DIMM Socket for Memory Expansion In Accordance with JEDEC Standard DMM Series, 100 Contacts ・ Laser Printers, Fax machines, Terminals, Peripherals FEATURE ●Applicable to 100-position DIMM module board in accordance with JEDEC standard ●Voltage keying design for 5V modules ●Insulator molded from surface mount compati- ble polyamide material ●Locking ejectors hold module in place during vibration Ｆ DMM(100) SPECIFICATION Voltage rating Current rating Dielectric withstanding voltage Insulation resistance Contact resistance 250 V AC (rms) 0.5A/contact 500V AC (rms) for 1 minute 500MΩ min. at 500V DC 40mΩmax. MATERIAL/FINISH Contact/Finish Insulator Ejector Copper alloy/0.38μm Gold over Nickel (mating),Tin-Lead (tail) Polyamide resin (UL94V-O)/Black Polyamide resin (UL94V-O)/Black 1 ● ● DMM Series (100 Contacts) Unit : mm DMM-100G-432FNK31 25.68 Contact № 100 1.26 6.35 6.35 15 × 1.27 ＝ 19.05 6.35 7.3 1.27 Contact № 1 27 × 1.27 ＝ 34.29 121.2MAX 104.5MAX 90.54 Ｆ 85.37 Ａ Ａ 0.4 78.74 2.6 3.85 5.8 3.3 97.74 0.6 19.28 15.93 24.46 DMM(100) 0.25 19.05 5.715 φ2.49 Section A-A 2 ● ● DMM Series (100 Contacts) Unit : mm PCB Mounting Dimensions (Connector Mount Side) № 100 100-φ1.02 78.74 ± 0.05 ± 0.05 1.905 ± 0.05 5.715 ± 0.05 № 51 6.35 ± 0.05 6.35 ± 0.05 1.27 ± 0.05 φ2.44 ± 0.05 34.29 ± 0.05 19.05 ± 0.05 6.35 3.18 ± 0.05 № 50 ± 0.05 72.39 ± 0.05 №1 Ｆ DMM(100) 17.78 ± 0.05 2.54MIN 4 ± 0.1 Module Dimensions Ｘ 6.35 ± 0.05 1.27 ± 0.03 1.26 ± 0.05 Ｙ 2.99MIN （3.175） 6.35 ± 0.05 19.05 ± 0.05 25.68 ± 0.05 6.35 ± 0.05 34.29 ± 0.05 （72.39） 1.27 ± 0.1 3.00 MIN 90.17 ± 0.10 0.25 MIN 0.99 ± 0.05 FULL R 30 ° 2.00 ± 0.05 Detail “X” Detail “Y” 3 ● ●