INTEGRATED CIRCUITS DATA SHEET TEA1104; TEA1104T Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers Objective specification File under Integrated Circuits, IC03 1996 Feb 26 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T FEATURES APPLICATIONS • Accurate detection of fully charged batteries by currentless peak voltage sensing • Portable telephone • Switch-over from fast to safe trickle charge current at battery full detection • Portable audio • Portable computer • Portable video. • Fast charge termination back-up by maximum time and maximum temperature detection GENERAL DESCRIPTION • Several trickle charge drive possibilities for mains isolated and non-mains isolated systems The TEA1104 is manufactured in a BiCMOS process intended to be used as a battery monitor circuit in charge systems for NiCd and NiMH batteries. It is especially designed for cost effective compact consumer applications. • Battery checking to protect against short-circuited and open batteries • Battery monitor allows recharging of different battery packs in the same charger The circuit is able to detect fully charged batteries by currentless battery voltage sensing. Several output drive functions are available to control the (reduced) trickle charge current to keep the batteries full with maximum life expectations. • Dual LED indicator provision • External regulator not required because of large input voltage range • Few low cost external components required. The battery full detection is backed up by two independent mechanisms to make the system fail safe; maximum time and maximum temperature. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 5.45 − 11.5 V − − 3 mA voltage range of battery full detection 0.81 − 3.6 V voltage peak detection level with respect to top value − 0.25 − % Ibat battery monitor input current − − 1 nA Vbat(l) battery voltage protection low − 0.81 0.91 V Vbat(h) battery voltage protection high 3.5 3.6 − V fosc oscillator frequency 10 − 100 kHz VP supply voltage IP supply current Vbat ∆Vbat/Vbat outputs off ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TEA1104 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TEA1104T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 1996 Feb 26 DESCRIPTION 2 VERSION Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T BLOCK DIAGRAM handbook, full pagewidth VP 6 Rref VS 5 3 SUPPLY battery high protection POR OR FILTER Vbat 8 fast trickle MODE LATCH CONTROL 1 4 battery low protection SAMPLEAND-HOLD BATTERY FULL DETECTOR TO trickle OR Tmax TIMER Tmin TEA1104 TEA1104T Tcut-off OSCILLATOR 2 7 NTC OSC MGE354 Fig.1 Block diagram. 1996 Feb 26 3 LED GND Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T PINNING SYMBOL PIN DESCRIPTION GND 1 ground NTC 2 negative temperature coefficient resistor input VS 3 stabilized supply voltage Vbat 4 battery voltage sensing Rref 5 reference resistor VP 6 positive supply voltage OSC 7 oscillator input LED 8 LED output handbook, halfpage GND 1 NTC 2 8 LED 7 OSC TEA1104 Vs 3 6 VP Vbat 4 5 Rref MGE353 Fig.2 Pin configuration. • Trickle charge is active if: INTRODUCTION The operation of the TEA1104; TEA1104T is explained with the aid of the application diagram illustrated in Fig.7. – battery full is detected An application note (AN95085) is available describing the versatility of the TEA1104; TEA1104T. – maximum cut-off temperature is exceeded after the initial phase. – maximum time is exceeded An external power current source charges the batteries via an electronic switch which is controlled by the TEA1104. The TEA1104 monitors the battery voltage. Fully charged batteries are detected when the battery voltage peaks. In fact, a voltage drop of 0.25% with respect to the top value is detected. Fast charging is initiated at ‘power on’ or at ‘replaced batteries’. The switch is continuously on, providing that all protection levels are met. At battery full detection, the charge current is duty cycled to reduce the average charge current to a lower level, keeping the batteries fully charged but at he same time assuring long battery life. In Fig.3 the battery voltage during fast charge is plotted. Supply block For correct start-up, the IC supply current is limited to 35 µA (typ.) until the start-up voltage of 6.4 V is reached (standby mode). Thereafter, the operating supply voltage VP has to be within the window of 5.45 to 11.5 V, meaning that there is no need for an external voltage regulator to supply the IC. The supply block delivers the following outputs: • With the help of an external resistor (pin Rref), a reference current is obtained which defines the accuracy of all IC timing characteristics • Externally available 4.25 V stabilized voltage source (Vsource). This source is used internally to supply a large part of the circuit and can be used to set the NTC biasing