CLARE CPC1779J

CPC1779
ISOPLUS™-264 DC Power Relay
Parameter
Blocking Voltage
Load Current, TA=25ºC
With 5ºC/W Heat Sink
No Heat Sink
On-resistance
RθJC
Rating
600
Units
VP
4.12
1.65
0.4
0.3
ADC
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of High Power Solid State Relays. As part of
this new family, the CPC1779 single-pole, normally
open (1-Form-A) DC Solid State Relay employs
optically coupled MOSFET technology to provide
2500Vrms of input to output isolation.
Ω
ºC/W
Features
•
•
•
•
•
•
•
•
•
•
100% Solid State
Compact ISOPLUS-264 Power Package
Low Thermal Resistance (0.3°C/W)
4.12ADC Load Current with 5ºC/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
2500Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
The output is constructed with an efficient MOSFET
switch and photovoltaic die that uses Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically-coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique ISOPLUS-264 package pioneered by
IXYS allows solid state relays to achieve the highest
load current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low thermal resistance (0.3°C/W).
Approvals
• UL 508 Recognized Component: File # E69938
Ordering Information
Part Number
CPC1779J
Pin Configuration
Description
ISOPLUS-264 (25 per tube)
Switching Characteristics of Normally
Open (Form A) Devices
Control
1
2
+
3
-
4
-
+
ILOAD
+
90%
10%+
tOFF
RoHS
2002/95/EC
tON
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DS-CPC1779-R03
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1
CPC1779
Absolute Maximum Ratings
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Isolation voltage, Input to Output
Operational Temperature
Storage Temperature
Ratings
600
5
100
1
150
2500
-40 to +85
-40 to +125
Units
VP
V
mA
ADC
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current 3
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
1
2
3
2
Conditions
TA=25°C
t ≤ 10ms
No Heat Sink
TC=25ºC
TC=99ºC
IF=10mA, IL=1A
VL=600VP
IF=20mA, VL=10V
V=25V, f=1MHz
TA=25°C
IL=1A
IF=5mA
VR=5V
TA=25°C
-
Symbol
Min
Typ
IL
-
-
Max
Units
AP
IL(99)
RON
ILEAK
-
0.3
-
20
1.65
15
2
0.4
1
TON
TOFF
COUT
-
6.5
0.16
675
20
5
-
ms
IF
IF
VF
IR
0.6
0.9
-
2.1
1.2
-
10
1.4
10
mA
mA
V
µA
CI/O
-
1
-
pF
ADC
Ω
µA
pF
Higher load currents possible with proper heatsinking.
Measurement taken within 1 second of on time.
For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended.
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CPC1779
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Junction Temperature (operation)
Conditions
Free air
-
Symbol
RθJC
RθJA
TJ
Min
-40
Typ
33
-
Max
0.3
100
Units
°C/W
°C/W
°C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal
interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate
junction-to-ambient thermal resistance of 12.5°C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
RθCA =
(TJ - TA) IL(99)2
IL2 • PD(99)
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
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CPC1779
PERFORMANCE DATA*
35
30
30
25
20
15
10
25
20
15
10
5
5
0
0
1.31
1.32
1.33
Device Count (N)
35
30
10
0.29
0.30
0.31
0.32
0.33
4.75
5.50
6.25
7.00
7.75
8.50
On-Resistance (Ω)
Turn-On (ms)
Typical Turn-Off Time
(N=50, TA=25ºC, IL=1ADC, IF=20mA)
Maximum Load Current
vs. Temperature with Heat Sink
Typical Leakage vs. Temperature
at Maximum Rated Voltage
