High Current, Low-Profile Power Inductors FLAT-PAC™ FP1105 Series Applications • • • • • • • • SMD Device Environmental Data • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (Range is application specific) • Solder reflow temperature: J-STD-020D compliant Description • • • • • • • • • • Multi-phase regulators Voltage Regulator Module (VRM) Portable electronics Servers and workstations Data networking and storage systems Notebook and desktop computers Graphics cards and battery power systems DCR sensing 125°C maximum total temperature operation 11.0 x 8.0 x 4.90mm surface mount package Ferrite core material High current carrying capacity Low core losses Controlled DCR tolerance for sensing circuits Inductance range from 101nH to 226nH Current range from 39 to 81Amps Frequency range up to 2MHz RoHS compliant Packaging • Supplied in tape and reel packaging, 900 parts per reel, 13” dia. reel Product Specifications Part Number FP1105R1-R10-R FP1105R1-R12-R FP1105R1-R15-R FP1105R1-R20-R FP1105R1-R22-R OCL1 ± 10% (nH) FLL2 Min. (nH) 100 72 120 86 150 109 192 138 226 163 Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6 81 63 467 66 50 467 46 54 42 0.35 ± 8.6% 467 42 34 467 39 28 467 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 4 Isat1: Peak current for approximately 20% rolloff at +25°C. 5 Isat2: Peak current for approximately 20% rolloff at +125°C. 3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps). 7 Part Number Definition: FP1105Rx-Rxx-R • FP1105 = Product code and size • Rx is the DCR indicator • Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant 05-05-08 BU-SB08211 Page 1 of 4 Data Sheet: 4324 Dimensions - mm A = 11.0 Max. B = 8.0 Max. Top View Left View B C 1 C = 4.9 Max. D = 2.4 ± 0.2 Bottom View Recommended Pad Layout D b E = 2.3 ± 0.3 F = 6.2 Typ. Schematic 2.8 E 1 2.8 1105Rx A Rxx wwllyy R F 2 2 Nominal DCR is measured from point “a” to point “b.” Part Marking: Coiltronics Logo 5.8 a 1105Rx (Rx = DCR indicator) Rxx = inductance value in μH (R = decimal point) wwllyy = date code R = revision level Packaging Information - mm 1.5 dia 1.5 dia 4.0 A 2.0 1.75 SECTION A-A 1 11.5 24.0 +/-0.3 1105Rx Rxx wwllyy R 11.3 2 A 12.0 8.2 Supplied in tape-and-reel packaging, 900 parts per reel, 13” diameter reel. 5.2 User direction of feed Temperature Rise vs.Total Loss 50 Temperature rise(°C ) 40 30 20 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Total loss (W) 05-05-08 BU-SB08211 Page 2 of 4 Data Sheet: 4324 1.6 Inductance Characteristics OCL vs. I sat1 100% % of OCL 80% 60% 40% +125°C 20% +25°C -40°C 0% 0% 20% 40% 60% % of I sat1 80% 100% 120% Core Loss Core Loss vs. B p-p 1MHz 10 500kHz 300kHz 200kHz Core Loss (W) 1 100kHz 0.1 0.01 0.001 0.0001 100 1000 10000 Bp-p (Gauss) 05-05-08 BU-SB08211 Page 3 of 4 Data Sheet: 4324 Solder Reflow Profile TP TC -5°C Package Thickness <2.5mm _2.5mm > Temperature TL Preheat A T smax 25°C Table 1 - Standard SnPb Solder (T c) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s t Volume mm3 <350 235°C 220°C Volume mm3 _350 > 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm ts Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak Standard SnPb Solder 100°C • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. Time 25°C to Peak Temperature * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2008 Cooper Bussmann St. Louis, MO 63178 w w w. c o o p e r b u s s m a n n . c o m 05-05-08 BU-SB08211 Page 4 of 4 Data Sheet: 4324