DDK DMM3-RS144A2B-13

SO-DIMM Socket for Memory Expansion
Comforming to JEDEC Standard DMM3 Series, 144 Contacts,
0.8mm Pitch
・ Notebook computers, palmtop computers and
handheld devices
FEATURE
●Applicable to 144-position SO-DIMM module
board per JEDEC standard
●Easy mating and unmating with unique locking
and ejecting system
●Surface mount design
●Voltage keying design for 3.3V modules
Ｇ
DMM3(144)
SPECIFICATION
Voltage rating
Current rating
Dielectric withstanding voltage
Insulation resistance
Contact resistance
100V AC (rms)
0.5A/contact
250V AC (rms) for 1 minute
250MΩ min. at 250V DC
40mΩmax.
MATERIAL/FINISH
Contact/Finish
Insulator
Locking Tab
Copper alloy/Gold over Nickel plating (mating), Tin-Lead (tail)
LCP resin (UL94V-O)/Ivory
Copper alloy/Solder plating
1 ●
●　DMM3 Series (144 Contacts)
Unit : mm
DMM3-RS144A2B-13
63.00
φ0.9
5.2
2.0
31.50
φ1.45
32.80
2.10
23.20
2.50
30.10
30.50
72.00
67.85
Ｇ
62.80
(1.00)
30.50
30.10
5.0
2.50
7.50
2.10
29.00
32.80
1.5
23.20
20.00
DMM3(144)
(1.10)
0.7
69.60
2.0
72.00
4.00
2 ●
●　DMM3 Series (144 Contacts)
Unit : mm
PCB Mounting Dimensions
63 ± 0.05
60.6 ± 0.03
4.5 ± 0.10
30.3
2± 0.05
60.6 ± 0.05
4.8 ± 0.05
32.8 ± 0.03
0.8 ± 0.03
± 0.
10
1
± 0.
1 ± 0.03
Ｇ
2.5 ± 0.10
23.2 ± 0.03
φ 1.
0.5 ± 0.03
DMM3(144)
10
32.8 ± 0.03
4.6 ± 0.03
3.1 ± 0.05
φ1.6
60.6 ± 0.03
PCB Connector Mounting Space (Reference)
Ｐ.Ｃ.Ｂ
4.3
4.7
25.
4
3.4
15.4
5.2
25°
3 ●
●　30.4
29
25.4
74
16.1
2.1 ± 0.10
3.1 ± 0.05
23.2
± 0.03
2 ± 0.05
4.6 ± 0.10
31.5 ± 0.10
DMM3 Series (144 Contacts)
Unit : mm
Module Dimensions
3
4 ± 0.10
Ｒ3
Ｄ
6
3.2
20
25.4
3.8MAX.
3.3 ± 0.10
№ 143
Ｃ
1.5 ± 0.10
23.2 ± 0.05
Ｅ
φ2
2.5 ± 0.05
4MIN.
№1
32.8 ± 0.05
2.1 ± 0.05
4 ± 0.10
4.8 ± 0.05
67.6 ± 0.10
Ｇ
DMM3(144)
1.5 ± 0.10
63.6
2
3.7
± 0.10
Detail “C”
4.8 ± 0.05
23.2 ± 0.05
2.1
± 0.10
32.8 ± 0.05
2.5 ± 0.05
30
°
2.5MAX.
№ 144
№2
1 ± 0.10
Ｒ2
Detail “D”
2
33.8
（63.6）
2.55
（67.6）
0.8 ± 0.10
0.6 ± 0.05
Detail “E”
4 ●
●