
15
iotest_ena
When set, enables the data pattern checker test. The outputs are
deactivated regardless of the state of TXENA and sif_txenable.
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
0
12
64cnt_ena
When set, enables resetting of the alarms after 64 good samples
with the goal of removing unnecessary errors. For instance, when
checking setup or hold through the pattern checker test, there may
initially be errors. Setting this bit removes the need for a SIF write to
clear the alarm register.
0
11
oddeven_parity
Selects between odd and even parity check
MM 0: Even parity
MM 1: Odd parity
0
10
parity_ena
When set, enables parity checking of each input word using the 1
PARITYP/N parity input. It should match the oddeven_parity
register setting.
1
9
single_dual_parity
When set, enables dual parity checking; otherwise, single parity
checking. The parity bit should match the oddeven_parity register
setting. parity_ena must be set for dual parity to function.
0
8
rev_interface
When set, the PARITY, SYNC, and ISTR inputs are rotated to allow
complete reversal of the data interface when setting the
rev_interface bit.
When rev_interface = 1, the following changes occurs
MM 1. SYNCP/N becomes ISTRP/N.
MM 2. PARITYP/N becomes SYNCP/N.
MM 3. ISTRP/N becomes PARITYP/N.
0
7
dacA_complement
When set, the DACA output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
0
6
dacB_complement
When set, the DACB output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
0
5
dacC_complement
When set, the DACC output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
0
4
dacD_complement
When set, the DACD output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
0
3
alarm_2away_ena
When set, the alarm from the FIFO indicating the write and read
pointers being 2 away is enabled.
1
2
alarm_1away_ena
When set, the alarm from the FIFO indicating the write and read
pointers being 1 away is enabled.
1
1
alarm_collision_ena
When set, the alarm from the FIFO indicating a collision between the
write and read pointers is enabled.
1
0
Reserved
Reserved for factory use
0
ADVANCE INFORMATION
Register
Name
28
Name
Default
Value
Function
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Register name: config2 – Address: 0x02, Default: 0x7000
Address
Bit
config2
0x02
15
Reserved
Reserved for factory use
0
14
dacclkgone_ena
When set, the DACCLK-gone signal from the clock monitor circuit can
be used to shut off the DAC outputs. The corresponding alarms,
alarm_dacclk_gone and alarm_output_gone, must not be masked
(i.e., config7, bit <10> and bit <8> must set to 0).
1
13
dataclkgone_ena
When set, the DATACLK-gone signal from the clock monitor circuit
can be used to shut off the DAC outputs. The corresponding alarms,
alarm_dataclk_gone and alarm_output_gone, must not be masked
(i.e., config7, bit <9> and bit <8> must set to 0).
1
12
collisiongone_ena
When set, the FIFO collision alarms can be used to shut off the DAC
outputs. The corresponding alarms, alarm_fifo_collision and
alarm_output_gone, must not be masked (i.e., config7, bit <13> and
bit <8> must set to 0).
1
11
Reserved
Reserved for factory use
0
10
Reserved
Reserved for factory use
0
9
Reserved
Reserved for factory use
0
8
Reserved
Reserved for factory use
0
7
sif4_ena
When set, the serial interface (SIF) is a 4-bit interface; otherwise, it is
a 3-bit interface.
0
6
mixer_ena
When set, the mixer block is enabled.
0
5
mixer_gain
When set, a 6-dB gain is added to the mixer output.
0
4
nco_ena
When set, the NCO is enabled. This is not required for coarse mixing.
0
3
revbus
When set, the input bits for the data bus are reversed. MSB becomes
LSB.
0
2
Reserved
Reserved for factory use
0
1
twos
When set, the input data format is expected to be 2s-complement.
When cleared, the input is expected to be offset-binary.
0
0
Reserved
Reserved for factory use
0
Name
Default
Value
Function
ADVANCE INFORMATION
Register
Name
Register name: config3 – Address: 0x03, Default: 0xF000
Register
Name
Address
Bit
config3
0x03
15:12
Name
coarse_dac(3:0)
Default
Value
Function
Scales the output current in 16 equal steps.
IFS
1111
V
= EXTIO ´ 2 ´ (coarse _ dac + 1)
RBIAS
11:8
Reserved
Reserved for factory use
0000
7:1
Reserved
Reserved for factory use
0000 000
sif_txenable
When set, the internal value of TXENABLE is set to 1.
To enable analog output data transmission, set sif_txenable to 1 or
pull the CMOS TXENA pin (N9) to high. To disable analog output,
set sif_txenable to 0 and pull the CMOS TXENA pin (N9) to low.
0
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29
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Register name: config4 – Address: 0x04, Default: No RESET Value (WRITE TO CLEAR)
Register
Name
Address
Bit
config4
0x04
15:0
Name
Function
iotest_results(15:0)
Bits in iotest_results with a logic value of 1 tell which bit in either DAB[15:0]
bus or DCD[15:0] bus failed during the pattern checker test.
iotest_results(15:8) correspond to the data bits on both DAB[15:8] and
DCD[15:8].
iotest_results(7:0) correspond to the data bits on both DAB[7:0] and DCD[7:0].
Default
Value
No RESET
value
Register name: config5 – Address: 0x05, Default: Setup and Power-Up Conditions Dependent (WRITE TO
CLEAR)
Register
Name
Address
config5
0x05
Bit
Function
Default
Value
ADVANCE INFORMATION
15
alarm_from_zerochk
This alarm indicates the 8-bit FIFO write pointer address has an allzeros pattern. Due to the pointer address being a shift register, this
is not a valid address and causes the write pointer to be stuck until
the next sync. This error is typically caused by a timing error or
improper power start-up sequence. If this alarm is asserted,
resynchronization of the FIFO is necessary. See the Power-Up
Sequence section for more detail.
NA
14
Reserved
Reserved for factory use
NA
alarms_from_fifo(2:0)
Alarm indicating FIFO pointer collisions and nearness:
MM 000: All fine
MM 001: Pointers are 2 away.
MM 01x: Pointers are 1 away.
MM 1xx: FIFO pointer collision
If the FIFO pointer collision alarm is set when collisiongone_ena is
enabled, the FIFO must be re-synchronized and the bits must be
cleared to resume normal operation.
NA
10
alarm_dacclk_gone
Alarm indicating the DACCLK has been stopped.
If the bit is set when dacclkgone_ena is enabled, DACCLK must
resume and the bit must be cleared to resume normal operation.
NA
9
alarm_dataclk_gone
Alarm indicating the DATACLK has been stopped.
If the bit is set when dataclkgone_ena is enabled, DATACLK must
resume and the bit must be cleared to resume normal operation.
NA
8
alarm_output_gone
Alarm indicating either alarm_dacclk_gone, alarm_dataclk_gone, or
alarm_fifo_collision are asserted. It controls the output. When high,
it outputs 0x8000 for each output connected to the DAC. If the bit is
set when dacclkgone_ena, dataclkgone_ena, or collisiongone_ena
are enabled, then the corresponding errors must be fixed and the
bits must be cleared to resume normal operation.
NA
7
alarm_from_iotest
Alarm indicating the input data pattern does not match the pattern in
the iotest_pattern registers. When the data pattern checker mode is
enabled, this alarm in register config5, bit7 is the only valid alarm.
Other alarms in register config5 are not valid and can be
disregarded.
NA
6
Reserved
Reserved for factory use
NA
5
alarm_from_pll
Alarm indicating the PLL has lost lock. For version ID 001,
alarm_from_PLL may not indicate the correct status of the PLL. See
pll_lfvolt(2:0) in register config24 for proper PLL lock indication.
NA
4
alarm_Aparity
In dual-parity mode, an alarm indicating a parity error on the A
word. In single-parity mode, an alarm on the 32-bit data captured on
the rising edge of DATACLKP/N.
NA
3
alarm_Bparity
In dual-parity mode, an alarm indicating a parity error on the B
word. In single-parity mode, an alarm on the 32-bit data captured on
the falling edge of DATACLKP/N.
NA
2
alarm_Cparity
In dual-parity mode, an alarm indicating a parity error on the C
word.
NA
1
alarm_Dparity
In dual-parity mode, an alarm indicating a parity error on the D
word.
NA
0
Reserved
Reserved for factory use
NA
13:11
30
Name
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Register name: config6 – Address: 0x06, Default: No RESET Value (READ ONLY)
Register
Name
Address
Bit
config6
0x06
15:8
tempdata(7:0)
This is the output from the chip temperature sensor. The value of this register in
2s-complement format represents the temperature in degrees Celsius. This
register must be read with a minimum SCLK period of 1 μs.
No
RESET
Value
7:2
Reserved
Reserved for factory use
0000 00
1
Reserved
Reserved for factory use
0
0
Reserved
Reserved for factory use
0
Name
Default
Value
Function
Register name: config7 – Address: 0x07, Default: 0xFFFF
Address
Bit
config7
0x07
15:0
Name
alarms_mask(15:0)
Default
Value
Function
These bits control the masking of the alarms. (0 = not masked, 1 = masked)
alarm_mask
Alarm That Is Masked
15
alarm_from_zerochk
14
Not used
13
alarm_fifo_collision
12
alarm_fifo_1away
11
alarm_fifo_2away
10
alarm_dacclk_gone
9
alarm_dataclk_gone
8
alarm_output_gone
7
alarm_from_iotest
6
Not used
5
alarm_from_pll
4
alarm_Aparity
3
alarm_Bparity
2
alarm_Cparity
1
alarm_Dparity
0
Not used
0xFFFF
Register name: config8 – Address: 0x08, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Address
Bit
config8
0x08
15
Reserved
Reserved for factory use
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
qmc_offsetA(12:0)
DACA offset correction. The offset is measured in DAC LSBs. If enabled in config30,
writing to this register causes an auto-sync to be generated. This loads the values of
the QMC offset registers (config8–config9) into the offset block at the same time.
When updating the offset values for the AB channel, config8 should be written last.
Programming config9 does not affect the offset setting.
12:0
Name
Default
Value
Function
0
All zeros
Register name: config9 – Address: 0x09, Default: 0x8000
Register
Name
Address
Bit
config9
0x09
15:13
fifo_offset(2:0)
When the sync to the FIFO occurs, this is the value loaded into the FIFO read pointer. With
this value, the initial difference between write and read pointers can be controlled. This may
be helpful in syncing multiple chips or controlling the delay through the device.
12:0
qmc_offsetB(12:0)
DACB offset correction. The offset is measured in DAC LSBs.
Name
Default
Value
Function
100
All zeros
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Register
Name
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Register name: config10 – Address: 0x0A, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Address
Bit
config10
0x0A
15
Reserved
Reserved for factory use
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
qmc_offsetC(12:0)
DACC offset correction. The offset is measured in DAC LSBs. If enabled in config30
writing to this register causes an auto-sync to be generated. This loads the values of
the CD-channel QMC offset registers (config10-config11) into the offset block at the
same time. When updating the offset values for the CD-channel config10 should be
written last. Programming config11 does not affect the offset setting.
12:0
Name
Default
Value
Function
0
All zeros
Register name: config11 – Address: 0x0B, Default: 0x0000
ADVANCE INFORMATION
Register
Name
Address
Bit
config11
0x0B
15
Reserved
Reserved for factory use
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
qmc_offsetD(12:0)
DACD offset correction. The offset is measured in DAC LSBs.
12:0
Name
Default
Value
Function
0
All zeros
Register name: config12 – Address: 0x0C, Default: 0x0400
Register
Name
Address
Bit
config12
0x0C
15
Reserved
Reserved for factory use
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
0
12
Reserved
Reserved for factory use
0
11
Reserved
Reserved for factory use
qmc_gainA(10:0)
QMC gain for DACA. The full 11-bit qmc_gainA(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between bit
9 and bit 10.
10:0
Name
Default
Value
Function
0
100 0000
0000
Register name: config13 – Address: 0x0D, Default: 0x0400
Register
Name
Address
Bit
config13
0x0D
15:12
11
10:0
Name
Default
Value
Function
cmix_mode(3:0)
Sets the mixing function of the coarse mixer.
MM Bit 15: fS / 8 mixer
MM Bit 14: fS / 4 mixer
MM Bit 13: fS / 2 mixer
MM Bit 12: –fS / 4 mixer
The various mixers can be combined together to obtain a ±n × fS / 8 total mixing factor.
Reserved
Reserved for factory use
qmc_gainB(10:0)
QMC gain for DACB. The full 11-bit qmc_gainB(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between
bit 9 and bit 10.
0000
0
100 0000
0000
Register name: config14 – Address: 0x0E, Default: 0x0400
Register
Name
Address
Bit
config14
0x0E
15
Reserved
Reserved for factory use
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
0
12
Reserved
Reserved for factory use
0
11
Reserved
Reserved for factory use
qmc_gainC(10:0)
QMC gain for DACC. The full 11-bit qmc_gainC(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between
bit 9 and bit 10.
10:0
32
Name
Default
Value
Function
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0
100 0000
0000
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Register name: config15 – Address: 0x0F, Default: 0x0400
Register
Name
Address
Bit
config15
0x0F
15:14
output_
delayAB(1:0)
Delays the AB data path outputs from 0 to 3 DAC clock cycles
00
13:12
output_
delayCD(1:0)
Delays the CD data path outputs from 0 to 3 DAC clock cycles
00
Reserved
Reserved for factory use
qmc_gainD(10:0)
QMC gain for DACD. The full 11-bit qmc_gainD(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between
bit 9 and bit 10.
