bq2002E/G NiCd/NiMH Fast-Charge Management ICs Features General Description ➤ The bq2002E and bq2002G FastCharge ICs are low-cost CMOS battery-charge controllers providing reliable charge termination for both NiCd and NiMH battery applications. Controlling a current-limited or constant-current supply allows t h e bq2002E/G to be the basis for a costeffective stand-alone or system-integrated charger. The bq2002E/G integrates fast charge with optional top-off and pulsed- trickle control in a single IC for charging one or more NiCd or NiMH battery cells. ➤ ➤ Fast charge of nickel cadmium or nickel-metal hydride batteries Direct LED output displays charge status Fast-charge termination by -∆V, maximum voltage, maximum temperature, and maximum time ➤ Internal band-gap voltage reference ➤ Optional top-off charge ➤ Selectable pulse trickle charge rates ➤ Low-power mode ➤ 8-pin 300-mil DIP or 150-mil SOIC Pin Connections Fast charge is initiated on application of the charging supply or battery replacement. For safety, fast charge is inhibited if the battery temperature and voltage are outside configured limits. Fast charge is terminated by any of the following: n Peak voltage detection (PVD) n Negative delta voltage (-∆V) n Maximum voltage n Maximum temperature n Maximum time After fast charge, the bq2002E/G optionally tops-off and pulse-trickles the battery per the pre-configured limits. Fast charge may be inhibited using the INH pin. The bq2002E/G may also be placed in low-standby-power mode to reduce system power consumption. T h e bq2002E differs from t h e bq2002G only in that a slightly different set of fast-charge and top-off time limits is available. All differences between the two ICs are illustrated in Table 1. Pin Names TM 1 8 CC LED 2 7 INH BAT 3 6 VCC VSS 4 5 TS TM Timer mode select input TS Temperature sense input LED Charging status output VCC Supply voltage input BAT Battery voltage input INH Charge inhibit input VSS System ground CC Charge control output 8-Pin DIP or Narrow SOIC PN-200201.eps bq2002E/G Selection Guide TCO HTF LTF bq2002E 0.175 ∗ VCC Part No. LBAT 0.5 ∗ VCC 0.6 ∗ VCC None bq2002G 0.175 ∗ VCC 0.5 ∗ VCC 0.6 ∗ VCC None -∆V PVD ✔ ✔ ✔ ✔ ✔ ✔ SLUS132 - FEBRUARY 1999 1 Fast Charge tMTO Top-Off Maintenance C/2 1C 2C C/2 1C 2C 200 80 40 160 80 40 None C/16 None None C/16 None C/32 C/32 C/32 C/32 C/32 C/32 bq2002E/G sumes operation at the point where initially suspended. Pin Descriptions TM Timer mode input Charge control output CC A three-level input that controls the settings for the fast charge safety timer, voltage termination mode, top-off, pulse-trickle, and voltage hold-off time. LED An open-drain output used to control the charging current to the battery. CC switching to high impedance (Z) enables charging current to flow, and low to inhibit charging current. CC is modulated to provide top-off, if enabled, and pulse trickle. Charging output status Open-drain output that indicates the charging status. BAT Functional Description Battery input voltage Figure 2 shows a state diagram and Figure 3 shows a block diagram of the bq2002E/G. The battery voltage sense input. The input to this pin is created by a high-impedance resistor divider network connected between the positive and negative terminals of the battery. VSS System ground TS Temperature sense input Battery Voltage and Temperature Measurements Battery voltage and temperature are monitored for maximum allowable values. The voltage presented on the battery sense input, BAT, should represent a single-cell potential for the battery under charge. A resistor-divider ratio of Input for an external battery temperature monitoring thermistor. VCC RB1 =N-1 RB2 Supply voltage input is recommended to maintain the battery voltage within the valid range, where N is the number of cells, RB1 is the resistor connected to the positive battery terminal, and RB2 is the resistor connected to the negative battery terminal. See Figure 1. 