FERROXCUBE
DATA SHEET
IIC2-14/4
Integrated inductive components
New data
2008 Sep 01
Ferroxcube
Integrated inductive components
IIC2-14/4
IIC2P-14/4
Effective core parameters
SYMBOL
PARAMETER
VALUE
UNIT
Σ(I/A)
core factor (C1)
2.47
mm−1
Ve
effective volume
338
mm3
Ie
effective length
28.9
mm
Ae
effective area
11.7
mm2
m
mass of core
≈1.85
g
14.4 ± 0.2
0.75
0.75
4.8
max.
4
± 0.08
0.8
max.
2˚ ± 2˚
0.3
1.87
min.
FEATURES
0.75 ± 0.2
0.1
• Inductive SMD component that looks like a standard IC.
• Windings are completed by PCB tracks.
• Suitable for reflow soldering.
detail A
0.51
3
max. 12.5
max.
7.2
± 0.15
identification :
Ikor
Ferroxcube
Batch number
• Partial air gap to resist saturation.
MFP185
APPLICATIONS
• Coupled inductor
3.81
min.
(1)
3.18
0.4
M
Dimensions in mm.
Fig.1 IIC2P-14/4 outline.
IICs with partial air gap for use as power inductors
GRADE
L (µH) FOR 2 TURNS
NO BIAS CURRENT
f = 100 kHz;
T = 25 °C
f = 500 kHz;
T = 25 °C
f = 1 MHz;
T = 25 °C
−
2.8 ± 25 %
−
3F35
TYPE NUMBER
IIC2P-14/4-3F35-E
IICs with partial air gap under power conditions
CORE LOSS (mW) at
GRADE
3F35
f = 100 kHz;
ˆ = 100 mT;
B
T = 100 °C
f = 500 kHz;
ˆ = 50 mT;
B
T = 100 °C
f = 1 MHz;
ˆ = 30 mT;
B
T = 100 °C
−
≤ 40
−
TYPE NUMBER
IIC2P-14/4-3F35-E
(1) The technology utilized in conjunction with the coupled inductor ("the CL") described in this data sheet includes
intellectual property (the "IP") owned by iWatt, Inc. and is covered by one or more of the following U.S. patents :
6,545,450 ; 6,686,727 ; 6,696,823. In connection with the end customer's purchase of the CL from "Ferroxcube USA",
the end customer is hereby granted a non-exclusive, worldwide, royalty-free license (without rights to sublicense) to use
and incorporate the IP in the end customer's product that also incorporates the CL. In no way does this license extend
to customer end products which do not incorporate the CL to implement the IP.
2008 Sep 01
910
Ferroxcube
Integrated inductive components
Leakage inductance
GENERAL DATA
ITEM
IIC2-14/4
SPECIFICATION
2 windings of 1 turn :
≈ 70 nH
Leadframe
material
copper (Cu), nickel (Ni) strike & tin (Sn)
plated (4-8 mm)
Moulding
material
liquid crystal polymer (LCP), flame
retardant in accordance with “ULV94-0”
Solderability
“IEC 60068-2-58”, Part 2, Test Ta,
method 1
Maximum peak current
Taping
method
“IEC 60286-3” and “EIA 481-1”
20 A
Maximum continuous current (DC)
20 A (depending on copper track thickness on PCB).
Rdc
≤ 110 µΩ per turn at 10 A
Isolation voltage
> 500 V (DC) between leads and between leads and ferrite
core.
Isolation resistance
>100 MΩ between leads.
2008 Sep 01
911
Ferroxcube
Integrated inductive components
IIC2-14/4
MOUNTING
Soldering information
300
soldering 10 s max.
CCB814
215 to 280 ¡C
natural cooling
200
180 ¡C
160 ¡C
max.
100
0
α=
10 K/s
max.
60 s min.
1 minute max.
t (s)
Fig.2 Recommended temperature profile for reflow soldering.
RECOMMENDED SOLDER LANDS
1.4
1.1
7.1
3.5 3.2 3.0
10.2
13.0
MFP187
solder paste
solder lands
clearance
Fig.3 Recommended solder lands
2008 Sep 01
912
Ferroxcube
Integrated inductive components
IIC2-14/4
PACKAGING
Tape and reel specifications
All tape and reel specifications are in accordance with the second edition of “IEC 60286-3”. Basic dimensions are given
in Figs 4 and 5, and Table 1.
Blister tape
P0
K0
D0
T
P2
cover tape
W
B0
D3
D2
MFP186
A0
D1
P1
K0: chosen so that the orientation of the component cannot change.
direction of unreeling
For dimensions see Table 1.
Fig.4 Blister tape.
Table 1
Dimensions of blister tape; see Fig.4
SYMBOL
DIMENSIONS
TOL.
UNIT
A0
B0
12.65
14.75
± 0.1
± 0.1
mm
mm
K0
K1
4.85
4.27
± 0.1
± 0.1
mm
mm
W
D0
24
1.55
± 0.3
± 0.05
mm
mm
D1
1.5
± 0.25
mm
D2
D3
3
6.85
P0; note 1
P1
P2
T
mm
mm
4
16
± 0.1
± 0.1
mm
mm
2
0.35
± 0.1
± 0.1
mm
mm
Note
1. P0 pitch tolerance over any 10 pitches is ± 0.2 mm.
2008 Sep 01
913
Ferroxcube
Integrated inductive components
IIC2-14/4
Reel specifications
20.5
12.75
+0.15
0
100
±5
330
±2
CCB816
<28.4
Dimensions in mm.
Fig.5 Reel.
Storage requirements
These storage requirements should be observed in order to ensure the soldering of the exposed electrode:
• Maximum ambient temperature shall not exceed 40 °C. Storage temperature higher than 40 °C could result in the
deformation of packaging materials.
• Maximum relative humidity recommended for storage is 70% RH. High humidity with high temperature can accelerate
the oxidation of the tin-lead plating on the termination and reduce the solderability of the components.
• Products shall not bestored in environments with the presence of harmful gases containing sulfur or chlorine.
2008 Sep 01
914
Ferroxcube
Integrated inductive components
IIC2-14/4
DATA SHEET STATUS DEFINITIONS
DATA SHEET
STATUS
PRODUCT
STATUS
DEFINITIONS
Preliminary
specification
Development
This data sheet contains preliminary data. Ferroxcube reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Ferroxcube reserves the right
to make changes at any time without notice in order to improve design and
supply the best possible product.
DISCLAIMER
Life support applications These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal injury. Ferroxcube customers
using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Ferroxcube
for any damages resulting from such application.
PRODUCT STATUS DEFINITIONS
STATUS
INDICATION
DEFINITION
Prototype
These are products that have been made as development samples for the purposes of
technical evaluation only. The data for these types is provisional and is subject to
change.
Design-in
These products are recommended for new designs.
Preferred
These products are recommended for use in current designs and are available via our
sales channels.
Support
These products are not recommended for new designs and may not be available
through all of our sales channels. Customers are advised to check for availability.
2008 Sep 01
915