CYStech Electronics Corp. Spec. No. : C393M3 Issued Date : 2007.05.28 Revised Date : Page No. : 1/6 60V N-CHANNEL Enhancement Mode MOSFET MTN2310M3 Features • VDS=60V RDS(ON)=90mΩ(max.)@VGS=10V, IDS=3A RDS(ON)=120mΩ(max.)@VGS=4.5V, IDS=2A • Simple drive requirement • Small package outline Symbol Outline MTN2310M3 SOT-89 DG D S G：Gate S：Source D：Drain Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TA=25°C (Note 3) Continuous Drain Current @ TA=70°C (Note 3) Pulsed Drain Current (Notes 1, 2) Maximum Power Dissipation@ TA=25℃ Linear Derating Factor Operating Junction Temperature Storage Temperature Symbol VDS VGS IDM PD Limits 60 ±20 3.0 2.3 10 1.5 Unit V V A A A W Tj Tstg 0.01 -55~+150 -55~+150 W/°C °C °C ID Note : 1. Pulse width limited by maximum junction temperature. 2. Pulse width≤ 300μs, duty cycle≤2%. 3. Surface mounted on FR-4 board, t≤10sec. MTN2310M3 CYStek Product Specification Spec. No. : C393M3 Issued Date : 2007.05.28 Revised Date : Page No. : 2/6 CYStech Electronics Corp. Thermal Performance Parameter Thermal Resistance, Junction-to-Ambient(PCB mounted) Symbol Limit Unit Rth,ja 83.3 °C/W Note : Surface mounted on FR-4 board, t≦10sec. Electrical Characteristics (Tj=25°C, unless otherwise noted) Symbol Static BVDSS ∆BVDSS/∆Tj VGS(th) IGSS IDSS IDSS *RDS(ON) *GFS Dynamic Ciss Coss Crss td(ON) tr td(OFF) tf Qg Qgs Qgd Source-Drain Diode *VSD Trr Qrr Min. Typ. Max. Unit 60 1.0 - 0.05 5 3.0 ±100 10 25 90 120 - V V/°C V nA μA μA - 490 55 40 6 5 16 3 6 1.6 3 780 10 - - 25 26 1.2 - Test Conditions S VGS=0, ID=250μA Reference to 25°C, ID=1mA VDS=VGS, ID=250μA VGS=±20V, VDS=0 VDS=60V, VGS=0 VDS=48V, VGS=0 (Tj=70°C) ID=3A, VGS=10V ID=2A, VGS=4.5V VDS=5V, ID=3A pF VDS=25V, VGS=0, f=1MHz ns VDS=30V, ID=1A, RD=30Ω VGS=10V, RG=3.3Ω nC VDS=48V, ID=3A, VGS=4.5V, mΩ V ns nC VGS=0V, IS=1.2A VGS=0V, IS=3A, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTN2310M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C393M3 Issued Date : 2007.05.28 Revised Date : Page No. : 3/6 Characteristic Curves MTN2310M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C393M3 Issued Date : 2007.05.28 Revised Date : Page No. : 4/6 Characteristic Curves(Cont.) MTN2310M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C393M3 Issued Date : 2007.05.28 Revised Date : Page No. : 5/6 Reel Dimension Carrier Tape Dimension MTN2310M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C393M3 Issued Date : 2007.05.28 Revised Date : Page No. : 6/6 SOT-89 Dimension Marking: A 2 1 3 2310 H C D B Style: Pin 1. Gate 2. Drain 3. Source E I F 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 G *: Typical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.01417 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.527 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN2310M3 CYStek Product Specification