Bright View Electronics SPECIFICATIONS FOR BRIGHT VIEW ELECTRONICS SIDE VIEW LED MODEL : BSV08WALN Version A Bright View Electronics Preliminary Version BSV08WALN ■ Description The PLCC2 type BSV08WALN SIDE VIEW LED, with its light weight , enables smaller board size, higher packing density, reduced storage space and miniature applications. • Dice Material • Light Color • Colloid Color ： InGaN ： White ： Yellow ■ Features • • • • • • • 1 chip package Compatible with automatic placement equipment Compatible with reflow soldering process Long operating life Low forward voltage operated Instant light Pb -free/ RoHS compliant ■ Applications • • • • • • • • Amusement equipment Lighting for small size device LCD back light unit Information boards Key pads Light bar Decoration Marker lights Date:2008/02/18 Page: 1 of 12 Version A Bright View Electronics BSV08WALN ■ Outline Dimensions ( mm ) Tolerance : ± 0.25 mm Tolerance：± 0.1 mm ■ Recommended Soldering Pad Design Unit：mm ■ Part Numbering System BSV08WALN Zener Code Materials Code L/F Code Color Code Outline Package Code Product Code ■ Sub Part Numbering : Please also refer to the label on product bags and cartons. Date:2008/02/18 Page: 2 of 12 Version A Bright View Electronics BSV08WALN ■ Absolute Maximum Ratings at Ta = 25 ℃ PARAMETER Power Dissipation Continuous Forward Current Peak Forward Current ( 1/10 Duty Cycle , 10ms Pulse Width ) Reverse Voltage Operating Temperature Range Storage Temperature Range LED Junction Temperature Reflow Soldering Condition 260 ℃ for 10 seconds symbol PD IF IFP VR Topr Tstg Tj Tsld UNIT mW mA mA V o C o C o C times Condition : IF = 20mA ,Ta = 25°C ■ Electro-Optical Characteristics PARAMETER---- SYMBOL TEST CONDITION Forward Voltage------ VF IF=20mA Reverse Current------ IR VR= 5V 1-- Viewing Angle at 50％ Iv 2θ 1/2 IF=20mA Date:2008/02/18 MAX. 114 30 80 5 －30 to ＋ 85 －40 to ＋ 100 100 2 Page: 3 of 12 MIN. VALUES TYP. MAX. 3.2 105 UNIT 3.8 V 10 μA Deg. Version A Bright View Electronics BSV08WALN ■ Bin Grade Limits ( I F = 20 mA* ) Luminous Intensity / mcd Min 1000 1050 1100 1150 1200 1250 1300 1350 1400 1450 1500 1550 1600 1650 1700 1750 Item Luminous Intensity 1 Rank B00 Rank B05 Rank B10 Rank B15 Rank B20 Rank B25 Rank B30 Rank B35 Rank B40 Rank B45 Rank B50 Rank B55 Rank B60 Rank B65 Rank B70 Rank B75 Max 1050 1100 1150 1200 1250 1300 1350 1400 1450 1500 1550 1600 1650 1700 1750 1800 Unit mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd 1. Luminous Intensity measurement allowance is 10%. ■ Bin Grade Limits ( I F = 20 mA* ) Chromaticity Coordinates Color Ranks Bin A1 A2 A3 B1 B2 B3 C1 C2 x y x y x y x y x y x y x y x y 0.2630 0.2435 0.2720 0.2340 0.2755 0.2310 0.2690 0.2610 0.2800 0.2480 0.2830 0.2440 0.2820 0.2720 0.2880 0.2620 0.2600 0.2475 0.2630 0.2435 0.2720 0.2340 0.2793 0.2755 0.2720 0.2580 0.2800 0.2480 0.2793 0.2755 0.2820 0.2720 0.2690 0.2610 0.2720 0.2580 0.2800 0.2480 0.2820 0.2720 0.2820 0.2720 0.2880 0.2620 0.2887 0.2916 0.2910 0.2870 Color Ranks Bin 0.2720 0.2580 0.2800 0.2480 0.2830 0.2440 0.2720 0.2580 0.2880 0.2620 0.2910 0.2580 0.2910 0.2870 0.2960 0.2760 C3 D1 D2 D3 E1 E2 E3 x y x y x y x y x y x y x y 0.2910 0.2580 0.2910 0.2870 0.2960 0.2760 0.2980 0.2710 0.2990 0.3010 0.3040 0.2900 0.3062 0.2853 0.2880 0.2620 0.2887 0.2916 0.2910 0.2870 0.2960 0.2760 0.2968 0.3058 0.2990 0.3010 0.3040 0.2900 0.2960 0.2760 0.2968 0.3058 0.2990 0.3010 0.3040 0.2900 0.3048 0.3198 0.3070 0.3150 0.3120 0.3040 0.2980 0.2710 0.2990 0.3010 0.3040 0.2900 0.3062 0.2853 0.3070 0.3150 0.3120 0.3040 0.3142 0.2993 *.Color Coordinates Measurement allowance is ± 0.01 Date:2008/02/18 Page: 4 of 12 Version A Bright View Electronics BSV08WALN ■ Chromaticity Diagram CIE 1931 0.90 0.33 520 515 525 530 0.80 535 540 545 510 0.70 F1 0.31 550 F2 555 505 D1 560 0.60 0.29 565 570 575 580 585 500 y 0.50 0.30 490 D2 D3 C1 C2 590 595 600 605 610 620 630 640 495 0.40 F3 y 0.27 B1 C3 B2 0.25 A1 B3 A2 A3 0.20 485 0.23 480 0.10 475 470 465 460 450 455 0.00 0.00 0.10 0.20 0.21 0.30 