11
10:0
Name
Default
Value
Function
0
100 0000
0000
Register name: config16 – Address: 0x10, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Address
Bit
config16
0x10
15
Reserved
Reserved for factory use
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
0
12
Reserved
Reserved for factory use
qmc_phaseAB(11:0)
QMC correction phase for the AB data path. The 12-bit qmc_phaseAB(11:0) word is
formatted as 2s-complement and scaled to occupy a range of –0.5 to 0.49975 and a
default phase correction of 0.00. To accomplish QMC phase correction, this value is
multiplied by the current B sample, then summed into the A sample. If enabled in
config30, writing to this register causes an auto-sync to be generated. This
loads the values of the QMC offset registers (config12, config13, and config16)
into the QMC block at the same time. When updating the QMC values for the
AB channel, config16 should be written last. Programming config12 and
config13 does not affect the QMC settings.
Default
Value
Function
0
All zeros
Register name: config17 – Address: 0x11, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Address
Bit
config17
0x11
15
Reserved
Reserved for factory use
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
0
12
Reserved
Reserved for factory use
qmc_phaseCD(11:0)
QMC correction phase for the CD data path. The 12-bit qmc_gainCD(11:0) word is
formatted as 2s-complement and scaled to occupy a range of –0.5 to 0.49975 and
a default phase correction of 0.00. To accomplish QMC phase correction, this value
is multiplied by the current D sample, then summed into the C sample. If enabled
in config30, writing to this register causes an auto-sync to be generated. This
loads the values of the CD-channel QMC block registers (config14, config15,
and config17) into the QMC block at the same time. When updating the QMC
values for the CD-channel, config17 should be written last. Programming
config14 and config15 does not affect the QMC settings.
11:0
Name
Default
Value
Function
0
All zeros
Register name: config18 – Address: 0x12, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Address
Bit
Name
Function
config18
0x12
15:0
phase_offsetAB(15:0)
Phase offset added to the AB data path NCO accumulator before the generation of
the SIN and COS values. The phase offset is added to the upper 16 bits of the NCO
accumulator results, and these 16 bits are used in the sin and cos lookup tables. If
enabled in config31, writing to this register causes an auto-sync to be
generated. This loads the values of the fine mixer block registers (config18,
config20, and config21) at the same time. When updating the mixer values,
config18 should be written last. Programming config20 and config21 does not
affect the mixer settings.
Default
Value
0x0000
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ADVANCE INFORMATION
11:0
Name
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Register name: config19 – Address: 0x13, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Address
Bit
config19
0x13
15:0
Name
phase_offsetCD(15:0)
Default
Value
Function
Phase offset added to the CD data path NCO accumulator before the generation of
the SIN and COS values. The phase offset is added to the upper 16 bits of the NCO
accumulator results, and these 16 bits are used in the sin and cos lookup tables. If
enabled in config31, writing to this register causes an auto-sync to be
generated. This loads the values of the CD-channel fine mixer block registers
(config19, config22, and config23) at the same time. When updating the mixer
values for the CD-channel, config19 should be written last. Programming
config22 and config23 does not affect the mixer settings.
0x0000
Register name: config20 – Address: 0x14, Default: 0x0000
Register
Name
Address
Bit
config20
0x14
15:0
Name
phase_ addAB(15:0)
Default
Value
Function
The phase_addAB(15:0) value is used to determine the NCO frequency. The 2scomplement formatted value can be positive or negative. Each LSB represents an fS
/ (232) frequency step.
0x0000
Register name: config21 – Address: 0x15, Default: 0x0000
ADVANCE INFORMATION
Register
Name
Address
Bit
config21
0x15
15:0
Name
phase_ addAB(31:16)
Default
Value
Function
See config20.
0x0000
Register name: config22 – Address: 0x16, Default: 0x0000
Register
Name
Address
Bit
config22
0x16
15:0
Name
phase_ addCD(15:0)
Default
Value
Function
The phase_addCD(15:0) value is used to determine the NCO frequency. The 2scomplement formatted value can be positive or negative. Each LSB represents an fS
/ (232) frequency step.
0x0000
Register name: config23 – Address: 0x17, Default: 0x0000
Register
Name
Address
Bit
config23
0x17
15:0
34
Name
phase_ addCD(31:16)
Function
See config22 above.
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Default
Value
0x0000
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Register name: config24 – Address: 0x18, Default: NA
Register
Name
Address
Bit
config24
0x18
15:13
Reserved
Reserved for factory use
12
pll_reset
When set, the PLL loop filter (LPF) is pulled down to 0 V. Toggle from 1 to 0 to
restart the PLL if an overspeed lockup occurs. Overspeed can happen when the
process is fast, the supplies are higher than nominal, etc., resulting in the feedback
dividers missing a clock.
0
11
pll_ndivsync_ena
When set, the LVDS SYNC input is used to sync the PLL N dividers.
1
10
pll_ena
When set, the PLL is enabled. When cleared, the PLL is bypassed.
0
9:8
Reserved
Reserved for factory use
00
7:6
pll_cp(1:0)
PLL pump charge select
MM 00: No charge pump
MM 01: Single pump charge
MM 10: Not used
MM 11: Dual pump charge
00
5:3
pll_p(2:0)
PLL pre-scaler dividing module control
MM 010: 2
MM 011: 3
MM 100: 4
MM 101: 5
MM 110: 6
MM 111: 7
MM 000: 8
001
2:0
pll_lfvolt(2:0)
PLL loop filter voltage. This 3-bit read-only indicator has step size of 0.4125 V. The
entire range covers from 0 V to 3.3 V. The optimal lock range of the PLL is from 010
to 101 (i.e., 0.825 V to 2.063 V). Adjust pll_vco(5:0) for optimal lock range.
NA
Name
Default
Value
Function
ADVANCE INFORMATION
001
Register name: config25 – Address: 0x19, Default: 0x0440
Register
Name
Address
Bit
config25
0x19
15:8
pll_m(7:0)
M portion of the M/N divider of the PLL.
If pll_m<7> = 0, the M divider value has the range of pll_m<6:0>, spanning from
4 to 127. (i.e., 0, 1, 2, and 3 are not valid.)
If pll_m<7> = 1, the M divider value has the range of 2 × pll_m<6:0>, spanning
from 8 to 254. (i.e., 0, 2, 4, and 6 are not valid. The M divider has even values
only.)
0x04
7:4
pll_n(3:0)
N portion of the M/N divider of the PLL.
MM 0000: 1
MM 0001: 2
MM 0010: 3
MM 0011: 4
MM 0100: 5
MM 0101: 6
MM 0110: 7
MM 0111: 8
MM 1000: 9
MM 1001: 10
MM 1010: 11
MM 1011: 12
MM 1100: 13
MM 1101: 14
MM 1110: 15
MM 1111: 16
0100
3:2
pll_vcoitune(1:0)
PLL VCO bias tuning bits. Set to 01 for normal PLL operation
00
1:0
Reserved
Reserved for factory use
00
Name
Default
Value
Function
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Register name: config26 – Address: 0x1A, Default: 0x0020
Register
Name
Address
Bit
config26
0x1A
15:10
Name
Default
Value
Function
pll_vco(5:0)
VCO frequency coarse-tuning bits.
9
Reserved
Reserved for factory use
0000 00
0
8
Reserved
Reserved for factory use
0
7
bias_sleep
When set, the bias amplifier is put into sleep mode.
0
6
tsense_sleep
Turns off the temperature sensor when asserted.
0
5
pll_sleep
When set, the PLL is put into sleep mode.
1
4
clkrecv_sleep
When asserted, the clock input receiver is put into sleep mode. This affects the
OSTR receiver as well.
0
3
sleepA
When set, the DACA is put into sleep mode.
0
2
sleepB
When set, the DACB is put into sleep mode.
0
1
sleepC
When set, the DACC is put into sleep mode.
0
0
sleepD
When set, the DACD is put into sleep mode.
0
Register name: config27 – Address: 0x1B, Default: 0x0000
ADVANCE INFORMATION
Register
Name
Address
Bit
config27
0x1B
15
extref_ena
Allows the device to use an external reference or the internal reference.
0: Internal reference
1: External reference
0
14
Reserved
Reserved for factory use
0
13
Reserved
Reserved for factory use
0
12
Reserved
Reserved for factory use
0
11
fuse_sleep
Put the fuses to sleep when set high.
Note: Default value is 0. Must be set to 1 for proper operation
0
10
Reserved
Reserved for factory use
0
9
Reserved
Reserved for factory use
0
8
Reserved
Reserved for factory use
0
7
Reserved
Reserved for factory use
0
6
Reserved
Reserved for factory use
atest
ATEST mode allows the user to check for the internal die voltages to ensure the
supply voltages are within range. When the ATEST mode is programmed, the
internal die voltages can be measured at the TXENA pin. The TXENA pin (N9) must
be floating without any pullup or pulldown resistors.
In ATEST mode, the TXENA and sif_txenable logic is bypassed, and the output is
active at all times.
5:0
36
Name
Default
Value
Function
0
Config27, bit<5:0>
Description
00 1110
DACA AVSS
0V
00 1111
DACA DVDD
1.35 V
01 0000
DACA AVDD
3.3 V
01 0110
DACB AVSS
0V
01 0111
DACB DVDD
1.35 V
01 1000
DACB AVDD
3.3 V
01 1110
DACC AVSS
0V
01 1111
DACC DVDD
1.35 V
10 0000
DACC AVDD
3.3 V
10 0110
DACD AVSS
0V
10 0111
DACD DVDD
1.35 V
10 1000
DACD AVDD
3.3 V
11 0000
1.3VDIG
1.3 V
00 0101
1.35VCLK
1.35 V
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000000
Expected Nominal Voltage
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Register name: config28 – Address: 0x1C, Default: 0x0000
Register
Name
Address
Bit
config28
0x1C
15:8
Reserved
Reserved for factory use
0x00
7:0
Reserved
Reserved for factory use
0x00
Name
Default
Value
Function
Register name: config29 – Address: 0x1D, Default: 0x0000
Register
Name
Address
Bit
config29
0x1D
15:8
Reserved
Reserved for factory use
0x00
7:0
Reserved
Reserved for factory use
0x00
Name
Default
Value
Function
Register name: config30 – Address: 0x1E, Default: 0x1111
Register
Name
Address
Bit
Name
config30
0x1E
15:12
syncsel_qmoffsetAB(3:0)
Selects the syncing source(s) of the AB data path double-buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 15: sif_sync (via config31)
MM Bit 14: SYNC
MM Bit 13: OSTR
MM Bit 12: Auto-sync from register write
0001
11:8
syncsel_qmoffsetCD(3:0)
Selects the syncing source(s) of the CD data path double-buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 11: sif_sync (via config31)
MM Bit 10: SYNC
MM Bit 9: OSTR
MM Bit 8: Auto-sync from register write
0001
7:4
syncsel_qmcorrAB(3:0)
Selects the syncing source(s) of the AB data path double buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 7: sif_sync (via config31)
MM Bit 6: SYNC
MM Bit 5: OSTR
MM Bit 4: Auto-sync from register write
0001
3:0
syncsel_qmcorrCD(3:0)
Selects the syncing source(s) of the CD data path double buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 3: sif_sync (via config31)
MM Bit 2: SYNC
MM Bit 1: OSTR
MM Bit 0: Auto-sync from register write
0001
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ADVANCE INFORMATION
Default
Value
Function
37
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
Register name: config31 – Address: 0x1F, Default: 0x1140
ADVANCE INFORMATION
Register
Name
Address
Bit
config31
0x1F
15:12
syncsel_mixerAB(3:0)
Selects the syncing source(s) of the AB data path double buffered mixer
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 15: sif_sync (via config31)
MM Bit 14: SYNC
MM Bit 13: OSTR
MM Bit 12: Auto-sync from register write
0001
11:8
syncsel_mixerCD(3:0)
Selects the syncing source(s) of the CD data path double buffered mixer
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 11: sif_sync (via config31)
MM Bit 10: SYNC
MM Bit 9: OSTR
MM Bit 8: Auto-sync from register write
0001
7:4
syncsel_nco(3:0)
Selects the syncing source(s) of the two NCO accumulators. A 1 in the bit
enables the signal as a sync source. More than one sync source is permitted.
MM Bit 7: sif_sync (via config31)
MM Bit 6: SYNC
MM Bit 5: OSTR
MM Bit 4: ISTR
0100
3:2
syncsel_fifo_input(1:0)
Selects either the ISTR or SYNC LVDS signal to be routed to the internal
FIFO_ISTR path if syncsel_fifoin(3:0) is set to be ISTR (i.e. syncsel_fifoin(3:0) =
0010). In conjunction with config1 register bit(8), this allows flexibility of external
LVDS signal routing to the internal FIFO. The syncsel_fifo_input(1:0) can only
have one bit active at a time.
MM 00: external LVDS ISTR signal to internal FIFO_ISTR path
MM 01: external LVDS SYNC signal to internal FIFO_ISTR path
MM 10: external LVDS ISTR signal to internal FIFO_ISTR path
MM 11: external LVDS SYNC signal to internal FIFO_ISTR path
00
1
sif_sync
SIF created sync signal. Set to 1 to cause a sync and then clear to 0 to remove
it.
0
0
Reserved
Reserved for factory use
0
Name
Default
Value
Function
Register name: config32 – Address: 0x20, Default: 0x2400
Register
Name
Address
Bit
config32
0x20
15:12
syncsel_fifoin(3:0)
Selects the syncing source(s) of the FIFO input side. A 1 in the bit enables the
signal as a sync source. More than one sync source is permitted.
