SN74ABT244A-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SGBS312A – JULY 2006 – REVISED JULY 2006 FEATURES • • • • • • • • (1) Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. • • • Typical VOLP (Output Ground Bounce) <1 V at VCC = 5 V, TA = 25°C High-Drive Outputs (–24-mA IOH, 48-mA IOL) Packaged in Shrink Small-Outline (DB) Package DB PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 xxxx DESCRIPTION This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT240, SN74ABT240A, SN54ABT241, and SN74ABT241A, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE inputs. The SN74ABT244A is organized as two 4-bit buffers/line drivers with separate OE inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74ABT244 is characterized for operation over the full military temperature range of –55°C to 125°C. ORDERING INFORMATION PACKAGE (1) TA –55°C to 125°C (1) SSOP – DB Tape and reel ORDERABLE PART NUMBER SN74ABT244AMDBREP TOP-SIDE MARKING ABT244AMEP Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-IIB is a trademark of Texas Intruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated SN74ABT244A-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SGBS312A – JULY 2006 – REVISED JULY 2006 FUNCTION TABLE (EACH BUFFER) INPUTS OE A OUTPUT Y L H H L L L H X Z LOGIC SYMBOL(1) 1 1OE 19 EN 2OE 2 18 4 16 1A1 1A2 6 14 8 12 1A3 1A4 (1) 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 EN 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 2 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 Submit Documentation Feedback 2Y1 2Y2 2Y3 2Y4 SN74ABT244A-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SGBS312A – JULY 2006 – REVISED JULY 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V VO Voltage range applied to any output in the high or power-off state –0.5 5.5 V IO Current into any output in the low state 96 mA IIK Input clamp current VI < 0 –18 mA IOK Output clamp current VO < 0 –50 mA θJA Package thermal impedance (3) 115 °C/W Tstg Storage temperature range 150 °C (1) (2) (3) –65 UNIT Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages, which use a trace length of zero. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage VI Input voltage IOH IOL ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) MIN MAX 4.5 5.5 2 UNIT V V 0.8 V VCC V High-level output current –24 mA Low-level output current 48 mA 5 ns/V 0 Outputs enabled –55 125 °C Unused inputs must be held high or low to prevent them from floating. Submit Documentation Feedback 3 SN74ABT244A-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SGBS312A – JULY 2006 – REVISED JULY 2006 Electrical Characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VOL TA = 25°C TEST CONDITIONS MIN MAX MIN VCC = 4.5 V, II = –18 mA –1.2 VCC = 4.5 V, IOH = –3 mA 2.5 2.5 VCC = 5 V, IOH = –3 mA 3 3 VCC = 4.5 V, IOH = –24 mA 2 2 VCC = 4.5 V, IOL = 48 mA 0.55 Vhys MAX UNIT –1.2 V V 0.55 100 II VCC = 5.5 V, VI = VCC or GND IOZH VCC = 5.5 V, VO = 2.7 V IOZL VCC = 5.5 V, VO = 0.5 V Ioff VCC = 0, VI or VO ≤ 5.5 V ICEX VCC = 5.5 V, Outputs high (3) VCC = 5.5 V, VO = 2.5 V IO TYP (2) VCC = 5.5 V, IO = 0, VI = VCC or GND ICC µA 10 10 µA –10 –10 µA µA ±100 50 –50 50 µA –180 mA –100 –180 Outputs high 1 250 250 µA Outputs low 24 30 30 mA Outputs disabled 0.5 µA 250 250 Outputs enabled 1.5 1.5 Outputs disabled 0.05 0.05 1.5 1.5 Data inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND ∆ICC (4) ±1 ±1 –50 V mV mA Ci VI = 2.5 V or 0.5 V 3.5 pF Co VO = 2.5 V or 0.5 V 7.5 pF (1) (2) (3) (4) On products compliant to MIL-PRF-38535, this parameter does not apply. All typical values are at VCC = 5 V. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ 4 FROM (INPUT) TO (OUTPUT) A Y OE Y OE Y VCC = 5 V, TA = 25°C MIN MAX 4.1 1 5.3 4.2 1 5 3.1 4.6 0.8 5.7 4.1 5.6 1.2 7.9 2.1 4.1 5.6 1.2 7.6 1.5 3.7 5.6 1 7.9 MIN TYP MAX 1 2.6 1 2.9 1.1 2.1 Submit Documentation Feedback UNIT ns ns ns SN74ABT244A-EP OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SGBS312A – JULY 2006 – REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V Input 1.5 V 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V tPLH 1.5 V 1.5 V VOL tPHL 1.5 V 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPLH VOH Output 3V Output Control tPHL VOH Output 1.5 V tPZH Output Waveform 2 S1 at Open (see Note B) 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ABT244AMDBREP ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/06667-01XE ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74ABT244A-EP : • Catalog: SN74ABT244A NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74ABT244AMDBREP Package Package Pins Type Drawing SSOP DB 20 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.2 7.5 2.5 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT244AMDBREP SSOP DB 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated