HT68F03M/HT68F04M/HT66F03M/HT66F04M 1.5V Battery Flash Type 8-Bit MCU with EEPROM & DC-DC Converter Features MCU Features · EEPROM Memory: 64´8 · Operating voltage: 3.0V (typ.) · Watchdog Timer function · Power down and wake-up functions to reduce · Up to 8 bidirectional I/O lines · External interrupt line shared with I/O pin power consumption · Five oscillators: - External High Speed Xtal - External 32.768kHz Xtal - External RC - Internal High Speed -- no ext. components - Internal 32kHz -- no ext. components · Multiple Timer Module for time measure, input capture, compare match output, PWM output or single pulse output functions · Comparator function · Dual Time-Base functions for generation of fixed time interrupt signal · Multi-mode operation: NORMAL, SLOW, IDLE and · Low voltage reset function SLEEP · Low voltage detect function · Fully integrated internal 4MHz, 8MHz and 12MHz · Multi-channel 12-bit resolution A/D converter · All instructions executed in one or two instruction cycles DC-DC converter Features · Table read instructions · 3.0V ± 2.5% output voltage · 63 powerful instructions · 0.7V start-up voltage · Up to 8 subroutine nesting levels · Output current up to 100mA · Bit manipulation instruction · High efficiency: 85% (typ.) at VOUT=3V · Flash Program Memory: 1K´14 ~ 2K´15 · RAM Data Memory: 64´8 ~ 96´8 General Description An extensive choice of oscillator functions is provided including a fully integrated system oscillator which requires no external components for its implementation. The ability to operate and switch dynamically between a range of operating modes using different clock sources gives users the ability to optimise microcontroller operation and minimise power consumption. The devices also include flexible I/O programming features Time-Base functions and a range of other features. This series of devices are Flash Memory type 8-bit high performance RISC architecture microcontrollers. Offering users the convenience of Flash Memory multi-programming features, these devices also include a wide range of functions and features, among which is their internal DC-DC Converter allowing low voltage operation. In addition to their Flash Program Memory there is also area of RAM Data Memory and an area of EEPROM memory for storage of non-volatile data such as serial numbers, calibration data etc. The internal PFM type step-up DC-DC Converter allows the MCU to be powered from low voltage sources, and has the advantages of high efficiency and low ripple. With a fixed and accurate 3.0V output voltage and extremely low 0.7V start-up voltage, these MCU devices will be especially suitable for battery-powered applications, portable handheld equipment etc. Analog features include a multi-channel 12-bit A/D converter and comparator functions. Multiple and extremely flexible Timer Modules provide timing, pulse generation and PWM generation functions. Protective features such as an internal Watchdog Timer, Low Voltage Reset and Low Voltage Detector coupled with excellent noise immunity and ESD protection ensure that reliable operation is maintained in hostile electrical environments. Rev. 1.10 1 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Selection Table Most features are common to all devices, the main feature distinguishing them are Memory capacity, A/D Converter, Timer Module types and stack capacity. The following table summarises the main features of each device. Part No. Program Memory Data Memory Data EEPROM I/O Ext. Int. A/D Timer Module Comparator DC-DC Converter Stack Package HT68F03M 1K´14 64´8 64´8 8 1 ¾ 10-bit CTM´1, 10-bit STM´1 1 Ö 4 16NSOP HT68F04M 2K´15 96´8 64´8 8 1 ¾ 10-bit CTM´1, 10-bit STM´1 1 Ö 8 16NSOP HT66F03M 1K´14 64´8 64´8 8 1 12-bit´4 10-bit CTM´1, 10-bit STM´1 1 Ö 4 16NSOP HT66F04M 2K´15 96´8 64´8 8 1 12-bit´4 10-bit CTM´1, 10-bit ETM´1, 10-bit STM´1 1 Ö 8 16NSOP Block Diagram The following block diagram illustrates the dual-chip structure of the devices, where an individual MCU and DC-DC Converter devices are combined into a single