184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. (FBGA) This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a high performance 8-byte interface in 5.25" width form factor of industry standard. It is suitable for easy interchange and addition. FEATURES • JEDEC Standard 184-pin dual in-line memory module (DIMM) • Programmable Burst Length 2 / 4 / 8 with both sequential and interleave mode • One rank 128M x 72, 64M x 72 organization • • Error Check Correction (ECC) Capability Edge-aligned DQS with data outs and Center-aligned DQS with data inputs • 2.6V ± 0.1V VDD and VDDQ Power supply for DDR400 and 2.5V ± 0.2V for DDR333 • Auto refresh and self refresh supported • 8192 refresh cycles / 64ms • All inputs and outputs are compatible with SSTL_2 interface • Serial Presence Detect (SPD) with EEPROM • • Fully differential clock operations (CK & /CK) with 166/200MHz Built with 512Mb DDR SDRAMs in 60 ball FBGA packages • • DLL aligns DQ and DQS transition with CK transition Lead-free product listed for each configuration (RoHS compliant) • Programmable CAS Latency: DDR333(2.5 clock), DDR400(3 clock) ADDRESS TABLE Organization Ranks SDRAMs # of DRAMs # of row/bank/column Address Refresh Method 512MB 64M x 72 1 64Mb x 8 9 13(A0~A12)/2(BA0,BA1)/11(A0~A9,A11) 8K / 64ms 1GB 128M x 72 1 128Mb x 4 18 13(A0~A12)/2(BA0,BA1)/12(A0~A9,A11,A12) 8K / 64ms PREFORMANCE Part-Number Suffix -D431 -J Unit Speed Bin DDR400B DDR333 - 3-3-3 2.5-3-3 CK CL=3 200 - MHz CL=2.5 166 166 MHz CL=2 133 133 MHz CL - tRCD- tRP Max Clock Frequency Note: 1. 2.6V ± 0.1V VDD and VDDQ Power supply for DDR400 and 2.5V ± 0.2V for DDR333 Rev. 1.1 /May. 2005 1 This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied. 184pin Registered DDR SDRAM DIMMs ORDERING INFORMATION Part Number HYMD564G726BF8N-D43/J Density Organization 512MB 64M x 8 # of DRAMs Material DIMM Dimension 9 Normal 133.35 x 28.575 x 2.99 [mm3] ↑ HYMD564G726BFP8N-D43/J 512MB 64M x 8 9 Pb-free1 HYMD512G726BF4N-D43/J 1GB 128M x 4 18 Normal 133.35 x 28.575 x 3.99 [mm3] HYMD512G726BFP4N-D43/J 1GB 128M x 4 18 Pb-free1 ↑ Note: 1. The “Pb-free” products contain Lead less than 0.1% by weight and satisfy RoHS - please contact Hynix for product availability. * These products are built with HY5DU124(8)22BF[P], the Hynix DDR SDRAM component. Rev.1.1 /May. 2005 2 184pin Registered DDR SDRAM DIMMs PIN DESCRIPTION Pin CK0, /CK0 /CS0, /CS1 CKE0, CKE1 /RAS, /CAS, /WE A0 ~ A13 A10/AP BA0, BA1 DQ0~DQ63 CB0~CB7 DQS0~DQS8 DM0~8 Pin Description Pin Differential Clock Inputs Chip Select Inputs Clock Enable Inputs Commend Sets Inputs Address Inputs Address Input/Autoprecharge Bank Address Data Inputs/Outputs Data Check bits Data Strobes Data-in Masks Pin Description VDD VDDQ VSS VREF VDDSPD VDDID SA0~SA2 SCL SDA DU NC TEST Power Supply for Core and I/O Power Supply for DQs Ground Input/Output Reference Power Supply for SPD VDD, VDDQ Level Detection SPD Address Inputs SPD Clock Input SPD Data Input/Output Do not Use No Connect Reserved for test equipment use PIN ASSIGNMENT Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Name VREF DQ0 VSS DQ1 DQS0 DQ2 VDD DQ3 NC NC VSS DQ8 DQ9 DQS1 VDDQ NC,CK1 NC,/CK1 VSS DQ10 DQ11 CKE0 VDDQ DQ16 DQ17 DQS2 VSS A9 DQ18 A7 VDDQ DQ19 Pin 