TI SM32C6415DGLZ50AEP

SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
www.ti.com
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
1 Introduction
1.1 Features
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Highest-Performance Fixed-Point Digital
Signal Processors (DSPs)
– 2-ns Instruction Cycle Time
– 500-MHz Clock Rate
– Eight 32-Bit Instructions/Cycle
– 28 Operations/Cycle
– 4000 MIPS
– Fully Software Compatible With C62x™
– C6414/15/16 Devices Pin Compatible
VelociTI.2™ Extensions to VelociTI™
Advanced Very Long Instruction Word (VLIW)
TMS320C64x™ DSP Core
– Eight Highly Independent Functional Units
With VelociTI.2 Extensions With Six ALUs
and Two Multipliers
– Nonaligned Load-Store Architecture
– 64 32-Bit General-Purpose Registers
– Instruction Packing Reduces Code Size
– All Instructions Conditional
Instruction Set Features
– Byte-Addressable (8-/16-/32-/64-Bit Data)
– 8-Bit Overflow Protection
– Bit-Field Extract, Set, Clear
– Normalization, Saturation, Bit Counting
– VelociTI.2 Increased Orthogonality
Viterbi Decoder Coprocessor (VCP) (C6416)
– Supports Over 500 7.95-Kbps Adaptive
Multi-Rate (AMR)
– Programmable Code Parameters
Turbo Decoder Coprocessor (TCP) (C6416)
– Supports up to Six 2-Mbps 3GPP
(Six Iterations)
– Programmable Turbo Code and Decoding
Parameters
L1/L2 Memory Architecture
– 128K-Bit (16K-Byte) L1P Program Cache
– 128K-Bit (16K-Byte) L1D Data Cache
– 8M-Bit (1024K-Byte) L2 Unified Mapped
RAM/Cache
Two External Memory Interfaces (EMIFs) for
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(1)
1280M-Byte Addressable External Memory
Enhanced Direct Memory Access (EDMA)
Controller (64 Independent Channels)
Host-Port Interface (HPI)
– User-Configurable Bus Width (32/16 Bit)
32-Bit/33-MHz, 3.3-V PCI Master/Slave Interface
Conforms to PCI Specification 2.2
(C6415/C6416)
– Three PCI Bus Address Registers
– Four-Wire Serial EEPROM Interface
– PCI Interrupt Request Under DSP Program
Control
– DSP Interrupt Via PCI I/O Cycle
Three Multichannel Buffered Serial Ports
(McBSPs)
– Direct Interface to T1/E1, MVIP, and SCSA
Framers
– Up to 256 Channels Each
– ST Bus Switching, AC97 Compatible
– Serial Peripheral Interface (SPI) Compatible
(Motorola)
Three 32-Bit General-Purpose Timers
Universal Test and Operations Physical Layer
(PHY) Interface for ATM (UTOPIA)
(C6415/C6416)
– UTOPIA Level-2 Slave ATM Controller
– 8-Bit Transmit and Receive Operations up
to 50 MHz per Direction
– User-Defined Cell Format up to 64 Bytes
16 General-Purpose I/O (GPIO) Pins
Flexible Phase-Locked Loop (PLL) Clock
Generator
IEEE Std 1149.1 (JTAG (1)) Boundary Scan
Compatible
532-Pin Ball Grid Array (BGA) Package (GLZ
Suffix), 0.8-mm Ball Pitch
0.13-µm/6-Level Metal Process (CMOS)
3.3-V I/Os, 1.25-V Internal (500 MHz)
IEEE Std 1149.1-1990 Standard Test-Access Port and
Boundary Scan Architecture
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2008, Texas Instruments Incorporated
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
www.ti.com
1.2 SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
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Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in A-Version (–40°C/105°C) and
S-Version (–55°C/105°C) Temperature
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(2)
Ranges (2)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
S-Version currently available for C6415 only. Additional
custom temperature ranges available upon request.
1.3 Description
The TMS320C64x™ DSPs (including the SM320C6414-EP, SM320C6415-EP, and SM320C6416-EP
devices) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform.
The SM320C64x™ (C64x™) device is based on the second-generation, high-performance, advanced
VelociTI™ very-long-instruction word (VLIW) architecture (VelociTI.2™) developed by Texas Instruments
(TI), making these DSPs an excellent choice for multichannel and multifunctional applications. The C64x™
is a code-compatible member of the C6000™ DSP platform.
With performance of up to 4000 million instructions per second (MIPS) at a clock rate of 500 MHz, the
C64x devices offer cost-effective solutions to high-performance DSP programming challenges. The C64x
DSPs possess the operational flexibility of high-speed controllers and the numerical capability of array
processors. The C64x DSP core processor has 64 general-purpose registers of 32-bit word length and
eight highly independent functional units – 2 multipliers for a 32-bit result and 6 arithmetic logic units
(ALUs) – with VelociTI.2 extensions. The VelociTI.2 extensions in the eight functional units include new
instructions to accelerate the performance in key applications and extend the parallelism of the VelociTI
architecture. The C64x can produce four 32-bit multiply-accumulates (MACs) per cycle for a total of 2400
million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4800 MMACS. The C64x
DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals
similar to the other C6000 DSP platform devices.
The C6416 device has two high-performance embedded coprocessors [Viterbi decoder coprocessor
(VCP) and turbo decoder coprocessor (TCP)] that significantly speed up channel-decoding operations on
chip. The VCP operating at CPU clock divided-by-4 can decode over 500 7.95-Kbps adaptive multi-rate
(AMR) (K = 9, R = 1/3) voice channels. The VCP supports constraint lengths K = 5, 6, 7, 8, and 9, rates
R = 1/2, 1/3, and 1/4, and flexible polynomials, while generating hard decisions or soft decisions. The TCP
operating at CPU clock divided-by-2 can decode up to 36 384-Kbps or 6 2-Mbps turbo encoded channels
(assuming iterations). The TCP implements the max*log-map algorithm and is designed to support all
polynomials and rates required by Third-Generation Partnership Projects (3GPP and 3GPP2), with fully
programmable frame length and turbo interleaver. Decoding parameters, such as the number of iterations
and stopping criteria, are also programmable. Communications between the VCP/TCP and the CPU are
carried out through the EDMA controller.
The C64x uses a two-level cache-based architecture and has a powerful and diverse set of peripherals.
The level 1 program (L1P) cache is a 128K-bit direct-mapped cache and the level 1 data (L1D) cache is a
128K-bit 2-way set-associative cache. The level 2 memory/cache (L2) consists of an 8M-bit memory
space that is shared between program and data space. L2 memory can be configured as mapped memory
or combinations of cache (up to 256K bytes) and mapped memory. The peripheral set includes 3
multichannel buffered serial ports (McBSPs), an 8-bit universal test and operations PHY interface for
asynchronous transfer mode (ATM) slave (UTOPIA slave) port (C6415/C6416 only), 3 32-bit
general-purpose timers, a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32), a peripheral
component interconnect (PCI) (C6415/C6416 only), a general-purpose input/output port (GPIO) with 16
GPIO pins, and two glueless external memory interfaces (64-bit EMIFA and 16-bit EMIFB), both of which
are capable of interfacing to synchronous and asynchronous memories and peripherals.
2
Introduction
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
The C64x has a complete set of development tools that includes an advanced C compiler with
C64x-specific enhancements, an assembly optimizer to simplify programming and scheduling, and a
Windows™ debugger interface for visibility into source code execution. (3) (4)
(3)
(4)
Throughout the remainder of this document, the SM320C6414-EP, SM320C6415-EP, and SM320C6416-EP are referred to as
SM320C64x or C64x where generic and, where specific, their individual full device part numbers are used or abbreviated as C6414,
C6415, or C6416, respectively.
These C64x devices have two EMIFs (64-bit EMIFA and 16-bit EMIFB). The prefix "A" in front of a signal name indicates it is an EMIFA
signal whereas a prefix "B" in front of a signal name indicates it is an EMIFB signal. Throughout the rest of this document, in generic
EMIF areas of discussion, the prefix "A" or "B" may be omitted from the signal name.
1.4 Ball-Grid Array (BGA) Package
GLZ 532-PIN BALL GRID ARRAY (BGA) PACKAGE
( BOTTOM VIEW )
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
3
2
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5
4
7
6
9
8
11 13 15 17 19 21 23 25
10 12 14 16 18 20 22 24 26
Introduction
3
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
www.ti.com
1.4.1 Device Characteristics
Table 1-1 provides an overview of the C6414, C6415, and C6416 DSPs. Table 1-1 shows significant
features of the C64x devices, including the capacity of on-chip RAM, the peripherals, the CPU frequency,
and the package type with pin count.
Table 1-1. Characteristics of the C6414, C6415, and C6416 Processors
Peripherals
HARDWARE FEATURES
C6414, C6415, AND C6416
EMIFA (64-bit bus width)
(default clock source = AECLKIN)
1
EMIFB (16-bit bus width)
(default clock source = BECLKIN)
1
Not all peripherals pins EDMA (64 independent channels)
are available at the same
HPI (32- or 16-bit user selectable)
time. (For more details,
see
the
Device PCI (32-bit) [DeviceID Register value 0xA106]
Configuration section.)
McBSPs
Peripheral performance is (default internal clock source = CPU/4 clock frequency)
dependent on chip-level UTOPIA (8-bit mode)
configuration.
32-bit timers
(default internal clock source = CPU/8 clock frequency)
General-purpose input/output 0 (GP0)
Decoder coprocessors
CPU ID + CPU Rev ID
3
1 (C6415/C6416 only)
3
16
1 (C6416 only)
TCP
1 (C6416 only)
Organization
Control Status Register (CSR[31:16])
Device_ID
Silicon Revision Identification Register
(DEVICE_REV[19:16])
Address: 0x01B0 0200
Frequency
MHz
Cycle time
ns
Voltage
1 (C6415/C6416 only)
VCP
Size (bytes)
On-chip memory
1
1 (HPI16 or HPI32)
Core (V)
I/O (V)
1056K
16K-byte (16KB) L1 program (L1P) cache
16KB L1 data (L1D) cache
1024KB unified mapped RAM/cache (L2)
0x0C01
DEVICE_REV[19:16]
1111
0001
0010
Silicon revision
1.03 or earlier
1.03
1.1
500
2 ns (C6414-50A, C6415-50A, C6416-50A)
(500-MHz CPU, 100-MHz EMIF) (1)
1.25 V (-50A)
3.3 V
PLL options
CLKIN frequency multiplier
Bypass (x1), x6, x12
BGA package
23 mm × 23 mm
532-pin BGA (GLZ)
Process technology
CMOS
Product status
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
(1)
4
0.3 µm
PD
On these C64x devices, the rated EMIF speed affects only the SDRAM interface on EMIFA. For more detailed information, see the
EMIF Device Speed section of this data manual.
Introduction
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1.4.2 Device Compatiblity
The C64x generation of devices has a diverse and powerful set of peripherals. The common peripheral set
and pin compatibility that the C6414, C6415, and C6416 devices offer lead to easier system designs and
faster time to market. Table 1-2 identifies the peripherals and coprocessors that are available on the
C6414, C6415, and C6416 devices.
The C6414, C6415, and C6416 devices are pin-for-pin compatible, provided the following conditions are
met:
• All devices use the same peripherals.
– The C6414 is pin-for-pin compatible with the C6415/C6416 when the PCI and UTOPIA peripherals
on the C6415/C6416 are disabled.
– The C6415 is pin-for-pin compatible with the C6416 when they are in the same peripheral selection
mode. For more information on peripheral selection, see the Device Configurations section of this
data manual.
• The BEA[9:7] pins are properly pulled up/down.
– For more details on the device-specific BEA[9:7] pin configurations, see the Terminal Functions
table of this data manual.
Table 1-2. Peripherals and Coprocessors Available on C6414, C6415, and C6416 Devices (1)
PERIPHERALS/COPROCESSORS
(2)
C6414
C6415
C6416
EMIFA (64-bit bus width)
√
√
√
EMIFB (16-bit bus width)
√
√
√
EDMA (64 independent channels)
√
√
√
HPI (32- or 16-bit user selectable)
√
√
√
PCI (32 bit) (specification v2.2)
—
√
√
McBSPs (McBSP0, McBSP1, McBSP2)
√
√
√
UTOPIA (8-bit mode) (specification v1.0)
—
√
√
Timers (32 bit) (TIMER0, TIMER1, TIMER2)
√
√
√
GPIOs (GP[15:0])
√
√
√
VCP/TCP coprocessors
—
—
√
(1)
(2)
— denotes peripheral/coprocessor is not available on this device.
Not all peripherals pins are available at the same time. (For more details, see the Device Configuration section.)
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Introduction
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SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
www.ti.com
For more detailed information on the device compatibility and similarities/differences among the C6414,
C6415, and C6416 devices, see the How To Begin Development Today With the TMS320C6414,
TMS320C6415, and TMS320C6416 DSPs application report (literature number SPRA718).
1.4.3 Functional Block and CPU (DSP Core) Diagram
C64x Digital Signal Processor
VCP(A)
L1P Cache
Direct-Mapped
16K Bytes Total
TCP(A)
SDRAM
64
SBSRAM
16
EMIF A
EMIF B
C64x DSP Core
ZBT SRAM
Instruction Fetch
Timer 2
FIFO
SRAM
Control
Registers
Instruction Dispatch
Advanced Instruction Packet
Timer 1
ROM/FLASH
Control
Logic
Instruction Decode
Timer 0
I/O Devices
Data Path A
A Register File
A31−A16
A15−A0
McBSP2
.L1
UTOPIA(B)
UTOPIA:
Up to 400 Mbps
Master ATMC
or
McBSPs:
Framing Chips:
H.100, MVIP,
SCSA, T1, E1
AC97 Devices,
SPI Devices,
Codecs
Enhanced
DMA
Controller
(64-channel)
.S1
.M1 .D1
Data Path B
Test
B Register File
B31−B16
B15−B0
.D2 .M2
.S2
Advanced
In-Circuit
Emulation
.L2
L2
Memory
1024K
Bytes
Interrupt
Control
McBSP1(B)
L1D Cache
2-Way Set-Associative
16K Bytes Total
McBSP0
16
GPIO[8:0]
GPIO[15:9](B)
32
HPI‡
or
PCI(B)
Boot Configuration
PLL
(x1, x6, x12)
Power-Down
Logic
Interrupt
Selector
6
A.
VCP and TCP decoder coprocessors are applicable to the C6416 device only.
B.
For the C6415 and C6416 devices, the UTOPIA peripheral is multiplexed with McBSP1, and the PCI peripheral is
multiplexed with the HPI peripheral and the GPIO[15:9] port. For more details on the multiplexed pins of these
peripherals, see the Device Configurations section of this data manual.
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1.4.4 CPU (DSP Core) Description
The CPU fetches VelociTI advanced very-long instruction words (VLIWs) (256 bits wide) to supply up to
eight 32-bit instructions to the eight functional units during every clock cycle. The VelociTI VLIW
architecture features controls by which all eight units do not have to be supplied with instructions if they
are not ready to execute. The first bit of every 32-bit instruction determines if the next instruction belongs
to the same execute packet as the previous instruction, or whether it should be executed in the following
clock as a part of the next execute packet. Fetch packets are always 256 bits wide; however, the execute
packets can vary in size. The variable-length execute packets are a key memory-saving feature,
distinguishing the C64x CPUs from other VLIW architectures. The C64x VelociTI.2 extensions add
enhancements to the TMS320C62x™ DSP VelociTI architecture. These enhancements include:
• Register file enhancements
• Data-path extensions
• Quad 8-bit and dual 16-bit extensions with data-flow enhancements
• Additional functional unit hardware
• Increased orthogonality of the instruction set
• Additional instructions that reduce code size and increase register flexibility
The CPU features two sets of functional units. Each set contains four units and a register file. One set
contains functional units .L1, .S1, .M1, and .D1. The other set contains units .D2, .M2, .S2, and .L2. The
two register files each contain 32 32-bit registers for a total of 64 general-purpose registers. In addition to
supporting the packed 16-bit and 32-/40-bit fixed-point data types found in the C62x VelociTI VLIW
architecture, the C64x register files also support packed 8-bit data and 64-bit fixed-point data types. The
two sets of functional units, along with two register files, compose sides A and B of the CPU [see the
functional block and CPU (DSP core) diagram, and Figure 1-1]. The four functional units on each side of
the CPU can freely share the 32 registers belonging to that side. Additionally, each side features a data
cross path – a single data bus connected to all the registers on the other side, by which the two sets of
functional units can access data from the register files on the opposite side. The C64x CPU pipelines
data-cross-path accesses over multiple clock cycles. This allows the same register to be used as a
data-cross-path operand by multiple functional units in the same execute packet. All functional units in the
C64x CPU can access operands via the data cross path. Register access by functional units on the same
side of the CPU as the register file can service all the units in a single clock cycle. On the C64x CPU, a
delay clock is introduced when an instruction attempts to read a register via a data cross path if that
register was updated in the previous clock cycle.
In addition to the C62x DSP fixed-point instructions, the C64x DSP includes a comprehensive collection of
quad 8-bit and dual 16-bit instruction set extensions. These VelociTI.2 extensions allow the C64x CPU to
operate directly on packed data to streamline data flow and increase instruction set efficiency.
Another key feature of the C64x CPU is the load/store architecture, where all instructions operate on
registers (as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are
responsible for all data transfers between the register files and the memory. The data address driven by
the .D units allows data addresses generated from one register file to be used to load or store data to or
from the other register file. The C64x .D units can load and store bytes (8 bits), half words (16 bits), and
words (32 bits) with a single instruction. And with the new data-path extensions, the C64x .D unit can load
and store doublewords (64 bits) with a single instruction. Furthermore, the nonaligned load and store
instructions allow the .D units to access words and doublewords on any byte boundary. The C64x CPU
supports a variety of indirect addressing modes using either linear or circular addressing with 5- or 15-bit
offsets. All instructions are conditional, and most can access any one of the 64 registers. Some registers,
however, are singled out to support specific addressing modes or to hold the condition for conditional
instructions (if the condition is not automatically true).
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
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The two .M functional units perform all multiplication operations. Each of the C64x .M units can perform
two 16-bit × 16-bit multiplies or four 8-bit × 8-bit multiplies per clock cycle. The .M unit can also perform
16-bit × 32-bit multiply operations, dual 16-bit × 16-bit multiplies with add/subtract operations, and quad
8-bit × 8-bit multiplies with add operations. In addition to standard multiplies, the C64x .M units include
bit-count, rotate, Galois field multiplies, and bidirectional variable shift hardware.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions, with
results available every clock cycle. The arithmetic and logical functions on the C64x CPU include single
32-bit, dual 16-bit, and quad 8-bit operations.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program
memory. The 32-bit instructions destined for the individual functional units are linked together by "1" bits in
the least significant bit (LSB) position of the instructions. The instructions that are chained together for
simultaneous execution (up to eight in total) compose an execute packet. A "0" in the LSB of an
instruction breaks the chain, effectively placing the instructions that follow it in the next execute packet. A
C64x DSP device enhancement now allows execute packets to cross fetch-packet boundaries. In the
TMS320C62x/TMS320C67x™ DSP devices, if an execute packet crosses the fetch-packet boundary (256
bits wide), the assembler places it in the next fetch packet, while the remainder of the current fetch packet
is padded with no-operation (NOP) instructions. In the C64x DSP device, the execute boundary
restrictions have been removed, thereby, eliminating all of the NOPs added to pad the fetch packet and,
thus, decreasing the overall code size. The number of execute packets within a fetch packet can vary from
one to eight. Execute packets are dispatched to their respective functional units at the rate of one per
clock cycle, and the next 256-bit fetch packet is not fetched until all the execute packets from the current
fetch packet have been dispatched. After decoding, the instructions simultaneously drive all active
functional units for a maximum execution rate of eight instructions every clock cycle. While most results
are stored in 32-bit registers, they can be subsequently moved to memory as bytes, halfwords, words, or
doublewords. All load and store instructions are byte, halfword, word, or doubleword addressable.
For more details on the C64x CPU functional units enhancements, see the following documents:
• TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189)
• TMS320C64x™ Technical Overview (literature number SPRU395)
• How to Begin Development Today With the TMS320C6414, TMS320C6415, and TMS320C6416 DSPs
application report (literature number SPRA718)
8
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src1
.L1
src2
dst
long dst
long src
ST1b (Store Data)
ST1a (Store Data)
8
8
32 MSBs
32 LSBs
long src
long dst
dst
src1
.S1
Data Path A
8
8
Register
File A
(A0−A31)
src2
See Note A
See Note A
long dst
dst
.M1 src1
src2
LD1b (Load Data)
LD1a (Load Data)
32 MSBs
32 LSBs
DA1 (Address)
.D1
dst
src1
src2
2X
1X
src2
.D2 src1
dst
DA2 (Address)
LD2a (Load Data)
LD2b (Load Data)
32 LSBs
32 MSBs
src2
.M2 src1
dst
long dst
See Note A
See Note A
Register
File B
(B0− B31)
src2
Data Path B
.S2
src1
dst
long dst
long src
ST2a (Store Data)
ST2b (Store Data)
8
8
32 MSBs
32 LSBs
long src
long dst
dst
8
8
.L2 src2
src1
Control Register
File
A.
For the .M functional units, the long dst is 32 MSBs and the dst is 32 LSBs.
Figure 1-1. SM320C64x™ CPU (DSP Core) Data Paths
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1.4.5 Memory Map Summary
Table 1-3 shows the memory map address ranges of the SM320C64x device. Internal memory is always
located at address 0 and can be used as both program and data memory. The external memory address
ranges in the C64x device begin at the hex address locations 0x6000 0000 for EMIFB and 0x8000 0000
for EMIFA.
Table 1-3. SM320C64x Memory Map Summary
MEMORY BLOCK DESCRIPTION
BLOCK SIZE (BYTES)
HEX ADDRESS RANGE
Internal RAM (L2)
1M
0000 0000–000F FFFF
Reserved
23M
0010 0000–017F FFFF
External Memory Interface A (EMIFA) Registers
256K
0180 0000–0183 FFFF
L2 Registers
256K
0184 0000–0187 FFFF
HPI Registers
256K
0188 0000–018B FFFF
McBSP 0 Registers
256K
018C 0000–018F FFFF
McBSP 1 Registers
256K
0190 0000–0193 FFFF
Timer 0 Registers
256K
0194 0000–0197 FFFF
Timer 1 Registers
256K
0198 0000–019B FFFF
Interrupt Selector Registers
256K
019C 0000–019F FFFF
EDMA RAM and EDMA Registers
256K
01A0 0000–01A3 FFFF
McBSP 2 Registers
256K
01A4 0000–01A7 FFFF
EMIFB Registers
256K
01A8 0000–01AB FFFF
Timer 2 Registers
256K
01AC 0000–01AF FFFF
GPIO Registers
256K
01B0 0000–01B3 FFFF
UTOPIA Registers (C6415 and C6416 only) (1)
256K
01B4 0000–01B7 FFFF
TCP/VCP Registers (C6416 only) (2)
256K
01B8 0000–01BB FFFF
Reserved
256K
01BC 0000–01BF FFFF
PCI Registers (C6415 and C6416 only) (1)
256K
01C0 0000–01C3 FFFF
4M–256K
01C4 0000–01FF FFFF
Reserved
QDMA Registers
52
0200 0000–0200 0033
736M–52
0200 0034–2FFF FFFF
McBSP 0 Data
64M
3000 0000–33FF FFFF
McBSP 1 Data
64M
3400 0000–37FF FFFF
McBSP 2 Data
64M
3800 0000–3BFF FFFF
UTOPIA Queues (C6415 and C6416 only) (1)
64M
3C00 0000–3FFF FFFF
Reserved
256K
4000 0000–4FFF FFFF
Reserved
TCP/VCP (C6416 only)
(2)
256K
5000 0000–5FFF FFFF
EMIFB CE0
64M
6000 0000–63FF FFFF
EMIFB CE1
64M
6400 0000–67FF FFFF
EMIFB CE2
64M
6800 0000–6BFF FFFF
EMIFB CE3
64M
6C00 0000–6FFF FFFF
Reserved
256K
7000 0000–7FFF FFFF
EMIFA CE0
256K
8000 0000–8FFF FFFF
EMIFA CE1
256K
9000 0000–9FFF FFFF
EMIFA CE2
256K
A000 0000–AFFF FFFF
EMIFA CE3
256K
B000 0000–BFFF FFFF
1G
C000 0000–FFFF FFFF
Reserved
(1)
(2)
10
For the C6414 device, these memory address locations are reserved. The C6414 device does not support the UTOPIA and PCI
peripherals.
Only the C6416 device supports the VCP/TCP coprocessors. For the C6414 and C6415 devices, these memory address locations are
reserved.
Introduction
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1.4.6 Peripheral Register Descriptions
Table 1-4 through Table 1-24 identify the peripheral registers for the C6414, C6415, and C6416 devices
by their register names, acronyms, and hex address or hex address range. For more detailed information
on the register contents and bit names and their descriptions, see the TMS320C6000 Peripherals
Reference Guide (literature number SPRU190).
