Preliminary DATA SHEET FEATURES: 10Gbps 1310nm DML RWG DFB laser Very low power dissipation 50 Ohm impedance matching inside the laser package Differential electrical interface DFB LASER DIODE LC TOSA DFB-1310-10LR-LC The DFB-1310-10LR-LC is specifically designed for applications based on several optical communications standards, including IEEE 10GBASE-LR, STM64, STM64 FEC, 10GFC, 10G GbE, 10G GbE FEC, & 10GFC FEC. Excellent optical performance is achieved by matching the electrical characteristics of the TOSA and laser to the external circuitry. Separate, differential laser bias and modulation pins significantly reduce the amount of electrical power required at the module level, and help to reduce the overall electro-magnetic emissions. The TOSA is designed to be paired with the 10G LR ROSA PIN-1310-10LR-x available at http://www.finisar.com/aoc.php. Anti-wiggle receptacle APPLICATION Designed for SONET and Gigabit Ethernet ♦ Compatible with all 10Gb MSAs (XFP, X2, XPAK, XENPAK) Part Number Description DFB-1310-10LR-LC 10Gb DFB laser in LC TOSA DFB-1310-10LR-LC DFB LC LASER DIODE ABSOLUTE MAXIMUM RATINGS Parameter Rating Storage Temperature -40°C to +85°C Case Operating Temperature -5°C to +85°C Lead Solder Temperature 260°C, 10 seconds Continuous Optical Power 20mW Liode Diode Reverse Voltage 2V Laser Diode Continuous Forward Current 130mA Monitor Photodiode Reverse Current 2mA Monitor Photodiode Reverse Voltage 10V NOTICE: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operations section for extended periods of time may affect reliability. NOTICE: The inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation to equipment, take normal ESD precautions when handling this product DFB-1310-10LR-LC ELECTRICAL-OPTICAL CHARACTERISTICS Unless otherwise stated, all parameters are at TCASE = 25°C, TRANGE, CASE = -5 to 85°C, 10.3125 Gbps, PRBS 231-1 Parameter Threshold Current Test Conditions Symbol T = 25°C ITH Min. Typ. 8 T = 25°C IOP T = 25°C IMOD IF = IOP LOP Slope Efficiency T = 25°C, SMF η Extinction Ratio T = TRANGE 25 -1.0 0.023 LA T = 25°C λ Spectral Width (-20dB) T = TRANGE Δλ 1291 Δλ/ΔT T = TRANGE Transmitter Reflectance Mask Margin -3.5 3.5 Wavelength Side Mode Suppression T = 25°C SMSR ER~4.5dB ER~6.5dB dBm 2 6.5 dB 3 1.5 dB 4 1329 nm 1.0 nm nm/°C 35 dB -25 dB MM 12 10 % 6 ps 6 35 45 Forward Voltage I=IOP, T=TRANGE Vf 1 TOSA Input Resistance I=IOP, T=TRANGE RDIFF 30 Monitor Current T = 25°C, I=IOP, IMON 1.6 V 40 Ohms 25 1000 μA -1.5 1.5 dB 34 Power Tracking Error IMON=Constant TE Monitor Dark Current T=25°C, VB=-2.5V T=TRANGE, VB=-2.5V ID 10 100 nA VB=-2.5V CMON 10 pF Monitor Diode Capacitance Optical Return Loss Tolerance Differential Return Loss Case to Signal Isolation ORL 0.1<f<7.5 GHz 7.5<f<12.5 GHz 5 RL Tr Tf VB=-2.5V mA mW/mA 0.09 T = TRANGE Rise / Fall Time 1 60 Output Power Wavelength temperature coefficient mA 70 T = TRANGE LA (wiggle) Notes mA 35 T = TRANGE Modulation Current Units 35 T = TRANGE Operating Current Max. 12 SDD11 RISO 8 dB -10 -6 10 7 dB K ohms Notes: 1. Operating current is the average bias current required to meet the ER, rise/fall, and bandwidth specifications. The target operating condition is 35 mA over threshold at high temperature, 30mA over threshold at RT. 2. Output power specification is defined into single-mode fiber(SMF 28). 3. TOSA would be capable of meeting other specifications when modulated over this ER range. 