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 Name A5 DQ24 VSS DQ25 DQS3 A4 VDD DQ26 DQ27 A2 VSS A1 CB0 CB1 VDD DQS8 A0 CB2 VSS CB3 BA1 Key DQ32 VDDQ DQ33 DQS4 DQ34 VSS BA0 DQ35 DQ40 Pin 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 Name VDDQ /WE DQ41 /CAS VSS DQS5 DQ42 DQ43 VDD NC,/CS2 DQ48 DQ49 VSS NC,/CK2 NC,CK2 VDDQ DQS6 DQ50 DQ51 VSS VDDID DQ56 DQ57 VDD DQS7 DQ58 DQ59 VSS NC SDA SCL Pin 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 Name VSS DQ4 DQ5 VDDQ DM0,DQS9 DQ6 DQ7 VSS NC NC,TEST NC,/FETEN VDDQ DQ12 DQ13 DM1,DQS10 VDD DQ14 DQ15 CKE1 VDDQ NC,BA2 DQ20 NC,A12 VSS DQ21 A11 DM2,DQS11 VDD DQ22 A8 DQ23 Pin 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 Name VSS A6 DQ28 DQ29 VDDQ DM3,DQS12 A3 DQ30 VSS DQ31 CB4 CB5 VDDQ CK0 /CK0 VSS DM8,DQS17 A10 CB6 VDDQ CB7 Key VSS DQ36 DQ37 VDD DM4,DQS13 DQ38 DQ39 VSS DQ44 Pin 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 Name /RAS DQ45 VDDQ /CS0 /CS1 DM5,DQS14 VSS DQ46 DQ47 NC,/CS3 VDDQ DQ52 DQ53 NC,A13 VDD DM6 DQ54 DQ55 VDDQ NC DQ60 DQ61 VSS DM7,DQS16 DQ62 DQ63 VDDQ SA0 SA1 SA2 VDDSPD note: 1. Pins 111, 158 are not used for single rank module. 2. Pin 167 is “NC” for 256MB, 512MB and 1GB or “A13” for 2GB module. 3. Pins 16, 17, 75, 71, 76, 102, 103, 113, 163 are not used on this module. Rev.1.1 /May. 2005 3 184pin Registered DDR SDRAM DIMMs FUNCTIONAL BLOCK DIAGRAM 512MB, 64Mb x 72 ECC Registered DIMM: HYMD564G726BF[P]8N /RS0 DQS0 DM0 DQS4 DM4 DM I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 DQ00 DQ01 DQ02 DQ03 DQ04 DQ05 DQ06 DQ07 /CS DQS D0 DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DM I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 /CS DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DM I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 DM I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 /CS DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DM I/O0 I/O1 /CS I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 D7 DQS D4 DQS5 DM5 DQS1 DM1 DM I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 DQ08 DQ09 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 /CS DQS D1 DQS2 DM2 /CS DQS D5 DQS6 DM6 DM I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 /CS DQS D2 DQS3 DM3 DQS D6 DQS7 DM7 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 DM I/O0 I/O1 /CS I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 D3 DM I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 /CS DQS DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 DQS8 DM8 DQS VDDSPD CB0 CB1 CB2 CB3 CB4 CB5 CB6 CB7 /S R E G I S T E R BA0-BA1 A0-A13 /RAS /CAS CKE /WE PCK Serial PD DQS SCL D8 SDA WP A0 A1 A2 SA0 SA1 SA2 Serial PD VDDQ DO-D8 VDD DO-D8 VREF DO-D8 VSS VDDID DO-D8 Strap:see Note 4 /RS0->/CSO : SDRAMs D0-D8 RBA0-RBA1-> : BA0->BA1 : SDRAMs D0-D8 RA0-RA13-> : A0->A13 : SDRAMs D0-D8 /RRAS->/RAS : SDRAMs D0-D8 /RCAS->/CAS : SDRAMs D0-D8 RCKEO->CKE : SDRAMs D0-D8 /RWE->WE : SDRAMs D0-D8 /RESET /PCK Note : 1. DQ-to-I/O wiring may be changed within a byte. 2. DQ/DQS/DM/CKE/S relationships must be maintained as shown. 