5.0V ± 20% power input. INH Charge inhibit input When high, INH suspends the fast charge in progress. When returned low, the IC re- Note: This resistor-divider network input impedance to end-to-end should be at least 200kΩ and less than 1 MΩ. VCC PACK + RT RB1 VCC R3 BAT bq2002E/G TM RB2 TS N T C bq2002E/G R4 VSS VSS BAT pin connection Mid-level setting for TM Thermistor connection NTC = negative temperature coefficient thermistor. Fg2002E/G01.eps Figure 1. Voltage and Temperature Monitoring and TM Pin Configuration 2 bq2002E/G Chip on 4.0V VCC Battery Voltage too High? VBAT > 2V VBAT < 2V Battery Voltage too Low? VBAT < 0.175 VCC 0.175 VCC < VBAT VTS > 0.6 (PVD or - V or Maximum Time Out) and TM = Low VCC Battery Temperature? VTS < 0.6 VCC Charge Pending Fast LED = Low VBAT > 2V or VTS < VCC/2 or ((PVD or - V or Maximum Time Out) Low) and TM Top-off LED = Z VBAT > 0.175 VCC, VBAT < 2V, and VTS > VCC/2 Trickle LED = Flash VBAT > 2V VBAT 2V Trickle LED = Z VBAT 2V or VTS VCC/2 or Maximum Time Out SD2002C.eps Figure 2. State Diagram Clock Phase Generator OSC TM Timing Control Sample History Voltage Reference PVD, - V ALU A to D Converter INH Charge-Control State Machine LBAT Check HTF TCO Check Check Power-On Reset CC LED TS Power Down VCC MCV Check BAT VSS Bd2002CEG.eps Figure 3. Block Diagram 3 bq2002E/G VCC = 0 Fast Charging Top-Off (optional) See Table 1 73ms CC Output Fast Charging Pulse-Trickle 1.17s 1.17s Charge initiated by application of power Charge initiated by battery replacement LED TD2002EG.eps Figure 4. Charge Cycle Phases A ground-referenced negative temperature coefficient thermistor placed near the battery may be used as a low-cost temperature-to-voltage transducer. The temperature sense voltage input at TS is developed using a resistorthermistor network between VCC and VSS. See Figure 1. 1. Application of power to VCC or Starting A Charge Cycle If the battery is within the configured temperature and voltage limits, the IC begins fast charge. The valid battery voltage range is VLBAT < VBAT < VMCV, where 2. Voltage at the BAT pin falling through the maximum cell voltage VMCV where VMCV = 2V ±5%. Either of two events starts a charge cycle (see Figure 4): Table 1. Fast-Charge Safety Time/Hold-Off/Top-Off Table Typical FastCharge and Top-Off Time Limits (minutes) Top-Off Rate PulseTrickle Rate PulseTrickle Width (ms) Maximum Synchronized Sampling Period (seconds) 300 Disabled C/32 73 18.7 80 150 C/16 C/32 37 18.7 40 75 Disabled C/32 18 9.4 Typical PVD and -∆V Hold-Off Time bq2002E bq2002G (seconds) Corresponding Fast-Charge Rate TM Termination C/2 Mid PVD 200 160 1C Low PVD 80 2C High -∆V 40 Notes: Typical conditions = 25°C, VCC = 5.0V Mid = 0.5 * VCC ± 0.5V Tolerance on all timing is ± 12%. 4 bq2002E/G VLBAT = 0.175 ∗ VCC ±20% The response of the IC to pulses less than 100ns in width or between 3.5ms and 12ms is indeterminate. Tolerance on all timing is ±12%. The valid temperature range is VTS > VHTF where VHTF = 0.6 ∗ VCC ±5%. Voltage Termination Hold-off If the battery voltage or temperature is outside of these limits, the IC pulse-trickle charges until the next new charge cycle begins. A hold-off period occurs at the start of fast charging. During the hold-off time, the PVD and -∆V terminations are disabled. This avoids premature termination on the voltage spikes sometimes produced by older batteries when fast-charge current is first applied. Maximum voltage and temperature terminations are not affected by the hold-off period. If VMCV < VBAT < VPD (see “Low-Power Mode”) when a new battery is inserted, a delay of 0.35 to 0.9s is imposed before the new charge cycle begins. Fast charge continues until termination by one or more of the five possible termination conditions: n Peak voltage detection (PVD) n Negative delta voltage (-∆V) n Maximum voltage n Maximum temperature n Maximum time Maximum Voltage, Temperature, and Time Any time the voltage on the BAT pin exceeds the maximum cell voltage,VMCV, fast charge or optional top-off charge is terminated. Maximum temperature termination occurs anytime the voltage on the TS pin falls below the temperature cut-off threshold VTCO where VTCO = 0.5 ∗ VCC ± 5%. PVD and -∆V Termination Maximum charge time is configured using the TM pin. Time settings are available for corresponding charge rates of C/2, 