SN74CBT16232 SYNCHRONOUS 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER www.ti.com SCDS009N – MAY 1995 – REVISED JUNE 2007 FEATURES • • • DGG OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus™ Family 5-Ω Switch Connection Between Two Ports TTL-Compatible Input and Output Levels 1A 2B1 2B2 3A 4B1 4B2 5A 6B1 6B2 7A 8B1 8B2 GND VCC 9A 10B1 10B2 11A 12B1 12B2 13A 14B1 14B2 15A 16B1 16B2 CLK CLKEN DESCRIPTION/ ORDERING INFORMATION The SN74CBT16232 is a synchronous 16-bit 1-of-2 FET multiplexer/demultiplexer used in applications in which two separate data paths must be multiplexed onto, or demultiplexed from, a single path. Two select (S0 and S1) inputs control the data flow. A clock (CLK) and a clock enable (CLKEN) synchronize the device operation. When CLKEN is high, the bus switch remains in the last clocked function. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1B1 1B2 2A 3B1 3B2 4A 5B1 5B2 6A 7B1 7B2 8A GND VCC 9B1 9B2 10A 11B1 11B2 12A 13B1 13B2 14A 15B1 15B2 16A S0 S1 ORDERING INFORMATION TA –40°C to 85°C PACKAGE SSOP – DL TSSOP – DGG (1) (2) (1) (2) ORDERABLE PART NUMBER Tube SN74CBT16232DL Tape and reel SN74CBT16232DLR Tape and reel SN74CBT16232DGGR TOP-SIDE MARKING CBT16232 CBT16232 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2007, Texas Instruments Incorporated SN74CBT16232 SYNCHRONOUS 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER www.ti.com SCDS009N – MAY 1995 – REVISED JUNE 2007 FUNCTION TABLE INPUTS FUNCTION S1 S0 CLK CLKEN X X X H L L ↑ L Disconnect L H ↑ L A = B1 and A = B2 H L ↑ L A = B1 H H ↑ L A = B2 Last state LOGIC DIAGRAM (POSITIVE LOGIC) 56 1 55 1A 1B1 1B2 25 16B1 28 CLKEN 16A 31 26 16B2 27 CLK 30 S0 D CE CLK S1 29 D CE CLK Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 VI Input voltage range (2) –0.5 7 Continuous channel current IIK θJA Package thermal impedance (3) Tstg Storage temperature range (1) (2) (3) 2 Input clamp current VI < 0 V V 128 mA –50 mA DGG package 64 DL package 56 –65 UNIT 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback SN74CBT16232 SYNCHRONOUS 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER www.ti.com SCDS009N – MAY 1995 – REVISED JUNE 2007 Recommended Operating Conditions (1) MIN MAX 5.5 VCC Supply voltage 4 VIH High-level input voltage 2 VIL Low-level input voltage TA Operating free-air temperature (1) UNIT V V 0.8 V 85 °C –40 All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VIK VCC = 4.5 V, II = –18 mA II VCC = 5.5 V, VI = 5.5 V or GND ICC VCC = 5.5 V, IO = 0, VI = VCC or GND One input at 3.4 V, Other inputs at VCC or GND ΔICC (2) Control inputs VCC = 5.5 V, CI Control inputs VI = 3 V or 0 Cio(OFF) A port B port MAX UNIT –1.2 V ±1 μA 3 μA 2.5 mA 4.5 pF 6.5 VO = 3 V or 0, CLKEN = 0, S0 and S1 = GND VCC = 4 V, TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 14 20 II = 64 mA 5 7 II = 30 mA 5 7 II = 15 mA 10 15 ron (3) VCC = 4.5 V VI = 0 VI = 2.4 V, (1) (2) (3) TYP (1) pF 4 Ω All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) fclock Clock frequency tw Pulse duration tsu Setup time th Hold time VCC = 4 V VCC = 5 V ±0.5 V MIN MIN MAX 150 150 CLK high or low 3.3 3.3 S0, S1 before CLK↑ 2.2 1.9 CLKEN before CLK↑ 2.4 1.9 S0, S1 after CLK↑ 0.5 1 CLKEN after CLK↑ 1.9 1.8 Submit Documentation Feedback UNIT MAX MHz ns ns ns 3 SN74CBT16232 SYNCHRONOUS 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER www.ti.com SCDS009N – MAY 1995 – REVISED JUNE 2007 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) TO (OUTPUT) tpd (1) A or B B or A 0.35 tpd CLK A or B 6.7 ten CLK tdis CLK fmax (1) 4 VCC = 5 V ±0.5 V VCC = 4 V FROM (INPUT) PARAMETER MIN MAX 150 MIN UNIT MAX 150 MHz 0.25 ns 2 5.8 ns A, B1, B2 7.2 1.8 6.2 B1 and B2 8.5 3.1 7.9 A or B 6.3 1.9 6.2 The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). Submit Documentation Feedback ns ns SN74CBT16232 SYNCHRONOUS 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER www.ti.com SCDS009N – MAY 1995 – REVISED JUNE 2007 PARAMETER MEASUREMENT INFORMATION 7V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V Output Control LOAD CIRCUIT 1.5 V 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V tPLZ 3.5 V 1.5 V 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) tPHZ VOH 1.5 V VOH − 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74CBT16232DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBT16232DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16232DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16232DL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16232DLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16232DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16232DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74CBT16232DGGR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 SN74CBT16232DLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBT16232DGGR TSSOP DGG 56 2000 346.0 346.0 41.0 SN74CBT16232DLR SSOP DL 56 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). 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