AMI PI403MC-A6

™
Peripheral
Imaging
Corporation
PI403MC-A6
400DPI CIS Module
Engineering Data Sheet
Key Features
• Light source, lens, and sensor are integrated into a single module
• 16 dpm resolution, 104 mm scanning length
• Up to 333 µsec/line scanning speed, with 5MHz pixel rate
• Wide dynamic range
• Analog output
• Red LED light source (660 nm)
• Compact size ≅ 14 mm x 19 mm x 120 mm
• Low power
• Light weight
General Description
The PI403MC-A6 is a contact imaging sensor, CIS, module, which is composed of 13
PI3022 sensor chips. The PI3022 is a 400 DPI solid-state line imaging array, also a
product of Peripheral Imaging Corporation. This imaging device is fabricated using
imaging sensor technology for high-speed performance and high sensitivity. The MOS
PI403MC-A6 is suitable for scanning A6 size (104 mm) documents with 16 dots per
millimeter resolution. Applications include ticket, check and card scanners, variety of mark
readers, and other automation equipment.
Functional Description
The PI403MC-A6 imaging array consists of 13 sensors that are cascaded to provide 1664
photo-detectors with their associated multiplex switches, and a digital shift register that
controls its sequential readout. Mounted in the module is one-to-one graded indexed
PAGE 1 OF 6 - PI403MC-A6, 10-13-00
micro lens array that focuses the scanned documents to image onto its sensing plane.
The on-board amplifier processes the video signal to produce a sequential stream of video
at the video output pin of the PI403MC-A6 module.
Illumination is by means of an integrated LED light source. All components are housed in
a small plastic housing with a cover glass which acts as the focal point for the object being
scanned and protects the imaging array, micro lens assembly, and LED light source from
dust. I/O to the module is the 10-pin connector located on one end of the module, see
Figure 4, Module Housing. The cross section of the PI403MC-A6 is shown in Figure 1 and
the block diagram in Figure 2.
DOCUMENT SURFACE
GLASS WINDOW
ROD LENS
MODULE HOUSE
LIGHT PATH
D
LE
R
BA
SENSORS
PCB
INSIDE PICTORIAL OF MODULE
Figure 1. PI403MC-A6 Cross Section
GLED
LED
LED
LED
LED
LED
LED
LED
LED
VLED
ROD LENS
1662
PHOTO SENSORS
1
2
3
4
5
1663
1664
----------------
VIDEO
LINE
VN(-V)
VDD (+5)
SHIFT REGISTER
GRD
BUFFER
CP
VIDEO AMPLIFIER
SP
GRD
Figure 2. PI403MC-A6 module block diagram.
(See Table 1 below)
PAGE 2 OF 6 - PI403MC-A6, 10-13-00
VOUT
Pin Number
1
2
3
4
5
6
7
8
9
10
Symbol
Vout
Gnd
Vdd (+5V)
Vn (-5V to –12V)
Gnd
SP
Gnd
CP
GLED
VLED
Names and Functions
Analog Video Output
Ground; 0V
Positive power supply
Negative power supply
Ground; 0V
Shift register start pulse
Ground; 0V
Sampling clock pulse
Ground for the light source; 0V
Supply for the light source
Table 1. Pin configuration
Absolute Maximum Rating:
Parameter
Power supply voltage
Symbols
Maximum Rating
Vdd
7
Idd
70
Vn
-15
In
15
VLED
5.5
ILED
400
Input clock pulse (high level) Vih
Vdd – 0.5V
Input clock pulse (low level) Vil
-0.6
Table 2. Absolute Maximum Rating
Note: Not to recommended for operational conditions.
