DS90LV011A www.ti.com SNLS140C – MAY 2002 – REVISED APRIL 2013 DS90LV011A 3V LVDS Single High Speed Differential Driver Check for Samples: DS90LV011A FEATURES DESCRIPTION • • • The DS90LV011A is a single LVDS driver device optimized for high data rate and low power applications. The DS90LV011A is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is designed to support data rates in excess of 400Mbps (200MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. 1 2 • • • • • • • • • • Conforms to TIA/EIA-644-A Standard >400Mbps (200MHz) Switching Rates 700 ps (100 ps Typical) Maximum Differential Skew 1.5 ns Maximum Propagation Delay Single 3.3V Power Supply ±350 mV Differential Signaling Power Off Protection (Outputs in TRI-STATE) Pinout Simplifies PCB Layout Low Power Dissipation (23 mW @ 3.3V Typical) SOT-23 5-Lead Package SOT-23 Version Pin Compatible with SN65LVDS1 Fabricated with Advanced CMOS Process Technology Industrial Temperature Operating Range – (−40°C to +85°C) The device is in a 5-lead SOT-23 package. The LVDS outputs have been arranged for easy PCB layout. The differential driver outputs provide low EMI with its typical low output swing of 350 mV. The DS90LV011A can be paired with its companion single line receiver, the DS90LV012A, or with any of TI's LVDS receivers, to provide a high-speed LVDS interface. Connection Diagram Figure 1. Top View See Package Number DBV (R-PDSO-G5) Functional Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2013, Texas Instruments Incorporated DS90LV011A SNLS140C – MAY 2002 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) −0.3V to +4V Supply Voltage (VDD) LVCMOS input voltage (TTL IN) −0.3V to +3.6V LVDS output voltage (OUT±) −0.3V to +3.9V LVDS output short circuit current 24mA Maximum Package Power Dissipation @ +25°C DBV Package 902 mW Derate DBV Package 7.22 mW/°C above +25°C Thermal Resistance (θJA) 138.5°C/Watt −65°C to +150°C Storage Temperature Lead Temperature – Soldering +260°C (4 sec.) Maximum Junction Temperature +150°C ESD Ratings ≥ 9kV HBM (1.5 kΩ, 100 pF) EIAJ (0 Ω, 200 pF) ≥ 900V CDM (0 Ω, 0 pF) ≥ 2000V IEC direct (330 Ω, 150 pF) (1) ≥ 4kV “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation. Recommended Operating Conditions Min Typ Max Supply Voltage (VDD) 3.0 3.3 3.6 V Temperature (TA) -40 +25 +85 °C 2 Submit Documentation Feedback Units Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011A DS90LV011A www.ti.com SNLS140C – MAY 2002 – REVISED APRIL 2013 Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) (3) Symbol Parameter Conditions RL = 100Ω (Figure 2 and Figure 3) Pin Min Typ Max Units OUT+, OUT− 250 350 450 mV 3 35 mV 1.125 1.22 1.375 V 0 1 25 mV |VOD| Output Differential Voltage ΔVOD VOD Magnitude Change VOS Offset Voltage ΔVOS Offset Magnitude Change IOFF Power-off Leakage VOUT = 3.6V or GND, VDD = 0V ±1 ±10 μA IOS Output Short Circuit Current (4) VOUT+ and VOUT− = 0V −6 −24 mA IOSD Differential Output Short Circuit Current (4) VOD = 0V −5 −12 mA COUT Output Capacitance VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = 3.3V or 2.4V IIL Input Low Current VIN = GND or 0.5V VCL Input Clamp Voltage ICL = −18 mA CIN Input Capacitance IDD Power Supply Current RL = 100Ω (Figure 2) 3 TTL IN VDD V GND 0.8 V ±2 ±10 μA ±1 ±10 μA −1.5 (2) (3) (4) −0.6 V 3 No Load VIN = VDD or GND VDD RL = 100Ω (1) pF 2.0 pF 5 8 mA 7 10 mA Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD. All typicals are given for: VDD = +3.3V and TA = +25°C. The DS90LV011A is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs. Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Switching Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (1) (2) (3) (4) Symbol Parameter Conditions Min Typ Max Units tPHLD Differential Propagation Delay High to Low RL = 100Ω, CL = 15 pF 0.3 1.0 1.5 ns tPLHD Differential Propagation Delay Low to High (Figure 4 and Figure 5) 0.3 1.1 1.5 ns tSKD1 Differential Pulse Skew |tPHLD − tPLHD| (5) 0 0.1 0.7 ns tSKD3 Differential Part to Part Skew (6) 0 0.2 1.0 ns tSKD4 Differential Part to Part Skew (7) 0 0.4 1.2 ns tTLH Transition Low to High Time 0.2 0.5 1.0 ns tTHL Transition High to Low Time 0.2 0.5 1.0 ns 200 250 fMAX (1) (2) (3) (4) (5) (6) (7) (8) Maximum Operating Frequency (8) MHz All typicals are given for: VDD = +3.3V and TA = +25°C. These parameters are specified by design. The limits are based on statistical analysis of the device performance over PVT (process, voltage, temperature) ranges. CL includes probe and fixture capacitance. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, tf ≤ 1 ns (10%-90%). tSKD1, |tPHLD − tPLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VDD and within 5°C of each other within the operating temperature range. tSKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay. fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, VOD > 250mV. The parameter is specified by design. The limit is based on the statistical analysis of the device over the PVT range by the transitions times (tTLH and tTHL). Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011A 3 DS90LV011A SNLS140C – MAY 2002 – REVISED APRIL 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 2. Differential Driver DC Test Circuit Figure 3. Differential Driver Full Load DC Test Circuit Figure 4. Differential Driver Propagation Delay and Transition Time Test Circuit Figure 5. Differential Driver Propagation Delay and Transition Time Waveforms 4 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011A DS90LV011A www.ti.com SNLS140C – MAY 2002 – REVISED APRIL 2013 APPLICATION INFORMATION Table 1. Device Pin Descriptions Package Pin Number SOT-23 Pin Name Description 5 TTL IN LVTTL/LVCMOS driver input pins 4 OUT+ Non-inverting driver output pin 3 OUT− Inverting driver output pin 2 GND Ground pin 1 VDD Power supply pin, +3.3V ± 0.3V Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011A 5 DS90LV011A SNLS140C – MAY 2002 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011A PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS90LV011ATMF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 N01 DS90LV011ATMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N01 DS90LV011ATMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N01 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SOT-23 DBV 5 1000 178.0 8.4 DS90LV011ATMF/NOPB SOT-23 DBV 5 1000 178.0 DS90LV011ATMFX/NOPB SOT-23 DBV 5 3000 178.0 DS90LV011ATMF Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90LV011ATMF SOT-23 DBV 5 1000 210.0 185.0 35.0 DS90LV011ATMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 DS90LV011ATMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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