1C, and 2C. Maximum time-out termination is enforced on the fast-charge phase, then reset, and enforced again on the top-off phase, if selected. There is no time limit on the trickle-charge phase. There are two modes for voltage termination, depending on the state of TM. For -∆V (TM = high), if VBAT is lower than any previously measured value by 12mV ±3mV, fast charge is terminated. For PVD (TM = low or mid), a decrease of 2.5mV ±2.5mV terminates fast charge. The PVD and -∆V tests are valid in the range 1V < VBAT < 2V. Top-off Charge Synchronized Voltage Sampling An optional top-off charge phase may be selected to follow fast charge termination for 1C and C/2 rates. This phase may be necessary on NiMH or other battery chemistries that have a tendency to terminate charge before reaching full capacity. With top-off enabled, ch arging continues a t a r educed r ate after fast-charge termination for a period of time selected by the TM pin. (See Table 1.) During top-off, the CC pin is modulated at a duty cycle of 73ms active for every 1097ms inactive. This modulation results in an average rate 1/16th that of the fast charge rate. Maximum voltage, time, and temperature are the only termination methods enabled during top-off. Voltage sampling at the BAT pin for PVD and -∆V termination may be synchronized to an external stimulus using the INH input. Low-high-low input pulses between 100ns and 3.5ms in width must be applied at the INH pin with a frequency greater than the “maximum synchronized sampling period” set by the state of the TM pin as shown in Table 1. Voltage is sampled on the falling edge of such pulses. If the time between pulses is greater than the synchronizing period, voltage sampling “free-runs” at once every 17 seconds. A sample is taken by averaging together voltage measurements taken 57µs apart. The IC takes 32 measurements in PVD mode and 16 measurements in -∆V mode. The resulting sample periods (9.17 and 18.18ms, respectively) filter out harmonics centered around 55 and 109Hz. This technique minimizes the effect of any AC line ripple that may feed through the power supply from either 50 or 60Hz AC sources. Pulse-Trickle Charge Pulse-trickle is used to compensate for self-discharge while the battery is idle in the charger. The battery is pulse-trickle charged by driving the CC pin active once every 1.17s for the period specified in Table 1. This results in a trickle rate of C/32. If the INH input remains high for more than 12ms, the voltage sample history kept by the IC and used for PVD and -∆V termination decisions is erased and a new history is started. Such a reset is required when transitioning from free-running to synchronized voltage sampling. TM Pin The TM pin is a three-level pin used to select the charge timer, top-off, voltage termination mode, trickle 5 bq2002E/G rate, and voltage hold-off period options. Table 1 describes the states selected by the TM pin. The midlevel selection input is developed by a resistor divider between VCC and ground that fixes the voltage on TM at VCC/2 ± 0.5V. See Figure 4. Low-Power Mode Charge Status Indication Both the CC pin and the LED pin are driven to the high-Z state. The operating current is reduced to less than 1µA in this mode. When VBAT returns to a value below VPD, the IC pulse-trickle charges until the next new charge cycle begins. The IC enters a low-power state when VBAT is driven above the power-down threshold (VPD) where VPD = VCC - (1V ±0.5V) A fast charge in progress is uniquely indicated when the LED pin goes low. The LED pin is driven to the high-Z state for all conditions other than fast charge. Figure 2 outlines the state of the LED pin during charge. Charge Inhibit Fast charge and top-off may be inhibited by using the INH pin. When high, INH suspends all fast charge and top-off activity and the internal charge timer. INH freezes the current state of LED until inhibit is removed. Temperature monitoring is not affected by the INH pin. During charge inhibit, the bq2002E/G continues to pulse-trickle charge the battery per the TM selection. When INH returns low, charge control and the charge timer resume from the point where INH became active. 6 bq2002E/G Absolute Maximum Ratings Symbol Parameter Minimum Maximum Unit VCC VCC relative to VSS -0.3 +7.0 V VT DC voltage applied on any pin excluding VCC relative to VSS -0.3 +7.0 V TOPR Operating ambient temperature TSTG Storage temperature TSOLDER Soldering temperature TBIAS Temperature under bias Note: +70 °C +85 °C - +260 °C -40 +85 °C Commercial 10 sec max. Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. DC Thresholds Symbol 0 -40 Notes (TA = 0 to 70°C; VCC ± 20%) Parameter Rating Tolerance Unit Notes VTCO Temperature cutoff 0.5 * VCC ± 5% V VTS ≤ VTCO inhibits/terminates fast charge and top-off VHTF High temperature fault 0.6 ∗ VCC ±5% V VTS < VHTF inhibits fast charge start VMCV Maximum cell voltage 2 ± 5% V VBAT ≥ VMCV inhibits/terminates fast charge and top-off VLBAT Minimum cell voltage 0.175 ∗ VCC ±20% V VBAT < VLBAT inhibits fast charge start -∆V BAT input change for -∆V detection -12 ±3 mV PVD BAT input change for PVD detection -2.5 ±2.5 mV 7 bq2002E/G Recommended DC Operating Conditions (TA = 0 to 70°C) Symbol Condition Minimum Typical Maximum Unit 4.0 5.0 6.0 V Notes VCC Supply voltage VDET -∆V, PVD detect voltage 1 - 2 V VBAT Battery input 0 - VCC V VTS Thermistor input 0.5 - VCC V VTS < 0.5V prohibited VIH Logic input high 0.5 - - V INH Logic input high VCC - 0.5 - - V TM Logic input mid VCC - + 0.5 V TM VIM 2 VIL - 0.5 VCC 2 Logic input low - - 0.1 V INH Logic input low - - 0.5 V TM VOL Logic output low - - 0.8 V LED, CC, IOL = 10mA VPD Power down VCC - 1.5 - VCC - 0.5 V VBAT ≥ VPD max. powers down bq2002E/G; VBAT < VPD min. = normal operation. ICC Supply current - - 500 µA Outputs unloaded, VCC = 5.1V I SB Standby current - - 1 µA VCC = 5.1V, VBAT = VPD I OL LED, CC sink 10 - - mA @VOL = VSS + 0.8V IL Input leakage - - ±1 µA INH, CC, V = VSS to VCC I OZ Output leakage in high-Z state -5 - - µA LED, CC Note: All voltages relative to VSS. 8 bq2002E/G Impedance Symbol Parameter Minimum Typical Maximum Unit RBAT Battery input impedance 50 - - MΩ RTS TS input impedance 50 - - MΩ Timing Symbol (TA = 0 to +70°C; VCC ± 10%) Parameter Minimum Typical Maximum Unit dFCV Time base variation -12 - 12 % t DLY Start-up delay 0.35 - 0.9 s Note: Typical is at TA = 25°C, VCC = 5.0V. 9 Notes Starting from VMCV < VBAT < VPD bq2002E/G 8-Pin DIP (PN) 8-Pin PN (0.300" DIP) Inches Min. Max. Min. Max. A 0.160 0.180 4.06 4.57 A1 0.015 0.040 0.38 1.02 B 0.015 0.022 0.38 0.56 B1 0.055 0.065 1.40 1.65 C 0.008 0.013 0.20 0.33 D 0.350 0.380 8.89 9.65 E 0.300 0.325 7.62 8.26 E1 0.230 0.280 5.84 7.11 D E1 E A B1 A1 L C B S e Millimeters Dimension e 0.300 0.370 7.62 9.40 G 0.090 0.110 2.29 2.79 L 0.115 0.150 2.92 3.81 S 0.020 0.040 0.51 1.02 G 8-Pin SOIC Narrow (SN) 8-Pin SN (0.150" SOIC) Inches 10 Millimeters Dimension Min. Max. Min. Max. A 0.060 0.070 1.52 1.78 A1 0.004 0.010 0.10 0.25 B 0.013 0.020 0.33 0.51 C 0.007 0.010 0.18 0.25 D 0.185 0.200 4.70 5.08 E 0.150 0.160 3.81 4.06 e 0.045 0.055 1.14 1.40 H 0.225 0.245 5.72 6.22 L 0.015 0.035 0.38 0.89 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty BQ2002EPN ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type BQ2002EPNE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type BQ2002ESN ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2002ESNG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2002ESNTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2002ESNTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2002GPN ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type BQ2002GPNE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type BQ2002GSN ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2002GSNG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2002GSNTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2002GSNTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2007 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ2002ESNTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 BQ2002GSNTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ2002ESNTR SOIC D 8 2500 340.5 338.1 20.6 BQ2002GSNTR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated