TI TPS2202AIDBR

TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
D
D
D
D
D
D
D
D
D
D
D
Fully Integrated VCC and Vpp Switching for
Dual-Slot PC Card Interface
P2C 3-Lead Serial Interface Compatible
With CardBus Controllers
Meets PC Card Standards
RESET Allows System Initialization of PC
Cards
12-V Supply Can Be Disabled Except
During 12-V Flash Programming
Short-Circuit and Thermal Protection
Space-Saving 30-Pin SSOP (DB) Package
Compatible With 3.3-V, 5-V and 12-V PC
Cards
Power Saving IDD = 83 µA Typ, IQ = 1 µA
Low rDS(on) (160-mΩ VCC Switch)
Break-Before-Make Switching
DB OR DF PACKAGE
(TOP VIEW)
5V
5V
DATA
CLOCK
LATCH
RESET
12V
AVPP
AVCC
AVCC
AVCC
GND
APWR_GOOD
RESET
3.3V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
5V
NC
NC
NC
NC
VDD
12V
BVPP
BVCC
BVCC
BVCC
BPWR_GOOD
OC
3.3V
3.3V
NC – No internal connection
description
The TPS2202AI PC Card power-interface switch provides an integrated power-management solution for two
PC Cards. All of the discrete power MOSFETs, a logic section, current limiting, thermal protection, and
power-good reporting for PC Card control are combined on a single integrated circuit (IC), using the Texas
Instruments LinBiCMOS process. The circuit allows the distribution of 3.3-V, 5-V, and/or 12-V card power by
means of the P2C (PCMCIA Peripheral-Control) Texas Instruments nonproprietary serial interface. The
current-limiting feature eliminates the need for fuses, which reduces component count and improves reliability.
Current-limit reporting can help the user isolate a system fault to a specific card.
The TPS2202AI incorporates a reset function, selectable by one of two inputs, to help alleviate system errors.
The reset function enables PC Card initialization concurrent with host platform initialization, allowing a system
reset. Reset is accomplished by grounding the VCC and Vpp (flash-memory programming voltage) outputs,
which discharges residual card voltage.
End equipment for the TPS2202AI includes notebook computers, desktop computers, personal digital assistants
(PDAs), digital cameras, handiterminals, and bar-code scanners.
AVAILABLE OPTIONS
PACKAGED DEVICES
TJ
SSOP
(DB)†
SSOP
(DF)†
– 40°C to 150°C
TPS2202AIDBR
TPS2202AIDFR
† The DB and DF packages are only available taped and reeled,
inidcated by the R suffix on the device type.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinBiCMOS and P2C are trademarks of Texas Instruments.
PC Card and CardBus are trademarks of PCMCIA (Personal Computer Memory Card International Association).
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
typical PC card power-distribution application
VDD
Power Supply
12V
5V
3.3V
12 V
5V
3.3 V
TPS2202AI
AVPP
AVCC
AVCC
RESET
RESET
Supervisor
3
Serial Interface
APWR_GOOD
BPWR_GOOD
OC
PCMCIA
Controller
Vpp1
Vpp2
VCC
VCC
PC
Card A
Vpp1
Vpp2
VCC
VCC
PC
Card B
AVCC
BVPP
BVCC
BVCC
BVCC
Terminal Functions
TERMINAL
NAME
3.3V
5V
12V
NO.
I/O
DESCRIPTION
15, 16, 17
I
3.3-V VCC input for card power
1, 2, 30
I
5-V VCC input for card power
7, 24
I
12-V Vpp input for card power
AVCC
9, 10, 11
O
Switched output that delivers 3.3 V, 5 V, low or high impedance to card
AVPP
8
O
Switched output that delivers 3.3 V, 5 V, 12 V, low or high impedance to card
APWR_GOOD
13
O
Logic-level power-ready output that stays low as long as AVPP is within limits
BVCC
20, 21, 22
O
Switched output that delivers 3.3 V, 5 V, low or high impedance
BVPP
23
O
Switched output that delivers 3.3 V, 5 V, 12 V, low or high impedance
BPWR_GOOD
19
O
Logic-level power-ready output that remains low as long as BVPP is within limits
4
I
Logic-level clock for serial data word
DATA
3
I
Logic-level serial data word
GND
12
CLOCK
LATCH
5
NC
26, 27,
28, 29
OC
Ground
I
Logic-level latch for serial data word
No internal connection
18
O
Logic-level overcurrent reporting output that goes low when an overcurrent condition exists
RESET
6
I
Logic-level RESET input active high. Do not connect if terminal 14 is used.
RESET
14
I
Logic-level RESET input active low. Do not connect if terminal 6 is used.
VDD
25
I
5-V power to chip
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 7 V
Input voltage range for card power: VI(5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 7 V
VI(3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VI(5V)
VI(12V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 14 V
Logic input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 7 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Output current (each card): IO(xVCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . internally limited
IO(xVPP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . internally limited
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE
DF
DISSIPATION RATING TABLE
TA ≤ 25°C
DERATING FACTOR‡
TA = 70°C
POWER RATING
POWER RATING
ABOVE TA = 25°C
1158 mW
9.26 mW/°C
741 mW
TA = 85°C
POWER RATING
602 mW
DB
1024 mW
8.2 mW/°C
655 mW
532 mW
‡ These devices are mounted on an FR4 board with no special thermal considerations.
recommended operating conditions
Supply voltage, VDD
Input voltage range, VI
Output current
MIN
MAX
UNIT
4.75
5.25
V
V
VI(5V)
VI(3.3V)
0
0
5.25
VI(5V)§
VI(12V)
IO(xVCC) at 25°C
0
13.5
V
1
A
IO(xVPP) at 25°C
Clock frequency
Operating virtual junction temperature, TJ
§ VI(3.3V) should not be taken above VI(5V).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
150
mA
0
2.5
MHz
– 40
125
°C
3
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
electrical characteristics, TA = 25°C, VDD = 5 V (unless otherwise noted)
dc characteristics
PARAMETER
Switch resistances†
VO(xVPP)
VO(xVCC)
Ilkg
lk
II
TEST CONDITIONS
MIN
TYP
160
3.3 V to xVCC
225
5 V to xVPP
6
3.3 V to xVPP
6
12 V to xVPP
1
Clamp low voltage
Ipp at 10 mA
ICC at 10 mA
Clamp low voltage
Ipp High-impedance
g
state
TA = 25°C
TA = 85°C
1
ICC High-impedance
g
state
TA = 25°C
TA = 85°C
1
IDD Supply current
VO(AVCC) = VO(BVCC) = 5 V,
VO(AVPP) = VO(BVPP) = 12 V
IDD Supply current
in shutdown
VO(BVCC) = VO(AVCC) = VO(AVPP)
= VO(BVPP) = Hi-Z
Leakage current
Input current
MAX
5 V to xVCC
Short-circuit outputcurrent limit
IO(xVCC)
IO(xVPP)
Ω
V
0.8
V
10
10
µA
50
83
10.72
12-V mode
mΩ
0.8
50
Power-ready threshold,
PWR_GOOD
Power-ready hysteresis,
PWR_GOOD
UNIT
11.05
150
µA
1
µA
11.4
V
50
TJ = 85°C,,
Output powered up into a short to GND
mV
0.75
1.3
1.9
A
120
200
400
mA
† Pulse-testing techniques are used to maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
logic section
PARAMETER
TEST CONDITIONS
MIN
Logic input current
1
Logic input high level
2
Logic input low level
IO = 1 mA
Logic output low level
Logic input minimum pulse width
VDD – 0.4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
µA
V
V
0.4
1
UNIT
V
0.8
Logic output high level
4
MAX
V
µs
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
switching characteristics†
PARAMETER
TEST CONDITIONS
MIN
TYP
tr
Output rise times
VO(xVCC)
VO(xVPP)
1.2
tf
Output fall times
VO(xVCC)
VO(xVPP)
10
tpd
d
Propagation delay (see Figure 1‡)
5
MAX
UNIT
ms
14
5.8
ms
LATCH↑ to VO(xVPP)
O(
)
ton
toff
18
ms
5.8
ms
LATCH↑ to xVCC (3 V)
ton
toff
28
ms
LATCH↑ to xVCC (5 V)
ton
toff
4
ms
30
ms
† Refer to Parameter Measurement Information
‡ Propagation delays are with CL = 100 µF.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
PARAMETER MEASUREMENT INFORMATION
Vpp
VCC
CL
CL
LOAD CIRCUIT
LOAD CIRCUIT
VDD
VDD
LATCH
50%
50%
LATCH
GND
GND
toff
toff
ton
ton
VI(12V)
90%
VO(xVPP)
10%
VI(5V)
90%
VO(xVCC)
10%
GND
GND
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
Figure 1. Test Circuits and Voltage Waveforms
Table of Timing Diagrams
FIGURE
DATA
Serial-Interface Timing
2
xVCC Propagation Delay and Rise Time With 1-µF Load, 3.3-V Switch
3
xVCC Propagation Delay and Fall Time With 1-µF Load, 3.3-V Switch
4
xVCC Propagation Delay and Rise Time With 100-µF Load, 3.3-V Switch
5
xVCC Propagation Delay and Fall Time With 100-µF Load, 3.3-V Switch
6
xVCC Propagation Delay and Rise Time With 1-µF Load, 5-V Switch
7
xVCC Propagation Delay and Fall Time With 1-µF Load, 5-V Switch
8
xVCC Propagation Delay and Rise Time With 100-µF Load, 5-V Switch
9
xVCC Propagation Delay and Fall Time With 100-µF Load, 5-V Switch
10
xVPP Propagation Delay and Rise Time With 1-µF Load, 12-V Switch
11
xVPP Propagation Delay and Fall Time With 1-µF Load, 12-V Switch
12
xVPP Propagation Delay and Rise Time With 100-µF Load, 12-V Switch
13
xVPP Propagation Delay and Fall Time With 100-µF Load, 12-V Switch
14
D8
D7
D6
D5
D4
D3
D2
D1
D0
LATCH
CLOCK
NOTE A: Data is clocked in on the positive leading edge of the clock. The latch should occur before next positive leading edge of the
clock. For definition of D0 to D8, see the control logic table.
Figure 2. Serial-Interface Timing
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
PARAMETER MEASUREMENT INFORMATION
LATCH (2 V/div)
LATCH (2 V/div)
xVCC (1 V/div)
0
1
2
xVCC (1 V/div)
3
4
5
6
7
8
9
0
5
10
15
20
25
30
35
40
t – Time – ms
t – Time – ms
Figure 3. xVCC Propagation Delay and
Rise Time With 1-µF Load, 3.3-V Switch
Figure 4. xVCC Propagation Delay and
Fall Time With 1-µF Load, 3.3-V Switch
LATCH (2 V/div)
LATCH (2 V/div)
xVCC (1 V/div)
xVCC (1 V/div)
0
1
2
3
45
4
5
6
7
8
9
0
t – Time – ms
5
10
15
20
25
30
35
40
45
t – Time – ms
Figure 5. xVCC Propagation Delay and
Rise Time With 100-µF Load, 3.3-V Switch
POST OFFICE BOX 655303
Figure 6. xVCC Propagation Delay and
Fall Time With 100-µF Load, 3.3-V Switch
• DALLAS, TEXAS 75265
7
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
PARAMETER MEASUREMENT INFORMATION
LATCH (2 V/div)
LATCH (2 V/div)
xVCC (1 V/div)
0
xVCC (1 V/div)
1
2
3
4
0
5
10
15
20
25
30
35
40
45
t – Time – ms
t – Time – ms
Figure 7. xVCC Propagation Delay and
Rise Time With 1-µF Load, 5-V Switch
Figure 8. xVCC Propagation Delay and
Fall Time With 1-µF Load, 5-V Switch
LATCH (2 V/div)
LATCH (2 V/div)
xVCC (1 V/div)
xVCC (1 V/div)
0
1
2
3
4
5
6
7
8
9
0
Figure 9. xVCC Propagation Delay and
Rise Time With 100-µF Load, 5-V Switch
8
5
10
15
20
25
30
35
40
45
t – Time – ms
t – Time – ms
POST OFFICE BOX 655303
Figure 10. xVCC Propagation Delay and
Fall Time With 100-µF Load, 5-V Switch
• DALLAS, TEXAS 75265
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
PARAMETER MEASUREMENT INFORMATION
LATCH (2 V/div)
LATCH (2 V/div)
xVPP (5 V/div)
xVPP (5 V/div)
0
0.2
0.4 0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
1
2
t – Time – ms
3
4
5
6
7
8
9
t – Time – ms
Figure 11. xVPP Propagation Delay and
Rise Time With 1-µF Load, 12-V Switch
Figure 12. xVPP Propagation Delay and
Fall Time With 1-µF Load, 12-V Switch
LATCH (2 V/div)
LATCH (2 V/div)
xVPP (5 V/div)
xVPP (5 V/div)
0
1
2
3
4
5
6
7
8
9
0
5
t – Time – ms
10
15
20
25
30
35
40
45
t – Time – ms
Figure 13. xVPP Propagation Delay and
Rise Time With 100-µF Load, 12-V Switch
POST OFFICE BOX 655303
Figure 14. xVPP Propagation Delay and
Fall Time With 100-µF Load, 12-V Switch
• DALLAS, TEXAS 75265
9
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
TYPICAL CHARACTERISTICS†
Table of Graphs
FIGURE
IDD
rDS(on)
Supply current
vs Junction temperature
15
Static drain-source on-state resistance, 3-V switch
vs Junction temperature
16
rDS(on)
Static drain-source on-state resistance, 5-V switch
vs Junction temperature
17
rDS(on)
Static drain-source on-state resistance, 12-V switch
vs Junction temperature
18
VO(xVCC)
VO(xVCC)
Output voltage, 5-V switch
vs Output current
19
Output voltage, 3.3-V switch
vs Output current
20
xVPP
Output voltage, Vpp switch
vs Output current
21
ISC(xVCC)
ISC(xVPP)
Short-circuit current, 5-V switch
vs Junction temperature
22
Short-circuit current, 12-V switch
vs Junction temperature
23
SUPPLY CURRENT
vs
JUNCTION TEMPERATURE
100
VO(AVCC) = VO(BVCC) = 5 V