(Measured Across Pins 1 & 2)
15
10
5
0.7
0.6
1ºC/W
Leakage (μA)
8
Load Current (ADC)
20
6
5ºC/W
4
10ºC/W
Free Air
2
0.5
0.4
0.3
0.2
0.1
0
0.14
0.15
0.16
Turn-Off (ms)
0.17
0.18
0
0
740
12
720
10
Turn-On (ms)
760
700
680
660
640
40
60
Temperature (ºC)
80
-40
100
Typical Turn-On vs. Temperature
(IL=1ADC)
Typical Blocking Voltage
vs. Temperature
14
20
8
IF=20mA
4
2
620
0
20
40
60
Temperature (ºC)
80
-40
100
Typical Forward Voltage Drop
vs. Temperature
1.4
IF=50mA
IF=20mA
IF=10mA
1.0
0.8
0
20
40
60
Temperature (ºC)
80
100
120
Turn-On (ms)
1.6
-20
0
20
40
60
Temperature (ºC)
80
80
100
0.18
0.16
IF=20mA
0.14
0.12
IF=10mA
0.08
100
-40
12
11
10
9
8
7
6
5
4
3
2
1
0
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Turn-Off vs. LED Forward Current
(IL=1ADC)
Typical Turn-On vs. LED Forward Current
(IL=1ADC)
1.8
1.2
-20
0.18
0.16
0.14
Turn-Off (ms)
-20
20
40
60
Temperature (ºC)
0.10
0
600
0
0.20
IF=10mA
6
-20
Typical Turn-Off vs. Temperature
(IL=1ADC)
0.22
Turn-Off (ms)
0.13
Blocking Voltage (VP)
15
LED Forward Voltage (V)
10
-40
20
0
0.28
25
-40
25
5
1.34
0
LED Forward Voltage Drop (V)
Typical Turn-On Time
(N=50, TA=25ºC, IL=1ADC, IF=20mA)
35
1.30
Device Count (N)
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
Device Count (N)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, TA=25ºC, IF=10mA)
0.12
0.10
0.08
0.06
0.04
0.02
0
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R03
CPC1779
Typical IF for Switch Operation
vs. Temperature
(IL=1ADC)
1.00
0.90
0.70
0.60
0.50
0.40
0.30
0.20
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.10
0.2
0.4
0.6
0.8
Load Voltage (V)
-20
0
20
40
60
80
100
1.0
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Typical On-Resistance vs. Temperature
(IL=Max Rated)
IF=10mA
IF=20mA
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
(Free Air, No Heat Sink)
Load Current (A)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
-40
Temperature (ºC)
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
Load Current (A)
IF=10mA
0.80
On-Resistance (Ω)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Typical On-Resistance vs. Temperature
(IL=1ADC)
On-Resistance (Ω)
LED Current (mA)
PERFORMANCE DATA*
20
18
16
14
12
10
8
6
4
2
0
10μs 100μs 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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5
CPC1779
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
e3
MECHANICAL DIMENSIONS:
4.83 - 5.21
(0.190 - 0.205)
ISOPLUS-264 Package
19.56 - 20.29
(0.770 - 0.799)
5.33 - 5.97
(0.210 - 0.235)
1.17 - 1.40
(0.046 - 0.055)
1.65 - 2.03
(0.065 - 0.080)
16.97 - 17.53
(0.668 - 0.690)
2.54 - 4.57
(0.100 - 0.180)
25.91 - 26.42
(1.020-1.040)
12.54 - 13.03
(0.490 - 0.513)
1
2
3
20.34 - 20.85
(0.801 - 0.821)
2.54 - 3.03
(0.100 - 0.130)
4
2.03 - 2.59
(0.080 - 0.102)
19.81 - 20.83
(0.780 - 0.820)
7.62 BSC
(0.300 BSC)
3.81 BSC
(0.150 BSC)
0.51 - 0.74
(0.020 - 0.029)
2.59 - 3.00
(0.102 - 0.118)
1.47 - 1.73
(0.058 - 0.068)
1.14 - 1.40
(0.045 - 0.055)
NOTE: Bottom heat sink meets 2500Vrms isolation to the pins.
DIMENSIONS
MIN - MAX mm
(MIN - MAX inches)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
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DS-CPC1779-R03
©Copyright 2008, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
ISOPLUS™ is a trademark of IXYS Corporation
All rights reserved. Printed in USA.
9/19/08