4. Maximum change in power as fiber is rotated by 360º. Continued.... DFB-1310-10LR-LC DFB LC LASER DIODE Notes continued... 5. SMSR is measured at Current => Ith + 8mA at -5C, 25C is Ith + 10mA and 85C Ith + 13mA 6. Measured with an optical receiver with a 10.7 Gb/s filter (4th order Bessel-Thomson filter with 3 dB bandwidth = 0.75*bitrate). 7. Includes the impedance matching network and the DFB intrinsic impedance 8. Tracking error is defined as the coupled power difference at Tmax or Tmin (relative to 25°C) where the back monitor current, Imon, is held constant at the value found at 25°C at I=Iop. PIN OUT Number Function 1 Laser BIAS+ 2 MPD Cathode 3 Ground 4 Laser MOD+ 4 Laser MOD- 4 Ground 4 MPD Anode 4 Laser BIAS- INTERNAL SCHEMATIC Pin 1 DFB-1310-10LR-LC TYPICAL PERFORMANCE CHARACTERISTICS 10.7Gbps, SONET Mask -5C FLEX MOUNTING DIMENSIONS Dimensions in Inches -85C DFB-1310-10LR-LC DFB LC LASER DIODE DFB-1310-10LR-SCA LC MOUNTING DIMENSIONS Dimensions in mm [inches] DFB-1310-10LR-LC DFB LC LASER DIODE ADVANCED OPTICAL COMPONENTS AOC CAPABILITIES Finisar’s ADVANCED OPTICAL COMPONENTS division was formed through strategic acquisition of key optical component suppliers. The company has led the industry in high volume Vertical Cavity Surface Emitting Laser (VCSEL) and associated detector technology since 1996. VCSELs have become the primary laser source for optical data communication, and are rapidly expanding into a wide variety of sensor applications. VCSELs’ superior reliability, low drive current, high coupled power, narrow and circularly symmetric beam and versatile packaging options (including arrays) are enabling solutions not possible with other optical technologies. ADVANCED OPTICAL COMPONENTS is also a key supplier of Fabrey-Perot (FP) and Distributed Feedback (DFB) Lasers, and Optical Isolators (OI) for use in single mode fiber data and telecommunications networks ADVANCED OPTICAL COMPONENTS’ advanced capabilities include: 1, 2, 4, 8, and 10Gbps serial VCSEL solutions 1, 2, 4, 8, and 10Gbps serial SW DETECTOR solutions VCSEL and detector arrays 1, 2, 4, 8, and 10Gbps FP and DFB solutions at 1310 and 1550nm 1, 2, 4, 8, and 10Gbps serial LW DETECTOR solutions Optical Isolators from 1260 to 1600nm range Laser packaging in TO46, TO56, and Optical subassemblies with SC, LC, and MU interfaces for communication networks VCSELs operating at 670nm, 780nm, 980nm, and 1310nm in development LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA – Wafer growth and fabrication of 1310 to 1550nm FP and DFB lasers. Sensor packages include surface mount, various plastics, chip on board, chipscale packages, etc. Custom packaging options Shanghai, PRC – Optical passives assembly, including optical isolators and splitters. SALES AND SERVICE Finisar’s ADVANCED OPTICAL COMPONENTS division serves its customers through a worldwide network of sales offices and distributors. For application assistance, current specifications, pricing or name of the nearest Authorized Distributor, contact a nearby sales office or call the number listed below. Phone:1-866-MY-VCSEL USA (toll free) 1-214-509-2700 USA (Direct dial) 44 (0) 174 336 5533 Europe 886-935-409898 China & Taiwan 81-90-4437-1130 Japan 82-11-220-6153 Asia Pacific & Korea Fax: 1-214-509-3709 USA Email: [email protected] WEB: www.finisar.com/aoc.php ©2007 Finisar Corporation. All rights reserved. Finisar is a registered trademark of Finisar Corporation. Features and specifications are subject to change without notice. Rev. C 02/09