VO(AVPP) = VO(BVPP) = 12 V
No load
I DD – Supply Current – µ A
95
90
ÁÁ
ÁÁ
ÁÁ
85
80
75
– 50
50
0
100
TJ – Junction Temperature – °C
Figure 15
† t = pulse tested
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
150
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
3.3-V SWITCH
5-V SWITCH
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
400
350
VDD = 5 V
VCC = 3.3 V
300
250
200
150
100
50
0
– 50
– 25
25
50
75
100
0
TJ – Junction Temperature – °C
125
r DS(on) – Static Drain-Source On-State Resistance – m Ω
r DS(on) – Static Drain-Source On-State Resistance – m Ω
TYPICAL CHARACTERISTICS†
240
VDD = 5 V
VCC = 5 V
220
200
180
160
140
120
100
80
– 50
– 25
0
25
50
75
100
TJ – Junction Temperature – °C
Figure 17
12-V SWITCH
5-V SWITCH
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
5.05
1700
VDD = 5 V
VCC = 5 V
VDD = 5 V
Vpp = 12 V
5
1500
– 40°C
VO(xVCC) – Output Voltage – V
r DS(on) – Static Drain-Source On-State Resistance – m Ω
Figure 16
125
1300
1100
900
700
500
– 50
4.95
4.9
25°C
4.85
85°C
125°C
4.8
4.75
– 25
0
25
50
75
100
125
0
0.1
TJ – Junction Temperature – °C
Figure 18
0.2
0.3
0.4
0.5
0.6
IO(xVCC) – Output Current – A
0.7
Figure 19
† t = pulse tested
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
TYPICAL CHARACTERISTICS†
3-V SWITCH
Vpp SWITCH
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
12.05
3.35
VDD = 5 V
Vpp = 12 V
3.3
V0(xVPP) – Output Voltage – V
VO(xVCC) – Output Voltage – V
VDD = 5 V
VCC = 3.3.3 V
– 40°C
3.25
25°C
3.2
3.15
3.1
12
– 40°C
25°C
11.95
11.90
85°C
11.85
125°C
125°C
85°C
11.80
3.05
0
0.1
0.2
0.3
0.4
0.5
0.6
0
0.7
0.02
0.04
Figure 20
0.1
0.12
Figure 21
5-V SWITCH
12-V SWITCH
SHORT-CIRCUIT CURRENT
vs
JUNCTION TEMPERATURE
SHORT-CIRCUIT CURRENT
vs
JUNCTION TEMPERATURE
400
2
VDD = 5 V
VCC = 5 V
I SC(xVPP) – Short-Circuit Current – mA
I SC(xVCC) – Short-Circuit Current – A
0.08
IO(xVPP) – Output Current – A
IO(xVCC) – Output Current – A
1.5
1
0.5
– 50
0
50
100
150
VDD = 5 V
Vpp = 12 V
350
300
250
200
150
100
– 50
TJ – Junction Temperature – °C
Figure 22
100
0
50
TJ – Junction Temperature – °C
Figure 23
† t = pulse tested
12
0.06
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
150
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
overview
PC Cards were initially introduced as a means to add EEPROM (flash memory) to portable computers with
limited on-board memory. The idea of add-in cards quickly took hold; modems, wireless LANs, GPS systems,
multimedia, and hard-disk versions were soon available. As the number of PC Card applications grew, the
engineering community quickly recognized the need for a standard to ensure compatibility across platforms.
To this end, the PCMCIA (Personal Computer Memory Card International Association) was established,
comprised of members from leading computer, software, PC card, and semiconductor manufacturers. One key
goal was to realize the plug-and-play concept. Cards and hosts from different vendors should be compatible
and able to communicate with one another transparently.