MM Bit 15: sif_sync (via config31)
MM Bit 14: Always zero
MM Bit 13: ISTR
MM Bit 12: SYNC
0010
11:8
syncsel_fifoout(3:0)
Selects the syncing source(s) of the FIFO output side. A 1 in the bit enables the
signal as a sync source. More than one sync source is permitted. clkdiv_sync_ena
must be set to 1 for the FIFO output pointer sync to occur.
MM Bit 11: sif_sync (via config31)
MM Bit 10: OSTR – Dual-sync-sources mode
MM Bit 9: ISTR – Single-sync-source mode
MM Bit 8: SYNC – Single-sync-source mode
0100
7:1
Reserved
Reserved for factory use
0000
clkdiv_sync_sel
Selects the signal source for clock divider synchronization
0
Name
Default
Value
Function
clkdiv_sync_sel
0
Sync Source
0
OSTR
1
ISTR, SYNC, or SIF SYNC, based on syncsel_fifoin
source selection
(config32, bits<15:12>)
Register name: config33 – Address: 0x21, Default: 0x0000
Register
Name
Address
Bit
config33
0x21
15:0
38
Name
Reserved
Function
Reserved for factory use
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Default
Value
0x0000
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Register name: config34 – Address: 0x22, Default: 0x1B1B
Register
Name
Address
Bit
config34
0x22
15:14
pathA_in_sel(1:0)
Selects the word used for the A channel path
00
13:12
pathB_in_sel(1:0)
Selects the word used for the B channel path
01
11:10
pathC_in_sel(1:0)
Selects the word used for the C channel path
10
9:8
pathD_in_sel(1:0)
Selects the word used for the D channel path
11
7:6
DACA_out_sel(1:0)
Selects the word used for the DACA output
00
5:4
DACB_out_sel(1:0)
Selects the word used for the DACB output
01
3:2
DACC_out_sel(1:0)
Selects the word used for the DACC output
10
1:0
DACD_out_sel(1:0)
Selects the word used for the DACD output
11
Name
Default
Value
Function
Register name: config35 – Address: 0x23, Default: 0xFFFF
Address
Bit
config35
0x23
15:0
Name
sleep_cntl(15:0)
Default
Value
Function
Controls the routing of the CMOS SLEEP signal (pin N11) to different blocks. When a
bit in this register is set, the SLEEP signal is sent to the corresponding block. The
block is only disabled when the SLEEP is logic HIGH and the corresponding bit is set
to 1.
0xFFFF
These bits do not override the SIF bits in config26 that control the same sleep function.
sleep_cntl(bit)
Function
15
DACA sleep
14
DACB sleep
13
DACC sleep
12
DACD sleep
11
Clock receiver sleep
10
PLL sleep
9
LVDS data sleep
8
LVDS control sleep
7
Temp sensor sleep
6
Reserved
5
Bias amplifier sleep
All others
Not used
Register name: config36 – Address: 0x24, Default: 0x0000
Register
Name
Address
Bit
config36
0x24
15:13
datadly(2:0)
Controls the delay of the data inputs through the LVDS receivers. Each LSB adds
approximately 40 ps
0: Minimum
000
12:10
clkdly(2:0)
Controls the delay of the data clock through the LVDS receivers. Each LSB adds
approximately 40 ps
0: Minimum
000
9:0
Reserved
Reserved for factory use
Name
Default
Value
Function
0x000
Register name: config37 – Address: 0x25, Default: 0x7A7A
Register
Name
Address
Bit
config37
0x25
15:0
Name
iotest_pattern0
Default
Value
Function
Dataword0 in the IO test pattern. It is used with the seven other words to test the input data.
At the start of the IO test pattern, this word should be aligned with rising edge of ISTR or
SYNC signal to indicate sample 0.
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0x7A7A
39
ADVANCE INFORMATION
Register
Name
DAC34SH84
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Register name: config38 – Address: 0x26, Default: 0xB6B6
Register
Name
Address
Bit
config38
0x26
15:0
Name
iotest_pattern1
Default
Value
Function
Dataword1 in the IO test pattern. It is used with the seven other words to test the input data.
0xB6B6
Register name: config39 – Address: 0x27, Default: 0xEAEA
Register
Name
Address
Bit
config39
0x27
15:0
Name
iotest_pattern2
Default
Value
Function
Dataword2 in the IO test pattern. It is used with the seven other words to test the input
data.
0xEAEA
Register name: config40 – Address: 0x28, Default: 0x4545
Register
Name
Address
Bit
config40
0x28
15:0
Function
Default
Value
Dataword3 in the IO test pattern. It is used with the seven other words to test the input data.
0x4545
Name
iotest_pattern3
Register name: config41 – Address: 0x29, Default: 0x1A1A
ADVANCE INFORMATION
Register
Name
Address
Bit
Name
config41
0x29
15:0
iotest_pattern4
Default
Value
Function
Dataword4 in the IO test pattern. It is used with the seven other words to test the input data.
0x1A1A
Register name: config42 – Address: 0x2A, Default: 0x1616
Register
Name
Address
Bit
config42
0x2A
15:0
Name
iotest_pattern5
Default
Value
Function
Dataword5 in the IO test pattern. It is used with the seven other words to test the input
data.
0x1616
Register name: config43 – Address: 0x2B, Default: 0xAAAA
Register
Name
Address
Bit
config43
0x2B
15:0
Name
iotest_pattern6
Default
Value
Function
Dataword6 in the IO test pattern. It is used with the seven other words to test the input
data.
0xAAAA
Register name: config44 – Address: 0x2C, Default: 0xC6C6
Register
Name
Address
Bit
config44
0x2C
15:0
Name
iotest_pattern7
Default
Value
Function
Dataword7 in the IO test pattern. It is used with the seven other words to test the input
data.
0xC6C6
Register name: config45 – Address: 0x2D, Default: 0x0004
Register
Name
Address
Bit
config45
0x2D
15
Reserved
Reserved for factory use
0
14
ostrtodig_sel
When set, the OSTR signal is passed directly to the digital block. This is the signal that
is used to clock the dividers.
0
40
Name
Default
Value
Function
13
ramp_ena
When set, a ramp signal is inserted in the input data at the FIFO input.
12:1
Reserved
Reserved for factory use
0
sifdac_ena
When set, the DAC output is set to the value in sifdac(15:0) in register config48.
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0
0000
0000
0010
0
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Register name: config46 – Address: 0x2E, Default: 0x0000
Register
Name
Address
Bit
config46
0x2E
15:0
Name
Reserved
Default
Value
Function
Reserved for factory use
0x00
Register name: config47 – Address: 0x2F, Default: 0x0000
Register
Name
Address
Bit
config47
0x2F
15:0
Name
Reserved
Default
Value
Function
Reserved for factory use
0x00
Register name: config48 – Address: 0x30, Default: 0x0000
Register
Name
Address
Bit
config48
0x30
15:0
Name
sifdac(15:0)
Default
Value
Function
Value sent to the DACs when sifdac_ena is asserted. DATACLK must be running to
latch this value into the DACs. The format would be based on twos in register config2.
0x0000
Register
Name
Address
Bit
version
0x7F
15:10
Reserved
Reserved for factory use
9
Reserved
Reserved for factory use
0
8:7
Reserved
Reserved for factory use
00
6:5
Reserved
Reserved for factory use
00
4:3
deviceid(1:0)
Returns 01 for DAC34SH84
01
2:0
versionid(2:0)
A hardwired register that contains the version of the chip
001
Name
Default
Value
Function
0101 01
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ADVANCE INFORMATION
Register name: version– Address: 0x7F, Default: 0x5409 (READ ONLY)
DAC34SH84
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DATA INTERFACE
The DAC34SH84 has a 32-bit LVDS bus that accepts quad, 16-bit data in word-wide format. The quad, 16-bit
data can be input to the device using a dual-bus, 16-bit interface. The bus accepts LVDS transfer rates up to 1.5
GSPS, which corresponds to a maximum data rate of 750 MSPS per data channel. The default LVDS bus input
assignment is shown in Table 3.
Table 3. LVDS Bus Input Assignment
Data Paths
Pins
A and B
DAB[15..0]
C and D
DCD[15..0]
Data is sampled by the LVDS double-data-rate (DDR) clock DATACLK. Setup and hold requirements must be
met for proper sampling. A and C data are captured on the rising edge of DATACLK. B and D data are captured
on the falling edge of DATACLK.
For both input bus modes, a sync signal, either ISTR or SYNC, is required to sync the FIFO read and/or write
pointers.
ADVANCE INFORMATION
The sync signal, either ISTR or SYNC, can be either a pulse or a periodic signal where the sync period
corresponds to multiples of eight samples. ISTR or SYNC is sampled by a rising edge in DATACLK. The pulse
duration t(ISTR_SYNC) must be at least equal to one-half of the DATACLK period.
DATA FORMAT
The 16-bit data for channels A and B is interleaved in the form A0[15:0], B0[15:0], A1[15:0], B1[15:0], A2[15:0]…
into the DAB[15:0]P/N LVDS inputs. Similarly, data for channels C and D is interleaved into the DCD[15:0]P/N
LVDS inputs. Data into the DAC34SH84 is formatted according to the diagram shown in Figure 51, where index
0 is the data LSB and index 15 is the data MSB.
SAMPLE 0
SAMPLE 1
SAMPLE 2
SAMPLE 3
DAB[15:0]P/N
A0
[15:0]
B0
[15:0]
A1
[15:0]
B1
[15:0]
A2
[15:0]
B2
[15:0]
A3
[15:0]
B3
[15:0]
DCD[15:0]P/N
C0
[15:0]
D0
[15:0]
C1
[15:0]
D1
[15:0]
C2
[15:0]
D2
[15:0]
C3
[15:0]
D3
[15:0]
DATACLKP/N (DDR)
t(ISTR_SYNC)
Sync
Option #1
ISTRP/N
t(ISTR_SYNC)
Sync
Option #2
SYNCP/N
T0530-01
Figure 51. Data Transmission Format
The FIFO read and write pointer can also be synced by SIF SYNC as the third sync option if multi-device
synchronization is not needed. In this sync mode, the syncsel_fifoin(3:0) and syncsel_fifoout(3:0) in register
config32 need to be both set to 1000 for the SIF SYNC option.
42
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INPUT FIFO
The DAC34SH84 includes a 4-channel, 16-bit-wide and 8-sample-deep input FIFO which acts as an elastic
buffer. The purpose of the FIFO is to absorb any timing variations between the input data and the internal DAC
data-rate clock, such as the ones resulting from clock-to-data variations from the data source.
Figure 52 shows a simplified block diagram of the FIFO.
Clock Handoff
Input Side
Clocked by DATACLK
Output Side
Clocked by FIFO Out Clock
(DACCLK/Interpolation Factor)
FIFO:
4 x 16-Bits Wide
8-Samples deep
16-Bit
DAB[15:0]
16-Bit
16-Bit
DCD[15:0]
De-Interleave
C-Data, 16-Bit
D-Data, 16-Bit
16-Bit
Write Pointer Reset
ISTR/
SYNC
0
Sample 0
A0[15:0], B0[15:0], C0[15:0], D0[15:0]
0
1
Sample 0
A1[15:0], B1[15:0], C1[15:0], D1[15:0]
1
2
Sample 0
A2[15:0], B2[15:0], C2[15:0], D2[15:0]
2
3
Sample 0
A3[15:0], B3[15:0], C3[15:0], D3[15:0]
3
4
Sample 0
A4[15:0], B4[15:0], C4[15:0], D4[15:0]
4
5
Sample 0
A5[15:0], B5[15:0], C5[15:0], D5[15:0]
5
6
Sample 0
A6[15:0], B6[15:0], C6[15:0], D6[15:0]
6
7
Sample 0
A7[15:0], B7[15:0], C7[15:0], D7[15:0]
7
64-Bit
FIFO Reset
16-Bit
64-Bit
Initial
Position
16-Bit
16-Bit
16-Bit
FIFO A Output
FIFO B Output
FIFO C Output
FIFO D Output
Read Pointer Reset
fifo_offset(2:0)
S
M
syncsel_fifoout
OSTR
syncsel_fifoin
S (Single Sync Sources Mode): Reset handoff from
input side to output side
M (Dual Sync Source Mode): OSTR resets read
pointer. Allows Multi-DAC synchronization
B0461-01
Figure 52. DAC34SH84 FIFO Block Diagram
Data is written to the device 32 bits at a time on the rising and falling edges of DATACLK. In order to form a
complete 64-bit wide sample (16-bit A-data, 16-bit B-data, 16-bit C-data, and 16-bit D-data) one DATACLK
period is required. Each 64-bit-wide sample is written into the FIFO at the address indicated by the write pointer.
Similarly, data from the FIFO is read by the FIFO-out clock 64 bits at a time from the address indicated by the
read pointer. The FIFO-out clock is generated internally from the DACCLK signal and its rate is equal to
DACCLK / interpolation. Each time a FIFO write or FIFO read is done, the corresponding pointer moves to the
next address.
The reset position for the FIFO read and write pointers is set by default to addresses 0 and 4 as shown in
Figure 52. This offset gives optimal margin within the FIFO. The default read pointer location can be set to
another value using fifo_offset(2:0) in register config9 (address 4 by default). Under normal conditions, data is
written to and read from the FIFO at the same rate and consequently, the write and read pointer gap remains
constant. If the FIFO write and read rates are different, the corresponding pointers cycle at different speeds,
which could result in pointer collision. Under this condition, the FIFO attempts to read and write data from the
same address at the same time, which results in errors and thus must be avoided.