0.40 0.50 0.60 0.70 0.80 0.25 x 0.27 0.29 0.31 x ■ Bin Grade Limits ( I F = 20 mA* ) Forward Voltage Please contact our sales department for more information. Date:2008/02/18 Page: 5 of 12 Version A 0.33 Bright View Electronics BSV08WALN ■ Characteristics Data TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES FIG. 1 Forward Current vs. Forward Voltage Fig. 2 Relative Intensity vs. Forward Current 60 2.3 Forward Current IF (mA) 40 30 20 10 0 1.0 2.0 Relative Luminous Flux Intensity Ta=25℃ 50 Ta=25℃ 1.8 1.5 1.3 1.0 0.8 0.5 0.3 0.0 1.5 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 Forword Voltage VF (V) Fig. 3 Relative Voltage vs. Temperature 35 40 45 50 55 Fig. 4 Relative Intensity vs. Temperature Relative Luminous Intensity 4.0 Forward Voltage (V) 30 1000 5.0 3.0 2.0 1.0 100 10 0.0 -50 0 50 100 -40 -20 0 Ambient Temperature (℃) 20 40 60 80 100 Ambient Temperature (℃) Fig. 5 Relative Intensity vs. Wavelength (λP) Fig. 6 Derating Curve 1.0 40 0.9 35 0.7 Forward Current IF (mA) Ta=25℃ IF=20mA 0.8 Relative Intensity 25 Forwrad Current IF (mA) 0.6 0.5 0.4 0.3 0.2 30 25 20 15 10 5 0.1 0.0 350 400 450 500 550 600 650 700 750 800 0 0 10 Date:2008/02/18 20 30 40 50 60 70 80 90 100 Ambient Temperature(℃) Wavelength (nm) Page: 6 of 12 Version A Bright View Electronics BSV08WALN ■ Radiation Characteristic 0° 1.0 10° 20° Relative Intensity (a.u.) 0.9 x y 30° 0.8 40° 0.7 50° 0.6 60° 0.5 0.4 70° 0.3 0.2 80° 0.1 0.0 90° Date:2008/02/18 60° 30° 0° Page: 7 of 12 0.5 90° 1.0 Version A Bright View Electronics BSV08WALN ■ Packaging ■ Package Carrier Tape Dimensions ( mm ) 0.23±0.05 2.00±0.05 4.00±0.10 4.00±0.10 3.5±0.05 3.05±0.10 1.50±0.10/-0 8.0±0.20 1.10±0.05 Feeding direction UNIT : mm Blue / Green / White : Black tape Others : Transparent tape ■ Package Reel Dimensions Label Label Reel UNIT : mm Anti-electrostatic bag Bright View Electronics Co.,Ltd. PART NO.: LOT NO.: GRADE: Q'ty pcs QA ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION RE Y Label Carton Date:2008/02/18 ITEM NO. DEVICE: Q'TY N. W.: G. W.: Page: 8 of 12 Label PCS. KGS. KGS. UNIT : mm Version A Bright View Electronics BSV08WALN ■ Reliability Test Items and Conditions (1)TEST ITEMS AND RESULTS Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 201 JEITA ED-4701 200 202 Test Item Resistance to Soldering Heat (Reflow Soldering) Thermal Shock Temperature Cycle High Temperature Storage Low Temperature Storage Steady State Operating Life Condition 1 Steady State Operating Life Condition 2 Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Test Conditions Note Number of Damaged Tsd=260℃ , 10secs (Pre treatment 30℃, 70%, 168hrs) 0℃ ~ 100℃ 5min. 5min. -40℃ ~ 25℃ ~ 100℃ ~ 25℃ 30min. 5min. 30min. 5min. 2 times 0/22 100 cycles 0/22 100 cycles 0/22 Ta=100℃ 1000 hrs. 0/22 Ta=-40℃ 1000 hrs. 0/22 － Ta=25℃, IF=20mA, DC 1000 hrs. 0/22 － Ta=25℃, IF=30mA, DC 500 hrs. 0/22 － Ta=85℃, IF=8.5mA, DC 1000 hrs. 0/22 － 60℃, RH=90%, IF=20mA, DC 500 hrs. 0/22 (2)CRITERIA FOR JUDGING DAMAGE Item Symbol VF Forward Voltage IR Reverse Current IV Luminous Intensity *)U.S.L.:Upper Standard Level Date:2008/02/18 Test Conditions IF=20mA VR=5V IF=20mA Criteria for Judgement Min Max U.S.L.*) x 1.2 ━ 10μA ━ L.S.L.**) x 0.7 ━ **)L.S.L.:Lower Standard Level Page: 9 of 12 Version A Bright View Electronics BSV08WALN ■ Cautions (1) Moisture Proof Package ＊ The moisture proof package, a plastic bag with a zipper, is used to keep moisture to a minimum in the package. ＊ A package of a moisture absorbent material (silica gel) is also inserted into the plastic moisture proof bag and the silica gel changes its color from blue to pink as it absorbs moisture. ＊ The absorbed moisture in the SMT package may vaporize and expand during soldering. This may cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. (2) Storage Conditions ＊ Before opening the package： The LEDs should be kept at 30℃ or less and 45~60% RH or less and should be used within a year. When storing the LEDs, moisture proof package with absorbent material (silica gel) is recommended. ＊ After opening the package： The LEDs should be kept at 30℃ or less and 55% RH or less and should be soldered within 168 hours (7days) after opening the package. The unused LEDs should be stored in moisture proof packages. ＊ It’s also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. ＊ If the moisture absorbent material (silica gel) has faded away or the SMD LEDs have exceeded the storage time, baking treatment ( more than 24 hours at 65+/-5℃) should be performed before soldering. (3) Heat Generation ＊ The thermal design of the end product is very important. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. ＊ The operating current should be decided after considering the ambient maximum temperature of LEDs. (4) Cleaning ＊ Isopropyl alcohol is recommended to be used as a solvent for cleaning the LEDs. ＊ Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. Date:2008/02/18 Page: 10 of 12 Version A Bright View Electronics BSV08WALN (5) Soldering Reflow Soldering ( recommended )： ＊ To prevent from cracking, please bake ( 65℃, 24hrs )before soldering. ＊ When soldering, do not load stress on the LEDs during heating. ＊ Never take next process until the component is cooled down to room temperature after reflow. ＊ After soldering, do not warp the circuit board. ＊ The recommended reflow soldering profile ( measuring on the surface of the LED resin ) is the following: (a) Lead-Free Solder TEMPERATURE 1~5℃/sec 1~5℃/sec 255±5℃ Max. 10sec. Max. Pre-heating 180~200℃ 60sec. MAX. Above 220℃ 120 sec. MAX. TIME (b) Lead Solder TEMPERATURE 2.5~5℃/sec 2.5~5℃/sec Pre-heating 120~150℃ 240±5℃ Max. 10sec. Max. 60sec. MAX. Above 200℃ 120 sec. MAX. TIME ＊ ＊ ＊ ＊ Manual Soldering ( not recommended )： To prevent from cracking, please bake ( 65℃, 24hrs ) before soldering. Temperature at tip of iron: 250℃ Max. ( 25W ). It's banned to load any stress on the resin during soldering. Soldering time: 3 sec. Max. (for one time only) Date:2008/02/18 Page: 11 of 12 Version A Bright View Electronics BSV08WALN (6) ESD ( eletrostatic discharge ) protection ( base on machine mode ) ＊ The product is Gallium Nitride ( GaN ) based light emitting diode ( LED ) and is extremely sensitive to ESD. Users are strongly recommended to take necessary meter to test the static electricty and avoid ESD when handling this product. ＊ Proper grounding of machines ( via 1MΩ ), using static disspative mats, containers, working uniforms and shoes are considered to be effective against ESD. ＊ An ionizer is recommended in the facility or environment where ESD may be generated easily, and soldering iron with a grounded tip is also recommended. ＊ When inspecting the final products in which LEDs are assembled, it is recommended to check whether the assembled LEDs are damaged by ESD or not. It is simple to find damaged LEDs by light-on or VF test at lower current ( below 1mA is recommended ). ＊ ESD damaged LEDs will show some unusual characteristics such as the remarkable increasing of leak current, the decreasing of forward voltage, or the LEDs do not light on at the low current. (7) Other ＊ Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. ＊ The LED light output is strong enough to injure human eyes. Precaution must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. ＊ The LEDs described here are intended to be used for ordinary electronic equipment, please consult Bright View's sales department in advance for information on applications. ＊ Installing a protection device in the LED driving circuit to avoid surge current exceeding the max rating during on/off switching. ＊ The appearance and specifications of the product may be modified for improvement without notice. ＊ Please use the product within 168 hours after opening the seal and keep under 30 ℃ and 70% humidity. ＊ Bright View will not be responsible for any claim for damage if the user use the product without following the caution or instruction of the specification. Date:2008/02/18 Page: 12 of 12 Version A