Table 1-4. EMIFA Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
0180 0000
GBLCTL
EMIFA Global Control
0180 0004
CECTL1
EMIFA CE1 Space Control
0180 0008
CECTL0
EMIFA CE0 Space Control
0180 000C
–
0180 0010
CECTL2
EMIFA CE2 Space Control
0180 0014
CECTL3
EMIFA CE3 Space Control
0180 0018
SDCTL
EMIFA SDRAM Control
0180 001C
SDTIM
EMIFA SDRAM Refresh Control
0180 0020
SDEXT
EMIFA SDRAM Extension
0180 0024–0180 003C
–
Reserved
Reserved
0180 0040
PDTCTL
Peripheral Device Transfer (PDT) Control
0180 0044
CESEC1
EMIFA CE1 Space Secondary Control
0180 0048
CESEC0
EMIFA CE0 Space Secondary Control
0180 004C
–
0180 0050
CESEC2
EMIFA CE2 Space Secondary Control
0180 0054
CESEC3
EMIFA CE3 Space Secondary Control
0180 0058–0183 FFFF
–
Reserved
Reserved
Table 1-5. EMIFB Registers
HEX ADDRESS
ACRONYM
01A8 0000
GBLCTL
EMIFB Global Control
01A8 0004
CECTL1
EMIFB CE1 Space Control
01A8 0008
CECTL0
EMIFB CE0 Space Control
01A8 000C
–
01A8 0010
CECTL2
EMIFB CE2 Space Control
01A8 0014
CECTL3
EMIFB CE3 Space Control
01A8 0018
SDCTL
EMIFB SDRAM Control
01A8 001C
SDTIM
EMIFB SDRAM Refresh Control
01A8 0020
SDEXT
EMIFB SDRAM Extension
01A8 0024–01A8 003C
–
01A8 0040
PDTCTL
Peripheral Device Transfer (PDT) Control
01A8 0044
CESEC1
EMIFB CE1 Space Secondary Control
01A8 0048
CESEC0
EMIFB CE0 Space Secondary Control
01A8 004C
–
01A8 0050
CESEC2
EMIFB CE2 Space Secondary Control
01A8 0054
CESEC3
EMIFB CE3 Space Secondary Control
01A8 0058–01AB FFFF
–
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REGISTER NAME
Reserved
Reserved
Reserved
Reserved
Introduction
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
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Table 1-6. L2 Cache Registers
12
HEX ADDRESS
ACRONYM
0184 0000
CCFG
REGISTER NAME
Cache Configuration
0184 0004–0184 0FFC
–
0184 1000
EDMAWEIGHT
Reserved
0184 1004–0184 1FFC
–
0184 2000
L2ALLOC0
L2 Allocation 0
0184 2004
L2ALLOC1
L2 Allocation 1
0184 2008
L2ALLOC2
L2 Allocation 2
0184 200C
L2ALLOC3
L2 Allocation 3
L2 EDMA Access Control
Reserved
0184 2010–0184 3FFC
–
0184 4000
L2FBAR
Reserved
L2 Flush Base Address Register
0184 4004
L2FWC
L2 Flush Word Count
0184 4010
L2CBAR
L2 Clean Base Address Register
0184 4014
L2CWC
L2 Clean Word Count
0184 4020
L1PFBAR
L1P Flush Base Address Register
0184 4024
L1PFWC
L1P Flush Word Count
0184 4030
L1DFBAR
L1D Flush Base Address Register
0184 4034
L1DFWC
L1D Flush Word Count
0184 4038–0184 4FFC
–
Reserved
0184 5000
L2FLUSH
L2 Flush
0184 5004
L2CLEAN
L2 Clean
0184 5008–0184 7FFC
–
Reserved
0184 8000–0184 817C
MAR0 to MAR95
Reserved
0184 8180
MAR96
Controls EMIFB CE0 range 6000 0000–60FF FFFF
0184 8184
MAR97
Controls EMIFB CE0 range 6100 0000–61FF FFFF
0184 8188
MAR98
Controls EMIFB CE0 range 6200 0000–62FF FFFF
0184 818C
MAR99
Controls EMIFB CE0 range 6300 0000–63FF FFFF
0184 8190
MAR100
Controls EMIFB CE1 range 6400 0000–64FF FFFF
0184 8194
MAR101
Controls EMIFB CE1 range 6500 0000–65FF FFFF
0184 8198
MAR102
Controls EMIFB CE1 range 6600 0000–66FF FFFF
0184 819C
MAR103
Controls EMIFB CE1 range 6700 0000–67FF FFFF
0184 81A0
MAR104
Controls EMIFB CE2 range 6800 0000–68FF FFFF
0184 81A4
MAR105
Controls EMIFB CE2 range 6900 0000–69FF FFFF
0184 81A8
MAR106
Controls EMIFB CE2 range 6A00 0000–6AFF FFFF
0184 81AC
MAR107
Controls EMIFB CE2 range 6B00 0000–6BFF FFFF
0184 81B0
MAR108
Controls EMIFB CE3 range 6C00 0000–6CFF FFFF
0184 81B4
MAR109
Controls EMIFB CE3 range 6D00 0000–6DFF FFFF
0184 81B8
MAR110
Controls EMIFB CE3 range 6E00 0000–6EFF FFFF
0184 81BC
MAR111
Controls EMIFB CE3 range 6F00 0000–6FFF FFFF
0184 81C0–0184 81FC
MAR112 to MAR127
0184 8200
MAR128
Controls EMIFA CE0 range 8000 0000–80FF FFFF
0184 8204
MAR129
Controls EMIFA CE0 range 8100 0000–81FF FFFF
Reserved
0184 8208
MAR130
Controls EMIFA CE0 range 8200 0000–82FF FFFF
0184 820C
MAR131
Controls EMIFA CE0 range 8300 0000–83FF FFFF
0184 8210
MAR132
Controls EMIFA CE0 range 8400 0000–84FF FFFF
0184 8214
MAR133
Controls EMIFA CE0 range 8500 0000–85FF FFFF
0184 8218
MAR134
Controls EMIFA CE0 range 8600 0000–86FF FFFF
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Table 1-6. L2 Cache Registers (continued)
HEX ADDRESS
ACRONYM
0184 821C
MAR135
Controls EMIFA CE0 range 8700 0000–87FF FFFF
REGISTER NAME
0184 8220
MAR136
Controls EMIFA CE0 range 8800 0000–88FF FFFF
0184 8224
MAR137
Controls EMIFA CE0 range 8900 0000–89FF FFFF
0184 8228
MAR138
Controls EMIFA CE0 range 8A00 0000–8AFF FFFF
0184 822C
MAR139
Controls EMIFA CE0 range 8B00 0000–8BFF FFFF
0184 8230
MAR140
Controls EMIFA CE0 range 8C00 0000–8CFF FFFF
0184 8234
MAR141
Controls EMIFA CE0 range 8D00 0000–8DFF FFFF
0184 8238
MAR142
Controls EMIFA CE0 range 8E00 0000–8EFF FFFF
0184 823C
MAR143
Controls EMIFA CE0 range 8F00 0000–8FFF FFFF
0184 8240
MAR144
Controls EMIFA CE1 range 9000 0000–90FF FFFF
0184 8244
MAR145
Controls EMIFA CE1 range 9100 0000–91FF FFFF
0184 8248
MAR146
Controls EMIFA CE1 range 9200 0000–92FF FFFF
0184 824C
MAR147
Controls EMIFA CE1 range 9300 0000–93FF FFFF
0184 8250
MAR148
Controls EMIFA CE1 range 9400 0000–94FF FFFF
0184 8254
MAR149
Controls EMIFA CE1 range 9500 0000–95FF FFFF
0184 8258
MAR150
Controls EMIFA CE1 range 9600 0000–96FF FFFF
0184 825C
MAR151
Controls EMIFA CE1 range 9700 0000–97FF FFFF
0184 8260
MAR152
Controls EMIFA CE1 range 9800 0000–98FF FFFF
0184 8264
MAR153
Controls EMIFA CE1 range 9900 0000–99FF FFFF
0184 8268
MAR154
Controls EMIFA CE1 range 9A00 0000–9AFF FFFF
0184 826C
MAR155
Controls EMIFA CE1 range 9B00 0000–9BFF FFFF
0184 8270
MAR156
Controls EMIFA CE1 range 9C00 0000–9CFF FFFF
0184 8274
MAR157
Controls EMIFA CE1 range 9D00 0000–9DFF FFFF
0184 8278
MAR158
Controls EMIFA CE1 range 9E00 0000–9EFF FFFF
0184 827C
MAR159
Controls EMIFA CE1 range 9F00 0000–9FFF FFFF
0184 8280
MAR160
Controls EMIFA CE2 range A000 0000–A0FF FFFF
0184 8284
MAR161
Controls EMIFA CE2 range A100 0000–A1FF FFFF
0184 8288
MAR162
Controls EMIFA CE2 range A200 0000–A2FF FFFF
0184 828C
MAR163
Controls EMIFA CE2 range A300 0000–A3FF FFFF
0184 8290
MAR164
Controls EMIFA CE2 range A400 0000–A4FF FFFF
0184 8294
MAR165
Controls EMIFA CE2 range A500 0000–A5FF FFFF
0184 8298
MAR166
Controls EMIFA CE2 range A600 0000–A6FF FFFF
0184 829C
MAR167
Controls EMIFA CE2 range A700 0000–A7FF FFFF
0184 82A0
MAR168
Controls EMIFA CE2 range A800 0000–A8FF FFFF
0184 82A4
MAR169
Controls EMIFA CE2 range A900 0000–A9FF FFFF
0184 82A8
MAR170
Controls EMIFA CE2 range AA00 0000–AAFF FFFF
0184 82AC
MAR171
Controls EMIFA CE2 range AB00 0000–ABFF FFFF
0184 82B0
MAR172
Controls EMIFA CE2 range AC00 0000–ACFF FFFF
0184 82B4
MAR173
Controls EMIFA CE2 range AD00 0000–ADFF FFFF
0184 82B8
MAR174
Controls EMIFA CE2 range AE00 0000–AEFF FFFF
0184 82BC
MAR175
Controls EMIFA CE2 range AF00 B000–AFFF FFFF
0184 82A0
MAR176
Controls EMIFA CE3 range B000 0000–B0FF FFFF
0184 82C4
MAR177
Controls EMIFA CE3 range B100 0000–B1FF FFFF
0184 82C8
MAR178
Controls EMIFA CE3 range B200 0000–B2FF FFFF
0184 82CC
MAR179
Controls EMIFA CE3 range B300 0000–B3FF FFFF
0184 82D0
MAR180
Controls EMIFA CE3 range B400 0000–B4FF FFFF
0184 82D4
MAR181
Controls EMIFA CE3 range B500 0000–B5FF FFFF
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Introduction
13
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
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Table 1-6. L2 Cache Registers (continued)
HEX ADDRESS
ACRONYM
0184 82D8
MAR182
Controls EMIFA CE3 range B600 0000–B6FF FFFF
REGISTER NAME
0184 82DC
MAR183
Controls EMIFA CE3 range B700 B000–B7FF FFFF
0184 82E0
MAR184
Controls EMIFA CE3 range B800 0000–B8FF FFFF
0184 82E4
MAR185
Controls EMIFA CE3 range B900 0000–B9FF FFFF
0184 82E8
MAR186
Controls EMIFA CE3 range BA00 0000–BAFF FFFF
0184 82EC
MAR187
Controls EMIFA CE3 range BB00 0000–BBFF FFFF
0184 82F0
MAR188
Controls EMIFA CE3 range BC00 0000–BCFF FFFF
0184 82F4
MAR189
Controls EMIFA CE3 range BD00 0000–BDFF FFFF
0184 82F8
MAR190
Controls EMIFA CE3 range BE00 0000–BEFF FFFF
Controls EMIFA CE3 range BF00 B000–BDFF FFFF
0184 82FC
MAR191
0184 8300–0184 83FC
MAR192 to MAR255
Reserved
0184 8400–0187 FFFF
–
Reserved
Table 1-7. EDMA Registers
HEX ADDRESS
ACRONYM
01A0 FF9C
EPRH
Event Polarity High Register
REGISTER NAME
01A0 FFA4
CIPRH
Channel Interrupt Pending High Register
01A0 FFA8
CIERH
Channel Interrupt Enable High Register
01A0 FFAC
CCERH
Channel Chain Enable High Register
01A0 FFB0
ERH
01A0 FFB4
EERH
Event High Register
Event Enable High Register
01A0 FFB8
ECRH
Event Clear High Register
01A0 FFBC
ESRH
Event Set High Register
01A0 FFC0
PQAR0
Priority Queue Allocation Register 0
01A0 FFC4
PQAR1
Priority Queue Allocation Register 1
01A0 FFC8
PQAR2
Priority Queue Allocation Register 2
01A0 FFCC
PQAR3
Priority Queue Allocation Register 3
01A0 FFDC
EPRL
Event Polarity Low Register
01A0 FFE0
PQSR
Priority Queue Status Register
01A0 FFE4
CIPRL
Channel Interrupt Pending Low Register
01A0 FFE8
CIERL
Channel Interrupt Enable Low Register
01A0 FFEC
CCERL
Channel Chain Enable Low Register
01A0 FFF0
ERL
01A0 FFF4
EERL
Event Low Register
Event Enable Low Register
01A0 FFF8
ECRL
Event Clear Low Register
01A0 FFFC
ESRL
Event Set Low Register
01A1 0000–01A3 FFFF
–
Reserved
Table 1-8. EDMA Parameter RAM (1)
HEX ADDRESS
(1)
14
REGISTER NAME
01A0 0000–01A0 0017
Parameters for Event 0 (6 words)
01A0 0018–01A0 002F
Parameters for Event 1 (6 words)
01A0 0030–01A0 0047
Parameters for Event 2 (6 words)
01A0 0048–01A0 005F
Parameters for Event 3 (6 words)
01A0 0060—01A0 0077
Parameters for Event 4 (6 words)
01A0 0078–01A0 008F
Parameters for Event 5 (6 words)
The C64x device has 21 parameter sets (6 words each) that can be used to reload/link EDMA transfers.
Introduction
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Table 1-8. EDMA Parameter RAM (continued)
HEX ADDRESS
REGISTER NAME
01A0 0090–01A0 00A7
Parameters for Event 6 (6 words)
01A0 00A8–01A0 00BF
Parameters for Event 7 (6 words)
01A0 00C0–01A0 00D7
Parameters for Event 8 (6 words)
01A0 00D8–01A0 00EF
Parameters for Event 9 (6 words)
01A0 00F0–01A0 00107
Parameters for Event 10 (6 words)
01A0 0108–01A0 011F
Parameters for Event 11 (6 words)
01A0 0120–01A0 0137
Parameters for Event 12 (6 words)
01A0 0138–01A0 014F
Parameters for Event 13 (6 words)
01A0 0150–01A0 0167
Parameters for Event 14 (6 words)
01A0 0168–01A0 017F
Parameters for Event 15 (6 words)
01A0 0150–01A0 0167
Parameters for Event 16 (6 words)
01A0 0168–01A0 017F
Parameters for Event 17 (6 words)
...
...
...
...
01A0 05D0–01A0 05E7
Parameters for Event 62 (6 words)
01A0 05E8–01A0 05FF
Parameters for Event 63 (6 words)
01A0 0600–01A0 0617
Reload/link parameters for Event M (6 words)
01A0 0618–01A0 062F
Reload/link parameters for Event N (6 words)
...
...
01A0 07E0–01A0 07F7
Reload/link parameters for Event Z (6 words)
01A0 07F8–01A0 07FF
Scratch pad area (2 words)
Table 1-9. Quick DMA (QDMA) and Pseudo Registers
HEX ADDRESS
ACRONYM
0200 0000
QOPT
QDMA Options Parameter
REGISTER NAME
0200 0004
QSRC
QDMA Source Address
0200 0008
QCNT
QDMA Frame Count
0200 000C
QDST
QDMA Destination Address
0200 0010
QIDX
QDMA Index
0200 0014–0200 001C
Reserved
0200 0020
QSOPT
QDMA Pseudo Options
0200 0024
QSSRC
QDMA Pseudo Source Address
0200 0028
QSCNT
QDMA Pseudo Frame Count
0200 002C
QSDST
QDMA Pseudo Destination Address
0200 0030
QSIDX
QDMA Pseudo Index
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Introduction
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
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Table 1-10. Interrupt Selector Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
COMMENTS
019C 0000
MUXH
Interrupt Multiplexer High
Selects which interrupts drive CPU interrupts 10–15
(INT10–INT15)
019C 0004
MUXL
Interrupt Multiplexer Low
Selects which interrupts drive CPU interrupts 4–9
(INT04–INT09)
019C 0008
EXTPOL
External Interrupt Polarity
Sets the polarity of the external interrupts
(EXT_INT4–EXT_INT7)
019C 000C–019C
01FF
–
Reserved
Table 1-11. Peripheral Power-Down Control Register
HEX ADDRESS
ACRONYM
019C 0200
PDCTL
019C 0204–019F FFFF
REGISTER NAME
Peripheral Power-Down Control
Reserved
Table 1-12. McBSP 0 Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
018C 0000
DRR0
McBSP0 Data Receive Register via configuration bus
0x3000 0000–0x33FF FFFF
DRR0
McBSP0 Data Receive Register via peripheral bus
018C 0004
DXR0
McBSP0 Data Transmit Register via configuration bus
0x3000 0000–0x33FF FFFF
DXR0
McBSP0 Data Transmit Register via peripheral bus
018C 0008
SPCR0
018C 000C
RCR0
McBSP0 Receive Control Register
018C 0010
XCR0
McBSP0 Transmit Control Register
018C 0014
SRGR0
McBSP0 Sample Rate Generator Register
McBSP0 Multichannel Control Register
COMMENTS
The CPU and EDMA controller
can only read this register; they
cannot write to it.
McBSP0 Serial Port Control Register
018C 0018
MCR0
018C 001C
RCERE00
McBSP0 Enhanced Receive Channel Enable Register 0
018C 0020
XCERE00
McBSP0 Enhanced Transmit Channel Enable Register
0
018C 0024
PCR0
018C 0028
RCERE10
McBSP0 Pin Control Register
McBSP0 Enhanced Receive Channel Enable Register 1
018C 002C
XCERE10
McBSP0 Enhanced Transmit Channel Enable Register
1
018C 0030
RCERE20
McBSP0 Enhanced Receive Channel Enable Register 2
018C 0034
XCERE20
McBSP0 Enhanced Transmit Channel Enable Register
2
018C 0038
RCERE30
McBSP0 Enhanced Receive Channel Enable Register 3
018C 003C
XCERE30
McBSP0 Enhanced Transmit Channel Enable Register
3
018C 0040–018F FFFF
–
Reserved
Table 1-13. McBSP 1 Registers
16
HEX ADDRESS
ACRONYM
018C 0000
DRR1
McBSP1 Data Receive Register via configuration bus
0x3400 0000–0x37FF
FFFF
DRR1
McBSP1 Data Receive Register via peripheral bus
019C 0004
DXR1
McBSP1 Data Transmit Register via configuration bus
Introduction
REGISTER NAME
COMMENTS
The CPU and EDMA controller can
only read this register; they cannot
write to it.
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Table 1-13. McBSP 1 Registers (continued)
HEX ADDRESS
ACRONYM
0x3400 0000–0x37FF
FFFF
DXR1
REGISTER NAME
COMMENTS
McBSP1 Data Transmit Register via peripheral bus
019C 0008
SPCR1
019C 000C
RCR1
McBSP1 Serial Port Control Register
McBSP1 Receive Control Register
019C 0010
XCR1
McBSP1 Transmit Control Register
019C 0014
SRGR1
019C 0018
MCR1
019C 001C
RCERE01
McBSP1 Enhanced Receive Channel Enable Register
0
019C 0020
XCERE01
McBSP1 Enhanced Transmit Channel Enable Register
0
019C 0024
PCR1
019C 0028
RCERE11
McBSP1 Enhanced Receive Channel Enable Register
1
019C 002C
XCERE11
McBSP1 Enhanced Transmit Channel Enable Register
1
019C 0030
RCERE21
McBSP1 Enhanced Receive Channel Enable Register
2
019C 0034
XCERE21
McBSP1 Enhanced Transmit Channel Enable Register
2
019C 0038
RCERE31
McBSP1 Enhanced Receive Channel Enable Register
3
019C 003C
XCERE31
McBSP1 Enhanced Transmit Channel Enable Register
3
019C 0040–0193 FFFF
–
McBSP1 Sample Rate Generator Register
McBSP1 Multichannel Control Register
McBSP1 Pin Control Register
Reserved
Table 1-14. McBSP 2 Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
01A4 0000
DRR2
McBSP2 Data Receive Register via configuration bus
0x3800 0000–0x3BFF FFFF
DRR2
McBSP2 Data Receive Register via peripheral bus
01A4 0004
DXR2
McBSP2 Data Transmit Register via configuration bus
0x3800 0000–0x3BFF FFFF
DXR2
McBSP2 Data Transmit Register via peripheral bus
01A4 0008
SPCR2
01A4 000C
RCR2
McBSP2 Receive Control Register
01A4 0010
XCR2
McBSP2 Transmit Control Register
01A4 0014
SRGR2
01A4 0018
MCR2
01A4 001C
RCERE02
McBSP2 Enhanced Receive Channel Enable Register 0
01A4 0020
XCERE02
McBSP2 Enhanced Transmit Channel Enable Register 0
McBSP2 Serial Port Control Register
McBSP2 Sample Rate Generator Register
McBSP2 Multichannel Control Register
01A4 0024
PCR2
01A4 0028
RCERE12
McBSP2 Enhanced Receive Channel Enable Register 1
01A4 002C
XCERE12
McBSP2 Enhanced Transmit Channel Enable Register 1
01A4 0030
RCERE22
McBSP2 Enhanced Receive Channel Enable Register 2
01A4 0034
XCERE22
McBSP2 Enhanced Transmit Channel Enable Register 2
01A4 0038
RCERE32
McBSP2 Enhanced Receive Channel Enable Register 3
01A4 003C
XCERE32
McBSP2 Enhanced Transmit Channel Enable Register 3
01A4 0040–01A7 FFFF
–
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COMMENTS
The CPU and EDMA controller can
only read this register; they cannot
write to it.
McBSP2 Pin Control Register
Reserved
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Table 1-15. Timer 0 Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
COMMENTS
0194 0000
CTL0
Timer 0 Control
Determines the operating mode of the timer, monitors the timer status,
and controls the function of the TOUT pin
0194 0004
PRD0
Timer 0 Period
Contains the number of timer input clock cycles to count. This number
controls the TSTAT signal frequency.
0194 0008
CNT0
Timer 0 Counter
Contains the current value of the incrementing counter
0194 000C–0197 FFFF
–
Reserved
Table 1-16. Timer 1 Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
COMMENTS
Determines the operating mode of the timer, monitors the timer status,
and controls the function of the TOUT pin
0198 0000
CTL1
Timer 1 Control
0198 0004
PRD1
Timer 1 Period
Contains the number of timer input clock cycles to count. This number
controls the TSTAT signal frequency.
0198 0008
CNT1
Timer 1 Counter
Contains the current value of the incrementing counter
0198 000C–019B FFFF
–
Reserved
Table 1-17. Timer 2 Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
COMMENTS
01AC 0000
CTL2
Timer 2 Control
Determines the operating mode of the timer, monitors the timer status,
and controls the function of the TOUT pin
01AC 0004
PRD2
Timer 2 Period
Contains the number of timer input clock cycles to count. This number
controls the TSTAT signal frequency.
01AC 0008
CNT2
Timer 2 Counter
Contains the current value of the incrementing counter
01AC 000C–01AF FFFF
–
Reserved
Table 1-18. HPI Registers
HEX ADDRESS
ACRONYM
–
HPID
HPI Data
Host read/write access only
0188 0000
HPIC
HPI Control
HPIC has both host/CPU read/write access.
0188 0004
HPIA (HPIAW) (1)
HPI Address (Write)
0188 0008
HPIA (HPIAR) (1)
HPI Address (Read)
0188 000C–0189 FFFF
–
018A 0000
TRCTL
018A 0004–018B FFFF
–
(1)
REGISTER NAME
COMMENTS
HPIA has both host/CPU read/write access.
Reserved
HPI Transfer Request Control
Reserved
Host access to the HPIA register updates both the HPIAW and HPIAR registers. The CPU can access HPIAW and HPIAR
independently.
Table 1-19. GPIO Registers
HEX ADDRESS
18
ACRONYM
REGISTER NAME
01B0 0000
GPEN
GPIO Enable
01B0 0004
GPDIR
GPIO Direction
01B0 0008
GPVAL
GPIO Value
01B0 000C
–
01B0 0010
GPDH
GPIO Delta High
01B0 0014
GPHM
GPIO High Mask
01B0 0018
GPDL
GPIO Delta Low
01B0 001C
GPLM
GPIO Low Mask
Introduction
Reserved
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Table 1-19. GPIO Registers (continued)
HEX ADDRESS
ACRONYM
01B0 0020
GPGC
GPIO Global Control
REGISTER NAME
01B0 0024
GPPOL
GPIO Interrupt Polarity
01B0 0028–01B0 01FF
–
01B0 0200
DEVICE_REV
01B0 0204–01B3 FFFF
–
Reserved
Silicon revision identification (For more details, see the device characteristics listed in
Table 1-3.)