The write pointer sync source is selected by syncsel_fifoin(3:0) in register config32. In most applications either
ISTR or SYNC are used to reset the write pointer. Unlike DATA, the sync signal is latched only on the rising
edges of DATACLK. A rising edge on the sync signal source causes the pointer to return to its original position.
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ADVANCE INFORMATION
B-Data, 16-Bit
0 ... 7
Write Pointer
A-Data, 16-Bit
0 ... 7
Read Pointer
Initial
Position
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
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Similarly, the read pointer sync source is selected by syncsel_fifoout(3:0). The write pointer sync source can be
set to reset the read pointer as well. In this case, the FIFO-out clock recaptures the write pointer sync signal to
reset the read pointer. This clock domain transfer (DATACLK to FIFO Out Clock) results in phase ambiguity of
the sync signal. This limits the precise control of the output timing and makes full synchronization of multiple
devices difficult.
To alleviate this, the device offers the alternative of resetting the FIFO read pointer independently of the write
pointer by using the OSTR signal. The OSTR signal is sampled by DACCLK and must satisfy the timing
requirements in the specifications table. In order to minimize the skew it is recommended to use the same clock
distribution device such as Texas Instruments CDCE62005 to provide the DACCLK and OSTR signals to all the
DAC34SH84 devices in the system. Swapping the polarity of the DACCLK outputs with respect to the OSTR
ones establishes proper phase relationship.
The FIFO pointers reset procedure can be done periodically or only once during initialization as the pointers
automatically return to the initial position when the FIFO has been filled. To reset the FIFO periodically, it is
necessary to have the ISTR, SYNC, and OSTR signals to repeat at multiples of 8 FIFO samples. To disable
FIFO reset, set syncsel_fifoin(3:0) and syncsel_fifoout(3:0) to 0000.
The frequency limitation for ISTR and SYNC signals are the following:
fsync = fDATACLK / (n × 8), where n = 1, 2, …
fOSTR = fDAC / (n × interpolation × 8) where n = 1, 2, …
The frequencies above are at maximum when n = 1. This is when the ISTR, SYNC, or OSTR have a rising edge
transition every 8 FIFO samples. The occurrence can be made less frequent by setting n > 1, for example, every
n × 8 FIFO samples.
LVDS Pairs (Data Source)
D[15:0]P/N
tS(DATA)
tS(DATA)
tH(DATA)
tH(DATA)
DATACLKP/N
(DDR)
tH(DATA)
tS(DATA)
ISTRP/N
SYNCP/N
LVPECL Pairs (Clock Source)
ADVANCE INFORMATION
The frequency limitation for the OSTR signal is the following:
Resets Write Pointer to Position 0
DACCLKP/N
2x Interpolation
tS(OSTR)
tH(OSTR)
OSTRP/N
(optionally internal
sync from Write Reset)
Resets Read Pointer to Position
Set by fifo_offset (4 by Default)
T0531-01
Figure 53. FIFO Write and Read Descriptions
FIFO MODES OF OPERATION
The DAC34SH84 input FIFO can be completely bypassed through registers config0 and config32. The register
configuration for each mode is described in Table 4.
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Register
Control Bits
config0
fifo_ena
config32
syncsel_fifoout(3:0)
Table 4. FIFO Operation Modes
config0 and config32 FIFO Bits
FIFO Mode
Dual Sync Sources
fifo_ena
syncsel_fifoout
Bit 3: sif_sync
Bit 2: OSTR
Bit 1: ISTR
0
1
0
0
1 or 0 Depends on the
sync source
X
1
Single Sync
Source
1
0
0
1 or 0 Depends on the sync
source
Bypass
0
X
X
X
Bit 0: SYNC
This is the recommended mode of operation for those applications that require precise control of the output
timing. In Dual Sync Sources mode, the FIFO write and read pointers are reset independently. The FIFO write
pointer is reset using the LVDS ISTR or SYNC signal, and the FIFO read pointer is reset using the LVPECL
OSTR signal. This allows LVPECL OSTR signal to control the phase of the output for either a single chip or
multiple chips. Multiple devices can be fully synchronized in this mode.
SINGLE-SYNC-SOURCE MODE
In single-sync-source mode, the FIFO write and read pointers are reset from the same source, either LVDS ISTR
or LVDS SYNC signal. This mode has a possibility of up to 2 DAC clocks offset between the multiple DAC
outputs. Applications requiring exact output timing control need dual-sync-sources mode instead of single-syncsource mode. A single rising edge for FIFO and clock divider sync is recommended. Periodic sync signal is not
recommended due to the non-deterministic latency of the sync signal through the clock domain transfer.
In this mode, there is a chance for FIFO pointers 2 away alarm (or possibly 1 away alarm) to occur at initial setup
or syncing. This is the result of single-sync-source mode having 0 to 3 address location slip, which is caused by
the asynchronous handoff of the sync signal occurring between the DATACLK zone and the DACCLK zone. The
asynchronous relationship between the clock domains means there could be a slip (from nominal) in the READ
and WRITE pointers at initial syncing. For example, with the default programming of FIFO offset of 4, the actual
FIFO offset may be 3, 2, or in some instances, 1. Please note that in this mode, the nominal address location slip
is 0 with the possibility getting less for each increase in slip amount. Also, the slip does not continue to occur as
the device functions, but the READ/WRITE pointers may not be at optimal settings. If an alarm occurs:
1. Adjust the FIFO offset accordingly and resynchronize the FIFO, data formatter, etc., such that there are no
alarms reported or at least only the 2-away alarm is reported.
2. The FIFO collision alarm is a warning of the system, because the read and write processes occur at the
same pointer. However, the FIFO 1-away and 2-away alarms are informational for the system designer. The
important thing for these two alarms is that the alarm should not get closer to collision during normal
operation. If the 1-away alarm or collision alarm starts to occur, it is a warning to check for system errors.
The system should have an interrupt or algorithm to fix the error and resynchronize the alarm appropriately.
BYPASS MODE
In FIFO bypass mode, the FIFO block is not used. As a result, the input data is handed off from the DATACLK to
the DACCLK domain without any compensation. In this mode, the relationship between DATACLK and DACCLK
is critical and used as a synchronizing mechanism for the internal logic. Due to this constraint, this mode is not
recommended. In bypass mode, the pointers have no effect on the data path or handoff.
CLOCKING MODES
The DAC34SH84 has a dual-clock setup in which a DAC clock signal is used to clock the DAC cores and internal
digital logic, and a separate DATA clock is used to clock the input LVDS receivers and FIFO input. The
DAC34SH84 DAC clock signal can be sourced directly or generated through an on-chip low-jitter phase-locked
loop (PLL).
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DUAL-SYNC-SOURCES MODE
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In those applications requiring extremely low noise it is recommended to bypass the PLL and source the DAC
clock directly from a high-quality external clock to the DACCLK input. In most applications, system clocking can
be simplified by using the on-chip PLL to generate the DAC core clock while still satisfying performance
requirements. In this case, the DACCLK pins are used as the reference frequency input to the PLL.
16-Bit
DACI
PLL
DACCLK
Clock Distribution
to Digital
VCO/
Dividers
16-Bit
DACQ
pll_ena
B0452-01
Figure 54. Top-Level Clock Diagram
ADVANCE INFORMATION
PLL BYPASS MODE
In PLL bypass mode, a very high-quality clock is sourced to the DACCLK inputs. This clock is used to directly
source the DAC34SH84 DAC sample-rate clock. This mode gives the device best performance and is
recommended for extremely demanding applications.
The bypass mode is selected by setting the following:
1. pll_ena bit in register config24 to 0 to bypass the PLL circuitry.
2. pll_sleep bit in register config26 to 1 to put the PLL and VCO into sleep mode.
PLL MODE
In this mode, the clock at the DACCLKP/N input functions as a reference clock source to the on-chip PLL. The
on-chip PLL then multiplies this reference clock to supply a higher-frequency DAC sample-rate clock. Figure 55
shows the block diagram of the PLL circuit.
OSTR (Internally Generated)
External Loop
Filter
DACCLKP
REFCLK
DACCLKN
N
Divider
SYNCP
SYNC_PLL
PFD
and
CP
Prescaler
Internal Loop
Filter
SYNCN
Note:
The PLL generates internal OSTR signal. In this mode
external LVPECL OSTR signal is not required.
DACCLK
VCO
M
Divider
If the DAC is configured with PLL enabled with Dual Sync
Sources mode, then the PFD frequency has to be the predefined OSTR frequency.
B0453-01
Figure 55. PLL Block Diagram
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The DAC34SH84 PLL mode is selected by setting the following:
1. pll_ena bit in register config24 to 1 to route to the PLL clock path.
2. pll_sleep bit in register config26 to 0 to enable the PLL and VCO.
The output frequency of the VCO is designed to be the in the range from 2.7 GHz to 3.3 GHz. The prescaler
value, pll_p(2:0) in register config24, should be chosen such that the product of the prescaler value and DAC
sample rate clock is within the VCO range. To maintain optimal PLL loop, the coarse-tuning bits, pll_vco(5:0) in
register config26, can adjust the center frequency of the VCO toward the product of the prescaler value and DAC
sample-rate clock. Figure 56 shows a typical relationship between the coarse-tuning bits and VCO center
frequency.
3300
Coarse-Tuning Bits @
VCO Frequency (MHz ) - 2673
9.7
3100
3000
2900
2800
2700
0
8
16
32
24
40
48
56
64
Coarse-Tuning Bits
Figure 56. Typical PLL/VCO Lock Range vs Coarse-Tuning Bits
Common wireless infrastructure frequencies (614.4MHz, 737.28MHz, 983.04 MHz, and so forth) are generated
from this VCO frequency in conjunction with the prescaler setting as shown in Table 5.
Table 5. VCO Operation
VCO Frequency (MHz)
Pre-Scale Divider
Desired DACCLK (MHz)
pll_p(2:0)
2949.12
6
491.52
110
3072
5
614.4
101
2949.12
4
737.28
100
2949.12
3
983.04
011
2949.12
2
1474.56
010
The M divider is used to determine the phase-frequency-detector (PFD) and charge-pump (CP) frequency.
Table 6. PFD and CP Operation
DACCLK Frequency
(MHz)
M Divider
PFD Update Rate (MHz)
pll_m(7:0)
491.52
4
122.88
0000 0100
491.52
8
61.44
0000 1000
491.52
16
30.72
0001 0000
491.52
32
15.36
0010 0000
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VCO Frequency (MHz)
3200
DAC34SH84
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The N divider in the loop allows the PFD to operate at a lower frequency than the reference clock. Both M and N
dividers can keep the PFD frequency below 155 MHz for peak operation.
The overall divide ratio inside the loop is the product of the pre-scale and M dividers (P × M), and the following
guidelines should be followed:
• The overall divide ratio range is from 24 to 480.
• When the overall divide ratio is less than 120, the internal loop filter can assure a stable loop.
• When the overall divide ratio is greater than 120, an external loop filter or double charge pump is required to
ensure loop stability.
The single- and double-charge-pump current options are selected by setting pll_cp in register config24 to 01 and
11, respectively. When using the double-charge-pump setting, an external loop filter is not required. If an external
loop filter is required, the following filter should be connected to the LPF pin (A1):
LPF
R = 1 kΩ
C2 = 1 nF
ADVANCE INFORMATION
C1 = 100 nF
S0514-01
Figure 57. Recommended External Loop Filter
The PLL generates an internal OSTR signal and does not require the external LVPECL OSTR signal. The OSTR
signal is buffered from the N-divider output in the PLL block, and the frequency of the signal is the same as the
PFD frequency. Therefore, using the PLL with dual-sync-sources mode would require the PFD frequency to be
the pre-defined OSTR frequency. This allows the FIFO to be synced correctly by the internal OSTR.
MULTI-DEVICE SYNCHRONIZATION
In various applications, such as multi antenna systems where the various transmit channels information is
correlated, it is required that multiple DAC devices are completely synchronized such that their outputs are phase
aligned. The DAC34SH84 architecture supports this mode of operation.
MULTI-DEVICE SYNCHRONIZATION: PLL BYPASSED WITH DUAL SYNC SOURCES MODE
For single- or multi-device synchronization it is important that delay differences in the data are absorbed by the
device so that latency through the device remains the same. Furthermore, to ensure that the outputs from each
DAC are phase aligned it is necessary that data is read from the FIFO of each device simultaneously. In the
DAC34SH84 this is accomplished by operating the multiple devices in Dual Sync Sources mode. In this mode
the additional OSTR signal is required by each DAC34SH84 to be synchronized.
Data into the device is input as LVDS signals from one or multiple baseband ASICs or FPGAs. Data into multiple
DAC devices can experience different delays due to variations in the digital source output paths or board level
wiring. These different delays can be effectively absorbed by the DAC34SH84 FIFO so that all outputs are phase
aligned correctly.
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DACCLKP/N
OSTRP/N
DAB[15:0]P/N
DCD[15:0]P/N
FPGA
DAC34SH84 DAC1
ISTRP/N
Clock Generator
PLL/
DLL
LVDS Interface
LVPECL Outputs
Delay 1
DATACLKP/N
Outputs are
Phase Aligned
Variable delays due to variations in the FPGA(s) output
DAB[15:0]P/N paths or board level wiring or temperature/voltage deltas
DCD[15:0]P/N
LVPECL Outputs
ISTRP/N
Delay 2
DATACLKP/N
DAC34SH84 DAC2
OSTRP/N
B0454-04
Figure 58. Synchronization System in Dual Sync Sources Mode With PLL Bypassed
For correct operation both OSTR and DACCLK must be generated from the same clock domain. The OSTR
signal is sampled by DACCLK and must satisfy the timing requirements in the specifications table. If the clock
generator does not have the ability to delay the DACCLK to meet the OSTR timing requirement, the polarity of
the DACCLK outputs can be swapped with respect to the OSTR ones to create 180 degree phase delay of the
DACCLK. This may help establish proper setup and hold time requirement of the OSTR signal.
LVPECL Pairs (DAC34SH84 2)
LVPECL Pairs (DAC34SH84 1)
Careful board layout planning must be done to ensure that the DACCLK and OSTR signals are distributed from
device to device with the lowest skew possible as this will affect the synchronization process. In order to
minimize the skew across devices it is recommended to use the same clock distribution device to provide the
DACCLK and OSTR signals to all the DAC devices in the system.
DACCLKP/N(1)
tS(OSTR)
tH(OSTR)
tSKEW ~ 0
OSTRP/N(1)
DACCLKP/N(2)
tS(OSTR)
tH(OSTR)
OSTRP/N(2)
•
•
•
•
T0526-04
Figure 59. Timing Diagram for LVPECL Synchronization Signals
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DACCLKP/N
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The following steps are required to ensure the devices are fully synchronized. The procedure assumes all the
DAC34SH84 devices have a DACCLK and OSTR signal and must be carried out on each device.
1. Start-up the device as described in the power-up sequence. Set the DAC34SH84 in Dual Sync Sources
mode and select OSTR as the clock divider sync source (clkdiv_sync_sel in register config32).
2. Sync the clock divider and FIFO pointers.
3. Verify there are no FIFO alarms either through register config5 or through the ALARM pin.
4. Disable clock divider sync by setting clkdiv_sync_ena to 0 in register config0.
After these steps all the DAC34SH84 outputs will be synchronized.
MULTI-DEVICE SYNCHRONIZATION: PLL ENABLED WITH DUAL SYNC SOURCES MODE
The DAC34SH84 allows exact phase alignment between multiple devices even when operating with the internal
PLL clock multiplier. In PLL clock mode, the PLL generates the DAC clock and an internal OSTR signal from the
reference clock applied to the DACCLK inputs so there is no need to supply an additional LVPECL OSTR signal.
For this method to operate properly the SYNC signal should be set to reset the PLL N dividers to a known state
by setting pll_ndivsync_ena in register config24 to 1. The SYNC signal resets the PLL N dividers with a rising
edge, and the timing relationship ts(SYNC_PLL) and th(SYNC_PLL) are relative to the reference clock presented on the
DACCLK pin.
DACCLKP/N
SYNCP/N
DAB[15:0]P/N
DCD[15:0]P/N
FPGA
DAC34SH84 DAC1
ISTRP/N
Outputs
Clock Generator
PLL/
DLL
LVDS Interface
ADVANCE INFORMATION
Both SYNC and DACCLK can be set as low frequency signals to greatly simplifying trace routing (SYNC can be
just a pulse as a single rising edge is required, if using a periodic signal it is recommended to clear the
pll_ndivsync_ena bit after resetting the PLL dividers). Besides the ts(SYNC_PLL) and th(SYNC_PLL) requirement
between SYNC and DACCLK, there is no additional required timing relationship between the SYNC and ISTR
signals or between DACCLK and DATACLK. The only restriction as in the PLL disabled case is that the DACCLK
and SYNC signals are distributed from device to device with the lowest skew possible.
Delay 1
DATACLKP/N
Outputs are
Phase Aligned
Variable delays due to variations in the FPGA(s) output
DAB[15:0]P/N paths or board level wiring or temperature/voltage deltas
DCD[15:0]P/N
Outputs
ISTRP/N
Delay 2
DATACLKP/N
DAC34SH84 DAC2
SYNCP/N
DACCLKP/N
B0455-04
Figure 60. Synchronization System in Dual Sync Sources Mode With PLL Enabled
The following steps are required to ensure the devices are fully synchronized. The procedure assumes all the
DAC34SH84 devices have a DACCLK and OSTR signal and must be carried out on each device.
1. Start up the device as described in the power-up sequence. Set the DAC34SH84 in Dual Sync Sources
mode and enable SYNC to reset the PLL dividers (set pll_ndivsync_ena in register config24 to 1).
2. Reset the PLL dividers with a rising edge on SYNC.
3. Disable PLL dividers resetting.
4. Sync the clock divider and FIFO pointers.
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5. Verify there are no FIFO alarms either through register config5 or through the ALARM pin.
6. Disable clock divider sync by setting clkdiv_sync_ena to 0 in register config0.
After these steps all the DAC34SH84 outputs will be synchronized.
MULTI-DEVICE OPERATION: SINGLE SYNC SOURCE MODE
In Single Sync Source mode, the FIFO write and read pointers are reset from the same sync source, either ISTR
or SYNC. Although the FIFO in this mode can still absorb the data delay differences due to variations in the
digital source output paths or board level wiring it is impossible to guarantee data will be read from the FIFO of
different devices simultaneously thus preventing exact phase alignment.
In Single Sync Source mode the FIFO read pointer reset is handoff between the two clock domains (DATACLK
and FIFO OUT CLOCK) by simply re-sampling the write pointer reset. Since the two clocks are asynchronous
there is a small but distinct possibility of a meta-stablility during the pointer handoff. This meta-stability can cause
the outputs of the multiple devices to slip by up to 2 DAC clock cycles.
When the PLL is enabled with Single Sync Source mode, the FIFO read pointer is not synchronized by the
OSTR signal. Therefore, there is no restriction on the PLL PFD frequency as described in the previous section.
DAB[15:0]P/N
DCD[15:0]P/N
FPGA
DAC34SH84 DAC1
ISTRP/N
Clock Generator
PLL/
DLL
LVDS Interface
LVPECL Outputs
Delay 1
DATACLKP/N
Variable delays due to variations in the FPGA(s) output
0 to 2 DAC Clock Cycles
DAB[15:0]P/N paths or board level wiring or temperature/voltage deltas
DCD[15:0]P/N
LVPECL Outputs
ISTRP/N
DATACLKP/N
Delay 2
DAC34SH84 DAC2
DACCLKP/N
B0456-04
Figure 61. Multi-Device Operation in Single Sync Source Mode
FIR FILTERS
Figure 62 through Figure 65 show the magnitude spectrum response for the FIR0, FIR1, FIR2 and FIR3
interpolating filters where fIN is the input data rate to the FIR filter. Figure 66 to Figure 69 show the composite
filter response for 2x, 4x, 8x and 16x interpolation. The transition band for all interpolation settings is from 0.4 to
0.6 x fDATA (the input data rate to the device) with < 0.001dB of pass-band ripple and > 90 dB stop-band
attenuation.
The DAC34SH84 also has a 9-tap inverse sinc filter (FIR4) that runs at the DAC update rate (fDAC) that can be
used to flatten the frequency response of the sample-and-hold output. The DAC sample-and-hold output sets the
output current and holds it constant for one DAC clock cycle until the next sample, resulting in the well-known
sin(x) / x or sinc(x) frequency response (Figure 70, red line). The inverse sinc filter response (Figure 70, blue
line) has the opposite frequency response from 0 to 0.4 x Fdac, resulting in the combined response (Figure 70,
green line). Between 0 to 0.4 x fDAC, the inverse sinc filter compensates the sample-and-hold roll-off with less
than 0.03 dB error.
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The inverse sinc filter has a gain > 1 at all frequencies. Therefore, the signal input to FIR4 must be reduced from
full scale to prevent saturation in the filter. The amount of back-off required depends on the signal frequency, and
is set such that at the signal frequencies the combination of the input signal and filter response is less than 1 (0
dB). For example, if the signal input to FIR4 is at 0.25 x fDAC, the response of FIR4 is 0.9 dB, and the signal must
be backed off from full scale by 0.9 dB to avoid saturation. The gain function in the QMC blocks can be used to
reduce the amplitude of the input signal. The advantage of FIR4 having a positive gain at all frequencies is that
the user is then able to optimize the back-off of the signal based on its frequency.
20
20
0
0
–20
–20
–40
–40
Magnitude (dB)
Magnitude (dB)
The filter taps for all digital filters are listed in Table 4. Note that the loss of signal amplitude may result in lower
SNR due to decrease in signal amplitude.
–60
–80
–100
–60
–80
–100
ADVANCE INFORMATION
–120
–120
–140
–140
–160
–160
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0
0.1
0.2
0.3
0.4
f/fIN
0.5
0.6
0.7
0.8
0.9
G049
Figure 62. Magnitude Spectrum for FIR0
Figure 63. Magnitude Spectrum for FIR1
20
20
0
0
–20
–20
–40
–40
Magnitude (dB)
Magnitude (dB)
G048
–60
–80
–100
–60
–80
–100
–120
–120
–140
–140
–160
–160
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0
0.1
f/fIN
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
f/fIN
G050
Figure 64. Magnitude Spectrum for FIR2
52
1
f/fIN
G051
Figure 65. Magnitude Spectrum for FIR3
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20
20
0
0
–20
–20
–40
–40
Magnitude (dB)
–60
–80
–100
–60
–80
–100
–120
–120
–140
–140
–160
–160
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0
1
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
f/fDATA
f/fDATA
G053
Figure 66. 2x Interpolation Composite Response
Figure 67. 4x Interpolation Composite Response
20
20
0
0
–20
–20
–40
–40
Magnitude (dB)
Magnitude (dB)
G052
–60
–80
–100
–60
–80
–100
–120
–120
–140
–140
–160
–160
0
0.5
1
1.5
2
2.5
3
3.5
4
0
1
2
3
f/fDATA
4
5
6
7
8
f/fDATA
G054
G055
Figure 68. 8x Interpolation Composite Response
Figure 69. 16x Interpolation Composite Response
4
3
FIR4
Magnitude (dB)
2
1
Corrected
0
–1
–2
sin(x)/x
–3
–4
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
f/fDAC
G056
Figure 70. Magnitude Spectrum for Inverse Sinc Filter
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Table 7. FIR Filter Coefficients
Non-Interpolating
Inverse-SINC Filter
Interpolating Half-band Filters
FIR0
FIR1
59 Taps
FIR2
23 Taps
FIR3
11 Taps
FIR4
11 Taps
9 Taps
6
6
–12
–12
29
29
3
3
1
1
0
0
0
0
0
0
0
0
–4
–4
–19
–19
84
84
–214
–214
–25
–25
13
13
0
0
0
0
0
0
0
0
–50
–50
47
47
–336
–336
1209
1209
150
150
592 (1)
0
0
0
0
2048 (1)
–100
–100
1006
1006
0
0
0
0
192
192
–2691
–2691
ADVANCE INFORMATION
0
0
0
0
–342
–342
10141
10141
0
0
16,384 (1)
572
572
0
0
–914
–914
0
0
1409
1409
0
0
–2119
–2119
0
0
3152
3152
0
0
–4729
–4729
0
0
7420
7420
0
0
–13,334
–13,334
0
0
41,527
41,527
256 (1)
65,536 (1)
(1)
Center taps are highlighted in BOLD
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COMPLEX SIGNAL MIXER
The DAC34SH84 has two paths of complex signal mixer blocks that contain two full complex mixer (FMIX) blocks
and power saving coarse mixer (CMIX) blocks. The signal path is shown in Figure 71.
I Data In
(A)
Q Data In
(B)
16
16
Fs/2
Mixer
16
16
±Fs/4
Mixer
16
CMIX<1>
16
Complex
Signal
Multiplier
16
sine
16
CMIX<2> CMIX<0>
I Data Out
(A)
16
Q Data Out
(B)
cosine
16
CMIX<3>
cosine sine
16
16
(AB)
Numerically
Controlled
Oscillator
NCO_ENA
cosine
16
Fixed Fs/8
Oscillator
B0471-02
Note:
Channel CD data path not shown
Figure 71. Path of Complex Signal Mixer
FULL COMPLEX MIXER
The two FMIX blocks operate with independent Numerically Controlled Oscillators (NCOs) and enable flexible
frequency placement without imposing additional limitations in the signal bandwidth. The NCOs have 32-bit
frequency registers (phaseaddAB(31:0) and phaseaddCD(31:0)) and 16-bit phase registers (phaseoffsetAB(15:0)
and phaseoffsetCD(15:0)) that generate the sine and cosine terms for the complex mixing. The NCO block
diagram is shown in Figure 72.
32
16
Frequency
Register
32
32
Σ
Accumulator
CLK
32
16
16
Σ
sin
Look-Up
Table
16
cos
RESET
16
fDAC
NCO SYNC
via
syncsel_NCO[3:0]
Phase
Register
B0026-03
Figure 72. NCO Block Diagram
Synchronization of the NCOs occurs by resetting the NCO accumulators to zero. The synchronization source is
selected by syncsel_NCO(3:0) in config31. The frequency word in the phaseaddAB(31:0) and phaseaddCD(31:0)
registers is added to the accumulators every clock cycle, fDAC. The output frequency of the NCO is:
freq ´ fNCO _ CLK
fNCO =
232
(1)
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sine
16
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With the complex mixer enabled, the two channels in the mixer path are treated as complex vectors of the form
IIN(t) + j QIN(t). The complex signal multiplier (shown in Figure 73) will multiply the complex channels with the sine
and cosine terms generated by the NCO. The resulting output, IOUT(t) + j QOUT(t), of the complex signal multiplier
is:
IOUT(t) = (IIN(t)cos(2πfNCOt + δ) – QIN(t)sin(2πfNCOt + δ)) × 2(mixer_gain – 1)
QOUT(t) = (IIN(t)sin(2πfNCOt + δ) + QIN(t)cos(2πfNCOt + δ)) × 2(mixer_gain – 1)
where t is the time since the last resetting of the NCO accumulator, δ is the phase offset value and mixer_gain is
either 0 or 1. δ is given by:
δ = 2π × phase_offsetAB/CD(15:0) / 216
The mixer_gain option allows the output signals of the multiplier to reduce by half (6 dB). See Mixer Gain section
for details.