and to supply other external circuitry with a maximum current of 1 mA. Protection information is provided via VS, to design a dual LED indicator FUNCTIONAL DESCRIPTION A block diagram of the TEA1104; TEA1104T is illustrated in Fig.1 • Power-on reset pulse resets all digital circuitry after a start or restart, due to an interrupted VS. Mode latch The Mode latch determines if the system is in the fast or in the slow charge mode. • Fast charge is active at: – power switch-on and battery connected – temperature between minimum and maximum value – battery insert 1996 Feb 26 4 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers • The battery voltage is sensed each ‘cycle time’. The cycle time is defined as: Open battery protection When the rechargeable battery is removed, the output voltage Vbat will rise to a high level. The ‘open battery protection’ block will detect this voltage and the charge current will be switched off. A digital filter prevents false open battery protection. The open battery signal (Vbat > 3.6 V) must be present for a duration of at least 4 clock pulses. – Tcycle = 2 exp16 × tosc • The ‘inhibit time’ is the time that the charger current is disabled, after which the battery voltage is sensed in a currentless way. – tinhibit = 10 × tosc Battery sampling takes one oscillator period for each cycle interval. Battery monitor – tsample = tosc One or two cell packs can be connected directly to Vbat (battery connection) without an external resistor divider. At larger cell packs the battery voltage must be scaled down to a voltage range of 0.81 to 3.6 V. It is also possible to take a tap on the chain of batteries. Battery full is recognized by voltage peak detection (Vpeak), meaning a decrease of 0.25% (typ.) with respect to the top value. Keeping in mind a battery voltage range of 0.81 to 3.6 V and an accuracy of 10% at Vbat = 2.4 V for battery full detection, means that the internal ADC has to be 13 bits. Several filters are included to prevent false full detection. The series resistance of the battery and battery connection can cause battery voltage fluctuations and therefore it is necessary to stop the charging before sensing; this is called the ‘inhibit time’. This will be performed automatically via the regulation output pin LED. The charging is stopped for ten oscillator periods at the end of which sampling is performed. The battery voltage will now be sensed in a currentless way. • The ‘disable time’ is present to correct start-up with flat or polarized batteries. During the disable time, the battery full detection is not active. – tdisable = 2 exp −5 × time-out The timer is reset by battery full detection, but is on hold during the temperature and battery-low protection modes. Temperature protection block Temperature sensing is achieved by using a cheap thermistor. Two temperature windows are built in: • If the temperature at power-on reset is above the maximum temperature protection level, the trickle charge current is active. The same applies for temperatures below the minimum temperature. Fast charging starts when the temperature is in between the minimum and the maximum temperature levels. • If the temperature is between the maximum and minimum temperature at power-on reset, the fast charge current level is active. If the temperature sinks below the minimum temperature level, again the trickle charge level is active. At rising temperature, the fast charge current is latched off at the ‘cut off’ temperature level. Timer/oscillator The oscillator has a sawtooth shape. The period time is defined by: tosc = K × Rref × Cosc The oscillator frequency is used in the timer block. In this block several important signals are created. To avoid switching on and off with temperature, a hysteresis is built in for low temperature level. If the temperature protection is not necessary, pin ‘Negative Temperature Coefficient resistor’ (NTC) must be connected to pin Rref. • Time-out for protecting the fast charge process in time. Time-out is normally chosen to be 25% longer than the associated fast charge time. So for a one hour charge time, time-out = 1.25 hours. The relationship with the oscillator period time is: Battery low protections – Time-out = 2 exp28 × tosc When the battery voltage is less than 0.81 V, the circuit assumes that there are short circuited batteries and the charge current is reduced to the trickle charge level. If the batteries are flat, the trickle charge current is able to raise the battery voltage within an acceptable period of time, after which fast charging starts. • The duty factor in the trickle charge mode: The duty factor is fixed to 1⁄40, meaning that the average: – Itrickle = 1⁄40 × Ifast – ton = 3⁄4 × 2 exp9 × tosc – toff = 2 exp14 × tosc. 1996 Feb 26 TEA1104; TEA1104T 5 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T