Reserved
Table 1-20. PCI Peripheral Registers (C6415 and C6416 Only) (1)
(1)
HEX ADDRESS
ACRONYM
REGISTER NAME
01C0 0000
RSTSRC
01C0 0004
–
01C0 0008
PCIIS
PCI Interrupt Source
01C0 000C
PCIIEN
PCI Interrupt Enable
01C0 0010
DSPMA
DSP Master Address
01C0 0014
PCIMA
PCI Master Address
01C0 0018
PCIMC
PCI Master Control
01C0 001C
CDSPA
Current DSP Address
01C0 0020
CPCIA
Current PCI Address
01C0 0024
CCNT
Current Byte Count
DSP Reset Source/Status
Reserved
01C0 0028
–
Reserved
01C0 02C–01C1 FFEF
–
Reserved
0x01C1 FFF0
HSR
0x01C1 FFF4
HDCR
Host-to-DSP Control Register
0x01C1 FFF8
DSPP
DSP Page
0x01C1 FFFC
–
Reserved
01C2 0000
EEADD
EEPROM Address
01C2 0004
EEDAT
EEPROM Data
01C2 0008
EECTL
EEPROM Control
01C2 000C–01C2 FFFF
–
01C3 0000
TRCTL
01C3 0004–01C3 FFFF
–
Host Status Register
Reserved
PCI Transfer Request Control
Reserved
These PCI registers are not supported on the C6414 device.
Table 1-21. UTOPIA Registers (C6415 and C6416 Only) (1)
(1)
HEX ADDRESS
ACRONYM
REGISTER NAME
01B4 0000
UCR
01B4 0004
–
Reserved
01B4 0008
–
Reserved
01B4 000C
UIER
UTOPIA Interrupt Enable Register
01B4 0010
UIPR
UTOPIA Interrupt Pending Register
01B4 0014
CDR
Clock Detect Register
UTOPIA Control Register
01B4 0018
EIER
Error Interrupt Enable Register
01B4 001C
EIPR
Error Interrupt Pending Register
01B4 0020–01B7 FFFF
–
Reserved
These UTOPIA registers are not supported on the C6414 device.
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Table 1-22. UTOPIA Queue Registers (C6415 and C6416 Only) (1)
(1)
HEX ADDRESS
ACRONYM
3C00 0000
URQ
UTOPIA Receive Queue
REGISTER NAME
3D00 0000
UXQ
UTOPIA Transmit Queue
3D00 0004–3FFF FFFF
–
Reserved
These UTOPIA registers are not supported on the C6414 device.
Table 1-23. VCP Registers (C6414 Only)
HEX ADDRESS
ACRONYM
REGISTER
EDMA BUS
PERIPHERAL BUS
5000 0000
01B8 0000
VCPIC0
VCP Input Configuration 0
5000 0004
01B8 0004
VCPIC1
VCP Input Configuration 1
5000 0008
01B8 0008
VCPIC2
VCP Input Configuration 2
5000 000C
01B8 000C
VCPIC3
VCP Input Configuration 3
5000 0010
01B8 0010
VCPIC4
VCP Input Configuration 4
5000 0014
01B8 0014
VCPIC5
VCP Input Configuration 5
5000 0040
01B8 0024
VCPOUT0
VCP Output 0
5000 0044
01B8 0028
VCPOUT1
VCP Output 1
5000 0080
–
VCPWBM
VCP Write Branch Metrics
5000 0088
–
VCPRDECS
–
01B8 0018
VCPEXE
VCP Execution
–
01B8 0020
VCPEND
VCP Endian
–
01B8 0040
VCPSTAT0
VCP Status Register 0
–
01B8 0044
VCPSTAT1
VCP Status Register 1
–
01B8 0050
VCPERR
VCP Read Decisions
VCP Error
Table 1-24. TCP Registers (C6414 Only)
HEX ADDRESS
20
ACRONYM
REGISTER
EDMA BUS
PERIPHERAL BUS
5800 0000
01BA 0000
TCPIC0
TCP Input Configuration 0
5800 0004
01BA 0004
TCPIC1
TCP Input Configuration 1
5800 0008
01BA 0008
TCPIC2
TCP Input Configuration 2
5800 000C
01BA 000C
TCPIC3
TCP Input Configuration 3
5800 0010
01BA 0010
TCPIC4
TCP Input Configuration 4
5800 0014
01BA 0014
TCPIC5
TCP Input Configuration 5
5800 0018
01BA 0018
TCPIC6
TCP Input Configuration 6
5800 001C
01BA 001C
TCPIC7
TCP Input Configuration 7
5800 0020
01BA 0020
TCPIC8
TCP Input Configuration 8
5800 0024
01BA 0024
TCPIC9
TCP Input Configuration 9
5800 0028
01BA 0028
TCPIC10
TCP Input Configuration 10
5800 002C
01BA 002C
TCPIC11
TCP Input Configuration11
5800 0030
01BA 0030
TCPOUT
TCP Output Parameters
5802 0000
–
TCPSP
5804 0000
–
TCPEXT
5806 0000
–
TCPAP
5808 0000
–
TCPINTER
TCP Systematics and Parities Memory
TCP Extrinsic Memory
TCP Apriori Memory
TCP Interleaver Memory
580A 0000
–
TCPHD
TCP Hard Decisions Memory
–
01BA 0038
TCPEXE
TCP Execution
Introduction
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Table 1-24. TCP Registers (C6414 Only) (continued)
HEX ADDRESS
EDMA BUS
PERIPHERAL BUS
–
01BA 0040
–
–
ACRONYM
REGISTER
TCPEND
TCP Endian
01BA 0050
TCPERR
TCP Error
01BA 0058
TCPSTAT
TCP Status
1.4.7 EDMA Channel Synchronization Events
The C64x EDMA supports up to 64 EDMA channels that service peripheral devices and external memory.
Table 1-25 lists the source of C64x EDMA synchronization events associated with each of the
programmable EDMA channels. For the C64x device, the association of an event to a channel is fixed;
each of the EDMA channels has one specific event associated with it. These specific events are captured
in the EDMA event registers (ERL, ERH), even if the events are disabled by the EDMA event enable
registers (EERL, EERH). The priority of each event can be specified independently in the transfer
parameters stored in the EDMA parameter RAM. For more detailed information on the EDMA module and
how EDMA events are enabled, captured, processed, linked, chained, and cleared, etc., see the EDMA
Controller chapter of the TMS320C6000 Peripherals Reference Guide (literature number SPRU190).
Table 1-25. SM320C64x EDMA Channel Synchronization Events (1)
(1)
(2)
(3)
EDMA
CHANNEL
EVENT NAME
0
DSP_INT
1
TINT0
Timer 0 interrupt
2
TINT1
Timer 1 interrupt
3
SD_INTA
4
GPINT4/EXT_INT4
GPIO event 4/External interrupt pin 4
5
GPINT5/EXT_INT5
GPIO event 5/External interrupt pin 5
6
GPINT6/EXT_INT6
GPIO event 6/External interrupt pin 6
7
GPINT7/ EXT_INT7
GPIO event 7/External interrupt pin 7
8
GPINT0
GPIO event 0
9
GPINT1
GPIO event 1
10
GPINT2
GPIO event 2
11
GPINT3
GPIO event 3
12
XEVT0
McBSP0 transmit event
13
REVT0
McBSP0 receive event
14
XEVT1
McBSP1 transmit event
15
REVT1
McBSP1 receive event
16
–
EVENT DESCRIPTION
HPI/PCI-to-DSP interrupt (PCI peripheral supported on C6415 and C6416 only) (2)
EMIFA SDRAM timer interrupt
None
17
XEVT2
McBSP2 transmit event
18
REVT2
McBSP2 receive event
19
TINT2
Timer 2 interrupt
20
SD_INTB
EMIFB SDRAM timer interrupt
21
–
Reserved, for future expansion
22–27
–
None
28
VCPREVT
VCP receive event (C6416 only) (3)
In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate
transfer completion events. For more detailed information on EDMA event-transfer chaining, see the EDMA Controller chapter of the
TMS320C6000 Peripherals Reference Guide (SPRU190).
The PCI and UTOPIA peripherals are not supported on the C6414 device; therefore, these EDMA synchronization events are reserved.
The VCP/TCP EDMA synchronization events are supported on the C6416 only. For the C6414 and C6415 devices, these events are
reserved.
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Table 1-25. SM320C64x EDMA Channel Synchronization Events (continued)
22
EDMA
CHANNEL
EVENT NAME
29
VCPXEVT
VCP transmit event (C6416 only) (3)
30
TCPREVT
TCP receive event (C6416 only) (3)
31
TCPXEVT
TCP transmit event (C6416 only) (3)
32
UREVT
33–39
–
40
UXEVT
EVENT DESCRIPTION
UTOPIA receive event (C6415 and C6416 only) (2)
None
UTOPIA transmit event (C6415 and C6416 only) (2)
41–47
–
48
GPINT8
GPIO event 8
49
GPINT9
GPIO event 9
50
GPINT10
GPIO event 10
51
GPINT11
GPIO event 11
52
GPINT12
GPIO event 12
53
GPINT13
GPIO event 13
54
GPINT14
GPIO event 14
55
GPINT15
GPIO event 15
56–63
–
Introduction
None
None
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1.4.8 Interrupt Sources and Interrupt Selector
The C64x DSP core supports 16 prioritized interrupts, which are listed in Table 1-26. The highest-priority
interrupt is INT_00 (dedicated to RESET), while the lowest-priority interrupt is INT_15. The first four
interrupts (INT_00–INT_03) are nonmaskable and fixed. The remaining interrupts (INT_04–INT_15) are
maskable and default to the interrupt source specified in Table 1-26. The interrupt source for interrupts
4–15 can be programmed by modifying the selector value (binary value) in the corresponding fields of the
interrupt selector control registers; MUXH (address 0x019C0000) and MUXL (address 0x019C0004).
Table 1-26. C64x DSP Interrupts
CPU
INTERRUPT
NUMBER
INTERRUPT
SELECTOR
CONTROL
REGISTER
SELECTOR
VALUE
(BINARY)
INTERRUPT
EVENT
INT_00 (1)
–
–
RESET
(1)
–
–
NMI
INT_02 (1)
–
–
Reserved
Reserved. Do not use.
INT_03 (1)
–
Reserved
GPIO interrupt 4/external interrupt 4
INT_01
(2)
MUXL[4:0]
00100
GPINT4/EXT_INT4
GPIO interrupt 5/external interrupt 5
INT_05 (2)
MUXL[9:5]
00101
GPINT5/EXT_INT5
TCP interrupt (C6416 only)
INT_06 (2)
MUXL[14:10]
00110
GPINT6/EXT_INT6
GPIO interrupt 6/external interrupt 6
INT_07 (2)
MUXL[20:16]
00111
GPINT7/EXT_INT7
GPIO interrupt 7/external interrupt 7
(2)
MUXL[25:21]
01000
EDMA_INT
INT_09 (2)
MUXL[30:26]
01001
EMU_DTDMA
INT_10 (2)
MUXH[4:0]
00011
SD_INTA
INT_04
INT_08
INT_11
(1)
(2)
INTERRUPT SOURCE
(2)
EDMA channel (0–63) interrupt
EMU DTDMA
EMIFA SDRAM timer interrupt
MUXH[9:5]
01010
EMU_RTDXRX
EMU real-time data exchange (RTDX) receive
INT_12 (2)
MUXH[14:10]
01011
EMU_RTDXTX
EMU RTDX transmit
INT_13 (2)
MUXH[20:16]
00000
DSP_INT
INT_14 (2)
MUXH[25:21]
00001
TINT0
Timer 0 interrupt
INT_15 (2)
MUXH[30:26]
00010
TINT1
Timer 1 interrupt
–
–
01100
XINT0
McBSP0 transmit interrupt
–
–
01101
RINT0
McBSP0 receive interrupt
–
–
01110
XINT1
McBSP1 transmit interrupt
–
–
01111
RINT1
McBSP1 receive interrupt
–
–
10000
GPINT0
–
–
10001
XINT2
McBSP2 transmit interrupt
–
–
10010
RINT2
McBSP2 receive interrupt
–
–
10011
TINT2
Timer 2 interrupt
–
–
10100
SD_INTB
EMIFB SDRAM timer interrupt
–
–
10101
Reserved
Reserved. Do not use.
–
–
10110
Reserved
Reserved. Do not use.
–
–
10111
UINT
–
–
11000–11101
Reserved
Reserved. Do not use.
–
–
11110
VCPINT
VCP interrupt (C6416 only)
–
–
11111
TCPINT
TCP interrupt (C6416 only)
HPI/PCI-to-DSP interrupt (PCI supported on C6415 and C6416
only)
GPIO interrupt 0
UTOPIA interrupt (C6415/C6416 only)
Interrupts INT_00–INT_03 are nonmaskable and fixed.
Interrupts INT_04–INT_15 are programmable by modifying the binary selector values in the Interrupt Selector Control registers fields.
Table 1-26 shows the default interrupt sources for interrupts INT_04–INT_15. For more detailed information on interrupt sources and
selection, see the Interrupt Selector and External Interrupts chapter of the TMS320C6000 Peripherals Reference Guide (SPRU190).
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1.4.9 Signal Groups Description
CLKIN
CLKOUT4/GP1†
CLKOUT6/GP2†
CLKMODE1
CLKMODE0
PLLV
TMS
TDO
TDI
TCK
TRST
EMU0
EMU1
EMU2
EMU3
EMU4
EMU5
EMU6
EMU7
EMU8
EMU9
EMU10
EMU11
Reset and
Interrupts
Clock/PLL
Reserved
IEEE Standard
1149.1
(JTAG)
Emulation
RESET
NMI
GP7/EXT_INT7‡
GP6/EXT_INT6‡
GP5/EXT_INT5‡
GP4/EXT_INT4‡
RSV
RSV
RSV
RSV
RSV
RSV
•
•
•
RSV
RSV
RSV
Peripheral
Control/Status
PCI_EN
MCBSP2_EN
Control/Status
GP15/PRST§
GP14/PCLK§
GP13/PINTA§
GP12/PGNT§
GP11/PREQ§
GP10/PCBE3§
GP9/PIDSEL§
CLKS2/GP8†
GPIO
GP7/EXT_INT7‡
GP6/EXT_INT6‡
GP5/EXT_INT5‡
GP4/EXT_INT4‡
GP3
CLKOUT6/GP2†
CLKOUT4/GP1†
GP0
General-Purpose Input/Output (GPIO) Port
† These pins are MUXed with the GPIO port pins and by default these signals function as clocks (CLKOUT4 or CLKOUT6) or McBSP2
clock source (CLKS2). To use these MUXed pins as GPIO signals, the appropriate GPIO register bits (GPxEN and GPxDIR) must be
properly enabled and configured. For more details, see the Device Configurations section of this data sheet.
‡ These pins are GPIO pins that can also function as external interrupt sources (EXT_INT[7:4]). Default after reset is EXT_INTx or GPIO
as input-only.
§ For the C6415 and C6416 devices, these GPIO pins are MUXed with the PCI peripheral pins. By default, these signals are set up to no
function with both the GPIO and PCI pin functions disabled. For more details on these MUXed pins, see the Device Configurations
section of this data sheet. For the C6414 device, the GPIO peripheral pins are not MUXed; the C6414 device does not support the PCI
peripheral.
Figure 1-2. CPU and Peripheral Signals
24
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64
Data
AED[63:0]
ACE3
ACE2
ACE1
ACE0
Memory Map
Space Select
20
AEA[22:3]
AECLKIN
External
Memory I/F
Control
Address
ABE7
ABE6
ABE5
ABE4
Byte Enables
ABE3
ABE2
ABE1
ABE0
Bus
Arbitration
AECLKOUT1
AECLKOUT2
ASDCKE
AARE/ASDCAS/ASADS/ASRE
AAOE/ASDRAS/ASOE
AAWE/ASDWE/ASWE
AARDY
ASOE3
APDT
AHOLD
AHOLDA
ABUSREQ
EMIFA (64-bit)†
16
Data
BED[15:0]
BCE3
BCE2
BCE1
BCE0
Memory Map
Space Select
BECLKIN
External
Memory I/F
Control
20
BEA[20:1]
BBE1
BBE0
BSOE3
BPDT
Address
Byte Enables
Bus
Arbitration
EMIFB (16-bit)†
†
BECLKOUT1
BECLKOUT2
BARE/BSDCAS/BSADS/BSRE
BAOE/BSDRAS/BSOE
BAWE/BSDWE/BSWE
BARDY
BHOLD
BHOLDA
BBUSREQ
These C64x devices have two EMIFs (64-bit EMIFA and 16-bit EMIFB). The prefix “A” in front of a signal name indicates it is an
EMIFA signal whereas a prefix “B” in front of a signal name indicates it is an EMIFB signal. Throughout the rest of this document,
in generic EMIF areas of discussion, the prefix “A” or “B” may be omitted from the signal name.
Figure 1-3. Peripheral Signals (1)
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Data
HD[31:0]/AD[31:0]
HCNTL0/PSTOP
HCNTL1/PDEVSEL
HPI†
(Host-Port Interface)
Register Select
Control
Half-Word
Select
HHWIL/PTRDY
(HPI16 ONLY)
HAS/PPAR
HR/W/PCBE2
HCS/PPERR
HDS1/PSERR
HDS2/PCBE1
HRDY/PIRDY
HINT/PFRAME
32
HD[31:0]/AD[31:0]
GP10/PCBE3
HR/W/PCBE2
HDS2/PCBE1
PCBE0§
GP12/PGNT
Data/Address
Command
Byte Enable
Clock
Control
Arbitration
Error
GP11/PREQ
Serial
EEPROM
PCI Interface‡
(C6415 and C6416 Only)
GP14/PCLK
GP9/PIDSEL
HCNTL1/PDEVSEL
HINT/PFRAME
GP13/PINTA
HAS/PPAR
GP15/PRST
HRDY/PIRDY
HCNTL0/PSTOP
HHWIL/PTRDY
HDS1/PSERR
HCS/PPERR
DX2/XSP_DO
XSP_CS§
CLKX2/XSP_CLK
DR2/XSP_DI
†
For the C6415 and C6416 devices, these HPI pins are MUXed with the PCI peripheral. By default, these signals function as HPI. For more
details on these MUXed pins, see the Device Configurations section of this data sheet. For the C6414 device, these HPI pins are not
MUXed; the C6414 device does not support the PCI peripheral.
‡ For the C6415 and C6416 devices, these PCI pins (excluding PCBE0 and XSP_CS) are MUXed with the HPI, McBSP2, or GPIO
peripherals. By default, these signals function as HPI, McBSP2, and no function, respectively. For more details on these MUXed pins,
see the Device Configurations section of this data sheet. For the C6414 device, the HPI, McBSP2, and GPIO peripheral pins are not
MUXed; the C6414 device does not support the PCI peripheral.
§ For the C6414 device, these pins are “Reserved (leave unconnected, do not connect to power or ground).”
Figure 1-4. Peripheral Signals (2)
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McBSP1
McBSP0
CLKX1/URADDR4†
FSX1/UXADDR3†
DX1/UXADDR4†
Transmit
Transmit
CLKR1/URADDR2†
FSR1/UXADDR2†
DR1/UXADDR1†
Receive
Receive
CLKS1/URADDR3†
Clock
CLKX0
FSX0
DX0
CLKR0
FSR0
DR0
Clock
CLKS0
McBSP2
CLKX2/XSP_CLK†
FSX2
DX2/XSP_DO†
Transmit
CLKR2
FSR2
DR2/XSP_DI†
Receive
CLKS2/GP8‡
Clock
McBSPs
(Multichannel Buffered
Serial Ports)
†
For the C6415 and C6416 devices, these McBSP2 and McBSP1 pins are MUXed with the PCI and UTOPIA peripherals, respectively.
By default, these signals function as McBSP2 and McBSP1, respectively. For more details on these MUXed pins, see the Device
Configurations section of this data sheet.
For the C6414 device, these McBSP2 and McBSP1 peripheral pins are not MUXed; the C6414 device does not support PCI and UTOPIA
peripherals.
‡ The McBSP2 clock source pin (CLKS2, default) is MUXed with the GP8 pin. To use this MUXed pin as the GP8 signal, the appropriate
GPIO register bits (GP8EN and GP8DIR) must be properly enabled and configured. For more details, see the Device Configurations
section of this data sheet.
Figure 1-5. Peripheral Signals (3)
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UTOPIA (SLAVE) [C6415 and C6416 Only]
URDATA7
URDATA6
URDATA5
URDATA4
URDATA3
URDATA2
URDATA1
URDATA0
URENB
CLKX1/URADDR4†
CLKS1/URADDR3†
CLKR1/URADDR2†
URADDR1
URADDR0
URCLAV
URSOC
†
Receive
UXDATA7
UXDATA6
UXDATA5
UXDATA4
UXDATA3
UXDATA2
UXDATA1
UXDATA0
Transmit
Control/Status
Control/Status
URCLK
Clock
Clock
TOUT1
TINP1
Timer 1
TOUT2
TINP2
Timer 2
UXENB
DX1/UXADDR4†
FSX1/UXADDR3†
FSR1/UXADDR2†
DR1/UXADDR1†
UXADDR0
UXCLAV
UXSOC
UXCLK
TOUT0
TINP0
Timer 0
Timers
For the C6415 and C6416 devices, these UTOPIA pins are MUXed with the McBSP1 peripheral. By default, these signals function as
McBSP1. For more details on these MUXed pins, see the Device Configurations section of this data sheet.
For the C6414 device, these McBSP1 peripheral pins are not MUXed; the C6414 does not support the UTOPIA peripheral.
Figure 1-6. Peripheral Signals (4)
Contents
1
Introduction ............................................... 1
Features .............................................. 1
SUPPORTS DEFENSE, AEROSPACE, AND
MEDICAL APPLICATIONS ........................... 2
1.1
1.2
1.3
Description ............................................ 2
1.4
Ball-Grid Array (BGA) Package
1.4.1
1.4.2
1.4.3
1.4.4
1.4.5
28
...................... 3
Device Characteristics ............................... 4
Device Compatiblity .................................. 5
Functional Block and CPU (DSP Core) Diagram ... 6
CPU (DSP Core) Description ........................ 7
Memory Map Summary ............................. 10
Contents
2
...................
...........
1.4.8 Interrupt Sources and Interrupt Selector............
1.4.9 Signal Groups Description ..........................
Device Configurations.................................
2.1
Peripherals Selection ................................
2.2
Other Device Configurations ........................
2.3
Multiplexed Pins .....................................
2.4
Debugging Considerations ..........................
2.5
Terminal Functions ..................................
1.4.6 Peripheral Register Descriptions
11
1.4.7 EDMA Channel Synchronization Events
21
23
24
30
30
31
33
33
35
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3
Development Support ................................. 43
3.1
4
5
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
Device and Development Support Tool
Nomenclature ....................................... 43
Electrical Specifications .............................. 50
4.1
ABSOLUTE MAXIMUM RATINGS .................. 50
4.2
RECOMMENDED OPERATING CONDITIONS
4.3
ELECTRICAL CHARACTERISTICS ................ 50
....
..
Signal Transition Levels .............................
Signal Transition Rates .............................
Timing Parameters and Board Routing Analysis....
INPUT AND OUTPUT CLOCKS ....................
50
PARAMETER MEASUREMENT INFORMATION
52
5.1
52
5.2
5.3
5.1
5.1.1
52
52
53
Timing Requirements for CLKIN for –50xEP
Devices (see Figure 5-5) ............................ 53
5.1.4 Timing Requirements ECLKIN for EMIFA and
EMIFB (see Figure 5-8) ............................. 55
5.2
ASYNCHRONOUS MEMORY TIMING .............
5.2.1 Timing Requirements for Asynchronous Memory
Cycles for EMIFA Module (see Figure 5-11 and
Figure 5-12) .........................................
5.2.3 Timing Requirements for Asynchronous Memory
Cycles for EMIFB Module (see Figure 5-11 and
Figure 5-12) .........................................
5.3
PROGRAMMABLE SYNCHRONOUS INTERFACE
TIMING ..............................................
5.3.1 Timing Requirements for Programmable
Synchronous Interface Cycles for EMIFA Module
(see Figure 5-13) ....................................
5.3.3 Timing Requirements for Programmable
Synchronous Interface Cycles for EMIFB Module
(see Figure 5-13) ...................................
56
56
56
58
58
5.5
HOLD/HOLDA TIMING .............................. 70
5.5.1 Timing Requirements for the HOLD/HOLDA cycles
for EMIFA and EMIFB Modules (see Figure 5-24) . 70
5.6
Switching Characteristics Over Recommended
Operating Conditions for the HOLD/HOLDA Cycles
for EMIFA and EMIFB Modules (see Figure 5-24) .. 71
5.7
BUSREQ TIMING ................................... 71
5.8
RESET TIMING
5.8.1
5.9
72
Timing Requirements for Reset (see Figure 5-26 ) 72
EXTERNAL INTERRUPT TIMING .................. 74
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5.10 HOST-PORT INTERFACE (HPI).................... 74
5.10.1 Timing Requirements for Host-Port Interface
Cycles (see Figure 5-28 through Figure 5-35) ..... 74
5.11 PERIPHERAL COMPONENT INTERCONNECT
(PCI) TIMING (C6415 AND C6416 ONLY) ......... 78
5.11.1
5.11.2
Timing Requirements for PCLK (see Figure 5-36
Timing Requirements for PCI Reset (see
Figure 5-37) .........................................
5.11.3 Timing Requirements for PCI Inputs (see
Figure 5-38) .........................................
5.11.5 Timing Requirements for Serial EEPROM
Interface (see Figure 5-39) ..........................
5.12 MULTICHANNEL BUFFERED SERIAL PORT
(McBSP) TIMING ....................................
5.12.1 Timing Requirements for McBSP (see
Figure 5-40 ..........................................
5.12.3 Timing Requirements for FSR When GSYNC = 1
(see Figure 5-41) ....................................
5.12.4 Timing Requirements for McBSP as SPI Master or
Slave: CLKSTP = 10b, CLKXP = 0 (see ) ..........
5.12.6 Timing Requirements for McBSP as SPI Master
or Slave: CLKSTP = 11b,
CLKXP = 1 (see Figure 5-43) .......................