package. V D D V O U T H T 6 6 F 0 x H T 6 8 F 0 x H T 7 7 3 0 P A 0 /C + /A N 0 P A 1 /C -/A N 1 /V R E F P A 2 /C X /[T P 0 ]/A N 2 P A 3 /IN T /T C K 1 /T P 0 /A N 3 P A 4 /T C K 0 /T P 1 L X C E P A 5 /[T P 0 ]/O S C 2 P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S V S S G N D Internal Chip Interconnection Diagram Note that the HT68F0x devices do not contain VREF or ANx A/D converter pins. Rev. 1.10 2 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M L o w V o lta g e D e te c t R e s e t C ir c u it L o w V o lta g e R e s e t F la s h /E E P R O M P r o g r a m m in g C ir c u itr y D C -D C C o n v e rte r W a tc h d o g T im e r 8 - b it R IS C M C U C o re In te rru p t C o n tr o lle r E x te rn a l R C /X ta l O s c illa to r s S ta c k F la s h P ro g ra m M e m o ry E E P R O M D a ta M e m o ry In te rn a l R C O s c illa to r R A M D a ta M e m o ry T im e B a s e 1 2 - B it A /D C o n v e rte r C o m p a ra to rs T im e r M o d u le s I/O Note that the HT68F0x devices do not contain an A/D converter. Pin Assignment N C 1 1 6 N C P A 3 /IN T /T C K 1 /T P 0 2 1 5 P A 4 /T C K 0 /T P 1 P A 2 /C X /[T P 0 ] 3 1 4 P A 1 /C 4 P A 0 /C + N C 1 1 6 N C P A 3 /IN T /T C K 1 /T P 0 /A N 3 2 1 5 P A 4 /T C K 0 /T P 1 P A 5 /[T P 0 ]/O S C 2 P A 2 /C X /[T P 0 ]/A N 2 3 1 4 P A 5 /[T P 0 ]/O S C 2 1 3 P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1 P A 1 /C -/A N 1 /V R E F 4 1 3 P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1 5 1 2 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S P A 0 /C + /A N 0 5 1 2 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S V S S 6 1 1 V D D V S S & A V S S 6 1 1 V D D G N D 7 1 0 P W D N G N D 7 1 0 P W D N 8 9 V O U T L X 8 9 V O U T L X H T 6 8 F 0 3 M /H T 6 8 F 0 4 M 1 6 N S O P -A & A V D D H T 6 6 F 0 3 M 1 6 N S O P -A N C 1 1 6 N C P A 3 /IN T /T C K 1 /[T C K 2 ]/T P 0 /A N 3 2 1 5 P A 4 /T C K 0 /T P 1 P A 2 /C X /[T C K 2 ]/[T P 0 ]/[T P 2 B ]/A N 2 3 1 4 P A 5 /[T C K 2 ]/[T P 0 ]/T P 2 B /O S C 2 P A 1 /[T P 2 A ]/C -/A N 1 /V R E F 4 1 3 P A 6 /[T C K 0 ]/[T P 1 ]/T P 2 A /O S C 1 P A 0 /[T P 2 B ]/C + /A N 0 5 1 2 P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/[T P 2 A ]/R E S V S S & A V S S 6 1 1 V D D G N D 7 1 0 P W D N L X 8 9 V O U T & A V D D H T 6 6 F 0 4 M 1 6 N S O P -A Rev. 1.10 3 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Pin Description HT68F03M/HT68F04M Pin Name Function PA0~PA7 Port A C- Comparator input C+ Comparator input OP I/T O/T PAWU PAPU ST CMOS Pin-Shared Mapping ¾ AN ¾ PA1 CPC CPC AN ¾ PA0 PA2 CX Comparator output ¾ CMOS TCK0 TM0 input PRM ST ¾ PA4, PA6 or PA7 TCK1 TM1 input PRM ST ¾ PA3 or PA7 TP0 TM0 I/O PRM ST CMOS PA3, PA5 or PA2 TP1 TM1 I/O PRM ST CMOS PA4, PA6 or PA7 INT External Interrupt PRM ST ¾ PA3 or PA7 OSC1 HXT/ERC/LXT pin CO HXT/LXT ¾ PA6 OSC2 HXT/LXT pin CO ¾ RES Reset pin CO ST ¾ PA7 VDD Power supply ¾ PWR ¾ ¾ VSS Ground ¾ PWR ¾ ¾ LX Switching input pin ¾ PWR ¾ ¾ VOUT DC-DC converter output pin ¾ PWR ¾ ¾ ¾ ¾ HXT/LXT PA5 CE DC-DC converter chip enable, active high ¾ NS GND Ground ¾ PWR ¾ ¾ NC Not connected ¾ ¾ ¾ ¾ Note: I/T: Input type O/T: Output type OP: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input NS: non-standard input CMOS: CMOS output NMOS: NMOS output SCOM: Software controlled LCD COM AN: Analog input pin HXT: High frequency crystal oscillator LXT: Low frequency crystal oscillator Rev. 1.10 4 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M HT66F03M Pin Name Function OP I/T O/T ST CMOS Pin-Shared Mapping PA0~PA7 Port A PAWU PAPU AN0~AN3 A/D converter input ACERL AN ¾ PA0~PA3 VREF A/D converter reference input ADCR1 AN ¾ PA1 C- Comparator input AN ¾ PA1 C+ Comparator input AN ¾ PA0 CX Comparator output ¾ CMOS PA2 TCK0 TM0 input PRM ST ¾ TCK1 TM1 input PRM ST ¾ TP0 TM0 I/O PRM ST CMOS PA3, PA5 or PA2 TP1 TM1 I/O PRM ST CMOS PA4, PA6 or PA7 INT External interrupt ¾ ST ¾ PA3 or PA7 OSC1 HXT/ERC/LXT pin CO HXT/LXT ¾ PA6 OSC2 HXT/LXT pin CO ¾ RES Reset input CO ST ¾ PA7 VDD MCU power supply ¾ PWR ¾ ¾ AVDD A/D converter