In non mains isolated systems, the current source can be switched via the auxiliary winding (see Fig.6) using the TEA140X power plugs. Output drivers Several output drive possibilities are supported by the TEA1104, to limit the fast charge current and to indicate the mode that the charge is in. In the application section, an example is shown driving two LEDs that are indicating fast charging, protection during fast charging, full status and removed batteries. It is also possible to output the same information via one LED only. In mains isolated systems, output drive current is available for a bipolar or MOS switching device. Moreover, current regulators can be driven (see Fig.4). handbook, full pagewidth MGE355 Vbat full detection t Icharge fast charge (Ifast) trickle charge (Ifast/40) Fig.3 NiCd battery characteristics during a 1.25C charge cycle. output handbook, full pagewidth output output LM317 LED LED TEA1104 LED TEA1104 TEA1104 MGE356 Fig.4 Output drivers. 1996 Feb 26 6 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T START handbook, full pagewidth Vs > 11.5 V no circuit active Vs < 5.25 V yes yes clamp at 11.5 V IDDmax = 25 mA no 6.2 V < Vs < 11.5 V yes total reset logic set TIME OUT (e.g. 111 min) set Tmax (e.g. 48 oC) circuit non-active IDD ≤ 45 µA Tmin (e.g. 20 oC) circuit active Vbat < 0.81 V or Tbat < Tmin or Tbat > Tmax (note 1) no yes trickle charge Ifast / 40 yes dual LED indication (note 2) no FAST blinks yes FULL FAST OFF blinks 0.81 V < Vbat < 3.6 V and Tmin < Tbat < Tmax (note 5) no (note 3) yes stop charge total reset open battery FAST charge set Tcut-off (e.g. 55 oC) yes dual LED indication no FAST dual LED indication no OFF ON yes yes FULL FAST FULL FAST OFF ON OFF OFF -∆Vbat ≥ 0.25% and tdis > 3% TO FAST no TIME OUT > 111 min (TO) Tbat ≥ 55 oC no no (TCO) MGE359 battery is FULL trickle charge Ifast / 40 (note 4) (1) Vbat < 0.81 V due to empty or flat battery. yes (2) For single LED application see Fig.7, for dual LED application see Fig.6. (3) Vbat > 3.6 V due to system occurrence or an external inhibit via pin Vbat. (4) Release via reset. (5) Tmin = VNTC ≥ 2 V; Tmax = VNTC ≤ 1 V; Tcut-off = VNTC ≤ 0.81 V. dual LED indication FAST blinks yes FULL FAST ON OFF Fig.5 Flow chart of the TEA1104. 1996 Feb 26 no 7 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); note 1. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage −0.5 +13.2 V VoLED LED output voltage (pin 8) −0.5 VP V ViNTC negative temperature coefficient resistor input voltage (pin 2) −0.5 +5 V Vi(OSC) oscillator input voltage (pin 7) −0.5 +5 V Vi(bat) battery input voltage (pin 4) −0.5 +5 V VRref reference resistor voltage (pin 5) −0.5 +5 V Isource output source current −3 +0.01 mA IoLED LED output current − 25 mA IRref reference resistor current −1 +0.01 mA Ibat battery current −1 +1 mA VP supply current − 25 mA Ptot total power dissipation − 0.5 W Tamb = 70 °C TEA1104 − 0.35 W Tamb operating ambient temperature −20 +70 °C Tj(max) maximum operating junction temperature − +150 °C Tstg storage temperature −55 +150 °C TEA1104T Note 1. All voltages are measured with respect to ground; positive currents flow into the IC. The voltage ratings are valid provided that other ratings are not violated; current ratings are valid provided that the power rating is not violated. QUALITY SPECIFICATION In accordance with “SNW-FQ-611 part E”. The numbers of the quality specification can be found in the “Quality Reference Handbook”. The handbook can be ordered using the code 9397 750 00192. 1996 Feb 26 8 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T CHARACTERISTICS VP = 10 V; Tamb = 25 °C; Rref = 33 kΩ; COSC = 1 nF; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage 5.45 − 11.5 V ∆VP/∆t supply voltage start rate − − 0.5 V/µs Vclamp clamping voltage 11.5 − 12.8 V Iclamp = 25 mA Vstart start-up voltage 6.1 6.4 6.7 V Vpd power-down voltage level 4.65 5.05 5.45 V IP supply current − − 3 mA Istart start-up current VP = 4 V − 45 50 µA VS stabilized voltage IS = 1 mA 4.03 4.25 4.46 V VRref voltage range at reference resistor IRref = 20 µA 1.18 1.25 1.31 V TCVref temperature coefficient of the reference voltage Tamb = 0 to 45 °C − ±60 ±120 ppm/K IRref current range of the reference resistor 10 − 100 µA outputs off Temperature related input; NTC Vi(co) input voltage level for detecting temperature cut-off 0.75 0.81 0.87 V Vi(co; max) maximum input voltage level for detecting temperature cut-off 0.92 1.0 1.08 V Vi(co; min) minimum input voltage level for detecting temperature cut-off 1.85 2.0 2.15 V INTC input current −5 − +5 µA 2.4 2.5 2.6 % VNTC = 1.5 V Output drivers δLED LED pulse duty factor VLED(sat) LED saturation voltage ILED(sat) = 15 mA − − 600 mV ILI(LED) LED input leakage current VLED = 15 V − − 5 µA Vbat = 2.4 V Battery