5.13 UTOPIA SLAVE TIMING (C6415 AND C6416
ONLY) ...............................................
5.13.1 Timing Requirements for UXCLK (see
Figure 5-44) .........................................
5.13.2 Timing Requirements for URCLK (see Figure 5-45
79
79
79
80
80
81
82
82
84
84
85
......................................................
59
5.4
SYNCHRONOUS DRAM TIMING................... 62
5.4.1 Timing Requirements for Synchronous DRAM
Cycles for EMIFA Module (see Figure 5-16 ........ 62
5.4.3 Timing Requirements for Synchronous DRAM
Cycles for EMIFB Module(see Figure 5-16)......... 63
.....................................
5.9.1 Timing Requirements for External Interrupts (see
Figure 5-27) ......................................... 74
85
Timing Requirements for UTOPIA Slave Transmit
(see Figure 5-46) .................................... 85
5.13.5 Timing Requirements for UTOPIA Slave Receive
(see Figure 5-47) .................................... 86
5.13.3
5.14 TIMER TIMING ......................................
5.14.1 Timing Requirements for Timer Inputs (see
Figure 5-48) .........................................
5.15 GENERAL-PURPOSE INPUT/OUTPUT (GPIO)
PORT TIMING.......................................
5.15.1 Timing Requirements for GPIO Inputs (see
Figure 5-48) .........................................
87
87
87
88
5.16 JTAG TEST PORT TIMING ......................... 88
5.16.1 Timing Requirements for JTAG Test Port (see
Figure 5-50) ......................................... 88
5.16.3 Thermal Resistance Characteristics (S-PBGA
Package) ............................................ 88
Contents
29
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
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2 Device Configurations
The C6414, C6415, and C6416 peripheral selections and other device configurations are determined by
external pullup/pulldown resistors on the following pins (all of which are latched during device reset):
• Peripherals selection (C6415 and C6416 devices)
– BEA11 (UTOPIA_EN)
– PCI_EN (for C6415 or C6416, see Table 28 footnotes)
– MCBSP2_EN (for C6414 or C6416, see Table 28 footnotes)
The C6414 device does not support the PCI and UTOPIA peripherals; for proper operation of the
C6414 device, do not oppose the internal pulldowns (IPDs) on the BEA11, PCI_EN, and
MCBSP2_EN pins. (For IPUs/IPDs on pins, see the Terminal Functions table of this data manual.)
• Other device configurations (C64x)
– BEA[20:13, 7]
– HD5
2.1 Peripherals Selection
Some C6415/C6416 peripherals share the same pins (internally multiplexed) and are mutually exclusive
(i.e., HPI, GPIO pins GP[15:9], PCI and its internal EEPROM, McBSP1, McBSP2, and UTOPIA). The
VCP/TCP coprocessors (C6416 only) and other C64x peripherals (i.e., the timers, McBSP0, and the
GP[8:0] pins) are always available.
• UTOPIA and McBSP1 peripherals
The UTOPIA_EN pin (BEA11) is latched at reset. For C6415 and C6416 devices, this pin selects
whether the UTOPIA peripheral or McBSP1 peripheral is functionally enabled (see Table 2-1).
The C6414 device does not support the UTOPIA peripheral; for proper device operation, do not
oppose the internal pulldown (IPD) on the BEA11 pin.
Table 2-1. UTOPIA_EN Peripheral Selection (McBSP1 and UTOPIA) (C6415/C6416 Only)
PERIPHERAL SELECTION
UTOPIA_EN
(BEA11) PIN [D16]
PERIPHERALS SELECTED
UTOPIA
√
0
•
McBSP1 is enabled and UTOPIA is disabled
(default).
This means all multiplexed McBSP1/UTOPIA pins
function as McBSP1 and all other stand alone
UTOPIA pins are tied off (Hi-Z).
UTOPIA is enabled and McBSP1 is disabled.
This means all multiplexed McBSP1/UTOPIA pins
now function as UTOPIA and all other stand alone
McBSP1 pins are tied off (Hi-Z).
√
1
DESCRIPTION
McBSP1
HPI, GP[15:9], PCI, EEPROM (internal to PCI), and McBSP2 peripherals
The PCI_EN and MCBSP2_EN pins are latched at reset. They determine specific peripheral selection
for the C6415 and C6416 devices, summarized in Table 2-2.
The C6414 device does not support the PCI peripheral; for proper device operation, do not oppose the
internal pulldowns (IPDs) on the PCI_EN and MCBSP2_EN pins.
Table 2-2. PCI_EN and MCBSP2_EN Peripheral Selection (HPI, GP[15:9], PCI, and McBSP2)
PERIPHERAL SELECTION (1)
(1)
30
PERIPHERALS SELECTED
PCI_EN
PIN [AA4]
MCBSP2_EN
PIN [AF3]
HPI
GP[15:9]
0
0
√
√
√
0
1
√
√
√
PCI
EEPROM
(INTERNAL TO PCI)
McBSP2
The PCI_EN pin must be driven valid at all times and the user must not switch values throughout device operation.
The MCBSP2_EN pin must be driven valid at all times and the user can switch values throughout device operation.
Device Configurations
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Table 2-2. PCI_EN and MCBSP2_EN Peripheral Selection (HPI, GP[15:9], PCI, and McBSP2) (continued)
PERIPHERAL SELECTION (1)
PCI_EN
PIN [AA4]
MCBSP2_EN
PIN [AF3]
1
(2)
1
(2)
PERIPHERALS SELECTED
PCI
EEPROM
(INTERNAL TO PCI)
0
√
√
1
√
HPI
GP[15:9]
McBSP2
√
The only time McBSP2 is disabled is when both PCI_EN = 1 and MCBSP2_EN = 0. This configuration enables, at reset, the
auto-initialization of the PCI peripheral through the PCI internal EEPROM [provided the PCI EEPROM auto-initialization pin (BEA13) is
pulled up (EEAI = 1)]. The user then can enable the McBSP2 peripheral (disabling EEPROM) by dynamically changing MCBSP2_EN to
a 1 after the device is initialized (out of reset).
•
•
•
If the PCI is disabled (PCI_EN = 0), the HPI peripheral is enabled and GP[15:9] pins can be
programmed as GPIO, provided the GPxEN and GPxDIR bits are properly configured.
This means all multiplexed HPI/PCI pins function as HPI and all stand-alone PCI pins (PCBE0 and
XSP_CS) are tied off (Hi-Z). Also, the multiplexed GPIO/PCI pins can be used as GPIO with the proper
software configuration of the GPIO Enable and Direction registers (for more details, see Table 2-4).
If the PCI is enabled (PCI_EN = 1), the HPI peripheral is disabled.
This means all multiplexed HPI/PCI pins function as PCI. Also, the multiplexed GPIO/PCI pins function
as PCI pins (for more details, see Table 2-4).
The MCBSP2_EN pin, in combination with the PCI_EN pin, controls the selection of the McBSP2
peripheral and the PCI internal EEPROM (for more details, see Table 2-2 and its footnotes).
2.2 Other Device Configurations
Table 2-3 describes the C6414, C6415, and C6416 devices configuration pins, which are set up via
external pullup/pulldown resistors through the specified EMIFB address bus pins (BEA[20:13, 11, 9:7]) and
the HD5 pin. For more details on these device configuration pins, see the Terminal Functions table and
the Debugging Considerations section.
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Table 2-3. Device Configuration Pins (BEA[20:13, 9:7], HD5, and BEA11)
CONFIGURATION
PIN
NO.
BEA20
E16
FUNCTIONAL DESCRIPTION
Device endian mode (LEND)
0 – System operates in big endian mode.
1 – System operates in little endian mode (default).
Bootmode [1:0]
00 – No boot
BEA19
BEA18
D18
C18
01 – HPI boot
10 – EMIFB 8-bit ROM boot with default timings (default mode)
11 – Reserved
EMIFA input clock select. Clock-mode select for EMIFA (AECLKIN_SEL[1:0]).
00 – AECLKIN (default mode)
BEA17
BEA16
B18
A18
01 – CPU/4 clock rate
10 – CPU/6 clock rate
11 – Reserved
EMIFA input clock select. Clock-mode select for EMIFB (BECLKIN_SEL[1:0]).
00 – BECLKIN (default mode)
BEA15
BEA14
D17
C17
01 – CPU/4 clock rate
10 – CPU/6 clock rate
11 – Reserved
PCI EEPROM auto-initialization (EEAI) (C6415 and C6416 devices only)
[The C6414 device does not support the PCI peripheral; for proper device operation, do not oppose the internal
pulldown (IPD) on the BEA13 pin.]
PCI auto-initialization via external EEPROM
BEA13
0 – PCI auto-initialization through EEPROM is disabled; the PCI peripheral uses the specified PCI default
values (default).
B17
1 – PCI auto-initialization through EEPROM is enabled; the PCI peripheral is configured through EEPROM
provided the PCI peripheral pin is enabled (PCI_EN = 1) and the McBSP2 peripheral pin is disabled
(MCBSP2_EN = 0).
Note: If the PCI peripheral is disabled (PCI_EN pin = 0), this pin must not be pulled up. For more information
on the PCI EEPROM default values, see the PCI chapter of the TMS320C6000 Peripherals Reference Guide
(literature number SPRU190).
UTOPIA enable (UTOPIA_EN) (C6415 and C6416 devices only)
[The C6414 device does not support the UTOPIA peripheral. For proper device operation, do not oppose the
internal pulldown (IPD) on the BEA11 pin.]
UTOPIA peripheral enable (functional)
BEA11
D16
0 – UTOPIA peripheral disabled (McBSP1 functions are enabled) (default). This means all multiplexed
McBSP1/UTOPIA pins function as McBSP1 and all other standalone UTOPIA pins are tied off (Hi-Z).
1 – UTOPIA peripheral enabled (McBSP1 functions are disabled). This means all multiplexed
McBSP1/UTOPIA pins now function as UTOPIA and all other stand-alone McBSP1 pins are tied off
(Hi-Z).
BEA7
BEA8
BEA9
D15
A16
B16
C6414 Devices
C6415 Devices
C6416 Devices
Do not oppose internal pulldown (IPD)
Pullup
Do not oppose IPD
Do not oppose IPD
Do not oppose IPD
Pullup(1)
Do not oppose IPD
Do not oppose IPD
Pullup(1)
(1)
HPI peripheral bus width (HPI_WIDTH)
HD5
Y1
0 – HPI operates as an HPI16.
(HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining HD[31:16] pins are reserved pins in
the Hi-Z state.)
1 – HPI operates as an HPI32.
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
(1)
32
For proper device operation, this pin must be externally pulled up with a 1-kΩ resistor.
Device Configurations
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2.3 Multiplexed Pins
Multiplexed pins are pins that are shared by more than one peripheral and are internally multiplexed.
Some of these pins are configured by software, and the others are configured by external pullup/pulldown
resistors only at reset. The multiplexed pins that are configured by software can be programmed to switch
functionalities at any time. The multiplexed pins that are configured by external pullup/pulldown resistors
are mutually exclusive; only one peripheral has primary control of the function of these pins after reset.
Table 2-4 identifies the multiplexed pins on the C6414, C6415, and C6416 devices, shows the default
(primary) function and the default settings after reset, and describes the pins, registers, etc., necessary to
configure specific multiplexed functions.
2.4 Debugging Considerations
It is recommended that external connections be provided to device configuration pins, including
CLKMODE[1:0], BEA[20:13, 11, 9:7], HD5/AD5, PCI_EN, and MCBSP2_EN. Although internal
pullup/pulldown resistors exist on these pins (except for HD5/AD5), providing external connectivity adds
convenience to the user in debugging and flexibility in switching operating modes.
Internal pullup/pulldown resistors also exist on the nonconfiguration pins on the BEA bus (BEA[12, 10,
6:1]). Do not oppose the internal pullup/pulldown resistors on these nonconfiguration pins with external
pullup/pulldown resistors. If an external controller provides signals to these nonconfiguration pins, these
signals must be driven to the default state of the pins at reset or not be driven at all.
For the internal pullup/pulldown resistors on the C6414, C6415, and C6416 device pins, see the Terminal
Functions table.
Table 2-4. C6414, C6415, and C6416 Device Multiplexed Pins (1)
MULTIPLEXED PINS
NAME
DEFAULT FUNCTION
DEFAULT SETTING
DESCRIPTION
These pins are software configurable. To use these pins as
GPIO pins, the GPxEN bits in the GPIO Enable Register
and the GPxDIR bits in the GPIO Direction Register must
be properly configured.
GPxEN = 1: GPx pin enabled
GPxDIR = 0: GPx pin is an input.
GPxDIR = 1: GPx pin is an output.
NO.
CLKOUT4/GP1 (2)
AE6
CLKOUT4
GP1EN = 0 (disabled)
CLKOUT6/GP2 (2)
AD6
CLKOUT6
GP2EN = 0 (disabled)
CLKS2/GP8 (2)
AE4
CLKS2
GP8EN = 0 (disabled)
GP9/PIDSEL
M3
GP10/PCBE3
L2
GP11/PREQ
F1
GP12/PGNT
J3
GP14/PCLK
G4
GP13/PINTA
F2
GP15/PRST
G3
None
DX1/UXADDR4
AB11
DX1
FSX1/UXADDR3
AB13
FSX1
FSR1/UXADDR2
AC9
FSR1
DR1/UXADDR1
AF11
DR1
CLKX1/URADDR4
AB12
CLKX1
CLKS1/URADDR3
AC8
CLKS1
CLKR1/URADDR2
AC10
CLKR1
(1)
(2)
GPxEN = 0 (disabled)
PCI_EN = 0 (disabled) (1)
To use GP[15:9] as GPIO pins, the PCI must be disabled
(PCI_EN = 0), the GPxEN bits in the GPIO Enable Register
and the GPxDIR bits in the GPIO Direction. Register must
be properly configured.
GPxEN = 1: GPx pin enabled
GPxDIR = 0: GPx pin is an input.
GPxDIR = 1: GPx pin is an output.
UTOPIA_EN (BEA11) = 0
(disabled) (1)
By default, McBSP1 is enabled upon reset (UTOPIA is
disabled).
To enable the UTOPIA peripheral, an external pullup
resistor (1 kΩ) must be provided on the BEA11 pin (setting
UTOPIA_EN = 1 at reset).
For the C6415 and C6416 devices, all other stand-alone UTOPIA and PCI pins are tied off internally (pins in Hi-Z) when the peripheral is
disabled [UTOPIA_EN (BEA11) = 0 or PCI_EN = 0].
The C6414 device does not support the PCI and UTOPIA peripherals. These are the only multiplexed pins on the C6414 device, all
other pins are stand-alone peripheral functions and are not multiplexed.
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Table 2-4. C6414, C6415, and C6416 Device Multiplexed Pins (continued)
MULTIPLEXED PINS
NAME
DEFAULT FUNCTION
CLKX2/XSP_CLK
AC2
CLKX2
DR2/XSP_DI
AB3
DR2
DX2/XSP_DO
AA2
HD[31:0]
HAS/PPAR
T3
HAS
HCNTL1/PDEVSEL
R1
HCNTL1
HCNTL0/PSTOP
T4
HCNTL0
HDS1/PSERR
T1
HDS1
HDS2/PCBE1
T2
HDS2
HR/W/PCBE2
P1
HR/W
HWWIL/PTRDY
R3
HHWIL (HPI16 only)
HINT/PFRAME
R4
HINT
HCS/PPERR
R2
HCS
HRDY/PIRDY
P4
HRDY
34
DESCRIPTION
DX2
(3)
HD[31:0]/AD[31:0]
(3)
DEFAULT SETTING
NO.
PCI_EN = 0 (disabled) (1)
By default, HPI is enabled upon reset (PCI is disabled).
To enable the PCI peripheral an external pullup resistor
(1 kΩ) must be provided on the PCI_EN pin (setting
PCI_EN = 1 at reset).
For the pin numbers of the HD[31:0]/AD[31:0] multiplexed pins, see the Terminal Functions table.
Device Configurations
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2.5 Terminal Functions
TERMINAL
NAME
NO.
TYPE (1)
IPD/IPU
DESCRIPTION
(2)
CLOCK/PLL Configuration
CLKIN
H4
I
IPD
Clock input. This clock is the input to the on-chip PLL.
(3)
AE6
I/O/Z
IPD
Clock output at 1/4 of the device speed (O/Z) (default) or this pin can be programmed as a
GPIO1 pin (I/O/Z).
CLKOUT6/GP2 (3)
AD6
I/O/Z
IPD
Clock output at 1/6 of the device speed (O/Z) (default) or this pin can be programmed as a
GPIO2 pin (I/O/Z).
CLKMODE1
G1
I
IPD
CLKMODE0
H2
I
IPD
PLLV (4)
J6
A (5)
CLKOUT4/GP1
Clock-mode select. Selects whether the CPU clock frequency = input clock frequency ×1
(bypass), ×6, or ×12.
For more details on the CLKMODE pins and the PLL multiply factors, see the Clock PLL
section of this data manual.
PLL voltage supply
JTAG Emulation
TMS
AB16
I
IPU
JTAG test-port mode select
TDO
AE19
O/Z
IPU
JTAG test-port data out
TDI
AF18
I
IPU
JTAG test-port data in
TCK
AF16
I
IPU
JTAG test-port clock
TRST
AB15
I
IPD
JTAG test-port reset. For IEEE Std 1149.1 JTAG compatibility, see the IEEE Std 1149.1
JTAG Compatibility Statement section of this data manual.
EMU11
AC18
EMU10
AD18
I/O/Z
IPU
Emulation pin [11:2]. Reserved for future use, leave unconnected.
EMU9
AE18
EMU8
AC17
EMU7
AF17
EMU6
AD17
EMU5
AE17
EMU4
AC16
EMU3
AD16
EMU2
AE16
Emulation pins [1:0]
Select the device functional mode of operation:
EMU1
EMU0
AC15
AF15
I/O/Z
IPU
EMU[1:0]
Operation
00
01
10
11
Boundary Scan/Normal mode (see Note)
Reserved
Reserved
Emulation/Normal mode (default) (see the IEEE 1149.1 JTAG
Compatibility Statement section of this data manual)
Normal mode refers to the DSPs normal operational mode, when the DSP is free running.
The DSP can be placed in normal operational mode when the EMU[1:0] pins are configured
for either Boundary Scan or Emulation.
Note: When the EMU[1:0] pins are configured for Boundary Scan mode, the internal
pulldown (IPD) on the TRST signal must not be opposed in order to operate in Normal
mode.
For the Boundary Scan mode pulldown EMU[1:0] pins with a dedicated 1-kΩ resistor.
Resets, Interrupts, and General-Purpose Input/Outputs (GPIOs)
RESET
NMI
(1)
(2)
(3)
(4)
(5)
AC7
I
B4
I
Device reset
IPD
Nonmaskable interrupt, edge-driven (rising edge)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the
opposite supply rail, a 1-kΩ resistor should be used.)
These pins are multiplexed pins. For more details, see the Device Configurations section of this data manual.
PLLV is not part of external voltage supply. See the Clock PLL section for information on how to connect this pin.
A = Analog signal (PLL filter)
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Device Configurations
35
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
TERMINAL
NAME
NO.
TYPE (1)
IPD/IPU
www.ti.com
(2)
DESCRIPTION
IPU
GP7/EXT_INT7
AF4
GP6/EXT_INT6
AD5
GP5/EXT_INT5
AE5
GP4/EXT_INT4
AF5
General-purpose input/outputs (GPIO) (I/O/Z) or external interrupts (input only). The default
after reset setting is GPIO enabled as input only.
When these pins function as external interrupts [by selecting the corresponding interrupt
enable register bit (IER.[7:4])], they are edge driven and the polarity can be independently
selected via the External Interrupt Polarity Register bits (EXTPOL[3:0]).
GP15/PRST (6)
G3
General-purpose input/output (GPIO) 15 (I/O/Z) or PCI reset (I). No function at default.
F2
GPIO 14 (I/O/Z) or PCI clock (I). No function at default.
GP14/PCLK
(6)
GP13/PINTA (6)
G4
GP12/PGNT (6)
J3
(6)
GP11/PREQ
I/O/Z
GPIO 13 (I/O/Z) or PCI interrupt A (O/Z). No function at default.
I/O/Z
GPIO 12 (I/O/Z) or PCI bus grant (I). No function at default.
F1
GPIO 11 (I/O/Z) or PCI bus request (O/Z). No function at default.
GP10/PCBE3 (6)
L2
GPIO 10 (I/O/Z) or PCI command/byte enable 3 (I/O/Z). No function at default.
GP9/PIDSEL (6)
M3
GP3
AC6
I/O/Z
GP0
AF6
I/O/Z
IPD
GPIO 0 (I/O/Z). Can be programmed as GPIO 0 (input only) (default) or as GPIO 0 (output
only) pin or output as a general-purpose interrupt (GP0INT) signal (output only).
AE4
I/O/Z
IPD
McBSP2 external clock source (CLKS2) [input only] (default) or this pin can be
programmed as a GPIO 8 pin (I/O/Z).
AD6
I/O/Z
IPD
Clock output at 1/6 of the device speed (O/Z) (default) or this pin can be programmed as a
GPIO 2 pin (I/O/Z).
AE6
I/O/Z
IPD
Clock output at 1/4 of the device speed (O/Z) (default) or this pin can be programmed as a
GPIO 1 pin (I/O/Z).
CLKS2/GP8 (6)
(7)
CLKOUT6/GP2 (6)
(7)
CLKOUT4/GP1
(6) (7)
GPIO 9 (I/O/Z) or PCI initialization device select (I). No function at default.
GPIO 3 (I/O/Z). The default after reset setting is GPIO 3 enabled as input only.
Host-Port Interface (HPI) (C64x) or Peripheral Component Interconnect (PCI) (C6415 or C6416 Devices Only)
PCI_EN
AA4
I
HINT/PFRAME (6)
R4
I/O/Z
Host interrupt from DSP to host (O) (default) or PCI frame (I/O/Z)
HCNTL1/PDEVS
EL (6)
R1
I/O/Z
Host control 1. Selects between control, address, or data registers (I) (default) or PCI
device select (I/O/Z).
6)
T4
I/O/Z
Host control 0. Selects between control, address, or data registers (I) (default) or PCI stop
(I/O/Z).
HHWIL/PTRDY (6)
R3
I/O/Z
Host half-word select-first or second half word (not necessarily high or low order) (For
HPI16 bus width selection only) (I) (default) or PCI target ready (I/O/Z).
HR/W/PCBE2 (6)
P1
I/O/Z
Host read or write select (I) (default) or PCI command/byte enable 2 (I/O/Z)
HAS/PPAR (6)
T3
I/O/Z
Host address strobe (I) (default) or PCI parity (I/O/Z)
HCS/PPERR (6)
R2
I/O/Z
Host chip select (I) (default) or PCI parity error (I/O/Z)
(6)
T1
I/O/Z
Host data strobe 1 (I) (default) or PCI system error (I/O/Z)
HDS2/PCBE1 (6)
T2
I/O/Z
Host data strobe 2 (I) (default) or PCI command/byte enable 1 (I/O/Z)
HRDY/PIRDY (6)
P4
I/O/Z
Host ready from DSP to host (O) (default) or PCI initiator ready (I/O/Z)
HCNTL0/PSTOP (
HDS1/PSERR
(6)
(7)
36
IPD
PCI enable. This pin controls the selection (enable/disable) of the HPI and GP[15:9], or PCI
peripherals (for the C6415 and C6416 devices). This pin works in conjunction with the
MCBSP2_EN pin to enable/disable other peripherals (for more details, see the Device
Configurations section of this data manual).
The C6414 device does not support the PCI peripheral; for proper device operation, do not
oppose the internal pulldown (IPD) on this pin.
For the C6415 and C6416 devices, these pins are multiplexed pins. For more details, see the Device Configurations section of this data
manual. The C6414 device does not support the PCI or UTOPIA peripherals; therefore, these MUXed peripheral pins are stand alone
peripheral functions for this device.
For the C6414 device, only these pins are multiplexed pins.
Device Configurations
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SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
www.ti.com
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
TERMINAL
NAME
NO.
HD31/AD31 (6)
J2
HD30/AD30 (6)
K3
HD29/AD29 (6)
J1
HD28/AD28 (6)
K4
HD27/AD27 (6)
K2
(6)
L3
HD25/AD25 (6)
K1
HD24/AD24 (6)
L4
HD26/AD26
(6)
L1
HD22/AD22 (6)
M4
HD21/AD21 (6)
M2
HD20/AD20 (6)
N4
(6)
M1
HD18/AD18 (6)
N5
HD17/AD17 (6)
N1
(6)
U4
HD23/AD23
HD19/AD19
HD15/AD15
HD16/AD16 (6)
P5
HD15/AD15 (6)
U4
HD14/AD14 (6)
U1
HD13/AD13 (6)
U3
HD12/AD12 (6)
U2
HD11/AD11 (6)
V4
(6)
V1
HD10/AD10
HD9/AD9 (6)
V3
HD8/AD8 (6)
V2
(6)
W2
HD6/AD6 (6)
W4
HD5/AD5 (6)
Y1
(6)
Y3
HD3/AD3 (6)
Y2
HD7/AD7
HD4/AD4
TYPE (1)
IPD/IPU
(2)
DESCRIPTION
I/O/Z
Host-port data (I/O/Z) (default) (C64x) or PCI data-address bus (I/O/Z) (C6415 and C6416)
AS HPI data bus (PCIPEN pin = 0):
Used for transfer of data, address, and control .
Host-port bus width user configurable at device reset via a 10-kΩ. resistor pullup/pulldown
resistor on the HD5 pin:
HD5 pin = 0: HPI operates as an HPI16.
(HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining HD[31:16] pins are
reserved pins in the high-impedance state.)
HD5 pin = 1: HPI operates as an HPI32.
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
As PCI data-address bus (PCI_EN pin = 1) (C6415 and C6416 devices only):
Used for transfer of data and address
The C6414 device does not support the PCI peripheral; therefore, the HPI peripheral pins
are stand alone peripheral functions, not MUXed.
PCI command/byte enable 0 (I/O/Z). When PCI is disabled (PCI_EN = 0), this pin is
tied–off. For the C6414 device this pin is “Reserved (leave unconnected, do not connect to
power or ground).”
HD2/AD2 (6)
Y4
HD1/AD1 (6)
AA1
HD0/AD0 (6)
AA3
PCBE0
W3
I/O/Z
XSP_CS
AD1
O
IPD
PCI serial interface chip select (O). When PCI is disabled (PCI_EN = 0), this pin is tied–off.
For the C6414 device this pin is “Reserved (leave unconnected, do not connect to power or
ground).”
CLKX2/
XSP_CLK (6)
AC2
I/O/Z
IPD
McBSP2 transmit clock (I/O/Z) [default] or PCI serial interface clock (O).
DR2/XSP_DI (6)
AB3
I
IPU
McBSP2 receive data (I) [default] or PCI serial interface data in (I). In PCI mode, this pin is
connected to the output data pin of the serial PROM.
DX2/XSP_DO (6)
AA2
O/Z
IPU
McBSP2 transmit data (O/Z) [default] or PCI serial interface data out (O). In PCI mode, this
pin is connected to the input data pin of the serial PROM.
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Device Configurations
37
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
TERMINAL
TYPE (1)
www.ti.com
IPD/IPU
DESCRIPTION
(2)
NAME
NO.
GP15/PRST (6)
G3
General–purpose input/output (GPIO) 15 pin (I/O/Z) or PCI reset (I). No function at default.
GP14/PCLK (6)
F2
GPIO 14 pin (I/O/Z) or PCI clock (I). No function at default.
(6)
G4
GP12/PGNT (6)
J3
GP11/PREQ (6)
F1
GPIO 11 pin (I/O/Z) or PCI bus request (O/Z). No function at default.
L2
GPIO 10 pin (I/O/Z) or PCI command/byte enable 3 (I/O/Z). No function at default.
M3
GPIO 9 pin (I/O/Z) or PCI initialization device select (I). No function at default.
GP13/PINTA
GP10/PCBE3
(6)
GP9/PIDSEL (6)
GPIO 13 pin (I/O/Z) or PCI interrupt A (O/Z). No function at default.
I/O/Z
GPIO 12 pin (I/O/Z) or PCI bus grant (I). No function at default.
EMIFA (64-bit) Control Signals Common to All Types of Memory (8) (9)
ACE3
L26
O/Z
IPU
ACE2
K23
O/Z
IPU
ACE1
K24
O/Z
IPU
ACE0
K25
O/Z
IPU
ABE7
T23
O/Z
IPU
ABE6
T24
O/Z
IPU
ABE5
R25
O/Z
IPU
ABE4
R26
O/Z
IPU
ABE3
M25
O/Z
IPU
ABE2
M26
O/Z
IPU
ABE1
L23
O/Z
IPU
ABE0
L24
O/Z
IPU
APDT
M22
O/Z
IPU
EMIFA peripheral data transfer, allows direct transfer between external peripherals
EMIFA memory space enables
• Enabled by bits 28 through 31 of the word address
• Only one pin is asserted during any external data access
EMIFA byte-enable control
• Decoded from the low–order address bits. The number of address bits or byte enables
used depends on the width of external memory.
• Byte-write enables for most types of memory
• Can be directly connected to SDRAM read and write mask signal (SDQM)
EMIFA (64-Bit) — Bus Arbitration
AHOLDA
N22
O
IPU
EMIFA hold-request-acknowledge to the host
AHOLD
V23
I
IPU
EMIFA hold request from the host
ABUSREQ
P22
O
IPU
EMIFA bus request output
EMIFA (64-Bit) — Asynchronous/Synchronous Memory Control
AECLKIN
H25
I
IPD
EMIFA external input clock. The EMIFA input clock (AECLKIN, CPU/4 clock, or CPU/6
clock) is selected at reset via the pullup/pulldown resistors on the BEA[17:16] pins.
AECLKIN is the default for the EMIFA input clock.
AECLKOUT2
J23
O/Z
IPD
EMIFA output clock 2. Programmable to be EMIFA input clock (AECLKIN, CPU/4 clock, or
CPU/6 clock) frequency divided–by–1, –2, or –4.
AECLKOUT1
J26
O/Z
IPD
EMIFA output clock 1 [at EMIFA input clock (AECLKIN, CPU/4 clock, or CPU/6 clock)
frequency].
AARE/ ASDCAS/
ASADS/ASRE
J25
O/Z
IPU
EMIFA asynchronous memory read–enable/SDRAM column–address strobe/programmable
synchronous interface–address strobe or read–enable
• For programmable synchronous interface, the RENEN field in the CE Space Secondary
Control Register (CExSEC) selects between ASADS and ASRE: If RENEN = 0, then
the ASADS/ASRE signal functions as the ASADS signal. If RENEN = 1, then the
ASADS/ASRE signal functions as the ASRE signal.
AAOE/ ASDRAS/
ASOE
J24
O/Z
IPU
EMIFA asynchronous memory output–enable/SDRAM row-address strobe/programmable
synchronous interface output–enable
AAWE/ ASDWE/
ASWE
K26
O/Z
IPU
EMIFA asynchronous memory write-enable/SDRAM write-enable/programmable
synchronous interface write–enable
ASDCKE
L25
O/Z
IPU
EMIFA SDRAM clock-enable (used for self–refresh mode). (EMIFA module only.)
• If SDRAM is not in system, ASDCKE can be used as a general–purpose output.
ASOE3
R22
O/Z
IPU
EMIFA synchronous memory output–enable for ACE3 (for glueless FIFO interface)
AARDY
L22
I
IPU
Asynchronous memory ready input
EMIFA (64–Bit) — Address
(8)
(9)
38
These C64x devices have two EMIFs (64-bit EMIFA and 16-bit EMIFB). The prefix "A" in front of a signal name indicates it is an EMIFA
signal whereas a prefix "B" in front of a signal name indicates it is an EMIFB signal. Throughout the rest of this document, in generic
EMIF areas of discussion, the prefix "A" or "B" may be omitted from the signal name.
To maintain signal integrity for the EMIF signals, serial termination resistors should be inserted into all EMIF output signal lines.
Device Configurations
Submit Documentation Feedback
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
www.ti.com
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
TERMINAL
NAME
NO.
AEA22
T22
AEA21
V24
AEA20
V25
AEA19
V26
AEA18
U23
AEA17
U24
AEA16
U25
AEA15
U26
AEA14
T25
AEA13
T26
AEA12
R23
AEA11
R24
TYPE (1)
IPD/IPU
O/Z
IPD
EMIFA external address (doubleword address)
O/Z
IPD
EMIFA external address (doubleword address)
I/O/Z
IPU
EMIFA external data
DESCRIPTION
(2)
EMIFA (64-Bit) — Address
AEA10
P23
AEA9
P24
AEA8
P26
AEA7
N23
AEA6
N24
AEA5
N26
AEA4
M23
AEA3
M24
EMIFA (64-Bit) — Data
AED63
AF24
AED62
AF23
AED61
AE23
AED60
AE22
AED59
AD22
AED58
AF22
AED57
AD21
AED56
AE21
AED55
AC21
AED54
AF21
AED53
AD20
AED52
AE20
AED51
AC20
AED50
AF20
AED49
AC19
AED48
AD19
AED47
W24
AED46
W23
AED45
Y26
AED44
Y23
AED43
Y25
AED42
Y24
AED41
AA26
AED40
AA23
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Device Configurations
39
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
TERMINAL
NAME
NO.
AED39
AA25
AED38
AA24
AED37
AB26
AED36
AB24
AED35
AB25
AED34
AC25
AED33
AC26
AED32
AD26
AED31
C26
AED30
D26
AED29
D25
AED28
E25
AED27
E24
AED26
E26
AED25
F24
AED24
F25
AED23
F23
AED22
F26
AED21
G24
AED20
G25
AED19
G23
AED18
G26
AED17
H23
AED16
H24
AED15
C19
AED14
D19
AED13
A20
AED12
D20
AED11
B20
AED10
C20
AED9
A21
AED8
D21
AED7
B21
AED6
C21
AED5
A22
AED4
C22
AED3
B22
AED2
B23
AED1
A23
AED0
A24
TYPE (1)
IPD/IPU
I/O/Z
IPU
www.ti.com
DESCRIPTION
(2)
EMIFA external data
EMIFB (16-bit) — Control Signals Common to All Types of Memory
BCE3
A13
O/Z
IPU
BCE2
C12
O/Z
IPU
BCE1
B12
O/Z
IPU
BCE0
A12
O/Z
IPU
40
Device Configurations
EMIFB memory space enables
• Enabled by bits 26 through 31 of the word address
• Only one pin is asserted during any external data access
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SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
TERMINAL
TYPE (1)
IPD/IPU
D13
O/Z
IPU
BBE0
C13
O/Z
IPU
BPDT
E12
O/Z
IPU
EMIFB peripheral data transfer, allows direct transfer between external peripherals
NAME
NO.
BBE1
DESCRIPTION
(2)
EMIFB byte–enable control
• Decoded from the low–order address bits. The number of address bits or byte enables
used depends on the width of external memory.
• Byte–write enables for most types of memory
• Can be directly connected to SDRAM read and write mask signal (SDQM)
EMIFB (16-Bit) — Bus Arbitration
BHOLDA
E13
O
IPU
EMIFB hold–request–acknowledge to the host
BHOLD
B19
I
IPU
EMIFB hold request from the host
BBUSREQ
E14
O
IPU
EMIFB bus request output
EMIFB (16-Bit) — Asynchronous/Synchronous Memory Control
BECLKIN
A11
I
IPD
EMIFB external input clock. The EMIFB input clock (BECLKIN, CPU/4 clock, or CPU/6
clock) is selected at reset via the pullup/pulldown resistors on the BEA[15:14] pins.
BECLKIN is the default for the EMIFB input clock.
BECLKOUT2
D11
O/Z
IPD
EMIFB output clock 2. Programmable to be EMIFB input clock (BECLKIN, CPU/4 clock, or
CPU/6 clock) frequency divided by 1, 2, or 4.
BECLKOUT1
D12
O/Z
IPD
EMIFB output clock 1 [at EMIFB input clock (BECLKIN, CPU/4 clock, or CPU/6 clock)
frequency].
BARE/BSDCAS/
BSADS/BSRE
A10
O/Z
IPU
EMIFB asynchronous memory read–enable/SDRAM column–address strobe/programmable
synchronous interface–address strobe or read–enable
• For programmable synchronous interface, the RENEN field in the CE Space ‘
Secondary Control Register (CExSEC) selects between BSADS and BSRE: If RENEN
= 0, then the BSADS/BSRE signal functions as the BSADS signal. If RENEN = 1, then
the BSADS/BSRE signal functions as the BSRE signal.
BAOE/BSDRAS/
BSOE
B11
O/Z
IPU
EMIFB asynchronous memory output–enable/SDRAM row–address strobe/programmable
synchronous interface output–enable
BAWE/BSDWE/
BSWE
C11
O/Z
IPU
EMIFB asynchronous memory write–enable/SDRAM write–enable/programmable
synchronous interface write–enable
BSOE3
E15
O/Z
IPU
EMIFB synchronous memory output enable for BCE3 (for glueless FIFO interface)
BARDY
E11
I
IPU
EMIFB asynchronous memory ready input
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Device Configurations
41
SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
TERMINAL
NAME
NO.
TYPE (1)
www.ti.com
IPD/IPU
DESCRIPTION
(2)
EMIFB (16-Bit) Address
BEA20
E16
IPU
BEA19
D18
IPU
BEA18
C18
IPD
BEA17
B18
BEA16
A18
BEA15
D17
BEA14
C17
BEA13
B17
BEA12
A17
BEA11
D16
BEA10
C16
BEA9
B16
BEA8
A16
BEA7
D15
BEA6
C15
BEA5
B15
BEA4
A15
BEA3
D14
BEA2
C14
BEA1
A14
42
Device Configurations
EMIFB external address (half–word address) (O/Z)
• Also controls initialization of DSP modes at reset (I) via pullup/pulldown resistors – Device Endian mode
BEA20:
0 – Big Endian 1 - Little Endian (default mode)
I/O/Z
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SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
www.ti.com
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
3 Development Support
TI offers an extensive line of development tools for the TMS320C6000. DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of C6000. DSP-based applications:
• Software Development Tools:
– Code Composer Studio. Integrated Development Environment (IDE) including Editor
– C/C++/Assembly Code Generation, and Debug plus additional development tools
– Scalable, Real-Time Foundation Software (DSP/BIOS.), which provides the basic run-time target
software needed to support any DSP application.
• Hardware Development Tools:
– Extended Development System (XDS.) Emulator (supports C6000. DSP multiprocessor system
debug) EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320C6000. DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For
information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
3.1 Device and Development Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
TMS320. DSP devices and support tools. Each TMS320. DSP family member has one of three prefixes;
TMX, TMP, or TMS. TI recommends two of three possible prefix designators for support tools; TMDX and
TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes
(TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device's electrical
specifications.
TMP
Final silicon die that conforms to the device's electrical specifications but has not completed quality
and reliability verificationf
SM
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped with appropriate disclaimers
describing their limitations and intended uses. Experimental devices (TMX) may not be representative of a
final product and Texas Instruments reserves the right to change or discontinue these products without
notice.
SM devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GLZ), the temperature range (for example, blank is the default commercial
temperature range), and the device speed range in megahertz. Figure 3-1 provides a legend for reading
the complete device name for any SM320C64x. DSP generation member.
SM
32
C 6414
D
GLZ
50
A
PREFIX
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMX= Experimental device, MIL
SMJ = MIL-PRF-38535, QML
SM = Commercial processing
DEVICE FAMILY
3 or 32 or 320 = TMS320
family
ENHANCED PLASTIC INDICATOR
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)†
Blank = 0°C to 90°C, commercial temperature
A
= -40°C to 105 °C, extended temperature ‡
= -55°C to 105°C, e xtended temperature ‡
S
DSP
TECHNOLOGY
C = CMOS
EP
DEVICE SPEED RANGE
50 (500-MHz CPU, 100-MHz EMIF)
PACKAGE TYPE §
GLZ = 532-pin plastic BGA
REV LETTER
DEVICE¶
C64x DSP:
6414,
6415,
6416
†
See the Recommended Operating Conditions section of this data sheet for more details.
The extended temperature “A or S version” devices may have different operating conditions than the commercial temperature devices.
See the Recommended Operating Conditions section of this data sheet for more details.
§ BGA = Ball Grid Array
‡
¶
Figure 3-1. TMS320C64xE DSP Device Nomenclature (Including C6414, C6415, and C6416 Devices)
3.1.1
Documentation Support
Extensive documentation supports all TMS320 DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data
sheets, such as this document, with design specifications; complete user's reference guides for all devices
and tools; technical briefs; development-support tools; on-line help; and hardware and software
applications. The following is a brief, descriptive list of support documentation specific to the C6000 DSP
devices.
The TMS320C6000 CPU and Instruction Set Reference Guide (SPRU189) describes the C6000E DSP
CPU (core) architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 Peripherals Reference Guide (SPRU190) describes the functionality of the peripherals
available on the C6000E DSP platform of devices, such as the 64-/32-/16-bit external memory interfaces
(EMIFs), direct-memory-access (DMA), enhanced direct-memory-access (EDMA) controller, multichannel
buffered serial ports (McBSPs), an 8-bit Universal Test and Operations PHY Interface for ATM Slave
(UTOPIA Slave) port, 32-/16-bit host-port interfaces (HPIs), a peripheral component interconnect (PCI),
expansion bus (XB), peripheral component interconnect (PCI), clocking and phase-locked loop (PLL);
general-purpose timers, general-purpose input/output (GPIO) port, and power-down modes. This guide
also includes information on internal data and program memories.
The TMS320C6000 Technical Brief (SPRU197) gives an introduction to the TMS320C62xE/
TMS320C67xE devices, associated development tools, and third-party support.
44
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The TMS320C64x Technical Overview (SPRU395) gives an introduction to the C64xE digital signal
processor, and discusses the application areas that are enhanced by the C64xE DSP VelociTI.2E VLIW
architecture.
The TMS320C6414, TMS320C6415, and TMS320C6416 Digital Signal Processors Silicon Errata
(SPRZ011) describes the known exceptions to the functional specifications for the TMS320C6414,
TMS320C6415, and TMS320C6416 devices
The tools support documentation is electronically available within the Code Composer StudioE Integrated
Development Environment (IDE). For a complete listing of C6000E DSP latest documentation, visit the
Texas Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL).
See the worldwide web URL for the How to Begin Development Today With the TMS320C6414,
TMS320C6415, and TMS320C6416 DSPs application report (SPRA718), which describes in more details
the compatibility and similarities/differences among the C6414, C6415, C6416, and C6211 devices.
3.1.2
Clock PLL
Most of the internal C64x DSP clocks are generated from a single source through the CLKIN pin. This
source clock either drives the PLL, which multiplies the source clock frequency to generate the internal
CPU clock, or bypasses the PLL to become the internal CPU clock.
To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed.
Figure 5 shows the external PLL circuitry for either x1 (PLL bypass) or other PLL multiply modes.
To minimize the clock jitter, a single clean power supply should power both the C64x DSP device and the
external clock oscillator circuit. The minimum CLKIN rise and fall times should also be observed. For the
input clock timing requirements, see the input and output clocks electrical section.
Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock
source must meet the DSP requirements in this data sheet (see the electrical characteristics over
recommended ranges of supply voltage and operating case temperature table and the input and output
clocks electrical section). Table 3-1 lists some examples of compatible CLKIN external clock sources.
Table 3-1. Compatible CLKIN External Clock Sources
COMPATIBLE PARTS FOR
EXTERNAL CLOCK SOURCES (CLKIN)
Oscillators
PLL
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PART NUMBER
MANUFACTURER
JITO-2
Fox Electronix
STA series, ST4100 series
SaRonix Corporation
SG-636
Epson America
342
Corning Frequency Control
ICS525-02
Integrated Circuit Systems
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3.3 V
CPU Clock
EMI
filter
C1
C2
10 µF
0.1 µF
/2
Peripheral Bus
/8
Timer Internal Clock
/4
CLKOUT4,
McBSP Internal Clock
/6
CLKOUT6
PLLV
CLKMODE0
CLKMODE1
PLLMULT
PLL
x6, x12
PLLCLK
CLKIN
ECLKIN_SEL (DEVCFG.[17,16]
and DEVCFG.[15,14])
00 01 10
1
0
/4
/2
ECLKIN
(For the PLL Options, CLKMODE Pins Setup, and
PLL Clock Frequency Ranges, see NO TAG.)
EK2RATE
(GBLCTL.[19,18])
EMIF
00 01 10
ECLKOUT1
ECLKOUT2
Internal to C64x
A.
Place all PLL external components (C1, C2, and the EMI filter) as close to the C6000 DSP device as possible. For the
best performance, TI recommends that all the PLL external components be on a single side of the board without
jumpers, switches, or components other than the ones shown.
B.
For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (C1, C2,
and the EMI Filter).
C.
The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
D.
EMI filter manufacturer TDK part number ACF451832-333, -223, -153, -103. Panasonic part number EXCCET103U.
Figure 3-2. External PLL Circuitry for Either PLL Multiply Modes or x1 (Bypass) Mode
Table 3-2. SM320C64x PLL Multiply Factor Options, Clock Frequency Ranges, and Typical Lock Time (1)
(2)
GLZ PACKAGE-23 × 23-mm BGA
CLKMODE1
CLKMODE0
CLKMODE
(PLL MULTIPLY
FACTORS)
0
0
Bypass (x1)
30–75
0
1
x6
30–75
1
0
x12
30–60
1
1
Reserved
–
(1)
(2)
(3)
46
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE (MHz)
CLKOUT4
RANGE
(MHz)
CLKOUT6
RANGE
(MHz)
TYPICAL LOCK
TIME (ms) (3)
30–75
7.5–18.8
5–12.5
N/A
180–450
45–112.5
30–75
75
360–720
90–180
60–120
–
–
–
–
These clock frequency range values are applicable to a 600-MHz CPU, 133-MHz EMIFA speed device. For a 500-MHz CPU, 100-MHz
EMIF, and 700-MHz CPU, 100 MHz EMIF device speed values, see the CLKIN timing requirements table for the specific device speed.
Use external pullup resistors on the CLKMODE pins (CLKMODE1 and CLKMODE0) to set the C64x device to one of the valid PLL
multiply clock
Under some operating conditions, the maximum PLL lock time may vary by as much as 150% from the specified typical value. For
example, if the typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
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3.1.3
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
Power-Supply Sequencing
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time (>1
second) if the other supply is below the proper operating voltage.
3.1.4
Power-Supply Design Considerations
A dual-power supply with simultaneous sequencing can be used to eliminate the delay between core and
I/O power up. A Schottky diode can also be used to tie the core rail to the I/O rail (see Figure 3-3).
I/O Supply
DVDD
Schottky
Diode
C6000
DSP
Core Supply
CVDD
VSS
GND
Figure 3-3. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000 platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
3.1.5
Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps, 30 for
the core supply and 30 for the I/O supply. These caps need to be close to the DSP, no more than 1.25-cm
maximum distance to be effective. Physically smaller caps are better, such as 0402, but need to be
evaluated from a yield/manufacturing point of view. Parasitic inductance limits the effectiveness of the
decoupling capacitors, therefore physically smaller capacitors should be used while maintaining the largest
available capacitance value. As with the selection of any component, verification of capacitor availability
over the product's production lifetime should be considered.
3.1.6
IEEE 1149.1 JTAG Compatibility Statement
The TMS320C6414/15/16 DSP requires that both TRST and RESET be asserted upon power up to be
properly initialized. While RESET initializes the DSP core, TRST initializes the DSP emulation logic. Both
resets are required for proper operation.
While both TRST and RESET should be asserted upon power up, only RESET should be released for the
DSP to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG port
interface and DSP emulation logic in the reset state.
TRST only should be released when it is necessary to use a JTAG controller to debug the DSP or
exercise the DSP boundary scan functionality.
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For maximum reliability, the TMS320C6414/15/16 DSP includes an internal pulldown (IPD) on the TRST
pin to ensure that TRST is always be asserted upon power up and the DSP internal emulation logic is
always properly initialized.
JTAG controllers from TI actively drive TRST high. However, some third-party JTAG controllers may not
drive TRST high, but expect the use of a pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the DSP after power up and externally
drive TRST high before attempting any emulation or boundary-scan operations. Following the release of
RESET, the low-to-high transition of TRST must be seen to latch the state of EMU1 and EMU0. The
EMU[1:0] pins configure the device for either boundary scan mode or emulation mode. For more detailed
information, see the terminal functions section of this data sheet.
3.1.7
EMIF Device Speed
The rated EMIF speed (referring to both EMIFA and EMIFB) of these devices only applies to the SDRAM
interface when in a system that meets the following requirements:
• One bank (maximum of 2 chips) of SDRAM connected to EMIF
• Up to one bank of buffers connected to EMIF
• EMIF trace lengths between 1 inch and 3 inches
• 183-MHz SDRAM for 133-MHz operation (applies only to EMIFA)
• 143-MHz SDRAM for 100-MHz operation
Other configurations may be possible, but timing analysis must be done to verify all ac timings are met.
Verification of ac timings is mandatory when using configurations other than those specified. TI
recommends utilizing I/O buffer information specification (IBIS) to analyze all ac timings.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS
Models for Timing Analysis application report (SPRA839).
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines
(see the Terminal Functions table for the EMIF output signals).
3.1.8
Boot Mode
The C6414/15/16 device resets using the active-low signal RESET. While RESET is low, the device is
held in reset and is initialized to the prescribed reset state. Refer to reset timing for reset timing
characteristics and states of device pins during reset. The release of RESET starts the processor running
with the prescribed device configuration and boot mode.
The C6414/C6415/C6416 has three types of boot modes:
• Host boot
If host boot is selected, upon release of RESET, the CPU is internally "stalled", while the remainder of
the device is released. During this period, an external host can initialize the CPU memory space as
necessary through the host interface, including internal configuration registers, such as those that
control the EMIF or other peripherals. For the C6414 device, the HPI peripheral is used for host boot.
For the C6415/C6416 device, the HPI peripheral is used for host boot if PCI_EN = 0, and the PCI
peripheral is used for host boot if PCI_EN = 1. Once the host is finished with all necessary initialization,
it must set the DSPINT bit in the HPIC register to complete the boot process. This transition causes
the boot configuration logic to bring the CPU out of the "stalled" state. The CPU then begins execution
from address 0. The DSPINT condition is not latched by the CPU, because it occurs while the CPU is
still internally "stalled". Also, DSPINT brings the CPU out of the "stalled" state only if the host boot
process is selected. All memory may be written to and read by the host. This allows for the host to
verify what it sends to the DSP if required. After the CPU is out of the "stalled" state, the CPU needs to
clear the DSPINT, otherwise, no more DSPINTs can be received.