16
IIN(t)
QIN(t)
(
16
IOUT(t)
16
ADVANCE INFORMATION
16
16
cosine
QOUT(t)
16
sine
B0472-02
Figure 73. Complex Signal Multiplier
COARSE COMPLEX MIXER
In addition to the full complex mixers, the DAC34SH84 also has coarse mixer blocks capable of shifting the input
signal spectrum by the fixed mixing frequencies ±n × fS / 8. Using the coarse mixer instead of the full mixers
lowers power consumption.
The output of the fS / 2, fS / 4, and –fS / 4 mixer block is:
IOUT(t) = I(t)cos(2πfCMIXt) – Q(t)sin(2πfCMIXt)
QOUT(t) = I(t)sin(2πfCMIXt) + Q(t)cos(2πfCMIXt)
Since the sine and the cosine terms are a function of fS / 2, fS / 4, or –fS / 4 mixing frequencies, the possible
resulting value of the terms can only be 1, –1, or 0. The simplified mathematics allows the complex signal
multiplier to be bypassed in any one of the modes, thus mixer gain is not available. The fS / 2, fS / 4, and –fS / 4
mixer blocks performs mixing through negating and swapping of I/Q channel on certain sequence of samples.
Table 8 shows the algorithm used for those mixer blocks.
Table 8. fS / 2, fS / 4, and –fS / 4 Mixing Sequence
MODE
Normal (mixer bypassed)
fS / 2
fS / 4
–fS / 4
56
MIXING SEQUENCE
Iout = {I1, I2, I3, I4…}
Qout = {Q1, Q2, Q3, Q4…}
Iout = {I1, –I2, I3, –I4…}
Qout = {Q1, –Q2, Q3, –Q4…}
Iout = {I1, –Q2, –I3, Q4…}
Qout = {Q1, I2, –Q3, –I4…}
Iout = {I1, Q2, –I3, –Q4…}
Qout = {Q1, –I2, –Q3, I4…}
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The fS / 8 mixer can be enabled along with various combinations of fS / 2, fS / 4, and –fS / 4 mixer. Because the fS
/ 8 mixer uses the complex signal multiplier block with fixed fS / 8 sine and cosine term, the output of the
multiplier is:
IOUT(t) = (IIN(t)cos(2πfNCOt + δ) – QIN(t)sin(2πfNCOt + δ)) × 2(mixer_gain – 1)
QOUT(t) = (IIN(t)sin(2πfNCOt + δ) + QIN(t)cos(2πfNCOt + δ)) × 2(mixer_gain – 1)
where fCMIX is the fixed mixing frequency selected by cmix(3:0). The mixing combinations are described in
Table 9. The mixer_gain option allows the output signals of the multiplier to reduce by half (6dB). See Mixer Gain
section for details.
cmix(3:0)
fS / 8 Mixer
cmix(3)
fS / 4 Mixer
cmix(2)
fS / 2 Mixer
cmix(1)
–fS / 4 Mixer
cmix(0)
Mixing Mode
0000
Disabled
Disabled
Disabled
Disabled
No mixing
0001
Disabled
Disabled
Disabled
Enabled
–fS / 4
0010
Disabled
Disabled
Enabled
Disabled
fS / 2
0100
Disabled
Enabled
Disabled
Disabled
fS / 4
1000
Enabled
Disabled
Disabled
Disabled
fS / 8
1010
Enabled
Disabled
Enabled
Disabled
–3fS / 8
1100
Enabled
Enabled
Disabled
Disabled
3fS / 8
1110
Enabled
Enabled
Enabled
Disabled
–fS / 8
All others
–
–
–
–
Not recommended
MIXER GAIN
The maximum output amplitude out of the complex signal multiplier (i.e., FMIX mode or CMIX mode with fS / 8
mixer enabled) occurs if IIN(t) and QIN(t) are simultaneously full scale amplitude and the sine and cosine
arguments are equal to 2π x fMIXt + δ (2N-1) x π / 4, where N = 1, 2, 3, etc....
cosine
sine
Max output occurs when both
sine and cosine are 0.707
M0221-01
Figure 74. Maximum Output of the Complex Signal Multiplier
With mixer_gain = 1 and both IIN(t) and QIN(t) are simultaneously full scale amplitude, the maximum output
possible out of the complex signal multiplier is 0.707 + 0.707 = 1.414 (or 3dB). This configuration can cause
clipping of the signal and should therefore be used with caution.
With mixer_gain = 0 in config2, the maximum output possible out of the complex signal multiplier is 0.5 × (0.707
+ 0.707) = 0.707 (or –3 dB). This loss in signal power is in most cases undesirable, and it is recommended that
the gain function of the QMC block be used to increase the signal by 3 dB to compensate.
REAL CHANNEL UPCONVERSION
The mixer in the DAC34SH84 treats the A, B, C, and D inputs are complex input data and produces a complex
output for most mixing frequencies. The real input data for each channel can be isolated only when the mixing
frequency is set to normal mode or fS / 2 mode. See Table 8 for details.
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Table 9. Coarse Mixer Combinations
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QUADRATURE MODULATION CORRECTION (QMC)
GAIN AND PHASE CORRECTION
The DAC34SH84 includes a Quadrature Modulator Correction (QMC) block. The QMC blocks provide a mean for
changing the gain and phase of the complex signals to compensate for any I and Q imbalances present in an
analog quadrature modulator. The block diagram for the QMC block is shown in Figure 75. The QMC block
contains 3 programmable parameters.
Registers qmc_gainA/B(10:0) and qmc_gainC/D(10:0) controls the I and Q path gains and is an 11-bit unsigned
value with a range of 0 to 1.9990 and the default gain is 1.0000. The implied decimal point for the multiplication
is between bit 9 and bit 10.
Register qmc_phaseAB/CD(11:0) control the phase imbalance between I and Q and are a 12-bit values with a
range of –0.5 to approximately 0.49975. The QMC phase term is not a direct phase rotation but a constant that is
multiplied by each Q sample then summed into the I sample path. This is an approximation of a true phase
rotation in order to keep the implementation simple.
LO feed-through can be minimized by adjusting the DAC offset feature described below.
qmc_gainA[10:0]
ADVANCE INFORMATION
11
16
Σ
I Data In
(A)
16
I Data Out
(A)
12
qmc_phaseAB[11:0]
16
16
Q Data In
(B)
Q Data Out
(B)
11
qmc_gainB[10:0]
qmc_gainC[10:0]
11
16
Σ
I Data In
(C)
16
I Data Out
(C)
12
qmc_phaseCD[11:0]
16
16
Q Data In
(D)
Q Data Out
(D)
11
qmc_gainD[10:0]
B0164-03
Figure 75. QMC Block Diagram
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OFFSET CORRECTION
Registers qmc_offsetA(12:0), qmc_offsetB(12:0), qmc_offsetC(12:0) and qmc_offsetD(12:0) can be used to
independently adjust the dc offsets of each channel. The offset values are in represented in 2s-complement
format with a range from –4096 to 4095.
The offset value adds a digital offset to the digital data before digital-to-analog conversion. Because the offset is
added directly to the data it may be necessary to back off the signal to prevent saturation. Both data and offset
values are LSB aligned.
qmc_offsetA
{–4096, –4095, ..., 4095}
13
16
A Data In
16
B Data In
16
Σ
A Data Out
16
Σ
B Data Out
ADVANCE INFORMATION
13
qmc_offsetB
{–4096, –4095, ..., 4095}
qmc_offsetC
{–4096, –4095, ..., 4095}
13
16
C Data In
16
D Data In
16
Σ
C Data Out
16
Σ
D Data Out
13
qmc_offsetD
{–4096, –4095, ..., 4095}
B0165-03
Figure 76. Digital Offset Block Diagram
TEMPERATURE SENSOR
The DAC34SH84 incorporates a temperature sensor block which monitors the temperature by measuring the
voltage across 2 transistors. The voltage is converted to an 8-bit digital word using a successive-approximation
(SAR) analog to digital conversion process. The result is scaled, limited and formatted as a twos complement
value representing the temperature in degrees Celsius.
The sampling is controlled by the serial interface signals SDENB and SCLK. If the temperature sensor is enabled
(tsense_sleep = 0 in register config26) a conversion takes place each time the serial port is written or read. The
data is only read and sent out by the digital block when the temperature sensor is read in tempdata(7:0) in
config6. The conversion uses the first eight clocks of the serial clock as the capture and conversion clock, the
data is valid on the falling eighth SCLK. The data is then clocked out of the chip on the rising edge of the ninth
SCLK. No other clocks to the chip are necessary for the temperature sensor operation. As a result the
temperature sensor is enabled even when the device is in sleep mode.
In order for the process described above to operate properly, the serial port read from config6 must be done with
an SCLK period of at least 1 μs. If this is not satisfied the temperature sensor accuracy is greatly reduced.
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DATA PATTERN CHECKER
The DAC34SH84 incorporates a simple pattern checker test in order to determine errors in the data interface.
The main cause of failures is setup and/or hold timing issues. The test mode is enabled by asserting iotest_ena
in register config1. In test mode the analog outputs are deactivated regardless of the state of TXENA or
sif_texnable in register config3.
The data pattern key used for the test is 8 words long and is specified by the contents of iotest_pattern[0:7] in
registers config37 through config44. The data pattern key can be modified by changing the contents of these
registers.
The first word in the test frame is determined by a rising edge transition in ISTR or SYNC, depending on the
syncsel_fifoin(3:0) setting in config32. At this transition, the pattern0 word should be input to the data DAB[15:0]
pins, and pattern2 should be input to the data DCD[15:0] pins. Patterns 1, 4, and 5 of DAB[15:0] bus and pattern
3, 6, and 7 of DCD[15:0] bus should follow sequentially on each edge of DATACLK (rising and falling). The
sequence should be repeated until the pattern checker test is disabled by setting iotest_ena back to 0. It is not
necessary to have a rising ISTR or SYNC edge aligned with every four DATACLK cycle, just the first one to mark
the beginning of the series.
Start cycle again with optional rising edge of ISTR or SYNC
ADVANCE INFORMATION
DAB[15:0]P/N
Pattern 0 Pattern 1 Pattern 4 Pattern 5 Pattern 0 Pattern 1 Pattern 4 Pattern 5
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
DCD[15:0]P/N
Pattern 2 Pattern 3 Pattern 6 Pattern 7 Pattern 2 Pattern 3 Pattern 6 Pattern 7
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
DATACLKP/N (DDR)
Sync
Option #1
ISTRP/N
Sync
Option #2
SYNCP/N
T0532-01
Figure 77. IO Pattern Checker Data Transmission Format
The test mode determines if the all the patterns on the two 16-bit LVDS data buses (DAB[15:0]P/N and
DCD[15:0]P/N) were received correctly by comparing the received data against the data pattern key. If any bits in
either of the two 16-bit data buses were received incorrectly, the corresponding bits in iotest_results(15:0) in
register config4 will be set to 1 to indicate bit error location. The user can check the corresponding bit location on
both 16-bit data buses and implement the fix accordingly. Furthermore, the error condition will trigger the
alarm_from_iotest bit in register config5 to indicate a general error in the data interface. When data pattern
checker mode is enabled, this alarm in register config5, bit7 is the only valid alarm. Other alarms in register
config5 are not valid and can be disregarded.
For instance, pattern0 is programmed to the default of 0x7A7A. If the received Pattern 0 is 0x7A7B, then bit 0 in
iotest_results(15:0) will be set to 1 to indicate an error in bit 0 location. The alarm_from_iotest will also be set to
1 to report the data transfer error. Note that iotest_results(15:0) does not indicate which of the 16-bit buses has
the error. The user needs to check both 16-bit buses and then narrow down the error from the bit location
information.
The alarms can be cleared by writing 0x0000 to iotest_results(15:0) and 0 to alarm_from_iotest through the serial
interface. The serial interface will read back 0s if there are no errors or if the errors are cleared. The
corresponding alarm bit will remain a 1 if the errors remain.
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It is recommended to enable the pattern checker and then run the pattern sequence for 100 or more complete
cycles before clearing the iotest_results(15:0) and alarm_from_iotest. This will eliminate the possibility of false
alarms generated during the setup sequence.