monitor Ii(bat) input battery current − 1 − nA Vbat voltage range for peak detection 0.81 − 3.6 V ∆Vbat/Vbat peak detection level with respect to Vbat = 2 V top level − 0.25 − % Tj temperature range of peak detection 0 − 50 °C Protections; BAT Vbat(l) low level battery protection voltage − 0.81 0.91 V Vbat(h) high level battery protection voltage 3.5 3.6 4.5 V k correction factor 0.84 0.93 1.02 fosc frequency range 10 − 100 Oscillator 1996 Feb 26 9 kHz Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers In the trickle charge mode the LED output will pulsate with a repetition time; ttrickle = 2 exp14 × tosc = 0.28 s. APPLICATION INFORMATION A guideline for the settings of TEA1104 and its external components selection is given based on an example of a 1 hour charger for a 4 cell NiCd or NiMH battery pack. The basic application diagram as illustrated in Fig.6 which is based on the application diagram illustrated in Fig.7 with some additional components; a 2 LED charge status indication has been provided. The duty factor of the pulse is 2.5% of ttrickle. This duty factor also applies to the charge current as the charge current switch is driven by the LED output. Therefore, the average trickle charge current is Ifast /40. The Vbat input can be adapted to the battery voltage via the resistor dividers R1 and R2. When an NTC thermistor has been incorporated into the battery, the minimum, maximum and cut-off temperature levels can be set with the resistors R3 and R4. For an NTC with a common sensitivity of 3965 and adjustment resistor values R3 = 13 kΩ, R4 = 20 kΩ the minimum, maximum and cut-off temperatures will be 5, 42 and 50 °C respectively. For charging a battery within one hour the charge current rating should be as follows: Required minimum charge current = battery capacity × 1.2/charge time. Therefore, for a 1 Ah battery the external charge current supply has to deliver at least 1.2 A. The flow chart of the TEA1104; TEA1104A is given in Fig.5. The load state of the batteries can be displayed by one or two LEDs. The flow chart is not to be regarded as sequential. Each mode of operation is a purely separate continuous process. TEA1104 settings The fast charge back-up timer period, time-out, has to be set in relation to the expected maximum charge time. Normally, a safety back-up time is chosen approximately 25% longer than the maximum expected fast charge time. For a one hour charger the time-out period can be set to 1.25 h. Table 1 Dual LED indication CHARGER MODE Time-out relationship with the oscillator repetition time is as follows; tosc = time-out (h) × 3600/2 exp28 tosc = 17µs for time-out = 1.25 h tosc is set with the combination of Cosc and Rref; where tosc = 0.93 × Rref × Cosc. VLED VS LED 1 LED 2 Fast charging low high on off Fast charging protection low/high high on/off off Full (trickle charging) low/high low off on high high off off Battery open Rref can be chosen between 13 and 120 kΩ, but a 27 kΩ resistor is recommended. The oscillator capacitor can be calculated which is 668 pF; the nearest higher practical value is 680 pF. 1996 Feb 26 TEA1104; TEA1104T 10 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers handbook, full pagewidth VP = 6.5 to 12 V TEA1104; TEA1104T + + + BD434 1.2 kΩ 5.1 kΩ R1 LED 2 FULL 100 kΩ current supply LED1 FAST 270 Ω BAW62 47 kΩ LED BC548 VP Vs 4 cells Vbat R3 TEA1104 BC548 GND OSC Vref Cosc R2 NTC Rref R4 − −θ − MGE357 Fig.6 Basic application diagram. handbook, full pagewidth 6 8 4 3 TEA1104 1 7 5 2 −θ MGE358 Fig.7 Application diagram. 1996 Feb 26 11 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T PACKAGE OUTLINES SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1996 Feb 26 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 12 o 8 0o Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1996 Feb 26 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 13 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Feb 26 TEA1104; TEA1104T 14 Philips Semiconductors Objective specification Cost effective battery monitor and fast charge IC for NiCd and NiMH chargers TEA1104; TEA1104T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Feb 26 15 Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40-2783749, Fax. (31)40-2788399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. (852)2319 7888, Fax. (852)2319 7700 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (45)32 88 26 36, Fax. 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No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. (0 212)279 27 70, Fax. (0212)282 67 07 Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601 Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825 SCDS47 © Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 417021/1100/02/pp16 Document order number: Date of release: 1996 Feb 26 9397 750 00692