• EMIF boot (using default ROM timings)
Upon the release of RESET, the 1K-Byte ROM code located in the beginning of CE1 is copied to
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address 0 by the EDMA using the default ROM timings, while the CPU is internally "stalled". The data
should be stored in the endian format that the system is using. In this case, the EMIF automatically
assembles consecutive 8-bit bytes to form the 32-bit instruction words to be copied. The transfer is
automatically done by the EDMA as a single-frame block transfer from the ROM to address 0. After
completion of the block transfer, the CPU is released from the "stalled" state and starts running from
address 0.
No boot
With no boot, the CPU begins direct execution from the memory located at address 0. If SDRAM is
used in the system, the CPU is internally "stalled" until the SDRAM initialization is complete. Note:
operation is undefined if invalid code is located at address 0.
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4 Electrical Specifications
4.1
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
Supply voltage ranges
VI
Input voltage ranges
VIP
VO
Output voltage ranges
VOP
TC
Tstg
(1)
(2)
(1)
VALUE
UNIT
–0.3 to 1.8
V
–0.3 to 4
V
–0.3 to 4
V
–0.5 to DVDD + 0.5
V
–0.3 V to 4
V
CVDD (2)
DVDD
(2)
Except PCI
PCI (C6415 and C6416 only)
Except PCI
PCI (C6415 and C6416 only)
–0.5 to DVDD + 0.5
V
Operating case temperature ranges (A version) [C6414/15/16-EP]
–40 to 105
°C
Operating case temperature ranges (S version) [C6415-EP]
–55 to 105
Storage temperature range
–65 to 150
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
4.2
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
CVDD
Supply voltage, Core (-50xEP device) (1)
1.19
1.25
1.31
V
DVDD
Supply voltage, I/O
3.14
3.3
3.46
V
VSS
Supply ground
0
0
0
V
VIH
High-level input voltage (except PCI)
2
VIL
Low-level input voltage (except PCI)
VIP
Input voltage (PCI) (C6415 and C6416 only)
VIHP
High-level input voltage (PCI) (C6415 and C6416 only)
VILP
Low-level input voltage (PCI) (C6415 and C6416 only)
TC
(1)
V
0.8
V
–0.5
DVDD + 0.5
V
0.5DVDD
DVDD + 0.5
V
–0.5
0.3DVDD
V
Operating case temperature (A version)
–40
105
°C
Operating case temperature (S version)
–55
105
°C
Future variants of the C641x DSPs may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system
power/performance options. TI highly recommends that users design a supply that can handle multiple voltages within this range (i.e.,
1.2 V, 1.25 V, 1.3 V, 1.35 V, 1.4 V with ±3% tolerances) by implementing simple board changes, such as reference resistor values or
input pin configuration modifications. Examples of such supplies include the PT4660, PT5500, PT5520, PT6440, and PT6930 series
from Power Trends, a subsidiary of TI. Not incorporating a flexible supply may limit the system's ability to easily adapt to future versions
of C641x devices.
4.3
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage (except PCI)
DVDD = MIN, IOH = MAX
VOHP
High-level output voltage (PCI)
(C6415/C6416 only)
IOHP = -0.5 mA, DVDD = 3.3 V
VOL
Low-level output voltage (except PCI)
DVDD = MIN, IOL = MAX
VOLP
Low-level output voltage (PCI)
(C6415/C6416 only)
IOLP = 1.5 mA, DVDD = 3.3 V
(1)
50
MIN
TYP
MAX
UNIT
2.4
V
0.9DVDD (1)
V
0.4
V
0.9DVDD (1)
V
These rated numbers are from the PCI specification version 2.3. The dc specification and ac specification are defined in Tables 4-3 and
4-4, respectively.
Electrical Specifications
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ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
VI = VSS to DVDD no opposing internal
resistor
II
Input current (except PCI)
Input leakage current (PCI)
(C6415/C6416 only) (3)
IIP
IOH
High-level output current
Low-level output current
VI = VSS to DVDD opposing internal
pullup resistor (A-Temp) (2)
50
100
150
VI = VSS to DVDD opposing internal
pullup resistor (S-Temp) (2)
50
100
160
VI = VSS to DVDD opposing internal
pulldown resistor (A-Temp) (2)
–150
–100
–50
VI = VSS to DVDD opposing internal
pulldown resistor (S-Temp) (2)
–160
–100
–50
0 < VIP < DVDD = 3.3 V
±50
EMIF, CLKOUT4, CLKOUT6, EMUx
–16
Timer, UTOPIA, TDO, GPIO (excluding
GP[15:9, 2, 1]), McBSP
–8
PCI/HPI
(1)
–0.5
Off-state output current
ICDD
Core supply current (4)
µA
µA
mA
16
Timer, UTOPIA, TDO, GPIO (excluding
GP[15:9, 2, 1]), McBSP
8
PCI/HPI
IOZ
UNIT
±10
EMIF, CLKOUT4, CLKOUT6, EMUx
IOL
MAX
1.5
±10
VO = DVDD or 0 V
mA
(1)
µA
(5)
CVDD = 1.4 V, CPU clock = 720 MHz
900
CVDD = 1.4 V, CPU clock = 600 MHz
750 (5)
CVDD = 1.2 V, CPU clock = 500 MHz
550
DVDD = 3.3 V, CPU clock = 600 MHz
125 (5)
mA
IDDD
I/O supply current (4)
Ci
Input capacitance
10
pF
Co
Output capacitance
10
pF
(2)
(3)
(4)
(5)
mA
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
PCI input leakage currents include Hi-Z output leakage for all bidirectional buffers with 3-state outputs.
Measured with average activity (50% high/50% low power). The actual current draw is highly application-dependent. For more details on
core and I/O activity, refer to the TMS320C6414/15/16 Power Consumption Summary application report (SPRA811).
Advance information
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5 PARAMETER MEASUREMENT INFORMATION
The load capacitance value stated is only for characterization and measurement of ac timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
Output
Under
Test
2 pF
Figure 5-1. AC Timing Reference Circuit for AC Timing Measurements
5.1 Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both 0 and 1 logic levels.
Vref = 1.5 V
Figure 5-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOL
MAX and VOH MIN for output clocks, VILP MAX and VIHP MIN for PCI input clocks, and VOLP MAX and
VOHP MIN for PCI output clocks.
Vref = VIH MIN (or VOH MIN or
VIHP MIN or VOHP MIN)
Vref = VIL MAX (or VOL MAX or
VILP MAX or VOLP MAX)
Figure 5-3. Rise and Fall Transition Time Voltage Reference Levels
5.2 Signal Transition Rates
All timings are tested with an input edge rate of 4 V per nanosecond (4 V/ns).
5.3 Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routing. As a good
board design practice, such delays must always be taken into account. Timing values may be adjusted by
increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information
specification (IBIS) models to analyze the timing characteristics correctly. If needed, external logic
hardware such as buffers may be used to compensate any timing differences.
52
PARAMETER MEASUREMENT INFORMATION
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For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external
device and from the external device to the DSP. This round-trip delay tends to negatively impact the input
setup time margin, but also tends to improve the input hold time margins (see Table 5-1 and Figure 5-4).
Figure 5-4 represents a general transfer between the DSP and an external device. The figure also
represents board route delays and how they are perceived by the DSP and the external device.
Table 5-1. Board-Level Timing (see Figure 5-4)
NO.
DESCRIPTION
1
Clock route delay
2
Minimum DSP hold time
3
Minimum DSP setup time
4
External device hold time requirement
5
External device setup time requirement
6
Control signal route delay
7
External device hold time
8
External device access time
9
DSP hold time requirement
10
DSP setup time requirement
11
Data route delay
ECLKOUTx
(Output from DSP)
1
ECLKOUTx
(Input to External Device)
Signals†
Control
(Output from DSP)
2
3
4
5
Control Signals
(Input to External Device)
6
7
Data Signals‡
(Output from External Device)
8
10
Data Signals‡
(Input to DSP)
9
11
Figure 5-4. Board-Level Input/Output Timing
5.1 INPUT AND OUTPUT CLOCKS
5.1.1
Timing Requirements for CLKIN for –50xEP Devices (1)
NO.
(1)
(2)
(3)
(see Figure 5-5)
–50xEP
PLL MODE x12
1
(2) (3)
tc(CLKIN)
Cycle time, CLKIN
UNIT
PLL MODE x6
x1 (BYPASS)
MIN
MAX
MIN
MAX
MIN
MAX
24
33.3
13.3
33.3
13.3
33.3
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
For more details on the PLL multiplier factors (x6, x12), see the Clock PLL section of this data manual.
C = CLKIN cycle time in ns. For example, when CLKIN frequency is 50 MHz, use C = 20 ns.
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
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NO.
–50xEP
PLL MODE x12
MIN
2
tw(CLKINH)
Pulse duration, CLKIN high
0.4C
3
tw(CLKINL)
Pulse duration, CLKIN low
0.4C
4
tt(CLKIN)
Transition time, CLKIN
5
tJ(CLKIN)
Peak-to-peak jitter, CLKIN
UNIT
PLL MODE x6
MAX
MIN
x1 (BYPASS)
MAX
MIN
0.4C
MAX
0.45C
0.4C
ns
0.45C
ns
5
5
1
ns
0.02C
0.02C
0.02C
ns
1
5
4
2
CLKIN
3
4
Figure 5-5. CLKIN Timing
–50xEP
NO.
PARAMETER
CLKMODE = x1, x6, x12
MIN
UNIT
MAX
1
tJ(CKO4)
Cycle-to-cycle jitter, CLKOUT4
0
±175
ns
2
tw(CKO4H)
Pulse duration, CLKOUT4 high
2P – 0.7
2P + 0.7
ns
3
tw(CKO4L)
Pulse duration, CLKOUT4 low
2P – 0.7
2P + 0.7
ns
4
tt(CKO4)
Transition time, CLKOUT4
1
ns
1
4
2
CLKOUT4
3
4
Figure 5-6. CLKOUT4 Timing
–50xEP
NO.
CLKMODE = x1, x6,
x12
PARAMETER
MIN
UNIT
MAX
1
tJ(CKO6)
Cycle-to-cycle jitter, CLKOUT6
0
±175
ns
2
tw(CKO6H)
Pulse duration, CLKOUT6 high
3P – 0.7
3P + 0.7
ns
3
tw(CKO6L)
Pulse duration, CLKOUT6 low
3P – 0.7
3P + 0.7
ns
4
tt(CKO6)
Transition time, CLKOUT6
1
ns
1
4
2
CLKOUT6
3
4
Figure 5-7. CLKOUT6 Timing
54
PARAMETER MEASUREMENT INFORMATION
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5.1.4 Timing Requirements ECLKIN for EMIFA and EMIFB
NO.
(1)
(2)
(3)
(4)
(1) (2) (3)
(see Figure 5-8)
–50xEP
PARAMETER
MIN
MAX
16P
1
tc(EKI)
Cycle time, ECLKIN
6 (4)
2
tw(EKIH)
Pulse duration, ECLKIN high
2.7
3
tw(EKIL)
Pulse duration, ECLKIN low
2.7
4
tt(EKI)
Transition time, ECLKIN
5
tJ(EKI)
Peak-to-Peak jitter, ECLKIN
UNIT
ns
ns
ns
2
ns
0.02E
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
These C64xE devices have two EMIFs (64-bit EMIFA and 16-bit EMIFB). All EMIFA signals are prefixed by an A and all EMIFB signals
are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or B may be omitted.
Minimum ECLKIN times are based on internal logic speed; the maximum useable speed of the EMIF may be lower due to ac timing
requirements. On the 7E3 and 6E3 devices, 133-MHz operation is achievable if the requirements of the EMIF Device Speed section are
met. On the 5E0 devices, 100-MHz operation is achievable if the requirements of the EMIF Device Speed section are met.
1
5
4
2
ECLKIN
3
4
Figure 5-8. ECLKIN Timing for EMIFA and EMIFB
NO.
(1)
–50xEP
PARAMETER
MIN
MAX
UNIT
1
tJ(EKO1)
Cycle-to-cycle jitter, ECLKOUT1
0
±175 (1)
ns
2
tw(EKO1H)
Pulse duration, ECLKOUT1 high
ER – 0.7
EH + 0.7
ns
3
tw(EKO1L)
Pulse duration, ECLKOUT1 low
EL – 0.7
EL + 0.7
ns
4
tt(EKO1)
Transition time, ECLKOUT1
1
ns
5
td(EKIH-EKO1H)
Delay time, ECLKIN high to ECLKOUT1 high
1
8
ns
6
td(EKIL-EKO1L)
Delay time, ECLKIN low to ECLKOUT1 low
1
8
ns
This cycle-to-cycle jitter specification was measured with CPU/4 or CPU/6 as the source of the EMIF input clock.
ECLKIN
1
6
5
3
4
2
4
ECLKOUT1
Figure 5-9. ECLKOUT1 Timing for EMIFA and EMIFB Modules
NO.
(1)
PARAMETER
–50xEP
MIN
MAX
UNIT
1
tJ(EKO2)
Cycle-to-cycle jitter, ECLKOUT2
0
±175 (1)
ns
2
tw(EKO2H)
Pulse duration, ECLKOUT2 high
05NE – 0.7
05NE + 0.7
ns
3
tw(EKO2L)
Pulse duration, ECLKOUT2 low
05NE – 0.7
05NE + 0.7
ns
4
tt(EKO2)
Transition time, ECLKOUT2
1
ns
5
td(EKIH-EKO2H)
Delay time, ECLKIN high to ECLKOUT2 high
1
8
ns
6
td(EKIL-EKO2L)
Delay time, ECLKIN low to ECLKOUT2 low
1
8
ns
This cycle-to-cycle jitter specification was measured with CPU/4 or CPU/6 as the source of the EMIF input clock.
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
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5
6
ECLKIN
1
3
4
2
4
ECLKOUT2
Figure 5-10. ECLKOUT2 Timing for EMIFA and EMIFB Modules
5.2 ASYNCHRONOUS MEMORY TIMING
5.2.1 Timing Requirements for Asynchronous Memory Cycles for EMIFA Module
(see Figure 5-11 and Figure 5-12)
NO.
(1)
(2)
(3)
PARAMETER
–50xEP
MIN
tsu(EDV-AREH)
Setup time, EDx valid before ARE high
6.5
ns
4
th(AREH-EDV)
Hold time, EDx valid after ARE high
1
ns
6
tsu(ARDY-EKO1H)
Setup time, ARDY valid before ECLKOUT1 high
3
ns
7
th(EKO1H-ARDY)
Hold time, ARDY valid after ECLKOUT1 high
1.5
ns
To ensure data setup time, program the strobe width wide enough. ARDY is internally synchronized. The ARDY is recognized in the
cycle for which the setup and hold time is met. To use ARDY as an asynchronous input, the pulse width of ARDY signal should be wide
enough (e.g., pulse width = 2E) to ensure setup and hold time is met.o
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIF CE space control registers.
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB signals are prefixed by
a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or B may be omitted [e.g., the
asynchronous memory access signals are shown as generic (AOE, ARE, and AWE) instead of AAOE, AARE, and AAWE (for EMIFA)
and BAOE, BARE, and BAWE (for EMIFB)].
PARAMETER
–50xEP
MIN
1
tosu(SELV-AREL)
Output setup time, select signals valid to ARE low
RS × E-1.5
2
toh(AREH-SELIV)
Output hold time, ARE high to select signals invalid
RH × E-1.9
5
td(EKO1H-AREV)
Delay time, ECLKOUT1 high to ARE valid
8
tosu(SELV-AWEL)
Output setup time, select signals valid to AWE low
WS × E-1.7
9
toh(AWEH-SELIV)
Output hold time, AWE high to select signals invalid
WH × E-1.8
10
td(EKO1H-AWEV)
Delay time, ECLKOUT1 high to AWE valid
NO.
(3)
56
PARAMETER
3
tsu(EDV-AREH)
Setup time, EDx valid before ARE high
4
th(AREH-EDV)
Hold time, EDx valid after ARE high
MAX
1.3
ns
7
ns
ns
ns
7.1
ns
(1) (2) (3)
–50xEP
MIN
UNIT
ns
1
5.2.3 Timing Requirements for Asynchronous Memory Cycles for EMIFB Module
(see Figure 5-11 and Figure 5-12)
(2)
UNIT
MAX
3
NO.
(1)
(1) (2) (3)
MAX
UNIT
6.2
ns
1
ns
To ensure data setup time, program the strobe width wide enough. ARDY is internally synchronized. The ARDY is recognized in the
cycle for which the setup and hold time is met. To use ARDY as an asynchronous input, the pulse width of ARDY signal should be wide
enough (e.g., pulse width = 2E) to ensure setup and hold time is met.o
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIF CE space control registers.
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB signals are prefixed by
a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or B may be omitted [e.g., the
asynchronous memory access signals are shown as generic (AOE, ARE, and AWE) instead of AAOE, AARE, and AAWE (for EMIFA)
and BAOE, BARE, and BAWE (for EMIFB)].
PARAMETER MEASUREMENT INFORMATION
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NO.
–50xEP
PARAMETER
MIN
6
tsu(ARDY-EKO1H)
Setup time, ARDY valid before ECLKOUT1 high
7
th(EKO1H-ARDY)
Hold time, ARDY valid after ECLKOUT1 high
NO.
3
ns
1.7
ns
–50xEP
PARAMETER
MIN
1
tosu(SELV-AREL)
Output setup time, select signals valid to ARE low
RS × E-1.6
2
toh(AREH-SELIV)
Output hold time, ARE high to select signals invalid
RH × E-1.7
5
td(EKO1H-AREV)
Delay time, ECLKOUT1 high to ARE valid
8
tosu(SELV-AWEL)
Output setup time, select signals valid to AWE low
WS × E-1.9
9
toh(AWEH-SELIV)
Output hold time, AWE high to select signals invalid
WH × E-1.7
10
td(EKO1H-AWEV)
Delay time, ECLKOUT1 high to AWE valid
Setup = 2
UNIT
MAX
0.8
0.9
Strobe = 3
Not Ready
MAX
UNIT
ns
ns
6.6
ns
ns
ns
6.7
ns
Hold = 2
ECLKOUT1
1
2
1
2
CEx
BE
ABE[7:0] or BBE[1:0]
2
1
AEA[22:3] or BEA[20:1]
Address
3
4
AED[63:0] or BED[15:0]
1
2
Read Data
AOE/SDRAS/SOE‡
5
5
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
7
7
6
6
ARDY
NOTE: These C64xE devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the asynchronous memory access signals are shown as generic (AOE, ARE, and AWE)
instead of AAOE, AARE, and AAWE (for EMIFA) and BAOE, BARE, and BAWE (for EMIFB)].
A.
AOE/SDRAS/SOE, ARE/SDCAS/SADS/SRE, and AWE/SDWE/SWE operate as AOE (identified under select signals),
ARE, and AWE, respectively, during asynchronous memory accesses.
Figure 5-11. Asynchronous Memory Read Timing for EMIFA and EMIFB (see NOTE NoLabel )
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Setup = 2
Strobe = 3
Hold = 2
Not Ready
ECLKOUT1
9
8
CEx
9
8
BE
ABE[7:0] or BBE[1:0]
9
8
AEA[22:3] or BEA[20:1]
Address
9
8
AED[63:0] or BED[15:0]
Write Data
AOE/SDRAS/SOE‡
ARE/SDCAS/SADS/SRE‡
10
10
AWE/SDWE/SWE‡
7
6
7
6
ARDY
NOTE: These C64xE devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the asynchronous memory access signals are shown as generic (AOE, ARE, and AWE)
instead of AAOE, AARE, and AAWE (for EMIFA) and BAOE, BARE, and BAWE (for EMIFB)].
A.
AOE/SDRAS/SOE, ARE/SDCAS/SADS/SRE, and AWE/SDWE/SWE operate as AOE (identified under select signals),
ARE, and AWE, respectively, during asynchronous memory accesses.
Figure 5-12. Asynchronous Memory Write Timing for EMIFA and EMIFB (see NOTE
(A)
)
5.3 PROGRAMMABLE SYNCHRONOUS INTERFACE TIMING
5.3.1 Timing Requirements for Programmable Synchronous Interface Cycles for EMIFA
Module (1) (see Figure 5-13)
NO.
(1)
PARAMETER
MAX
UNIT
6
tsu(EDV-EKOxH)
Setup time, read EDx valid before ECLKOUTx high
3.1
ns
7
th(EKOxH-EDV)
Hold time, read EDx valid after ECLKOUTx high
1.5
ns
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB signals are prefixed by
a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or B may be omitted [e.g., the
programmable synchronous interface access signals are shown as generic (SADS/SRE, SOE, and SWE) instead of ASADS/ASRE,
ASOE, and ASWE (for EMIFA) and BSADS/BSRE, BSOE, and BSWE (for EMIFB)].
NO.
58
–50xEP
MIN
PARAMETER
1
td(EKOxH-CEV)
Delay time, ECLKOUTx high to CEx valid
2
td(EKOxH-BEV)
Delay time, ECLKOUTx high to BEx valid
3
td(EKOxH-BEIV)
Delay time, ECLKOUTx high to BEx invalidE
4
td(EKOxH-EAV)
Delay time, ECLKOUTx high to EAx valid
5
td(EKOxH-EAIV)
Delay time, ECLKOUTx high to EAx invalid
PARAMETER MEASUREMENT INFORMATION
–50xEP
UNIT
MIN
MAX
1.3
6.4
ns
6.4
ns
1.3
ns
6.4
1.3
ns
ns
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NO.
PARAMETER
–50xEP
MIN
MAX
UNIT
8
td(EKOxH-ADSV)
Delay time, ECLKOUTx high to SADS/SRE valid
1.3
6.4
ns
9
td(EKOxH-OEV)
Delay time, ECLKOUTx high to, SOE validE
1.3
6.4
ns
10
td(EKOxH-EDV)
Delay time, ECLKOUTx high to EDx valid
6.4
ns
11
td(EKOxH-EDIV)
Delay time, ECLKOUTx high to EDx invalidE
1.3
12
td(EKOxH-WEV)
Delay time, ECLKOUTx high to SWE valid
1.3
ns
6.4
ns
5.3.3 Timing Requirements for Programmable Synchronous Interface Cycles for EMIFB
Module (1) (see Figure 5-13)
NO.
(1)
PARAMETER
–50xEP
MIN
MAX
UNIT
6
tsu(EDV-EKOxH)
Setup time, read EDx valid before ECLKOUTx high
3.1
ns
7
th(EKOxH-EDV)
Hold time, read EDx valid after ECLKOUTx high
1.5
ns
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB signals are prefixed by
a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or B may be omitted [e.g., the
programmable synchronous interface access signals are shown as generic (SADS/SRE, SOE, and SWE) instead of ASADS/ASRE,
ASOE, and ASWE (for EMIFA) and BSADS/BSRE, BSOE, and BSWE (for EMIFB)].
NO.
PARAMETER
–50xEP
UNIT
MIN
MAX
1.3
6.4
ns
6.4
ns
1
td(EKOxH-CEV)
Delay time, ECLKOUTx high to CEx valid
2
td(EKOxH-BEV)
Delay time, ECLKOUTx high to BEx valid
3
td(EKOxH-BEIV)
Delay time, ECLKOUTx high to BEx invalidE
4
td(EKOxH-EAV)
Delay time, ECLKOUTx high to EAx valid
5
td(EKOxH-EAIV)
Delay time, ECLKOUTx high to EAx invalid
1.3
8
td(EKOxH-ADSV)
Delay time, ECLKOUTx high to SADS/SRE valid
1.3
6.4
ns
9
td(EKOxH-OEV)
Delay time, ECLKOUTx high to, SOE validE
1.3
6.4
ns
10
td(EKOxH-EDV)
Delay time, ECLKOUTx high to EDx valid
6.4
ns
11
td(EKOxH-EDIV)
Delay time, ECLKOUTx high to EDx invalidE
1.3
12
td(EKOxH-WEV)
Delay time, ECLKOUTx high to SWE valid
1.3
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1.3
ns
6.4
ns
ns
ns
6.4
PARAMETER MEASUREMENT INFORMATION
ns
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SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
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READ latency = 2
ECLKOUTx
1
1
CEx
ABE[7:0] or BBE[1:0]
2
BE1
3
BE2
BE3
BE4
4
AEA[22:3] or BEA[20:1]
EA1
5
EA3
EA2
6
AED[63:0] or BED[15:0]
EA4
7
Q1
Q2
Q3
Q4
8
8
ARE/SDCAS/SADS/SRE§
9
9
AOE/SDRAS/SOE§
AWE/SDWE/SWE§
A.
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the programmable synchronous interface access signals are shown as generic (SADS/SRE,
SOE, and SWE) instead of ASADS/ASRE, ASOE, and ASWE (for EMIFA) and BSADS/BSRE, BSOE, and BSWE (for
EMIFB)].
B.
The read latency and the length of CEx assertion are programmable via the SYNCRL and CEEXT fields, respectively,
in the EMIFx CE Space Secondary Control register (CExSEC). In this figure, SYNCRL = 2 and CEEXT = 0.
C.
The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):
D.
a.
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency.
b.
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
c.
CEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, CEx goes inactive after the final
command has been issued (CEEXT = 0). For synchronous FIFO interface with glue, CEx is active when SOE is
active (CEEXT = 1).
d.
Function of SADS/SRE (RENEN): For standard SBSRAM or ZBT SRAM interface, SADS/SRE acts as SADS with
deselect cycles (RENEN = 0). For FIFO interface, SADS/SRE acts as SRE with NO deselect cycles (RENEN =
1).
e.
Synchronization clock (SNCCLK): Synchronized to ECLKOUT1 or ECLKOUT2
ARE/SDCAS/SADS/SRE, AOE/SDRAS/SOE and AWE/SDWE/SWE operate as SADS/SRE, SOE, and SWE,
respectively, during programmable synchronous interface accesses.
Figure 5-13. Programmable Synchronous Interface Read Timing for EMIFA and EMIFB (With Read
Latency = 2) (See Notes A, B, C)
60
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ECLKOUTx
1
1
CEx
3
ABE[7:0] or BBE[1:0]
2
BE1
AEA[22:3] or BEA[20:1]
4
EA1
EA2
EA3
EA4
10
Q1
Q2
Q3
Q4
10
AED[63:0] or BED[15:0]
ARE/SDCAS/SADS/SRE¶
BE2
BE3
BE4
5
11
8
8
AOE/SDRAS/SOE¶
12
12
AWE/SDWE/SWE¶
A.
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the programmable synchronous interface access signals are shown as generic (SADS/SRE,
SOE, and SWE) instead of ASADS/ASRE, ASOE, and ASWE (for EMIFA) and BSADS/BSRE, BSOE, and BSWE (for
EMIFB)].
B.
The write latency and the length of CEx assertion are programmable via the SYNCWL and CEEXT fields,
respectively, in the EMIFx CE Space Secondary Control register (CExSEC). In this figure, SYNCWL = 0 and CEEXT
= 0.
C.
The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):
D.
a.
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency.
b.
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
c.
CEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, CEx goes inactive after the final
command has been issued (CEEXT = 0). For synchronous FIFO interface with glue, CEx is active when SOE is
active (CEEXT = 1).
d.
Function of SADS/SRE (RENEN): For standard SBSRAM or ZBT SRAM interface, SADS/SRE acts as SADS with
deselect cycles (RENEN = 0). For FIFO interface, SADS/SRE acts as SRE with NO deselect cycles (RENEN =
1).
e.
Synchronization clock (SNCCLK): Synchronized to ECLKOUT1 or ECLKOUT2
ARE/SDCAS/SADS/SRE, AOE/SDRAS/SOE and AWE/SDWE/SWE operate as SADS/SRE, SOE, and SWE,
respectively, during programmable synchronous interface accesses.
Figure 5-14. Programmable Synchronous Interface Write Timing for EMIFA and EMIFB (With Write
Latency = 0) (See Notes A, B, C)
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Write
Latency =
1‡
ECLKOUTx
1
1
CEx
ABE[7:0] or BBE[1:0]
2
BE1
AEA[22:3] or BEA[20:1]
4
EA1
10
AED[63:0] or BED[15:0]
3
BE2
BE3
BE4
EA2
10
EA3
EA4
Q1
Q2
Q3
5
11
Q4
8
8
ARE/SDCAS/SADS/SRE¶
AOE/SDRAS/SOE¶
12
12
AWE/SDWE/SWE¶
A.
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the programmable synchronous interface access signals are shown as generic (SADS/SRE,
SOE, and SWE) instead of ASADS/ASRE, ASOE, and ASWE (for EMIFA) and BSADS/BSRE, BSOE, and BSWE (for
EMIFB)].
B.
The write latency and the length of CEx assertion are programmable via the SYNCWL and CEEXT fields,
respectively, in the EMIFx CE Space Secondary Control register (CExSEC). In this figure, SYNCWL = 1 and CEEXT
= 0.
C.
The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):
D.
a.
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency.
b.
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
c.
CEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, CEx goes inactive after the final
command has been issued (CEEXT = 0). For synchronous FIFO interface with glue, CEx is active when SOE is
active (CEEXT = 1).
d.
Function of SADS/SRE (RENEN): For standard SBSRAM or ZBT SRAM interface, SADS/SRE acts as SADS with
deselect cycles (RENEN = 0). For FIFO interface, SADS/SRE acts as SRE with NO deselect cycles (RENEN =
1).
e.
Synchronization clock (SNCCLK): Synchronized to ECLKOUT1 or ECLKOUT2
ARE/SDCAS/SADS/SRE, AOE/SDRAS/SOE, and AWE/SDWE/SWE operate as SADS/SRE, SOE, and SWE,
respectively, during programmable synchronous interface accesses.
Figure 5-15. Programmable Synchronous Interface Write Timing for EMIFA and EMIFB (With Write
Latency = 1) See Notes A, B, C)
5.4 SYNCHRONOUS DRAM TIMING
5.4.1 Timing Requirements for Synchronous DRAM Cycles for EMIFA Module (see
Figure 5-16
NO.
62
PARAMETER
–50xEP
MIN
MAX
UNIT
6
tsu(EDV-EKO1H)
Setup time, read EDx valid before ECLKOUT1 high
2.1
ns
7
th(EKO1H-EDV)
Hold time, read EDx valid after ECLKOUT1 high
2.5
ns
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NO.
–50xEP
PARAMETER
UNIT
MIN
MAX
1.3
6.4
ns
6.4
ns
1
td(EKO1H-CEV)
Delay time, ECLKOUT1 high to CEx valid
2
td(EKO1H-BEV)
Delay time, ECLKOUT1 high to BEx valid
3
td(EKO1H-BEIV)
Delay time, ECLKOUT1 high to BEx invalid
4
td(EKO1H-EAV)
Delay time, ECLKOUT1 high to EAx valid
5
td(EKO1H-EAIV)
Delay time, ECLKOUT1 high to EAx invalid
1.3
8
td(EKO1H-CASV)
Delay time, ECLKOUT1 high to SDCAS valid
1.3
9
td(EKO1H-EDV)
Delay time, ECLKOUT1 high to EDx valid
10
td(EKO1H-EDIV)
Delay time, ECLKOUT1 high to EDx invalid
1.3
11
td(EKO1H-WEV)
Delay time, ECLKOUT1 high to SDWE valid
1.3
6.4
ns
12
td(EKO1H-RAS)
Delay time, ECLKOUT1 high to SDRAS valid
1.3
6.4
ns
13
td(EKO1H-ACKEV)
Delay time, ECLKOUT1 high to ASDCKE valid (EMIFA only)
1.3
6.4
ns
14
td(EKO1H-PDTV)
Delay time, ECLKOUT1 high to PDT valid
1.3
6.4
ns
1.3
ns
6.4
ns
ns
6.4
ns
6.4
ns
ns
5.4.3 Timing Requirements for Synchronous DRAM Cycles for EMIFB Module (1)(see
Figure 5-16)
NO.
(1)
–50xEP
PARAMETER
MIN
MAX
UNIT
6
tsu(EDV-EKO1H)
Setup time, read EDx valid before ECLKOUT1 high
2.1
ns
7
th(EKO1H-EDV)
Hold time, read EDx valid after ECLKOUT1 high
2.5
ns
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB signals are prefixed by
a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or B may be omitted [e.g., the synchronous
DRAM memory access signals are shown as generic ( SDCAS, SDWE, and SDRAS ) instead of ASDCAS, ASDWE, and ASDRAS (for
EMIFA) and BSDCAS, BSDWE, and BSDRAS (for EMIFB)].
NO.
–50xEP
PARAMETER
UNIT
MIN
MAX
1.3
6.4
ns
6.4
ns
1
td(EKO1H-CEV)
Delay time, ECLKOUT1 high to CEx valid
2
td(EKO1H-BEV)
Delay time, ECLKOUT1 high to BEx valid
3
td(EKO1H-BEIV)
Delay time, ECLKOUT1 high to BEx invalid
4
td(EKO1H-EAV)
Delay time, ECLKOUT1 high to EAx valid
5
td(EKO1H-EAIV)
Delay time, ECLKOUT1 high to EAx invalid
1.3
8
td(EKO1H-CASV)
Delay time, ECLKOUT1 high to SDCAS valid
1.3
9
td(EKO1H-EDV)
Delay time, ECLKOUT1 high to EDx valid
10
td(EKO1H-EDIV)
Delay time, ECLKOUT1 high to EDx invalidE
1.3
11
td(EKO1H-WEV)
Delay time, ECLKOUT1 high to SDWE valid
1.3
6.4
ns
12
td(EKO1H-RAS)
Delay time, ECLKOUT1 high to SDRAS valid
1.3
6.4
ns
13
td(EKO1H-ACKEV)
Delay time, ECLKOUT1 high to ASDCKE valid (EMIFA only)
1.3
6.4
ns
14
td(EKO1H-PDTV)
Delay time, ECLKOUT1 high to PDT valid
1.3
6.4
ns
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1.3
ns
6.4
ns
ns
6.4
ns
6.4
ns
ns
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
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READ
ECLKOUT1
1
1
CEx
2
ABE[7:0] or BBE[1:0]
AEA[22:14] or BEA[20:12]
AEA[12:3] or BEA[10:1]
BE1
4
Bank
5
4
Column
5
4
3
BE2
BE3
BE4
5
AEA13 or BEA11
6
D1
AED[63:0] or BED[15:0]
7
D2
D3
D4
AOE/SDRAS/SOE‡
8
8
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
14
14
PDT§
NOTE: These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic ( SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
A.
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE and AOE/SDRAS/SOE operate as SDCAS, SDWE, SOE, and SDRAS,
respectively, during SDRAM accesses.
B.
PDT signal is only asserted when the EDMA is in PDT mode (set the PDTS bit to 1 in the EDMA options parameter
RAM). For PDT read, data is not latched into EMIF. The PDTRAL field in the PDT cotnrol register (PDTCTL)
configures the latency of the PDT signal with respect ot the data phase of read transaction. The latency of the PDT
signal for a read can be programmed to 0, 1, 2, or 3 by setting PDTRL to 00, 01, 10, or 11, respectively. PDTRL
equals 00 (zero latency) in Figure 22.
Figure 5-16. SDRAM Read Command (CAS Latency 3) for EMIFA and EMIFB (see Note)
64
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WRITE
ECLKOUT1
1
2
2
4
CEx
ABE[7:0] or BBE[1:0]
BE1
4
3
BE2
BE3
BE4
D2
D3
D4
5
Bank
AEA[22:14] or BEA[20:12]
5
4
Column
AEA[12:3] or BEA[10:1]
4
5
AEA13 or BEA11
9
AED[63:0] or BED[15:0]
9
D1
10
AOE/SDRAS/SOE‡
8
8
11
11
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
14
14
PDT§
NOTE: These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic ( SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
A.
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE and AOE/SDRAS/SOE operate as SDCAS, SDWE, and SDRAS,
respectively, during SDRAM accesses.
B.
PDT signal is only asserted when the EDMA is in PDT mode (set the PDTD bit to 1 in the EDMA options parameter
RAM). For PDT write, data is not driven (in High-Z). The PDTWL field in the PDT control register (PDTCTL)
configures the latency of the PDT signal with respect ot the data phase of write transaction. The latency of the PDT
signal for a write can be programmed to 0, 1, 2, or 3 by setting PDTWL to 00, 01, 10, or 11, respectively. PDTWL
equals 00 (zero latency) in Figure 23.
Figure 5-17. SDRAM Write Command for EMIFA and EMIFB (see Note)
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ACTV
ECLKOUT1
1
1
CEx
ABE[7:0] or BBE[1:0]
4
Bank Activate
5
AEA[22:14] or BEA[20:12]
4
Row Address
5
AEA[12:3] or BEA[10:1]
4
Row Address
5
AEA13 or BEA11
AED[63:0] or BED[15:0]
12
12
AOE/SDRAS/SOE‡
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
NOTE: These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic ( SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
A.
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE and AOE/SDRAS/SOE operate as SDCAS, SDWE, and SDRAS,
respectively, during SDRAM accesses.
Figure 5-18. SDRAM ACTV Command for EMIFA and EMFB (see Note)
66
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DCAB
ECLKOUT1
1
1
4
5
12
12
11
11
CEx
ABE[7:0] or BBE[1:0]
AEA[22:14, 12:3] or BEA[20:12,
10:1]
AEA13 or BEA11
AED[63:0] or BED[15:0]
AOE/SDRAS/SOE‡
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
NOTE: These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic ( SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
A.
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE and AOE/SDRAS/SOE operate as SDCAS, SDWE, and SDRAS,
respectively, during SDRAM accesses.
Figure 5-19. SDRAM DCAB Command for EMIFA and EMIFB (see Note)
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DEAC
ECLKOUT1
1
1
CEx
ABE[7:0] or BBE[1:0]
4
AEA[22:14] or BEA[20:12]
5
Bank
AEA[12:3] or BEA[10:1]
4
5
12
12
11
11
AEA13 or BEA11
AED[63:0] or BED[15:0]
AOE/SDRAS/SOE‡
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
NOTE: These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic ( SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
A.
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE and AOE/SDRAS/SOE operate as SDCAS, SDWE, and SDRAS,
respectively, during SDRAM accesses.
Figure 5-20. SDRAM DEAC Command for EMIFA and EMIFB (see Note)
68
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REFR
ECLKOUT1
1
1
12
12
8
8
CEx
ABE[7:0] or BBE[1:0]
AEA[22:14, 12:3] or
BEA[20:12, 10:1]
AEA13 or BEA11
AED[63:0] or BED[15:0]
AOE/SDRAS/SOE‡
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
NOTE: These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic ( SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
A.
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE and AOE/SDRAS/SOE operate as SDCAS, SDWE, and SDRAS,
respectively, during SDRAM accesses.
Figure 5-21. SDRAM REFR Command for EMIFA and EMIFB (see Note)
MRS
ECLKOUT1
1
1
4
MRS value
5
12
12
8
8
11
11
CEx
ABE[7:0] or BBE[1:0]
AEA[22:3] or BEA[20:1]
AED[63:0] or BED[15:0]
AOE/SDRAS/SOE‡
ARE/SDCAS/SADS/SRE‡
AWE/SDWE/SWE‡
NOTE: These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic ( SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
A.
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE and AOE/SDRAS/SOE operate as SDCAS, SDWE, and SDRAS,
respectively, during SDRAM accesses.
Figure 5-22. SDRAM MRS Command for EMIFA and EMIFB (see Note)
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≥ TRAS cycles
End Self-Refresh
Self Refresh
AECLKOUT1
ACEx
ABE[7:0]
AEA[22:14, 12:3]
AEA13
AED[63:0]
AAOE/ASDRAS/ASOE‡
AARE/ASDCAS/ASADS/
ASRE‡
AAWE/ASDWE/ASWE‡
13
13
ASDCKE
A.
These C64x devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., the synchronous DRAM memory access signals are shown as generic (SDCAS, SDWE, and
SDRAS) instead of ASDCAS, ASDWE, and ASDRAS (for EMIFA) and BSDCAS, BSDWE, and BSDRAS (for
EMIFB)].
B.
AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE,
and ASDRAS, respectively, during SDRAM accesses.
Figure 5-23. SDRAM Self-Refresh Timing for EMIFA Only
5.5 HOLD/HOLDA TIMING
5.5.1
Timing Requirements for the HOLD/HOLDA cycles for EMIFA and EMIFB Modules
(see Figure 5-24)
(1)
NO.
3
(1)
70
PARAMETER
toh(HOLDAL-HOLDL)
Hold time, HOLD low after HOLDA low
–50xEP
MIN
E
MAX
UNIT
ns
E = the EMIF input clock (ECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA or EMIFB.
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5.6
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
Switching Characteristics Over Recommended Operating Conditions for the
HOLD/HOLDA Cycles for EMIFA and EMIFB Modules (1) (2) (3) (see Figure 5-24)
NO.
(1)
(2)
(3)
(4)
–50xEP
PARAMETER
MIN
MAX
UNIT
(4)
ns
0
2E
ns
2E
7E
ns
0
2E
ns
(4)
ns
7E
ns
1
td(HOLDL-EMHZ)
Delay time, HOLD low to EMIF Bus high impedance
2E
2
td(EMHZ-HOLDAL)
Delay time, EMIF Bus high impedance to HOLDA low
4
td(HOLDH-EMLZ)
Delay time, HOLD high to EMIF Bus low impedance
5
td(EMLZ-HOLDAH)
Delay time, EMIF Bus low impedance to HOLDA high
6
td(HOLDL-EKOHZ)
Delay time, HOLD low to ECLKOUTx high impedance
2E
7
td(HOLDH-EKOLZ)
Delay time, HOLD high to ECLKOUTx low impedance
2E
See
See
E = the EMIF input clock (ECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA or EMIFB
For EMIFA, EMIF Bus consists of: ACE[3:0], ABE[7:0], AED[63:0], AEA[22:3], AARE/ASDCAS/ASADS/ASRE, AAOE/ASDRAS/ASOE,
and AAWE/ASDWE/ASWE , ASDCKE, ASOE3, and APDT.
For EMIFB, EMIF Bus consists of: BCE[3:0], BBE[1:0], BED[15:0], BEA[20:1], BARE/BSDCAS/BSADS/BSRE, BAOE/BSDRAS/BSOE,
and BAWE/BSDWE/BSWE, BSOE3, and BPDT.
The EKxHZ bits in the EMIF Global Control register (GBLCTL) determine the state of the ECLKOUTx signals during HOLDA. If EKxHZ =
0, ECLKOUTx continues clocking during Hold mode. If EKxHZ = 1, ECLKOUTx goes to high impedance during Hold mode, as shown in
Figure 5-24.
All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the
minimum delay time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
External Requestor
Owns Bus
DSP Owns Bus
DSP Owns Bus
3
HOLD
2
5
HOLDA
1
EMIF Bus†
4
C64x
C64x
ECLKOUTx
6
7
ECLKOUTx
A.
For EMIFA, EMIF Bus consists of : ACE[3:0], ABE[7:0], AED[63:0], AEA[22:3], AARE/ASDCAS/ASADS/ASRE,
AAOE/ASDRAS/ASOE,
and
AAWE/ASDWE/ASWE,
ASDCKE,
ASOE3,
and
APDT.
For EMIFB, EMIF Bus consists of: BCE[3:0], BBE[1:0], BED[15:0], BEA[20:1], BARE/BSDCAS/BSADS/BSRE,
BAOE/BSDRAS/BSOE, and BAWE/BSDWE/BSWE, BSOE3, and BPDT.
Figure 5-24. HOLD/HOLDA Timing for EMIFA and EMIFB
5.7 BUSREQ TIMING
NO.
–50xEP
PARAMETER
MIN
MAX
UNIT
1
td(AEKO1H-ABUSRV)
Delay time, AECLKOUT1 high to ABUSREQ validA
0.6
7.1
ns
2
td(BEKO1H-BBUSRV)
Delay time, BECLKOUT1 high to BBUSREQ validB
0.5
6.9
ns
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ECLKOUT1
1
1
2
2
ABUSREQ
BBUSREQ
Figure 5-25. BUSREQ Timing for EMIFA and EMIFB
5.8 RESET TIMING
5.8.1
Timing Requirements for Reset (1) (see Figure 5-26 )
NO.
1
tw(RST)
Width of the RESET pulse
MIN MAX
UNIT
PLL stable (2)
10P
ns
PLL needs to sync up (3)
250
µs
16
tsu(boot)
Setup time, boot configuration bits valid before RESET high (4)
4P
ns
17
th(boot)
Hold time, boot configuration bits valid after RESET high (4)
4P
ns
(1)
(2)
(3)
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
This parameter applies to CLKMODE x1 when CLKIN is stable, and applies to CLKMODE x6, x12 when CLKIN and PLL are stable.
This parameter applies to CLKMODE x6, x12 only (it does not apply to CLKMODE x1). The RESET signal is not connected internally to
the clock PLL circuit. The PLL, however, may need up to 250 =s to stabilize following device power up or after PLL configuration has
been changed. During that time, RESET must be asserted to ensure proper device operation. See the clock PLL section for PLL lock
times.
EMIFB address pins BEA[20:13, 11, 7] are the boot-configuration pins during device reset.
(4)
NO.
–50xEP
PARAMETER
MIN
MAX
UNIT
2
td(RSTL-ECKI)
Delay time, RESET low to ECLKIN synchronized internally
2E 3P + 20E
ns
3
td(RSTH-ECKI)
Delay time, RESET high to ECLKIN synchronized internally
2E 8P + 20E
ns
4
td(RSTL-ECKO1HZ)
Delay time, RESET low to ECLKOUT1 high impedance
2E
ns
5
td(RSTH-ECKO1V)
Delay time, RESET high to ECLKOUT1 valid
6
td(RSTL-EMIFZHZ)
Delay time, RESET low to EMIF Z high impedance
7
td(RSTH-EMIFZV)
Delay time, RESET high to EMIF Z valid
8
td(RSTL-EMIFHIV)
Delay time, RESET low to EMIF high group invalid
9
td(RSTH-EMIFHV)
Delay time, RESET high to EMIF high group valid
10
td(RSTL-EMIFLIV)
Delay time, RESET low to EMIF low group invalid
11
td(RSTH-EMIFLV)
Delay time, RESET high to EMIF low group valid
12
td(RSTL-LOWIV)
Delay time, RESET low to low group invalid
13
td(RSTH-LOWV)
Delay time, RESET high to low group valid
14
td(RSTL-ZHZ)
Delay time, RESET low to Z group high impedance
15
td(RSTH-ZV)
Delay time, RESET high to Z group valid
16
72
–50xEP
PARAMETER
td(PCLK-RSTH)
Delay time, PCLK active to RESET high
PARAMETER MEASUREMENT INFORMATION
8P + 20E
ns
3P + 4E
ns
16E 8P + 20E
ns
2E
2E
8P + 20E
2E
0
ns
ns
11P
0
32N
ns
ns
8P + 20E
2P
(3)
ns
ns
ns
8P
ns
ns
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CLKOUT4
CLKOUT6
1
RESET
16
PCLK
2
3
4
5
6
7
ECLKIN
ECLKOUT1
ECLKOUT2
EMIF Z Group‡§
8
9
10
11
EMIF High Group‡
EMIF Low Group‡
12
13
14
15
Low Group‡
Group‡§
Z
Boot and Device
Configuration Inputs§¶
16
17
A.
These C64x. devices have two EMIFs (EMIFA and EMIFB). All EMIFA signals are prefixed by an A and all EMIFB
signals are prefixed by a B. Throughout the rest of this document, in generic EMIF areas of discussion, the prefix A or
B may be omitted [e.g., ECLKIN, ECLKOUT1, and ECLKOUT2].
B.
The following groups consist of:
a.
EMIF Z group consists of: AEA[22:3], BEA[20:1], AED[63:0], BED[15:0], CE[3:0], ABE[7:0], BBE[1:0],
ARE/SDCAS/SADS/SRE, AWE/SDWE/SWE, and AOE/SDRAS/SOE, SOE3, ASDCKE, and PDT.
b.
EMIF high group consists of: AHOLDA and BHOLDA (when the corresponding HOLD input is high)
c.
EMIF low group consists of: ABUSREQ and BBUSREQ; AHOLDA and BHOLDA (when the corresponding
HOLD input is low)
d.
Low group consists of: XSP_CS, CLKX2/XSP_CLK, and DX2/XSP_DO; all of which apply only when PCI
EEPROM (BEA13) is enabled (with PCI_EN = 1 and MCBSP2_EN = 0). Otherwise, the CLKX2/XSP_CLK and
DX2/XSP_DO pins are in the Z group. For more details on the PCI configuration pins, see the Device
Configurations section of this data sheet.
e.
Z group consists of : HD[310]/AD[31:0], CLKX0, CLKX1/URADDR4, CLKX2/XSP_CLK, FSX0,
FSX1/UXADDR3, FSX2, DX0, DX1/UXADDR4, DX2/XSP_DO, CLKR0, CLKR1/URADDR2, CLKR2, FSR0,
FSR1/UXADDR2, FSR2, TOUT0, TOUT1, TOUT2, GP[8:0], GP10/PCBE3, HR/W/PCBE2, HDS2/PCBE1,
PCBE0, GP13/PINTA, GP11/PREQ, HDS1/PSERR, HCS/PPERR, HCNTL1/PDEVSEL, HAS/PPAR,
HCNTL0/PSTOP, HHWIL/PTRDY (16-bit HPI mode only), HRDY/PIRDY, HINT/PFRAME, UXDATA[7:0], UXSOC,
UXCLAV, and URCLAV.
C.
If BEA[20:13, 11, 7] and HD5/AD5 pins are actively driven, car must be taken to ensure no timing contention between
parameters 6, 7, 14, 15, 16, and 17.
D.
Boot and Device Configurations Inputs (during reset) includ: EMIFB address pins BEA[20:13, 11, 7] and HD5/AD5.
The CI_EN pin must be driven valid at all times and the user must not switch values throughout device operation.
The MCBSP2_EN pin must be driven valid at all times and the user can switch values throughout device operation.
Figure 5-26. Reset Timing(A)
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
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5.9 EXTERNAL INTERRUPT TIMING
5.9.1 Timing Requirements for External Interrupts (1) (see Figure 5-27)
NO.
(1)
–50xEP
PARAMETER
1
tw(ILOW)
2
tw(IHIGH)H
MIN
MAX
UNIT
Width of the NMI interrupt pulse low
4P
ns
Width of the EXT_INT interrupt pulse low
8P
ns
Width of the NMI interrupt pulse high
4P
ns
Width of the EXT_INT interrupt pulse high
8P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
1
2
EXT_INTx, NMI
Figure 5-27. External/NMI Interrupt Timing
5.10 HOST-PORT INTERFACE (HPI)
5.10.1 Timing Requirements for Host-Port Interface Cycles (1)
Figure 5-35)
NO.
(1)
(2)
(3)
(4)
74
(see Figure 5-28 through
PARAMETER
1
tsu(SELV-HSTBL)
Setup time, select signals (3) valid before HSTROBE low
2
th(HSTBL-SELV)
Hold time, select signals (3) valid after HSTROBE low
3
tw(HSTBL)
Pulse duration, HSTROBE low
4
tw(HSTBH)
Pulse duration, HSTROBE high between consecutive accesses
10
tsu(SELV-HASL)
Setup time, select signals(3) valid before HAS low
(3)
–50xEP
MIN
MAX
UNIT
5
ns
2.4
ns
(4)
ns
4P
ns
5
ns
2
ns
5
ns
2.8
ns
4P
11
th(HASL-SELV)
Hold time, select signals
12
tsu(HDV-HSTBH)
Setup time, host data valid before HSTROBE high
13
th(HSTBH-HDV)
Hold time, host data valid after HSTROBE high
14
th(HRDYL-HSTBL)
Hold time, HSTROBE low after HRDY low. HSTROBE should not be
inactivated until HRDY is active (low); otherwise, HPI writes will not complete
properly.
2
ns
18
tsu(HASL-HSTBL)
Setup time, HAS low before HSTROBE low
2
ns
19
valid after HAS low
th(HSTBL-HASL)
Hold time, HAS low after HSTROBE low
2.1
ns
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT (HDS1 XOR HDS2)] OR HCS.
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
Select signals include: HCNTL[1:0] and HR/W. For HPI16 mode only, select signals also include HHWIL.
Select the parameter value of 4P or 12.5 ns, whichever is greater.
NO.
(1)
(2)
PARAMETER
6
td(HSTBL-HRDYH)
Delay time, HSTROBE low to HRDY high (1)
7
td(HSTBL-HDLZ)
Delay time, HSTROBE low to HD low impedance for an HPI read
8
td(HDV-HRDYL)
9
toh(HSTBH-HDV)
–50xEP
UNIT
MIN
MAX
1.3
4P + 9
ns
2
ns
Delay time, HD valid to HRDY low
–3
ns
Output hold time, HD valid after HSTROBE high
1.5
ns
This parameter is used during HPID reads and writes. For reads, at the beginning of a word transfer (HPI32) or the first half-word
transfer (HPI16) on the falling edge of HSTROBE, the HPI sends the request to the EDMA internal address generation hardware, and
HRDY remains high until the EDMA internal address generation hardware loads the requested data into HPID. For writes, HRDY goes
high if the internal write buffer is full.
PARAMETER MEASUREMENT INFORMATION
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
NO.
PARAMETER
–50xEP
MIN
15
td(HSTBH-HDHZ)
Delay time, HSTROBE high to HD high impedance
16
td(HSTBL-HDV)
Delay time, HSTROBE low to HD valid (HPI16 only)
UNIT
MAX
12
ns
4P + 8
ns
HAS
1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
4
3
3
HSTROBE†
HCS
15
9
7
15
9
16
HD[15:0] (output)
1st half-word
6
2nd half-word
8
HRDY
(1)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-28. HPI16 Read Timing (HAS Not Used, Tied High)
HAS†
19
11
19
10
11
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
4
3
HSTROBE‡
18
18
HCS
15
7
9
15
16
9
HD[15:0] (output)
6
1st half-word
8
2nd half-word
HRDY
(1)
For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
(2)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-29. HPI16 Read Timing (HAS Used)
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FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
HAS
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1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
3
3
4
HSTROBE†
HCS
12
12
13
13
HD[15:0] (input)
1st half-word
2nd half-word
6
14
HRDY
(1)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-30. HPI16 Write Timing (HAS Not Used, Tied High)
19
HAS†
19
11
11
10
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
3
4
HSTROBE‡
18
18
HCS
12
13
12
13
HD[15:0] (input)
1st half-word
6
2nd half-word
14
HRDY
(1)
For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
(2)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-31. HPI16 Write Timing (HAS Used)
76
PARAMETER MEASUREMENT INFORMATION
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
HAS
1
2
1
2
HCNTL[1:0]
HR/W
3
HSTROBE†
HCS
7
9
15
HD[31:0] (output)
6
8
HRDY
(1)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-32. HPI32 Read Timing (HAS Not Used, Tied High)
19
HAS†
11
10
HCNTL[1:0]
11
10
HR/W
18
3
HSTROBE‡
HCS
7
9
15
HD[31:0] (output)
6
8
HRDY
(1)
For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
(2)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-33. HPI32 Read Timing (HAS Used)
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HAS
1
2
1
2
HCNTL[1:0]
HR/W
3
HSTROBE†
HCS
12
13
HD[31:0] (input)
6
14
HRDY
(1)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-34. HPI32 Write Timing (HAS Not Used, Tied High)
19
HAS†
11
10
HCNTL[1:0]
11
10
HR/W
3
18
HSTROBE‡
HCS
12
13
HD[31:0] (input)
6
14
HRDY
(1)
For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
(2)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-35. HPI32 Write Timing (HAS Used)
5.11 PERIPHERAL COMPONENT INTERCONNECT (PCI) TIMING (C6415 AND C6416 ONLY)
78
PARAMETER MEASUREMENT INFORMATION
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5.11.1
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
Timing Requirements for PCLK
NO.
(1) (2)
(see Figure 5-36
PARAMETER
–50xEP
UNIT
MIN
(1)
(2)
(3)
MAX
30 (or 8P (3))
ns
Pulse duration, PCLK high
11
ns
Pulse duration, PCLK low
11
1
tc(PCLK)
Cycle time, PCLK
2
tw(PCLKH)
3
tw(PCLKL)
4
tsr(PCLK)
Δv/Δt slew rate, PCLK
ns
1
4
V/ns
For 3.3-V operation, the reference points for the rise and fall transitions are measured at VILP MAX and VIHP MIN.
P = 1/CPU clock frequency in ns. For example when running parts at 500 MHz, use P = 2 ns.
Select the parameter value of 30 ns or 8P, whichever is greater.
1
0.4 DVDD V MIN
Peak to Peak for
3.3V signaling
4
2
PCLK
3
4
Figure 5-36. PCLK Timing
5.11.2
Timing Requirements for PCI Reset (see Figure 5-37)
NO.
–50xEP
MIN
1
tw(PRST)
Pulse duration, PRST
2
tsu(PCLKA-PRSTH)
Setup time, PCLK active before PRST high
UNIT
MAX
1
ms
100
µs
PCLK
1
PRST
2
Figure 5-37. PCI Reset (PRST) Timing
5.11.3 Timing Requirements for PCI Inputs (see Figure 5-38)
NO.
–50xEP
MIN
UNIT
MAX
1
tsu(IV-PCLKH)
Setup time, input valid before PCLK high
7
ns
2
th(IV-PCLKH)
Hold time, input valid after PCLK high
0
ns
NO.
PARAMETER
–50xEP
MIN
UNIT
MAX
1
td(PCLKH-OV)
Delay time, PCLK high to output valid
2
td(PCLKH-OIV)
Delay time, PCLK high to output invalid
2
ns
3
td(PCLKH-OLZ)
Delay time, PCLK high to output low impedance
2
ns
4
td(PCLKH-OHZ)
Delay time, PCLK high to output high impedance
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11
28
PARAMETER MEASUREMENT INFORMATION
ns
ns
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PCLK
1
2
Valid
PCI Output
3
4
Valid
PCI Input
5
6
Figure 5-38. PCI Input/Output Timing
5.11.5 Timing Requirements for Serial EEPROM Interface (see Figure 5-39)
NO.
–50xEP
MIN
8
tsu(DIV-CLKH)
Setup time, XSP_DI valid before XSP_CLK high
9
th(CLKH-DIV)
Hold time, XSP_DI valid after XSP_CLK high
NO.
UNIT
MAX
50
ns
0
ns
–50xEP
MIN
1
tw(CSL)
Pulse duration, XSP_CS low
2
td(CLKL-CSL)
Delay time, XSP_CLK low to XSP_CS low
3
td(CSH-CLKH)
4
5
TYP
UNIT
MAX
4092P
ns
0
ns
Delay time, XSP_CS high to XSP_CLK high
2046P
ns
tw(CLKH)
Pulse duration, XSP_CLK high
2046P
ns
tw(CLKL)
Pulse duration, XSP_CLK low
2046P
ns
6
tosu(DOV-CLKH)
Output setup time, XSP_DO valid after XSP_CLK high
2046P
7
toh(CLKH-DOV)
Output hold time, XSP_DO valid after XSP_CLK high
2046P
2
1
XSP_CS
3
4
5
XSP_CLK
6
7
XSP_DO
8
9
XSP_DI
Figure 5-39. PCI Serial EEPROM Interface Timing
5.12 MULTICHANNEL BUFFERED SERIAL PORT (McBSP) TIMING
80
PARAMETER MEASUREMENT INFORMATION
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5.12.1
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
Timing Requirements for McBSP
(1) (2)
(see Figure 5-40
NO.
–50xEP
UNIT
MIN
2
tc(CKRX)
Cycle time, CLKR/X
3
tw(CKRX)
5
tsu(FRH-CKRL) Setup time, external FSR high before CLKR low
6
th(CKRL-FRH)
7
Pulse duration, CLKR/X high or CLKR/X low
Hold time, external FSR high after CLKR low
tsu(DRV-CKRL) Setup time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
11
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
(1)
MAX
CLKR/X ext
6.67 (3)
ns
CLKR/X ext
(3)
ns
CLKR int
9
ns
CLKR ext
1.3
CLKR int
6
CLKR ext
3
0.5tc(CKRX) - 1
CLKR int
8
CLKR ext
0.9
CLKR int
3
CLKR ext
3.1
CLKR int
9
CLKR ext
1.3
CLKR int
6
CLKR ext
3
ns
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times
are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and ac timing requirements.
(2)
(3)
NO.
PARAMETER
–50xEP
UNIT
MIN
MAX
1.4
10
1
td(CKSH-CKRXH)
Delay time, CLKS high to CLKR/X high for internal CLKR/X generated from
CLKS input
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X int
6.67 (1)
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X int
C – 1(4)
C + 1(4)
ns
4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
CLKR int
–2.1
3
ns
9
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
CLKR int
–1.7
3
ns
CLKR ext
1.7
9
–3.9
4
ns
12
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
CLKR int
CLKR ext
–2.1
9
13
td(CKXH-DXV)
Delay time, CLKX high to DX valid
CLKR int
–3.9 + D1(5)
4 + D2(5)
CLKR ext
–2.1 + D1(5)
9 + D2(5)
FSX int
–2.3
5.6
FSX ext
1.9
9
14
(1)
(4)
td(FXH-DXV)H
Delay time, FSX high to DX valid
ONLY applies when in data delay 0 (XDATDLY = 00b) moded
ns
ns
ns
ns
Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times
are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and ac timing requirements.
C
= H or L
S
= sample rate generator input clock = 4P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H
= CLKX high pulse width = (CLKGDV/2 + 1) × S if CLKGDV is even
L
CLKX low pulse width
= (CLKGDV + 1)/2 × S if CLKGDV is odd or zero
= (CLKGDV/2) × S if CLKGDV is even
= (CLKGDV + 1)/2 × S if CLKGDV is odd or zero
(5)
Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 4P, D2 = 8P
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CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
DR
8
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
14
13
Bit(n-1)
12
DX
Bit 0
13
(n-2)
(n-3)
Figure 5-40. McBSP Timing
5.12.3
Timing Requirements for FSR When GSYNC = 1 (see Figure 5-41)
NO.
PARAMETER
–50xEP
MIN
UNIT
MAX
1
tsu(FRH-CKSH)
Setup time, FSR high before CLKS high
4
ns
2
th(CKSH-FRH)
Hold time, FSR high after CLKS high
4
ns
CLKS
1
2
FSR external
CLKR/X (no need to resync)
CLKR/X (needs resync)
Figure 5-41. FSR Timing When GSYNC = 1
5.12.4 Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 (1)
(2)
(see )
NO.
–50xEP
MASTER
MIN
4
(1)
(2)
82
tsu(DRV-CKXL) Setup time, DR valid before CLKX low
12
UNIT
SLAVE
MAX
MIN
2 – 12P
MAX
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
PARAMETER MEASUREMENT INFORMATION
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
NO.
–50xEP
MASTER
MIN
5
th(CKXL-DRV)
Hold time, DR valid after CLKX low
NO.
UNIT
SLAVE
MAX
4
MIN
MAX
5 + 24P
PARAMETER
ns
–50xEP
MASTER
UNIT
SLAVE
MIN
MAX
MIN
MAX
1
th(CKXL-FXL)
Hold time, FSX low after CLKX low(4)
T–2
T+3
ns
2
td(FXL-CKXH)
Delay time, FSX low to CLKX high(5)
L–2
L+3
ns
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
–2
4
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
L–2
L+3
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
8
td(FXL-DXV)
Delay time, FSX low to DX valid
12P +
2.8
20P + 17
ns
ns
4P + 3
12P + 17
ns
8P + 1.8
16P + 17
ns
(3) S = Sample rate generator input clock = 4P if CLKSM = 1 (P = 1/CPU clock frequency)
= Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) × S
H = CLKX high pulse
width
= (CLKGDV/2 + 1) × S if CLKGDV is even
= (CLKGDV + 1)/2 × S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) × S if CLKGDV is even
= (CLKGDV + 1)/2 × S if CLKGDV is odd or zero
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave,
the active-low signal input on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSPF
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at
the rising edge of the Master clock (CLKX).
CLKX
1
2
6
Bit 0
7
FSX
DX
3
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 5-42. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
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www.ti.com
5.12.6 Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b,
CLKXP = 1 (1) (2)(see Figure 5-43)
NO.
–50xEP
UNIT
MASTER
MIN
4
5
(1)
(2)
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
th(CKXH-DRV)
Hold time, DR valid after CLKX high
SLAVE
MAX
MIN
MAX
12
2 – 12P
ns
4
5 + 24P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
NO.
PARAMETER
–50xEP
UNIT
MASTER(3)
1
th(CKXH-FXL)
Hold time, FSX low after CLKX low(4)
(5)
2
td(FXL-CKXXL)
Delay time, FSX low to CLKX high
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
6
tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from
CLKX low
7
td(FXL-DXV)
Delay time, FSX low to DX valid
SLAVE
MIN
MAX
H–2
H+3
MIN
MAX
T–2
T+1
–2
4
12P + 4
20P + 17
ns
–2
4
12P + 3
20P + 17
ns
L–2
L–4
8P + 2
16P + 17
ns
ns
ns
(3) S = Sample rate generator input clock = 4P if CLKSM = 1 (P = 1/CPU clock frequency)
= Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) × S
= (CLKGDV/2 + 1) × S if CLKGDV is even
H = CLKX high pulse
width
= (CLKGDV + 1)/2 × S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) × S if CLKGDV is even
= (CLKGDV + 1)/2 × S if CLKGDV is odd or zero
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave,
the active-low signal input on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSPF
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at
the rising edge of the Master clock (CLKX).
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 5-43. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
5.13 UTOPIA SLAVE TIMING (C6415 AND C6416 ONLY)
84
PARAMETER MEASUREMENT INFORMATION
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
5.13.1 Timing Requirements for UXCLK (1) (see Figure 5-44)
NO.
–50xEP
UNIT
MIN
(1)
MAX
1
tc(UXCK)
Cycle time, UXCLK
20
ns
2
tw(UXCKH)
Pulse duration, UXCLK high
0.4tc(UXCK)
0.6tc(UXCK)
ns
3
tw(UXCKL)
Pulse duration, UXCLK low
0.4tc(UXCK)
0.6tc(UXCK)
ns
4
tt(UXCK)
Transition time, UXCLK
2
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
1
4
2
UXCLK
3
4
Figure 5-44. UXCLK Timing
5.13.2 Timing Requirements for URCLK (1) (see Figure 5-45
NO.
–50xEP
UNIT
MIN
(1)
MAX
1
tc(URCK)
Cycle time, URCLK
20
ns
2
tw(URCKH)
Pulse duration, URCLK high
0.4tc(URCK)
0.6tc(URCK)
ns
3
tw(URCKL)
Pulse duration, URCLK low
0.4tc(URCK)
0.6tc(URCK)
ns
4
tt(URCK)
Transition time, URCLK
2
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
1
4
2
URCLK
3
4
Figure 5-45. URCLK Timing
5.13.3
Timing Requirements for UTOPIA Slave Transmit (see Figure 5-46)
NO.
–50xEP
MIN
UNIT
MAX
2
tsu(UXAV-UXCH)
Setup time, UXADDR valid before UXCLK high
4
ns
3
th(UXCH-UXAV)
Hold time, UXADDR valid after UXCLK high
1
ns
8
tsu(UXENBL-UXCH)
Setup time, UXENB low before UXCLK high
4
ns
9
th(UXCH-UXENBL)
Hold time, UXENB low after UXCLK high
1
ns
–50xEP
UNIT
NO.
PARAMETER
MIN
MAX
1
td(UXCH-UXDV)
Delay time, UXCLK high to UXDATA valid
3
12
ns
4
td(UXCH-UXCLAV)
Delay time, UXCLK high to UXCLAV driven active value
3
12
ns
5
td(UXCH-UXCLAVL)
Delay time, UXCLK high to UXCLAV driven inactive low
3
12
ns
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SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
NO.
www.ti.com
PARAMETER
–50xEP
UNIT
MIN
MAX
18.5
6
td(UXCH-UXCLAVHZ)
Delay time, UXCLK high to UXCLAV Hi-Z
9
7
tw(UXCLAVL-UXCLAVHZ)
Pulse duration (low), UXCLAV low to UXCLAV Hi-Z
3
10
td(UXCH-UXSV)
Delay time, UXCLK high to UXSOC valid
3
ns
ns
12
ns
UXCLK
1
UXDATA[7:0]
P45
P46
P47
P48
H1
3
2
UXADDR[4:0]
0 x1F
N
0x1F
N
0x1F
N+1
0x1F
6
7
4
5
N
UXCLAV
N
9
8
UXENB
10
UXSOC
† The UTOPIA Slave module has signals that are middle-level signals indicating a high-impedance state (i.e., the UXCLAV and UXSOC
signals).
(1)
The UTOPIA Slave module has signals that are middle-level signals indicating a high-impedance state (i.e., the UXCLAV and
UXSOC signals).
Figure 5-46. UTOPIA Slave Transmit Timing(1)
5.13.5 Timing Requirements for UTOPIA Slave Receive (see Figure 5-47)
NO.
–50xEP
MIN
1
tsu(URDV-URCH)
Setup time, URDATA valid before URCLK highR
4
ns
2
th(URCH-URDV)
Hold time, URDATA valid after URCLK high
1
ns
3
tsu(URAV-URCH)
Setup time, URADDR valid before URCLK highR
4
ns
4
th(URCH-URAV)
Hold time, URADDR valid after URCLK high
1
ns
9
tsu(URENBL-URCH)
Setup time, URENB low before URCLK high
4
ns
10
th(URCH-URENBL)
Hold time, URENB low after URCLK high
1
ns
11
tsu(URSH-URCH)
Setup time, URSOC high before URCLK highU
4
ns
12
th(URCH-URSH)
Hold time, URSOC high after URCLK high
1
ns
NO.
86
UNIT
MAX
PARAMETER
–50xEP
UNIT
MIN
MAX
5
td(URCH-URCLAV)
Delay time, URCLK high to URCLAV driven active value
3
12
ns
6
td(URCH-URCLAVL)
Delay time, URCLK high to URCLAV driven inactive low
3
12
ns
7
td(URCH-URCLAVHZ)
Delay time, URCLK high to URCLAV Hi-Z
9
18.5
ns
8
tw(URCLAVL-URCLAVHZ)
Pulse duration (low), URCLAV low to URCLAV Hi-Z
3
PARAMETER MEASUREMENT INFORMATION
ns
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
URCLK
2
1
URDATA[7:0]
P48
H1
H2
H3
0x1F
N+2
0x1F
4
3
URADDR[4:0]
N
0x1F
N+1
7
6
5
URCLAV
N
8
N+1
10
N+2
9
URENB
11
12
URSOC
† The UTOPIA Slave module has signals that are middle-level signals indicating a high-impedance state (i.e., the URCLAV and URSOC
signals).
(1)
The UTOPIA Slave module has signals that are middle-level signals indicating a high-impedance state (i.e., the URCLAV and
URSOC signals).
Figure 5-47. UTOPIA Slave Receive Timing
(1)
5.14 TIMER TIMING
5.14.1 Timing Requirements for Timer Inputs (1) (see Figure 5-48)
NO.
–50xEP
MIN
1
2
(1)
UNIT
MAX
tw(TINPH)
Pulse duration, TINP high
8P
ns
tw(TINPL)
Pulse duration, TINP low
8P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
NO.
PARAMETER
–50xEP
MIN
UNIT
MAX
3
tw(TOUTH)
Pulse duration, TOUT high
8P-3
ns
4
tw(TOUTL)
Pulse duration, TOUT low
8P-3
ns
2
1
TINPx
4
3
TOUTx
Figure 5-48. Timer Timing
5.15 GENERAL-PURPOSE INPUT/OUTPUT (GPIO) PORT TIMING
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SM320C6414-EP, SM320C6415-EP, SM320C6416-EP
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
5.15.1
www.ti.com
Timing Requirements for GPIO Inputs (1)
(2)
(see Figure 5-48)
NO.
–50xEP
UNIT
MIN
(1)
(2)
MAX
1
tw(GPIH)
Pulse duration, GPIx high 8P
8P
ns
2
tw(GPIL)
Pulse duration, GPIx low 8P
8P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the DSP recognize
the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to at least 12P to allow the DSP
enough time to access the GPIO register through the CFGBUS.
NO.
PARAMETER
–50xEP
UNIT
MIN
MAX
3
tw(GPOH)
Pulse duration, GPOx high
32P
ns
4
tw(GPOL)
Pulse duration, GPOx low
32P
ns
2
1
GPIx
4
3
GPOx
Figure 5-49. GPIO Port Timing
5.16 JTAG TEST PORT TIMING
5.16.1 Timing Requirements for JTAG Test Port (see Figure 5-50)
NO.
–50xEP
MIN
UNIT
MAX
1
tc(TCK)
Cycle time, TCK
35
ns
3
tsu(TDIV-TCKH)
Setup time, TDI/TMS/TRST valid before TCK high
10
ns
4
th(TCKH-TDIV)
Hold time, TDI/TMS/TRST valid after TCK high
9
ns
NO.
2
–50xEP
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
MIN
MAX
–3
18
UNIT
ns
1
TCK
2
2
TDO
4
3
TDI/TMS/TRST
Figure 5-50. JTAG Test Port Timing
5.16.3 Thermal Resistance Characteristics (S-PBGA Package)
88
PARAMETER MEASUREMENT INFORMATION
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SGUS043D – MAY 2003 – REVISED SEPTEMBER 2008
NO.
(1)
(2)
AIR FLOW
(m/s (1))
°C/W
°C/W
(WITH HEAT SINK (2))
1
RθJC
Junction to case
N/A
1.55
1.0
2
RθJB
Junction to board
N/A
9.1
9.0
3
RθJA
Junction to free air
0.00
17.9
13.8
4
RθJA
Junction to free air
0.5
15.02
8.95
5
RθJA
Junction to free air
1.0
13.4
7.35
6
RθJA
Junction to free air
2.00
11.89
6.46
7
PsiJT
Junction to package top
N/A
0.5
0.5
8
PsiJB
Junction to board
N/A
7.4
7.4
m/s = meters per seconds
These thermal resistance numbers were modeled using a heatsink, part number 374024B00035, manufactured by AAVID Thermalloy.
AAVID Thermalloy also manufactures a similar epoxy-mounted heatsink, part number 374024B00000. TI recommends a passive,
laminar heatsink, similar to the part numbers mentioned above.
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PACKAGE OPTION ADDENDUM
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9-May-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
SM32C6414DGLZ50AEP
OBSOLETE
FCBGA
GLZ
532
SM32C6414EGLZ50AEP
ACTIVE
FCBGA
GLZ
532
SM32C6415DGLZ50AEP
OBSOLETE
FCBGA
GLZ
532
SM32C6415EGLZ50AEP
ACTIVE
FCBGA
GLZ
532
60
SM32C6415EGLZ50SEP
ACTIVE
FCBGA
GLZ
532
60
SM32C6416DGLZ50AEP
OBSOLETE
FCBGA
GLZ
532
SM32C6416EGLZ50AEP
ACTIVE
FCBGA
GLZ
532
V62/04609-01XA
OBSOLETE
FCBGA
GLZ
V62/04609-02XA
OBSOLETE
FCBGA
GLZ
V62/04609-03XA
OBSOLETE
FCBGA
V62/04609-04XA
ACTIVE
V62/04609-05XA
ACTIVE
V62/04609-06XA
V62/04609-08XA
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TBD
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Call TI
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TBD
SNPB
Level-4-220C-72 HR
Add to cart
TBD
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TBD
SNPB
Level-4-220C-72 HR
Add to cart
TBD
SNPB
Level-4-220C-72 HR
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TBD
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TBD
SNPB
Level-4-220C-72 HR
Add to cart
532
TBD
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532
TBD
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GLZ
532
TBD
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FCBGA
GLZ
532
60
TBD
SNPB
Level-4-220C-72 HR
Add to cart
FCBGA
GLZ
532
60
TBD
SNPB
Level-4-220C-72 HR
Add to cart
ACTIVE
FCBGA
GLZ
532
60
TBD
SNPB
Level-4-220C-72 HR
Add to cart
ACTIVE
FCBGA
GLZ
532
60
TBD
SNPB
Level-4-220C-72 HR
Add to cart
60
60
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2012
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SM320C6415-EP :
• Catalog: SM320C6415
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
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