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ISTR
or
SYNC
32-Bit
32-Bit
LVDS
Drivers Only one
edge needed
DATACLK
Data
Format
Pattern 0 ... 7
DAB[15:0]
DCD[15:0]
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0
Pattern 0
Bit-by-Bit Compare
0
1
Pattern 1
Bit-by-Bit Compare
1
2
Pattern 2
Bit-by-Bit Compare
3
Pattern 3
Bit-by-Bit Compare
16-Bit
4
Pattern 4
Bit-by-Bit Compare
5
Pattern 5
Bit-by-Bit Compare
16-Bit
2
3
iotest_pattern0
iotest_pattern1
iotest_pattern2
iotest_results[15]
iotest_pattern3
iotest_pattern4
4
iotest_pattern5
5
iotest_pattern6
ADVANCE INFORMATION
6
Pattern 6
Bit-by-Bit Compare
6
7
Pattern 7
Bit-by-Bit Compare
7
8-Bit
Input
iotest_pattern7
16-Bit
Input
Bit 15
Results
•
•
•
8-Bit
Input
•
•
•
•
•
•
iotest_results[0]
alarm_from_iotest
All Bits
Results
Bit 0
Results
Go back to 0 after cycle or new
rising edge on ISTR or SYNC
B0462-01
Figure 78. DAC34SH84 Pattern Check Block Diagram
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PARITY CHECK TEST
The DAC34SH84 has a parity check test that enables continuous validity monitoring of the data received by the
DAC. Parity check testing in combination with the data pattern checker offer an excellent solution for detecting
board assembly issues due to missing pad connections.
For the parity check test, an extra parity bit is added to the data bits to ensure that the total number of set bits
(bits with value 1) is even or odd. This simple scheme is used to detect single or any other odd number of data
transfer errors. Parity testing is implemented in the DAC34SH84 in two ways: 32-bit parity and dual 16-bit parity.
32-BIT PARITY
For example, if the oddeven_parity bit is set to 1 for odd parity, then the number of 1s on the 33-bit data bus
should be odd. The DAC will check the data transfer through the parity input. If the data received has odd
number of 1s, then the parity is correct. If the data received has even number of 1s, then the parity is incorrect.
The corresponding alarm for parity error will be set accordingly.
Figure 79 shows the simple XOR structure used to check word parity. Parity is tested independently for data
captured on both rising and falling edges of DATACLK (alarm_Aparity and alarm_Bparity, respectively). Testing
on both edges helps in determining a possible setup or hold issue. Both alarms are captured individually in
register config5.
PARITY
alarm_Aparity
oddeven_parity
DAB[15:0]
DCD[15:0]
Parity Block
alarm_Bparity
DATACLK
B0458-02
Figure 79. DAC34SH84 32-Bit Parity Check
DUAL 16-BIT PARITY
In the dual 16-bit mode, each 16-bit LVDS data bus input will be accompanied by a parity bit for error checking.
The DAB[15:0]P/N and ISTRP/N are one 17-bit data path, and the DCD[15:0]P/N and PARITYP/N are another
path. This mode is enabled by setting parity_ena = 1 and single_dual_parity = 1 in register config1. The input
parity value is defined to be the total number of logic 1s on each 17-bit data bus. This value, the total number of
logic 1s, must match the parity test selected in the oddeven_parity bit in register config1.
For example, if the oddeven_parity bit is set to 1 for odd parity, then the number of 1s on each 17-bit data bus
should be odd. The DAC will check the data transfer through the parity input. If the data received has odd
number of 1s, then the parity is correct. If the data received has even number of 1s, then the parity is incorrect.
The corresponding alarm for parity error will be set accordingly.
Figure 80 shows the simple XOR structure used to check word parity. Parity is tested independently for data
captured on both rising and falling edges of DATACLK for each data path (alarm_Aparity, alarm_Bparity,
alarm_Cparity, and alarm_Dparity, respectively). Testing on both edges and both data buses helps in
determining a possible setup or hold issue. All of the alarms are captured individually in register config5.
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In the 32-bit mode the additional parity bit is sourced to the parity input (PARITYP/N) for the 32-bit data transfer
into the DAB[15:0]P/N and DCD[15:0]P/N inputs. This mode is enabled by setting parity_ena = 1 and
single_dual_parity = 0 in register config1. The input parity value is defined to be the total number of logic 1s on
the 33-bit data bus – the DAB[15:0]P/N inputs, the DCD[15:0]P/N inputs, and the PARITYP/N input. This value,
the total number of logic 1s, must match the parity test selected in the oddeven_parity bit in register config1.
DAC34SH84
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In this mode the ISTR signal functions as a parity signal and cannot be used to sync the FIFO pointer
simultaneously. It is recommended to use the SYNC to sync the FIFO pointer. If ISTR has to be used to sync the
FIFO pointer, the ISTR sync can only be possible upon start-up when dual 16-bit parity function is disabled.
Once the initialization is finished, disable the FIFO pointer sync through ISTR (by configuring syncsel_fifoin and
syncsel_fifoout in config32) and enable the dual 16-bit parity function afterwards.
alarm_Aparity
ISTR
oddeven_parity
DAB[15:0]
alarm_Bparity
Parity Block
DATACLK
ADVANCE INFORMATION
alarm_Cparity
PARITY
oddeven_parity
DCD[15:0]
Parity Block
alarm_Dparity
DATACLK
B0463-01
Figure 80. DAC34SH84 Dual 16-Bit Parity Check
DAC34SH84 ALARM MONITORING
The DAC34SH84 includes a flexible set of alarm monitoring that can be used to alert of a possible malfunction
scenario. All the alarm events can be accessed either through the config5 register or through the ALARM pin.
Once an alarm is set, the corresponding alarm bit in register config5 must be reset through the serial interface to
allow further testing. The set of alarms includes the following conditions:
Zero check alarm
• Alarm_from_zerochk. Occurs when the FIFO write pointer has an all zeros pattern. Since the write pointer is a
shift register, all zeros will cause the input point to be stuck until the next sync event. When this happens a
sync to the FIFO block is required.
FIFO alarms
• alarm_from_fifo. Occurs when there is a collision in the FIFO pointers or a collision event is close.
– alarm_fifo_2away. Pointers are within two addresses of each other.
– alarm_fifo_1away. Pointers are within one address of each other.
– alarm_fifo_collision. Pointers are equal to each other.
Clock alarms
• clock_gone. Occurs when either the DACCLK or DATACLOCK have been stopped.
– alarm_dacclk_gone. Occurs when the DACCLK has been stopped.
– alarm_dataclk_gone. Occurs when the DATACLK has been stopped.
Pattern checker alarm
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alarm_from_iotest. Occurs when the input data pattern does not match the pattern key.
PLL alarm
• alarm_from_pll. Occurs when the PLL is out of lock.
Parity alarms
• alarm_Aparity: In dual parity mode, alarm indicating a parity error on the A word. In single parity mode, alarm
on the 32-bit data captured on the rising edge of DATACLKP/N.
• alarm_Bparity: In dual parity mode, alarm indicating a parity error on the B word. In single parity mode, alarm
on the 32-bit data captured on the falling edge of DATACLKP/N.
• alarm_Cparity: In dual parity mode, alarm indicating a parity error on the C word.
• alarm_Dparity: In dual parity mode, alarm indicating a parity error on the D word.
Alarm monitoring is implemented as follows:
• Power up the device using the recommended power-up sequence.
• Clear all the alarms in config5 by setting them to zeros.
• Unmask those alarms that will generate a hardware interrupt through the ALARM pin in config7.
• Enable automatic DAC shut-off in register config2 if required.
• In the case of an alarm event, the ALARM pin will trigger. If automatic DAC shut-off has been enabled the
DAC outputs will be disabled.
• Read registers config5 to determine which alarm triggered the ALARM pin.
• Correct the error condition and re-synchronize the FIFO.
• Clear the alarms in config5.
• Re-read config5 to ensure the alarm event has been corrected.
• Keep clearing and reading config5 until no error is reported.
POWER-UP SEQUENCE
The following startup sequence is recommended to power-up the DAC34SH84:
1. Set TXENA low
2. Supply all 1.35V voltages (DACVDD, CLKVDD), 1.3V voltages (DIGVDD, VFUSE), and 3.3V voltages
(AVDD, IOVDD, and PLLAVDD). The 1.2V and 3.3V supplies can be powered up simultaneously or in any
order. There are no specific requirements on the ramp rate for the supplies.
3. Provide all LVPECL inputs: DACCLKP/N and the optional OSTRP/N. These inputs can also be provided after
the SIF register programming.
4. Toggle the RESETB pin for a minimum 25 ns active low pulse width.
5. Program the SIF registers.
6. Program fuse_sleep (config27, bit<11>) to put the internal fuses to sleep.
7. FIFO configuration needed for synchronization:
(a) Program syncsel_fifoin(3:0) (config32, bit<15:12>) to select the FIFO input pointer sync source.
(b) Program syncsel_fifoout(3:0) (config32, bit<11:8>) to select the FIFO output pointer sync source.
(c) Program syncsel_fifo_input(1:0) (config31, bit<3:2>) to select the FIFO input sync source.
8. Clock divider configuration needed for synchronization:
(a) Program clkdiv_sync_sel (config32, bit<0>) to select the clock divider sync source.
(b) Program clkdiv_sync_ena (config0, bit<2>) to 1 to enable clock divider sync.
(c) For multi-DAC synchronization in PLL mode, program pll_ndivsync_ena (config24, bit<11>) to 1 to
synchronize the PLL N-divider.
9. Provide all LVDS inputs (D[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, ISTRP/N, SYNCP/N and PARITYP/N)
simultaneously. Synchronize the FIFO and clock divider by providing the pulse or periodic signals needed.
(a) For Single Sync Source Mode where either ISTRP/N or SYNCP/N is used to sync the FIFO, a single
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ADVANCE INFORMATION
To prevent unexpected DAC outputs from propagating into the transmit channel chain, the clock and alarm_
fifo_collision alarms can be set in config2 to shut-off the DAC output automatically regardless of the state of
TXENA or sif_txenable.
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
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ADVANCE INFORMATION
rising edge for FIFO and clock divider sync is recommended. Periodic sync signal is not recommended
due to the non-deterministic latency of the sync signal through the clock domain transfer.
(b) For Dual Sync Sources Mode, both single pulse or periodic sync signals can be used.
(c) For multi-DAC synchronization in PLL mode, the LVDS SYNCP/N signal is used to sync the PLL Ndivider and can be sourced from either the FPGA/ASIC pattern generator or clock distribution circuit as
long as the t(SYNC_PLL) setup and hold timing requirement is met with respect to the reference clock
source at DACCLKP/N pins. The LVDS SYNCP/N signal can be provided at this point.
10. FIFO and clock divider configurations after all the sync signals have provided the initial sync pulses needed
for synchronization:
(a) For Single Sync Source Mode where the clock divider sync source is either ISTRP/N or SYNCP/N, clock
divider syncing must be disabled after DAC34SH84 initialization and before the data transmission by
setting clkdiv_sync_ena (config0, bit 2) to 0.
(b) For Dual Sync Sources Mode, where the clock divider sync source is from the OSTR signal (either from
external OSTRP/N or internal PLL N divider output), the clock divider syncing may be enabled at all time.
(c) Optionally, to prevent accidental syncing of the FIFO when sending the ISTRP/N or SYNCP/N pulse to
other digital blocks such as NCO, QMC, etc, disable FIFO syncing by setting syncsel_fifoin(3:0) and
syncsel_fifoout(3:0) to 0000 after the FIFO input and output pointers are initialized. If the FIFO and sync
remain enabled after initialization, the ISTRP/N or SYNCP/N pulse must occur in ways to not disturb the
FIFO operation. Refer to the INPUT FIFO section for detail.
(d) Disable PLL N-divider syncing by setting pll_ndivsync_ena (config24, bit<11>) to 0.
11. Enable transmit of data by asserting the TXENA pin or set sif_txenable to 1.
12. At any time, if any of the clocks (that is, DATACLK or DACCLK) is lost or a FIFO collision alarm is detected,
a complete resynchronization of the DAC is necessary. Set TXENABLE low and repeat steps 7 through 11.
Program the FIFO configuration and clock divider configuration per steps 7 and 8 appropriately to accept the
new sync pulse or pulses for the synchronization.
EXAMPLE START-UP ROUTINE
DEVICE CONFIGURATION
fDATA = 737.28 MSPS
Interpolation = 2×
Input data = baseband data
fOUT = 122.88 MHz
PLL = Enabled
Full Mixer = Enabled
NCO = Enabled
Dual Sync Sources Mode
PLL CONFIGURATION
fREFCLK = 737.28 MHz at the DACCLKP/N LVPECL pins
fDACCLK = fDATA × Interpolation = 1474.56 MHz
fVCO = 2 × fDACCLK = 2949.12 MHz (keep fVCO between 2.7 GHz and 3.3
GHz)
PFD = fOSTR = 46.08 MHz
N = 16, M = 32, P = 2, single charge pump
pll_vco(5:0) = 01 1100 (28)
66
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NCO CONFIGURATION
fNCO = 122.88 MHz
fNCO_CLK = 1474.56 MHz
freq = fNCO × 232 / 1228.8 = 357,913,941 = 0x1555 5555
phaseaddAB(31:0) and/or phaseaddCD(31:0) = 0x1555 5555
NCO SYNC = sif_sync
EXAMPLE START-UP SEQUENCE
Table 10. Example Start-Up Sequence Description
READ/WRITE
ADDRESS
VALUE
1
N/A
N/A
N/A
Set TXENA low
DESCRIPTION
2
N/A
N/A
N/A
Power up the device
3
N/A
N/A
N/A
Apply LVPECL DACCLKP/N for PLL reference clock
4
N/A
N/A
N/A
Toggle RESETB pin
5
Write
0x00
0xF19F
QMC offset and correction enabled, 2x int, FIFO enabled, Alarm enabled,
clock divider sync enabled, inverse sinc filter enabled.
6
Write
0x01
0x040E
Single parity enabled, FIFO alarms enabled (2 away, 1 away, and collision).
7
Write
0x02
0x7052
Output shut-off when DACCLK gone, DATACLK gone, and FIFO collision.
Mixer block with NCO enabled, twos complement.
8
Write
0x03
0xA000
Output current set to 20 mAFS with internal reference and 1.28-kΩ RBIAS
resistor.
9
Write
0x07
0xD8FF
Un-mask FIFO collision, DACCLK-gone, and DATACLK-gone alarms to the
Alarm output.
10
Write
0x08
N/A
Program the desired channel A QMC offset value. (Causes auto-sync for
QMC AB-channels offset block)
11
Write
0x09
N/A
Program the desired FIFO offset value and channel B QMC offset value.
12
Write
0x0A
N/A
Program the desired channel C QMC offset value. (Causes auto-sync for
QMC CD-channels offset block)
13
Write
0x0B
N/A
Program the desired channel D QMC offset value.
14
Write
0x0C
N/A
Program the desired channel A QMC gain value.
15
Write
0x0D
N/A
Coarse mixer mode not used. Program the desired channel B QMC gain
value.
16
Write
0x0E
N/A
Program the desired channel B QMC gain value.
17
Write
0x0F
N/A
Program the desired channel C QMC gain value.
18
Write
0x10
N/A
Program the desired channel AB QMC phase value. (Causes Auto-Sync
QMC AB-Channels Correction Block)
19
Write
0x11
N/A
Program the desired channel CD QMC phase value. (Causes Auto-Sync for
the QMC CD-Channels Correction Block)
20
Write
0x12
N/A
Program the desired channel AB NCO phase offset value. (Causes AutoSync for Channel AB NCO Mixer)
21
Write
0x13
N/A
Program the desired channel CD NCO phase offset value. (Causes AutoSync for Channel CD NCO Mixer)
22
Write
0x14
0x5555
Program the desired channel AB NCO frequency value
23
Write
0x15
0x1555
Program the desired channel AB NCO frequency value
24
Write
0x16
0x5555
Program the desired channel CD NCO frequency value
25
Write
0x17
0x1555
Program the desired channel CD NCO frequency value
26
Write
0x18
0x2C50
PLL enabled, PLL N-dividers sync enabled, single charge pump, prescaler =
2.
27
Write
0x19
0x20F4
M = 32, N = 16, PLL VCO bias tune = "01"
28
Write
0x1A
0x7010
PLL VCO coarse tune = 28
29
Write
0x1B
0x0800
Internal reference
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ADVANCE INFORMATION
STEP
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
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Table 10. Example Start-Up Sequence Description (continued)
STEP
ADVANCE INFORMATION
68
READ/WRITE
ADDRESS
VALUE
DESCRIPTION
30
Write
0x1E
0x9999
QMC offset AB, QMC offset CD, QMC correction AB, and QMC correction
CD can be synced by sif_sync or auto-sync from register write
31
Write
0x1F
0x4440
Mixer AB and CD values synced by SYNCP/N. NCO accumulator synced by
SYNCP/N.
32
Write
0x20
0x2400
FIFO Input Pointer Sync Source = ISTR FIFO Output Pointer Sync Source =
OSTR (from PLL N-divider output) Clock Divider Sync Source = OSTR
33
N/A
N/A
N/A
Provide all the LVDS DATA and DATACLK Provide rising edge ISTRP/N
and rising edge SYNCP/N to sync the FIFO input pointer and PLL Ndividers.
34
Read
0x18
N/A
Read back pll_lfvolt(2:0). If the value is not optimal, adjust pll_vco(5:0) in
0x1A.
35
Write
0x05
0x0000
36
Read
0x05
N/A
37
Write
0x1F
0x4442
Sync all the QMC blocks using sif_sync. These blocks can also be synced
via auto-sync through appropriate register writes.
38
Write
0x00
0xF19B
Disable clock divider sync.
39
Write
0x1F
0x4448
Set sif_sync to 0 for the next sif_sync event.
40
Write
0x20
0x0000
Disable FIFO input and output pointer sync.
41
Write
0x18
0x2450
Disable PLL N-dividers sync.
42
N/A
N/A
N/A
Clear all alarms in 0x05.
Read back all alarms in 0x05. Check for PLL lock, FIFO collision, DACCLKgone, DATACLK-gone, etc. Fix the error appropriately. Repeat step 34 and
35 as necessary.
Set TXENA high. Enable data transmission.
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LVPECL INPUTS
Figure 81 shows an equivalent circuit for the DAC input clock (DACCLKP/N) and the output strobe clock
(OSTRP/N).
CLKVDD
250 Ω
2 kΩ
2 kΩ
DACCLKN
OSTRN
DACCLKP
OSTRP
SLEEP
GND
S0515-01
Figure 81. DACCLKP/N and OSTRP/N Equivalent Input Circuit
Figure 82 shows the preferred configuration for driving the CLKIN/CLKINC input clock with a differential ECL or
PECL source.
CAC
0.1 μF
Differential
ECL
or
(LV)PECL
Source
+
CLKIN
CAC
0.1 μF
100 Ω
CLKINC
–
RT
150 Ω
RT
150 Ω
S0029-02
Figure 82. Preferred Clock Input Configuration With a Differential ECL or PECL Clock Source
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ADVANCE INFORMATION
Internal
Digital In
250 Ω
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
LVDS INPUTS
The DAB[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, SYNCP/N, PARITYP/N, and ISTRP/N LVDS pairs have the
input configuration shown in Figure 83. Figure 84 shows the typical input levels and common-move voltage used
to drive these inputs.
IOVDD
100 Ω
LVDS
Receiver
Internal Digital In
ADVANCE INFORMATION
GND
S0516-01
Figure 83. DAB[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, ISTRP/N, SYNCP/N and PARITYP/N LVDS Input
Configuration
Example
DAC34SH84
VA, B
VCOM = (VA + VB)/2
VA
1.4 V
VB
1V
LVDS
Receiver
100 Ω
400 mV
VA, B
VA
0V
–400 mV
VB
GND
1
Logical Bit
Equivalent
0
B0459-04
Figure 84. LVDS Data Input Levels
Table 11. Example LVDS Data Input Levels
Applied Voltages
70
Resulting Differential
Voltage
Resulting Common-Mode
Voltage
VA,B
VCOM
VA
VB
1.4 V
1.0 V
400 mV
1.0 V
1.4 V
–400 mV
1.2 V
0.8 V
400 mV
0.8 V
1.2 V
–400 mV
1.2 V
1.0 V
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Logical Bit Binary
Equivalent
1
0
1
0
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CMOS DIGITAL INPUTS
Figure 85 shows a schematic of the equivalent CMOS digital inputs of the DAC34SH84. SDIO, SCLK, SLEEP
and TXENA have pull-down resistors while SDENB and RESETB have pull-up resistors internal to the
DAC34SH84. All the CMOS digital inputs and outputs are referred to the IOVDD2 supply, which can vary from
1.8V to 3.3V. This facilitates the I/O interface and eliminates the need of level translation. See the specification
table for logic thresholds. The pull-up and pull-down circuitry is approximately equivalent to 100kΩ.
IOVDD2
IOVDD2
100 kΩ
400 Ω
Internal
Digital In
SDENB
RESETB
GND
400 Ω
Internal
Digital In
GND
S0027-04
Figure 85. CMOS Digital Equivalent Input
REFERENCE OPERATION
The DAC34SH84 uses a bandgap reference and control amplifier for biasing the full-scale output current. The
full-scale output current is set by applying an external resistor RBIAS to pin BIASJ. The bias current IBIAS through
resistor RBIAS is defined by the on-chip bandgap reference voltage and control amplifier. The default full-scale
output current equals 64 times this bias current and can thus be expressed as:
IOUTFS = 64 × IBIAS = 64 × (VEXTIO / RBIAS ) / 2
The DAC34SH84 has a 4-bit coarse gain control coarse_dac(3:0) in the config3 register. Using gain control, the
IOUTFS can be expressed as:
IOUTFS = (coarse_dac + 1) / 16 × IBIAS × 64 = (coarse_dac + 1) / 16 × (VEXTIO / RBIAS) / 2 × 64
where VEXTIO is the voltage at terminal EXTIO. The bandgap reference voltage delivers an accurate voltage of
1.2V. This reference is active when extref_ena = 0 in config27. An external decoupling capacitor CEXT of 0.1 µF
should be connected externally to terminal EXTIO for compensation. The bandgap reference can additionally be
used for external reference operation. In that case, an external buffer with high impedance input should be
applied in order to limit the bandgap load current to a maximum of 100 nA. The internal reference can be
disabled and overridden by an external reference by setting the extref_ena control bit. Capacitor CEXT may hence
be omitted. Terminal EXTIO thus serves as either input or output node.
The full-scale output current can be adjusted from 30 mA down to 10 mA by varying resistor RBIAS, programming
coarse_dac(3:0), or changing the externally applied reference voltage.
NOTE
With internal reference, the minimum Rbias resistor value is 1.28kΩ. Resistor value below
1.28kΩ is not recommended sice it will program the full-scale current to go above 30mA
and potentially damages the device.
DAC TRANSFER FUNCTION
The CMOS DACs consist of a segmented array of PMOS current sources, capable of sourcing a full-scale output
current up to 30 mA. Differential current switches direct the current to either one of the complementary output
nodes IOUTP or IOUTN. Complementary output currents enable differential operation, thus canceling out
common mode noise sources (digital feed-through, on-chip and PCB noise), dc offsets, even order distortion
components, and increasing signal output power by a factor of two.
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ADVANCE INFORMATION
SDIO
SCLK
SLEEP
TXENA
100 kΩ
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
The full-scale output current is set using external resistor RBIAS in combination with an on-chip bandgap voltage
reference source (+1.2 V) and control amplifier. Current IBIAS through resistor RBIAS is mirrored internally to
provide a maximum full-scale output current equal to 64 times IBIAS.
The relation between IOUTP and IOUTN can be expressed as:
IOUTFS = IOUTP + IOUTN
We will denote current flowing into a node as – current and current flowing out of a node as + current. Since the
output stage is a current source the current flows from the IOUTP and IOUTN pins. The output current flow in
each pin driving a resistive load can be expressed as:
IOUTP = IOUTFS × CODE / 65,536
IOUTN = IOUTFS × (65,535 – CODE) / 65,536
where CODE is the decimal representation of the DAC data input word
For the case where IOUTP and IOUTN drive resistor loads RL directly, this translates into single ended voltages
at IOUTP and IOUTN:
VOUTP = IOUT1 x RL
VOUTN = IOUT2 x RL
ADVANCE INFORMATION
Assuming that the data is full scale (65,535 in offset binary notation) and the RL is 25 Ω, the differential voltage
between pins IOUTP and IOUTN can be expressed as:
VOUTP = 20mA x 25 Ω = 0.5 V
VOUTN = 0mA x 25 Ω = 0 V
VDIFF = VOUTP – VOUTN = 0.5V
Note that care should be taken not to exceed the compliance voltages at node IOUTP and IOUTN, which would
lead to increased signal distortion.
ANALOG CURRENT OUTPUTS
The DAC34SH84 can be easily configured to drive a doubly terminated 50 Ω cable using a properly selected RF
transformer. Figure 86 and Figure 87 show the 50 Ω doubly terminated transformer configuration with 1:1 and 4:1
impedance ratio, respectively. Note that the center tap of the primary input of the transformer has to be grounded
to enable a DC current flow. Applying a 20 mA full-scale output current would lead to a 0.5 Vpp for a 1:1
transformer and a 1 Vpp output for a 4:1 transformer. The low dc-impedance between IOUTP or IOUTN and the
transformer center tap sets the center of the ac-signal to GND, so the 1 Vpp output for the 4:1 transformer
results in an output between –0.5 V and +0.5 V.
50 Ω
1:1
IOUTP
100 Ω
AGND
RLOAD
50 Ω
IOUTN
50 Ω
S0517-01
Figure 86. Driving a Doubly Terminated 50 Ω Cable Using a 1:1 Impedance Ratio Transformer
72
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100 Ω
4:1
IOUTP
RLOAD
50 Ω
AGND
IOUTN
100 Ω
S0518-01
PACKAGE OPTION ADDENDUM
ORDERABLE
DEVICE
STATUS
PACKAGE
TYPE
PINS
PACKAGE
QUANTITY
ECO PLAN
LEAD/BALL
FINISH
MSL PEAK
TEMPERATURE
DAC34SH84IZAY
Active
NFBGA
196
800
Green (RoHS and no
Sb/Br)
SNAGCU
MSL3 260C
DAC34SH84IZAYR
Active
NFBGA
196
1000
Green (RoHS and no
Sb/Br)
SNAGCU
MSL3 260C
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ADVANCE INFORMATION
Figure 87. Driving a Doubly Terminated 50 Ω Cable Using a 4:1 Impedance Ratio Transformer
DAC34SH84
SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
www.ti.com
REVISION HISTORY
Changes from Revision A (June 2012) to Revision B
Page
•
Added thermal information to the Absolute Maximum Ratings table .................................................................................... 6
•
Deleted TJ row from top of thermal table .............................................................................................................................. 7
•
Added Recommended Operating Conditions table .............................................................................................................. 7
•
Deleted OPERATING RANGE section from bottom of Electrical Characteristics - DC Specifications table ....................... 9
ADVANCE INFORMATION
74
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
DAC34SH84IZAY
PREVIEW
NFBGA
ZAY
196
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
DAC34SH84IZAYR
PREVIEW
NFBGA
ZAY
196
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
XDAC34SH84IZAY
PREVIEW
NFBGA
ZAY
196
160
TBD
Call TI
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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