power supply * ¾ PWR ¾ ¾ ¾ VSS MCU ground AVSS A/D converter ground ** LX Switching input pin CPC ¾ PA4, PA6 or PA7 PA3 or PA7 HXT/LXT PA5 PWR ¾ ¾ PWR ¾ ¾ ¾ PWR ¾ ¾ VOUT DC-DC converter output pin ¾ PWR ¾ ¾ CE DC-DC converter chip enable, active high ¾ NS ¾ ¾ GND Ground ¾ PWR ¾ ¾ NC Not connected ¾ ¾ ¾ ¾ Note: I/T: Input type O/T: Output type OP: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input NS: non-standard input CMOS: CMOS output NMOS: NMOS output SCOM: Software controlled LCD COM AN: Analog input pin HXT: High frequency crystal oscillator LXT: Low frequency crystal oscillator *: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded together internally with VDD. **: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally with VSS. Rev. 1.10 5 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M HT66F04M Pin Name Function OP I/T O/T ST CMOS Pin-Shared Mapping PA0~PA7 Port A PAWU PAPU AN0~AN3 A/D converter input ACERL AN ¾ PA0~PA3 VREF A/D converter reference input ADCR1 AN ¾ PA1 C- Comparator input AN ¾ PA1 C+ Comparator input AN ¾ PA0 CX Comparator output ¾ CMOS PA2 TCK0 TM0 input PRM ST ¾ PA4, PA6 or PA7 TCK1 TM1 input PRM ST ¾ PA3 or PA7 TCK2 TM2 input PRM ST ¾ PA3, PA5 or PA2 TP0 TM0 I/O PRM ST CMOS PA3, PA5 or PA2 TP1 TM1 I/O PRM ST CMOS PA4, PA6 or PA7 TP2A TM2 I/O PRM ST CMOS PA6, PA1 or PA7 TP2B TM2 I/O PRM ST CMOS PA5, PA0 or PA2 INT External interrupt ¾ ST ¾ PA3 or PA7 OSC1 HXT/ERC/LXT pin CO HXT/LXT ¾ PA6 OSC2 HXT/LXT pin CO ¾ RES Reset input CO ST ¾ PA7 VDD MCU power supply ¾ PWR ¾ ¾ CPC ¾ HXT/LXT PA5 AVDD A/D converter power supply * ¾ PWR ¾ ¾ VSS MCU ground ¾ PWR ¾ ¾ AVSS A/D converter ground ** PWR ¾ ¾ LX Switching input pin ¾ PWR ¾ ¾ VOUT DC-DC converter output pin ¾ PWR ¾ ¾ CE DC-DC converter chip enable, active high ¾ NS ¾ ¾ GND Ground ¾ PWR ¾ ¾ NC Not connected ¾ ¾ ¾ ¾ Note: I/T: Input type O/T: Output type OP: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input NS: non-standard input CMOS: CMOS output NMOS: NMOS output SCOM: Software controlled LCD COM AN: Analog input pin HXT: High frequency crystal oscillator LXT: Low frequency crystal oscillator *: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded together internally with VDD. **: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally with VSS. Rev. 1.10 6 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Functional Description As these device packages contain multiple internal chips, for a detailed functional description, users must refer to the relevant individual datasheets for both the MCU and the DC-DC Converter. The following table shows which individual devices are inside each package. Device MCU DC-DC Converter HT68F03M HT68F03 HT7730 HT68F04M HT68F04 HT7730 HT66F03M HT66F03 HT7730 HT66F04M HT66F04 HT7730 DC-DC Converter output pin, VOUT is also not connected to the MCU power supply pin, VDD, so these two pins should also be connected together externally. If the DC-DC Converter is used to power the MCU, then the MCU will always have a power supply of 3V, so care must be taken to only consult the MCU characteristics specified at this power supply voltage. If required, the MCU can be supplied directly on its VDD pin by an external power source if the DC-DC converter is not used. When calculating the total current consumption of the device, the internal DC specifications of the two internal chips must be consulted and the individual currents added together. As the MCU power supply may be supplied by the DC-DC Converter it is important to note that if the MCU is powered down or placed into a low power mode to conserve power, that the DC-DC Converter will continue running and will consume a certain amount of power. The DC-DC Converter can of course be powered down by pulling its CE pin low, however as its output voltage falls toward zero, the MCU will experience a reset. The CE pin must therefore be held low for sufficient time to allow the VOUT voltage to fall to a level where the MCU will be properly reset before being powered up again. Multi-chip Internal Devices Although most of the functional description material will be located in the individual datasheets, there are some special considerations which need to be taken into account when using multi-chip devices. These points will be mentioned in the hardware and software consideration sections. Multi-chip Hardware Considerations As these single-package multi-chip devices are composed of an individual MCU and DC-DC converter chips, using them together requires the user to take care of some special points. Multi-chip Programming Considerations As there are no internal signal connections between the two internal chips there are no real programming considerations for these devices. It is only necessary to realise that if the MCU is switched into any of its low power modes or executes the HALT instruction by the application program to reduce power consumption, that the DC-DC Converter will continue operating and therefore contribute to the overall power consumption. The DC-DC Converter can only be powered-down manually using its CE pin and if this is done the MCU will be reset. · Absolute Maximum Ratings The Absolute Maximum Ratings for the two individual chips must be checked for discrepancies and the necessary care taken in device handling and usage. · Power Supply Examination of the block diagram will reveal that the DC-DC Converter Ground pin, GND, has no internal connection to the MCU Ground pin, VSS. For this reason these two pins must be connected externally. The Rev. 1.10 7 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Application Circuits HT68F03M/HT68F04M Application Circuit 0 .0 1 m F * * 0 .1 m F V D D R e s e t C ir c u it 1 0 k W ~ 1 0 0 k W 1 N 4 1 4 8 * 0 .1 ~ 1 m F 3 0 0 W * R E S V S S O S C C ir c u it S e e O s c illa to r S e c tio n V IN Note: P A 0 P A 1 P A 2 P A 3 P A 4 O S C 1 O S C 2 G N D L X C E V O U T ²*² Recommended component for added ESD protection. ²**² Recommended component in environments where power line noise is significant. Rev. 1.10 8 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M HT66F03M/HT66F04M Application Circuit 0 .0 1 m F * * 0 .1 m F V D D R e s e t C ir c u it 1 0 k W ~ 1 0 0 k W 1 N 4 1 4 8 * 0 .1 ~ 1 m F 3 0 0 W * R E S V S S O S C C ir c u it S e e O s c illa to r S e c tio n V IN Note: P A 0 P A 1 P A 2 P A 3 /A N /A N /A N /A N P A 0 1 2 3 4 O S C 1 O S C 2 G N D L X C E V O U T ²*² Recommended component for added ESD protection. ²**² Recommended component in environments where power line noise is significant. Rev. 1.10 9 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Package Information 16-pin NSOP (150mil) Outline Dimensions 1 6 A 9 B 8 1 C C ' G H D E a F · MS-012 Symbol Nom. Max. A 0.228 ¾ 0.244 B 0.150 ¾ 0.157 C 0.012 ¾ 0.020 C¢ 0.386 ¾ 0.402 D ¾ ¾ 0.069 E ¾ 0.050 ¾ F 0.004 ¾ 0.010 G 0.016 ¾ 0.050 H 0.007 ¾ 0.010 a 0° ¾ 8° Symbol A Rev. 1.10 Dimensions in inch Min. Dimensions in mm Min. Nom. Max. 5.79 ¾ 6.20 B 3.81 ¾ 3.99 C 0.30 ¾ 0.51 C¢ 9.80 ¾ 10.21 D ¾ ¾ 1.75 E ¾ 1.27 ¾ F 0.10 ¾ 0.25 G 0.41 ¾ 1.27 H 0.18 ¾ 0.25 a 0° ¾ 8° 10 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 16N (150mil) Symbol Description Dimensions in mm A Reel Outer Diameter 330.0±1.0 B Reel Inner Diameter 100.0±1.5 C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.10 13.0 +0.5/-0.2 2.0±0.5 16.8 +0.3/-0.2 22.2±0.2 11 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Carrier Tape Dimensions P 0 D P 1 t E F W B 0 C D 1 P K 0 A 0 R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . SOP 16N (150mil) Symbol Description Dimensions in mm W Carrier Tape Width 16.0±0.3 P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 7.5±0.1 D Perforation Diameter 1.55 +0.10/-0.00 D1 Cavity Hole Diameter 1.50 +0.25/-0.00 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.5±0.1 B0 Cavity Width 10.3±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 13.3±0.1 Rev. 1.10 12 May 24, 2010 HT68F03M/HT68F04M/HT66F03M/HT66F04M Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2010 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.10 13 May 24, 2010