Units
V
ma
V
ma
V
ma
V
V
Operating Environment
Operating temperature
Top
0 to 50
Operating humidity
Hop
10 to 85
Storage temperature
Tstg
-25 to+75
Storage humidity
Hstg
5 to 95
Table 3. Typical Operational Environment for CIS
PAGE 3 OF 6 - PI406MC-A6, 10-13-00
0
C
%
0
C
%
Electro-Optical Characteristics (25° C)
Parameter
Symbol
Number of photo detectors
Pixel to pixel spacing
Line scanning rate
Tint(1)
Parameter
1664
63.1
333
Units
elements
µm
µsec
Clock frequency(2)
Bright output voltage(3)
Bright output
nonuniformity(4)
Adjacent pixel
nonuniformity(5)
Dark nonuniformity(6)
Dark output voltage(7)
Modulation transfer
function(8)
f
Video Output
Up
5.0
1.0
<+/-30
MHz
V
%
Uadj
<25
%
Ud
Vd
MTF
<100
<550
>50
mV
mV
%
Note
@ 5.0 MHz
clock
frequency
Table 4. Electro-optical characteristics at 25° C.
Definition:
(1) Tint: Line scanning rate or integration time. Tint is determined by the interval of two
SP, start pulses.
(2) f: main clock frequency,
(3) Vpavg = ∑ Vp(n)/1664
(4) Up = [(Vpmax - Vp) / Vp] x 100% or [(Vp - Vpmin) / Vp] x 100%
(5) Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)] x 100%
Upadj is the nonuniformity percentage pixel to pixel.
(6) Ud = Vdmax - Vdmin
Vdmin is the minimum output on a black document(O.D.=0.8)
Vdmax: maximum output voltage of black document (O.D.= 0.8)
(7) Vd is the dark level, measured from the reset level.
(8) MTF = [(Vmax - Vmin) / (Vmax + Vmin)] x 100 [%]
Vmax: maximum output voltage at 100 lp/in
Vmin: minimum output voltage at 100 lp/in
(9) O.D. = Optical Density
(10) lp / in: line pair per inch
PAGE 4 OF 6 - PI403MC-A6, 10-13-00
Recommended Operating Conditions (25 °C)
Item
Power Supply
Symbol
Vdd
Vn.
VLED
Idd
Ivn
ILED
Vih
Vil
f
Input voltage at digital high
Input voltage at digital low
Clock frequency
Clock pulse high duty cycle
Clock pulse high duration
Integration time
Operating temperature
Min
4.5
-4.5
Vdd-1.0
0
Mean
5.0
-5
5
47
6.6
280
Vdd-.5
25
50
0.333
Tint*
Top
25
Max
5.5
-12
5.5
55
10.0
350
Vdd
0.8
5.0
5.0
50
Units
V
V
V
ma
ma
ma
V
V
MHz
%
ns
ms
0
C
Table 5. Recommend Operational Characteristics
* Tint (Min) is the lowest line integration time available with 5.0 MHz clock rate.
Switching Characteristics (25°C)
to
tw
CP
tprh
tdh
SP
tdl
tds
Vout
tsh
FIGURE 3. MODULE TIMING DIAGRAM
The switching characteristics for the I/O clocks are shown in the above timing diagrams.
See timing symbol definitions in the following table.
Item
Clock cycle time
Symbol
to
Min.
0.20
Typical
PAGE 5 OF 6 - PI403MC-A6, 10-13-00
Max.
4.0
Units
µs
Clock pulse width
Clock duty cycle
Prohibit crossing time
of Start Pulse
Data setup time
Data hold time
Signal delay time
Signal settling time
tw
tprh
50
25
15
tds
tdh
tdl
tsh
20
20
50
120
75
ns
%
ns
ns
ns
ns
ns
Table 6. Symbol Definitions for the Above Timing Diagram
PI403MC-A6 Module and Its Mechanical Dimensions
19
12
pin
m
0m
PC
RE
L
AD
IN
E
6.0
mm
gla
s
B
u
ss
.5m
m
1
14
.0m
m
in
0p 3-E
x 1 125L
m
S
5m P1.2 Z-10
1E
JA
rfa
ce
Pictorial of the Plastic
Standard A6 Housing Size
Figure 4. Module Housing
The sketch of this module is to provide a pictorial of the module size and structure. A
detailed drawing is available upon request.
©2000 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications
are subject to change without notice. Contents may not be reproduced in whole or in part without
the express prior written permission of Peripheral Imaging Corporation. Information furnished
herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral
Imaging Corporation for its use nor for any infringement of patents or other rights granted by
implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation.
PAGE 6 OF 6 - PI403MC-A6, 10-13-00