PC Card power specification
System compatibility also means power compatibility. The most current set of specifications (PC Card Standard)
set forth by the PCMCIA committee states that power is to be transferred between the host and the card through
eight of the PC Card connector’s 68 terminals. This power interface consists of two VCC, two Vpp, and four
ground terminals. Multiple VCC and ground terminals minimize connector-terminal and line resistance. The two
Vpp terminals were originally specified as separate signals but are commonly tied together in the host to form
a single node to minimize voltage losses. Card primary power is supplied through the VCC terminals;
flash-memory programming and erase voltage is supplied through the Vpp terminals. As each terminal is rated
to 0.5 A, VCC and Vpp can theoretically supply up to 1 A, assuming equal terminal resistance and no terminal
failure. A conservative design would limit current to 500 mA. Some applications, however, require higher VCC
currents. Disk drives, for example, may need as much as 750-mA peak current to create the initial torque
necessary to spin up the platter. Vpp currents, on the other hand, are defined by flash-memory programming
requirements, typically under 120 mA.
future power trends
The 1-A physical-terminal current alluded to in the PC Card specification has caused some host-system
engineers to believe they are required to deliver 1 A within the voltage tolerance of the card. Future applications,
such as RF cards, could use the extra power for their radio transmitters. The 5 W required for these cards require
very robust power supplies and special cooling considerations. The limited number of host sockets that are able
to support cards makes the market for these high-powered PC Cards uncertain. The vast majority of the cards
require less than 600 mA continuous current, and the trend is towards even lower powered PC Cards that assure
compatibility with a greater number of host systems. Recognizing the need for power derating, an ad hoc
committee of the PCMCIA is currently working to limit the amount of steady-state dc current to the
PC Card to something less than the currently implied 1 A. When a system is designed to support 1 A, the switch
rDS(on), power-supply requirements, and PC Card cooling need to be carefully considered.
designing around 1-A delivery
Delivering 1 A means minimizing voltage and power losses across the PC Card power interface, which requires
that designers trade off switch resistance and the cost associated with large-die (low rDS(on)) MOSFET
transistors. The PC Card standard requires that 5 V ±5% or 3.3 V ±0.3 V be supplied to the card. The
approximate 10% tolerance for the 3.3-V supply makes the 3.3-V rDS(on) less critical than the 5-V switch. A
conservative approach is to allow 2% for voltage-regulator tolerance and 1% for etch- and pin-resistance drops,
which leaves 2% (100 mV) for voltage drop at the 5-V switch and at least 6% (198 mV) for the 3.3-V switch.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
designing around 1-A delivery (continued)
Calculating the rDS(on) necessary to support a 100 mV or 198 mV switch loss, using R = E/I and setting I = 1 A,
the 5-V and 3.3-V switches would need to be 100 mΩ and 198 mΩ respectively. One solution would be to pay
for a more expensive switch with lower rDS(on). A second, less expensive approach is to increase the headroom
of the power supply—for example, to increase the 5 V supply 1.5% or to 5.075 ±2%. Working through the
numbers once more, the 2% for the regulator plus 1 % for etch and terminal losses leaves 97% or 4.923 V. The
allowable voltage loss across the power distribution switch is now 4.923 V minus 4.750 V or 173 mV. Therefore,
a switch with 173 mΩ or less could deliver 1 A or greater. Setting the power supply high is a common practice
for delivering voltages to allow for system switch connector and etch losses. This practice has a minimal effect
on overall battery life. In the example above, setting the power supply 1.5% high would only decrease a 3-hour
battery life by approximately 2.7 minutes, trivial when compared with the decrease in battery life when running
a 5-W PC Card.
heat dissipation
A greater concern in delivering 1 A or 5 W is the ability of the host to dissipate the heat generated by the PC
Card. For desktop computers the solution is simpler: locate the PC Card cage such that it receives convection
cooling from the forced air of the fan. Notebooks and other handheld equipment will not be able to rely on
convection, but on conduction of heat away from the PC Card through the rails into the card cage. This is difficult
because PC Card/card cage heat transfer is very poor. A typical design scenario would require the PC Card
to be held at 60°C maximum with the host platform operating as high as 50°C. Preliminary testing reveals that
a PC Card can have a 20°C rise, exceeding the 10°C differential in the example, when dissipating less than 2 W
of continuous power. Sixty degrees centigrade was chosen because it is the maximum operating temperature
allowable by PC Card specification. Power handling requirements and temperature rises are topics of concern
and are currently being addressed by the PCMCIA committee.
overcurrent and overtemperature protection
PC Cards are inherently subject to damage that can result from mishandling. Host systems require protection
against short-circuited cards that could lead to power supply or PCB-trace damage. Even systems sufficiently
robust to withstand a short circuit would still undergo rapid battery discharge into the damaged PC Card,
resulting in the rather sudden and unacceptable loss of system power. Most hosts include fuses for protection.
The reliability of fused systems is poor though, as blown fuses require troubleshooting and repair, usually by
the manufacturer.
The TPS2202AI takes a two-pronged approach to overcurrent protection. First, instead of fuses, sense FETs
monitor each of the power outputs. Excessive current generates an error signal that linearly limits the output
current, preventing host damage or failure. Sense FETs, unlike sense resistors or polyfuses, have an added
advantage in that they do not add to the series resistance of the switch and thus produce no additional voltage
losses. Second, when an overcurrent condition is detected, the TPS2202AI asserts a signal at OC that can be
monitored by the microprocessor to initiate diagnostics and/or send the user a warning message. In the event
that an overcurrent condition persists, causing the IC to exceed its maximum junction temperature,
thermal-protection circuitry activates, shutting down all power outputs until the device cools to within a safe
operating region.
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
12-V supply not required
Most PC Card switches use the externally supplied 12-V Vpp power for switch-gate drive and other chip
functions, which requires that power be present at all times. The TPS2202AI offers considerable power savings
by using an internal charge pump to generate the required higher voltages from the 5-V VDD supply; therefore,
the external 12-V supply can be disabled except when needed for flash-memory functions, thereby extending
battery lifetime. Do not ground the 12-V inputs when 12-V supply is not in use. Additional power savings are
realized by the TPS2202AI during a software shutdown in which quiescent current drops to a maximum of
1 µA.
voltage transitioning requirement
PC Cards, like portables, are migrating from 5 V to 3.3 V to minimize power consumption, optimize board space,
and increase logic speeds. The TPS2202AI is designed to meet all combinations of power delivery as currently
defined in the PCMCIA standard. The latest protocol accommodates mixed 3.3-V/5-V systems by first powering
the card with 5 V, then polling it to determine its 3.3-V compatibility. The PCMCIA specification requires that the
capacitors on 3.3-V-compatible cards be discharged to below 0.8 V before applying 3.3-V power. This ensures
that sensitive 3.3-V circuitry is not subjected to any residual 5-V charge and functions as a power reset. The
TPS2202AI offers a selectable VCC and Vpp ground state, in accordance with PCMCIA 3.3-V/5-V switching
specifications, to fully discharge the card capacitors while switching between VCC voltages.
output ground switches
Several PCMCIA power-distribution switches on the market do not have an active-grounding FET switch. These
devices do not meet the PC Card specification requiring a discharge of VCC within 100 ms. PC Card resistance
can not be relied on to provide a discharge path for voltages stored on PC Card capacitance because of possible
high-impedance isolation by power-management schemes. A method commonly shown to alleviate this
problem is to add to the switch output an external 100-kΩ resistor in parallel with the PC Card. Considering that
this is the only discharge path to ground, a timing analysis will reveal that the RC time constant delays the
required discharge time to more than 2 seconds. The only way to ensure timing compatibility with PC Card
standards is to use a power-distribution switch that has an internal ground switch, like that of the TPS22xx family,
or add an external ground FET to each of the output lines with the control logic necessary to select it.
In summary, the TPS2202AI is a complete single-chip dual-slot PC Card power interface. It meets all currently
defined PCMCIA specifications for power delivery in 5-V, 3.3-V, and mixed systems, and offers a serial controller
interface. The TPS2202AI offers functionality, power savings, overcurrent and thermal protection, and fault
reporting in one 30-pin SSOP surface-mount package for maximum value added to new portable designs.
power-supply considerations
The TPS2202AI has multiple pins for each of its 3.3-V, 5-V, and 12-V power inputs and for the switched VCC
outputs. Any individual pin can conduct the rated input or output current. Unless all pins are connected in
parallel, the series resistance is significantly higher than that specified, resulting in increased voltage drops and
lost power. Both 12-V inputs must be connected for proper Vpp switching; it is recommended that all input and
output power pins be paralleled for optimum operation. The VDD input lead must be connected to the 5-V input
leads.
Although the TPS2202AI is fairly immune to power input fluctuations and noise, it is generally considered good
design practice to bypass power supplies typically with a 1-µF electrolytic or tantalum capacitor paralleled by
a 0.047-µF to 0.1-µF ceramic capacitor. It is strongly recommended that the switched VCC and Vpp outputs be
bypassed with a 0.1-µF or larger capacitor; doing so improves the immunity of the TPS2202AI to electrostatic
discharge (ESD). Care should be taken to minimize the inductance of PCB traces between the TPS2202AI and
the load. High switching currents can produce large negative-voltage transients, which forward biases substrate
diodes, resulting in unpredictable performance.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
power-supply considerations (continued)
The TPS2202AI, unlike other PC Card power-interface switches, does not use the 12-V power supply for
switching or other chip functions. Instead, an internal charge pump generates the necessary voltage from VDD,
allowing the 12-V input supply to be shut down except when the Vpp programming or erase voltage is needed.
Careful system design using this feature reduces power consumption and extends battery lifetime.
The 3.3-V power input should not be taken higher than the 5-V input. Though doing so is nondestructive, this
results in high current flow into the device and could result in abnormal operation. In any case, this occurrence
indicates a malfunction of one input voltage or both, which should be investigated.
Similarly, no pin should be taken below – 0.3 V; forward biasing the parasitic-substrate diode results in substrate
currents and unpredictable performance.
RESET or RESET inputs
To ensure that cards are in a known state after power brownouts or system initialization, the PC Cards should
be reset at the same time as the host by applying a low impedance to the VCC and Vpp terminals. A
low-impedance output state allows discharging of residual voltage remaining on PC Card filter capacitance,
permitting the system (host and PC Cards) to be powered up concurrently. The RESET or RESET input will close
internal switches S1, S4, S7, and S10 with all other switches left open (see TPS2202AI control-logic table). The
TPS2202AI remains in the low-impedance output state until the signal is deasserted and further data is clocked
in and latched. RESET or RESET is provided for direct compatibility with systems that use either an active-low
or active-high reset voltage supervisor. The unused pin is internally pulled up or down and should be left
unconnected.
overcurrent and thermal protection
The TPS2202AI uses sense FETs to check for overcurrent conditions in each of the VCC and Vpp outputs. Unlike
sense resistors or polyfuses, these FETs do not add to the series resistance of the switch; therefore, voltage
and power losses are reduced. Overcurrent sensing is applied to each output separately. When an overcurrent
condition is detected, only the power output affected is limited; all other power outputs continue to function
normally. The OC indicator, normally a logic high, is a logic low when any overcurrent condition is detected,
providing for initiation of system diagnostics and/or sending a warning message to the user.
During power up, the TPS2202AI controls the rise time of the VCC and Vpp outputs and limits the current into
a faulty card or connector. If a short circuit is applied after power is established (e.g., hot insertion of a bad card),
current is initially limited only by the impedance between the short and the power supply. In extreme cases, as
much as 10 A to 15 A may flow into the short before the current limiting of the TPS2202AI engages. If the VCC
or Vpp outputs are driven below ground, the TPS2202AI may latch nondestructively in an off state. Cycling power
will reestablish normal operation.
Overcurrent limiting for the VCC outputs is designed to activate, if powered up, into a short in the range of
0.75 A to 1.9 A, typically at about 1.3 A. The Vpp outputs limit from 120 mA to 400 mA, typically around 200 mA.
The protection circuitry acts by linearly limiting the current passing through the switch rather than initiating a full
shutdown of the supply. Shutdown occurs only during thermal limiting.
Thermal limiting prevents destruction of the IC from overheating if the package power-dissipation ratings are
exceeded. Thermal limiting disables all power outputs (both A and B slots) until the device has cooled.
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
calculating junction temperature
The switch resistance, rDS(on), is dependent on the junction temperature, TJ, of the die. The junction temperature
is dependent on both rDS(on) and the current through the switch. To calculate TJ, first find rDS(on) from Figures
16, 17, and 18 using an initial temperature estimate about 50°C above ambient. Then calculate the power
dissipation for each switch, using the formula:
P
D
+ rDS(on)
ǒS
I2
Ǔ)
Next, sum the power dissipation and calculate the junction temperature:
T
J
+
P
D
R
qJA
T , R
A
qJA
+ 108°CńW
Compare the calculated junction temperature with the initial temperature estimate. If the temperatures are not
within a few degrees of each other, recalculate using the calculated temperature as the initial estimate.
logic input and outputs
The serial interface consists of DATA, CLOCK, and LATCH leads. The data is clocked in on the positive leading
edge of the clock (see Figure 2). The 9-bit (D0 through D8) serial data word is loaded during the positive edge
of the latch signal. The latch signal should occur before the next positive leading edge of the clock.
The shutdown bit of the data word places all VCC and Vpp outputs in a high-impedance state and reduces chip
quiescent current to 1 µA to conserve battery power.
The TPS2202AI serial interface is designed to be compatible with serial-interface PCMCIA controllers and
current PCMCIA and Japan Electronic Industry Development Association (JEIDA) standards.
An overcurrent output (OC) is provided to indicate an overcurrent condition in any of the VCC or Vpp outputs as
previously discussed.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
TPS2202AI
S7
S9
S2
3.3V
S3
CS
3.3V
3.3V
17
12V
12V
17
11
51
20
17
21
51
VCC
VCC
Card B
S4
S6
5V
10
CS
CS
5V
Vpp1
Vpp2
9
16
S5
5V
18
52
S8
S1
15
Card A
8
S10
1
S12
30
CS
VCC
22
S11
2
VCC
18
23
52
Vpp1
Vpp2
7
24
Internal
Current Monitor
Supervisor
6
14
RESET
RESET
Thermal
3
4
5
DATA
CLOCK
LATCH
Serial
Interface
25
VDD
Controller
19
13
18
BPWR_GOOD
APWR_GOOD
GND
OC
12
Figure 24. Internal Switching Matrix
18
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
TPS2202AI control logic
AVPP
CONTROL SIGNALS
INTERNAL SWITCH SETTINGS
D8 SHDN
D0 A_VPP_PGM
D1 A_VPP_VCC
S7
1
0
0
1
0
1
1
1
OUTPUT
S8
S9
VAVPP
CLOSED
OPEN
OPEN
0V
OPEN
CLOSED
OPEN
VCC†
0
OPEN
OPEN
CLOSED
VPP(12 V)
1
1
1
OPEN
OPEN
OPEN
Hi-Z
0
X
X
OPEN
OPEN
OPEN
Hi-Z
BVPP
CONTROL SIGNALS
INTERNAL SWITCH SETTINGS
D8 SHDN
D4 B_VPP_PGM
D5 B_VPP_VCC
S10
1
0
0
1
0
1
1
1
OUTPUT
S11
S12
VBVPP
CLOSED
OPEN
OPEN
0V
OPEN
CLOSED
OPEN
VCC‡
0
OPEN
OPEN
CLOSED
VPP(12 V)
1
1
1
OPEN
OPEN
OPEN
Hi-Z
0
X
X
OPEN
OPEN
OPEN
Hi-Z
AVCC
CONTROL SIGNALS
INTERNAL SWITCH SETTINGS
OUTPUT
D8 SHDN
D3 A_VCC3
D2 A_VCC5
S1
S2
S3
VAVCC
1
0
0
CLOSED
OPEN
OPEN
0V
1
0
1
OPEN
CLOSED
OPEN
3.3 V
1
1
0
OPEN
OPEN
CLOSED
5V
1
1
1
CLOSED
OPEN
OPEN
0V
0
X
X
OPEN
OPEN
OPEN
Hi-Z
BVCC
CONTROL SIGNALS
INTERNAL SWITCH SETTINGS
OUTPUT
D8 SHDN
D6 B_VCC3
D7 B_VCC5
S4
S5
S6
VBVCC
1
0
0
CLOSED
OPEN
OPEN
0V
1
0
1
OPEN
CLOSED
OPEN
3.3 V
1
1
0
OPEN
OPEN
CLOSED
5V
1
1
1
CLOSED
OPEN
OPEN
0V
0
X
X
OPEN
OPEN
OPEN
Hi-Z
† Output depends on AVCC
‡ Output depends on BVCC
ESD protection
All TPS2202AI inputs and outputs incorporate ESD-protection circuitry designed to withstand a 2-kV
human-body-model discharge as defined in MIL-STD-883C, Method 3015. The VCC and Vpp outputs can be
exposed to potentially higher discharges from the external environment through the PC Card connector.
Bypassing the outputs with 0.1-µF capacitors protects the devices from discharges up to 10 kV.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
TPS2202AI
DUAL-SLOT PC CARD POWER-INTERFACE SWITCH
WITH RESET FOR SERIAL PCMCIA CONTROLLER
SLVS123B – SEPTEMBER 1995 – REVISED JANUARY 2001
APPLICATION INFORMATION
5V
VDD
AVCC
0.1 µF
AVCC
12 V
12V
AVCC
VCC
VCC
Vpp1
Vpp2
12V
PC Card
Connector A
BVCC
BVCC
BVCC
TPS2202AI
0.1 µF
Vpp1
Vpp2
AVPP
5V
0.1 µF
AVPP
5V
VCC
VCC
PC Card
Connector B
5V
5V
3.3 V
BVPP
0.1 µF
BVPP
3.3V
3.3V
DATA
3.3V
DATA
CLOCK
CLOCK
LATCH
LATCH
RESET
RESET
System Voltage
Supervisor
or
Bus Reset
PCMCIA
Controller
APWR_GOOD
AVPPGOOD
BVPPGOOD
BPWR_GOOD
OC
To CPU
GND
CS
Shutdown Signal
From CPU
Figure 25. Detailed Interconnections and Capacitor Recommendations
20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
ACTIVE
SSOP
DB
30
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2202AIDBG4
ACTIVE
SSOP
DB
30
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2202AIDBLE
OBSOLETE
SSOP
DB
30
TPS2202AIDBR
ACTIVE
SSOP
DB
30
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2202AIDBRG4
ACTIVE
SSOP
DB
30
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2202AIDF
OBSOLETE
SSOP
DF
30
TBD
Call TI
Call TI
TPS2202AIDFLE
OBSOLETE
SSOP
DF
30
TBD
Call TI
Call TI
Call TI
Samples
(Requires Login)
TPS2202AIDB
TBD
(3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPS2202AIDBR
Package Package Pins
Type Drawing
SSOP
DB
30
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
8.2
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.5
2.5
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS2202AIDBR
SSOP
DB
30
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated