High Current, High Frequency, Power Inductors HCP0805 Series Applications: • • • • • • • • • SMD Device Environmental Data: • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (Range is application specific) • Solder reflow temperature: J-STD-020D compliant Description: • • • • • • • • • • • Voltage Regulator Module (VRM) Multi-phase regulators Desktop and servers Base station equipment Notebook regulators Data networking and storage systems Point-of-load modules Battery power systems DCR sensing Halogen free 125°C maximum total temperature operation 7.6 x 7.9 x 5.0mm surface mount package Powder iron core material Magnetically shielded, low EMI High current carrying capacity, Low core losses Controlled DCR tolerance for sensing circuits Inductance range from 0.40μH to 2.2μH Current range from 10.0 to 32 amps Frequency range up to 2MHz RoHS compliant Packaging: • Supplied in tape-and-reel packaging, 700 parts per reel, 13” diameter reel Product Specifications Part Number6 HCP0805-R40-R HCP0805-R68-R HCP0805-1R0-R HCP0805-1R5-R HCP0805-2R2-R OCL1 ± 20% (μH) FLL2 Min. (μH) Irms3 (Amps) 0.40 0.68 1.00 1.50 2.20 0.26 0.44 0.64 0.96 1.41 20 17.5 14.5 13.3 10 Isat4 @ 25°C (Amps) 32 25 22 18 14 DCR (mΩ) @ 20°C K-factor5 3.1 ±6.0% 4.5 ±6.0% 5.8 ±6.0% 6.8 ±6.0% 11.2 ±6.0% 376.0 292.0 239.0 202.0 175.0 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 4 Isat: Peak current for approximately 20% rolloff at +25°C. 5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p : (Gauss), K: 3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps). 6 Part Number Definition: HCP0805-xxx-R • HCP0805 = Product code and size • xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros. • “-R” suffix = RoHS compliant 1108 BU-SB08798 Page 1 of 4 Data Sheet: 4349 Dimensions - mm P art N o. P in w idth E (m m ) H C P 0805-R 40-R T op V iew S ide V iew 7.40 ± 0.20 5.0 m ax 1.3 ±0.2 H C P 0805-R 68-R 1.1 ±0.2 H C P 0805-1R 0-R 1.1 ±0.2 H C P 0805-1R 5-R 1.1 ±0.2 H C P 0805-2R 2-R 0.8 ±0.2 R ecom m ended P ad Layout B ottom V iew 1.8 (2x) E (2x) b 1 S chem atic 1 4.3 typ. 1 3.50 H C P 0805 7.70 ± 0.20 8.1 XXX 2 w w llyy R 2 2 a 1.70 ± 0.30 The nominal DCR is measured from point “a” to point”b.” xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros Part Marking: HCP0805 Packaging Information - mm 4.0 1.5 Dia min. 2.0 wwllyy = Date code R = Revision level 1.5 Dia. +0.1/-0.0 1.75 A Section A-A 1 7.5 HCP0805 XXX wwllyy R 8.1 2 5.2 A 7.8 User direction of feed 16.0 Supplied in tape-and-reel packaging, 700 parts per reel, 13” diameter reel. Temperature Rise vs.Total Loss T e mpe ra ture R is e (° C ) 60 50 40 30 20 10 0 0 0.2 0.4 0.6 0.8 1 Tota l Los s (W) 1108 BU-SB08798 Page 2 of 4 Data Sheet: 4349 1.2 16.0 ± 0.3 Core Loss C o re L o ss vs. Bp -p 100 1 MHz 10 5 0 0 k Hz Co re L o ss (W ) 3 0 0 k Hz 2 0 0 k Hz 1 1 0 0 k Hz 0.1 0.01 0.001 100 1000 10000 Bp -p (G u a ss) Inductance Characteristics % of O C L vs. % of Isat 110% 100% 90% % of O C L 80% 70% 60% 50% 40% 30% 20% 10% 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of Isat 1108 BU-SB08798 Page 3 of 4 Data Sheet: 4349 180% 200% Solder Reflow Profile TP TC -5°C Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness <2.5mm _2.5mm > Temperature TL Preheat A T smax Table 1 - Standard SnPb Solder (T c) tP t Volume mm3 <350 235°C 220°C Volume mm3 _ >350 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm ts 25°C Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. Time 25°C to Peak Temperature * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2008 Cooper Bussmann S t . L o u i s, M O 6 3 1 7 8 w w w. c o o p e r bu s s m a n n . c o m 1108 BU-SB08798 Page 4 of 4 Data Sheet: 4349