AM26LV31E www.ti.com............................................................................................................................................................... SLLS848A – APRIL 2008 – REVISED MAY 2008 LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVER WITH ±15-kV IEC ESD PROTECTION FEATURES 1 • • • 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 4A 4Y 4Z G 3Z 3Y 3A RGY PACKAGE (TOP VIEW) 1Y 1Z G 2Z 2Y 2A VCC • • 1A 1Y 1Z G 2Z 2Y 2A GND 1 16 2 15 4A 3 4 14 4Y 5 6 12 G 13 4Z 11 3Z 10 3Y 7 8 9 3A • • • • • • D, NS, OR PW PACKAGE (TOP VIEW) 1A • • Meets or Exceeds Standards TIA/EIA-422-B and ITU Recommendation V.11 Operates From a Single 3.3-V Power Supply ESD Protection for RS422 Bus Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC61000-4-2, Contact Discharge – ±15-kV IEC61000-4-2, Air-Gap Discharge Switching Rates up to 32 MHz Propagation Delay Time . . . 8 ns Typ Pulse Skew Time . . . 500 ps Typ High Output-Drive Current . . . ±30 mA Controlled Rise and Fall Times . . . 5 ns Typ Differential Output Voltage With 100-Ω Load . . . 2.6 V Typ Accepts 5-V Logic Inputs With 3.3-V Supply Ioff Supports Partial-Power-Down Mode Operation Driver Output Short-Protection Circuit Glitch-Free Power-Up/Power-Down Protection Package Options: SOP, SOIC, TSSOP, QFN GND • DESCRIPTION/ORDERING INFORMATION The AM26LV31E is a quadruple differential line driver with 3-state outputs. This driver has ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection. This device is designed to meet TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply voltage. The device is optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have high current capability for driving balanced lines, such as twisted-pair transmission lines, and provide a high impedance in the power-off condition. The AM26LV31EI is characterized for operation from –40°C to 85°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated AM26LV31E SLLS848A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC – D Tape and reel AM26LV31EIDR AM26LV3IEI SOP – NS Tape and reel AM26LV31EINSR 26LV31EI TSSOP – PW Tape and reel AM26LV31EIPWR SB31 QFN – RGY Tape and reel AM26LV31EIRGYR SB31 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTION TABLE (1) (1) ENABLES OUTPUTS INPUT A G G Y Z H H X H L H L H X L H X L H L L X L L H X L H Z Z H = high level, L = low level, X = irrelevant, Z = high impedance (off) LOGIC DIAGRAM G G 1A 2A 3A 4A 2 4 12 1 2 3 7 6 5 9 10 11 15 14 13 Submit Documentation Feedback 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV31E AM26LV31E www.ti.com............................................................................................................................................................... SLLS848A – APRIL 2008 – REVISED MAY 2008 SCHEMATIC EQUIVALENT OF EACH INPUT (A, G, OR G) TYPICAL OF EACH DRIVER OUTPUT VCC VCC Input Output GND GND ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) (2) MIN MAX UNIT VCC Supply voltage range –0.5 6 V VI Input voltage range –0.5 6 V VO Output voltage range –0.5 6 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 lO Continuous output current Continuous current through VCC or GND ±200 mA 150 °C TJ Operating virtual junction temperature V –20 mA –20 mA ±150 mA D package 73 NS package 64 PW package 108 θJA Package thermal impedance (3) (4) TA Operating free-air temperature range –40 85 °C Tstg Storage temperature range –65 150 °C RGY package (1) (2) (3) (4) °C/W 39 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values except differential input voltage are with respect to the network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV31E 3 AM26LV31E SLLS848A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT 3.3 3.6 V 5.5 V VCC Supply voltage 3 VI Input voltage 0 VIH High-level input voltage 2 VIL Low-level input voltage 0.8 V IOH High-level output current –30 mA IOL Low-level output current 30 mA TA Operating free-air temperature 85 °C V –40 ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VOH High-level output voltage VIH = 2 V, VIL = 0.8 V, IOH = –20 mA VOL Low-level output voltage VIH = 2 V, VIL = 0.8 V, IOL = 20 mA |VOD1| Differential output voltage IO = 0 mA MIN 2.4 TYP (1) MAX 3 V 0.2 2 |VOD2| Differential output voltage RL = 100 Ω (see Figure 1) (2) Δ|VOD| Change in magnitude of differential output voltage RL = 100 Ω (see Figure 1) (2) VOC Common-mode output voltage RL = 100 Ω (see Figure 1) (2) Δ|VOC| Change in magnitude of common-mode output voltage RL = 100 Ω (see Figure 1) (2) IO(OFF) Output current with power off IOZ II 2 UNIT 0.4 V 4 V 2.6 V ±0.4 V 2 V ±0.4 V VCC = 0, VO = –0.25 V or 5.5 V ±100 µA High-impedance state output current VO = –0.25 V or 5.5 V, G = 0.8 V or G = 2 V ±100 µA Input current VCC = 0 or 3.6 V, VI = 0 or 5.5 V IOS Short-circuit output current VO = VCC or GND (3) ICC Supply current (total package) VI = VCC or GND, No load, enable Cpd Power dissipation capacitance No load (4) (1) (2) (3) (4) 4 1.5 –30 ±10 µA –150 mA 100 µA 160 pF All typical values are at VCC = 3.3 V, TA = 25°C. Refer to TIA-EIA-422-B for exact conditions. Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. Cpd determines the no-load dynamic current consumption. IS = Cpd × VCC × f + ICC Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV31E AM26LV31E www.ti.com............................................................................................................................................................... SLLS848A – APRIL 2008 – REVISED MAY 2008 SWITCHING CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX 4 8 12 ns 4 8 12 ns UNIT tPHL Propagation delay time, high- to low-level output tPLH Propagation delay time, low- to high-level output tt Transition time (tr or tf) See Figure 2 5 10 ns tPZH Output-enable time to high level See Figure 3 10 20 ns tPZL Output-enable time to low level See Figure 4 10 20 ns tPHZ Output-disable time from high level See Figure 3 10 20 ns tPLZ Output-disable time from low level See Figure 4 10 20 ns tsk(p) Pulse skew 0.5 1.5 ns 1.5 ns tsk(o) Skew limit (pin to pin) tsk(lim) Skew limit (device to device) f(max) Maximum operating frequency (1) (2) (3) See Figure 2 See Figure 2 (2) (3) 3 See Figure 2 32 ns MHz All typical values are at VCC = 3.3 V, TA = 25°C. Pulse skew is defined as the |tPLH – tPHL| of each channel of the same device. Skew limit (device to device) is the maximum difference in propagation delay times between any two channels of any two devices. ESD PROTECTION PARAMETER Driver output TEST CONDITIONS TYP HBM ±15 IEC61000-4-2, Air-Gap Discharge ±15 IEC61000-4-2, Contact Discharge ±8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV31E UNIT kV 5 AM26LV31E SLLS848A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION RL/2 VOD RL/2 VOC Figure 1. Test Circuit, VOD and VOC C2 = 40 pF Y Input C1 = 40 pF Z RL = 100 Ω C3 = 40 pF See Note A VCC Input 50% 50% A 0V tPHL tPLH Z Output, V O Y PROPAGATION DELAY TIMES 90% 10% Y VOH 90% 10% tr tf tf tr VOL Output, V O Z 90% 90% 10% 10% VOH VOL RISE AND FALL TIMES NOTES: A. CL includes probe and jig capacitance. B. tr and tf ≤ 2 ns. Figure 2. Test Circuit and Voltage Waveforms, tPHL and tPLH 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV31E AM26LV31E www.ti.com............................................................................................................................................................... SLLS848A – APRIL 2008 – REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION (continued) Y A VCC S1 Z Output CL = 40 pF (see Note A) RL = 110 Ω G Generator (see Note B) G 50 Ω VCC (see Note C) TEST CIRCUIT VCC 50% Input 50% 0V tPHZ tPZH 0.3 V VOH Output 50% Voff ≈ 0 VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. C. To test the active-low enable G, ground G and apply an inverted waveform to G. r and tf ≤ 2 ns. Figure 3. Test Circuit and Voltage Waveforms, tPZH and tPHZ Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV31E 7 AM26LV31E SLLS848A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC Y A VCC RL = 110 Ω S1 Z Output CL = 40 pF (see Note A) G Generator (see Note B) 50 Ω G VCC (see Note C) TEST CIRCUIT VCC Input 50% 50% 0V tPLZ tPZL Voff ≈ VCC Output 50% VOL VOLTAGE WAVEFORMS 0.3 V NOTES: A. CL includes probe and jig capacitance. B. C. To test the active-low enable G, ground G and apply an inverted waveform to G. r and tf ≤ 2 ns. Figure 4. Test Circuit and Voltage Waveforms, tPZL and tPLZ 8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AM26LV31E PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty AM26LV31EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31EINSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31EINSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31EIRGYR ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR AM26LV31EIRGYRG4 ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jun-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device AM26LV31EIDR Package Package Pins Type Drawing SOIC SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26LV31EINSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 AM26LV31EIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 AM26LV31EIRGYR QFN RGY 16 1000 180.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jun-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AM26LV31EIDR SOIC D 16 2500 346.0 346.0 33.0 AM26LV31EINSR SO NS 16 2000 346.0 346.0 33.0 AM26LV31EIPWR TSSOP PW 16 2000 346.0 346.0 29.0 AM26LV31EIRGYR QFN RGY 16 1000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. 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