3. DQ/DQS resistors should be 22 Ohms. 4. VDDID strap connections (for memory device VDD, VDDQ) : STRAP OUT (OPEN) : VDD = VDDQ STRAP IN (VSS) : VDD ≠ VDDQ 5. SDRAM placement alternates between the back and front sides of the DIMM. 6. Address and control resistors should be 22 Ohms. CKO, /CKO------PLL* * Wire per Clock Loading Table/Wiring Diagram Rev.1.1 /May. 2005 4 184pin Registered DDR SDRAM DIMMs FUNCTIONAL BLOCK DIAGRAM 1GB, 128Mb x 72 ECC Registered DIMM: HYMD512G726BF[P]4N VSS /RS0 DQS0 DM0/DQS9 DQ0 DQ1 DQ2 DQ3 DQS /CS I/O0 I/O1 I/O2 I/O3 DM DQ8 DQ9 DQ10 DQ11 DQS /CS I/O0 I/O1 I/O2 I/O3 DM DQ16 DQ17 DQ18 DQ19 DQS /CS I/O0 I/O1 I/O2 I/O3 DM DQ24 DQ25 DQ26 DQ27 DQS /CS I/O0 I/O1 I/O2 I/O3 DM DQ32 DQ33 DQ34 DQ35 DQS /CS I/O0 I/O1 I/O2 I/O3 DM DQ40 DQ41 DQ42 DQ43 DQS /CS I/O0 I/O1 I/O2 I/O3 DM DQ48 DQ49 DQ50 DQ51 DQS /CS I/O0 I/O1 I/O2 I/O3 DM DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DM DQ12 DQ13 DQ14 DQ15 DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DM DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DM DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DM DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DM DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DM DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DM D0 DQS1 D9 DM1/DQS10 D1 DQS2 D10 DM2/DQS11 DQ20 DQ21 DQ22 DQ23 D2 DQS3 D11 DM3/DQS12 DQ28 DQ29 DQ30 DQ31 D3 DQS4 D12 DM4/DQS13 DQ36 DQ37 DQ38 DQ39 D4 DQS5 D13 DM5/DQS14 DQ44 DQ45 DQ46 DQ47 D5 DQS6 D14 DM6/DQS15 VDDSPD DQ52 DQ53 DQ54 DQ55 D6 DQS7 D15 Serial PD VDDQ DO-D8 VDD DO-D8 VREF DO-D8 DM7/DQS16 DQS /CS I/O0 I/O1 I/O2 I/O3 DQ56 DQ57 DQ58 DQ59 DM DQS /CS I/O0 I/O1 D0 I/O2 I/O3 DQ60 DQ61 DQ62 DQ63 D7 DM DO-D8 VSS VDDID D16 Strap:see Note 4 Serial PD DQS8 DM8/DQS17 DQS /CS I/O0 I/O1 I/O2 I/O3 CB0 CB1 CB2 CB3 /S0 BA0-BA1 A0-A13 /RAS /CAS CKE /WE PCK /PCK DM D8 R E G I S T E R DQS /CS I/O0 I/O1 D0 I/O2 I/O3 CB4 CB5 CB6 CB7 D17 DM SCL SDA WP A0 A1 A2 SA0 SA1SA2 /RS->/CS : SDRAMs D0-D17 RBA0-RBA1-> : BA0->BA1 : SDRAMs D0-D17 RA0-RA13-> : A0->A13 : SDRAMs D0-D17 /RRAS->/RAS : SDRAMs D0-D17 /RCAS->/CAS : SDRAMs D0-D17 RCKEA->CKE : SDRAMs D0-D17 /RWE->WE : SDRAMs D0-D17 /RESET CKO, /CKO------PLL* * Wire per Clock Loading Table/Wiring Diagram Rev.1.1 /May. 2005 DQ4 DQ5 DQ6 DQ7 Note : 1. DQ-to-I/O wiring may be changed within a byte. 2. DQ/DQS/DM/CKE/S relationships must be maintained as shown. 3. DQ/DQS resistors should be 22 Ohms. 4. VDDID strap connections (for memory device VDD, VDDQ) : STRAP OUT (OPEN) : VDD = VDDQ STRAP IN (VSS) : VDD ≠ VDDQ 5. Address and control resistors should be 22 Ohms. 5 184pin Registered DDR SDRAM DIMMs ABSOLUTE MAXIMUM RATINGS1 Parameter Operating Temperature (Ambient) Storage Temperature Voltage on VDD relative to VSS Symbol Rating Unit TA 0 ~ 70 oC TSTG -55 ~ 150 oC VDD -1.0 ~ 3.6 V Voltage on VDDQ relative to VSS VDDQ -1.0 ~ 3.6 V Voltage on inputs relative to Vss VINPUT -1.0 ~ 3.6 V Voltage on I/O pins relative to Vss VIO -0.5 ~3.6 V Output Short Circuit Current IOS 50 Soldering Temperature ⋅ Time mA oC 260 ⋅ 10 TSOLDER ⋅ Sec Note: 1. Operation at above absolute maximum rating can adversely affect device reliability DC OPERATING CONDITIONS (TA=0 to 70 oC, Voltage referenced to VSS = 0V) Symbol Min Typ. Max Unit Power Supply Voltage Parameter VDD 2.3 2.5 2.7 V Power Supply Voltage VDDQ 2.3 2.5 2.7 V 1 Power Supply Voltage VDDQ 2.5 2.6 2.7 V 1,2 Input High Voltage VIH VREF + 0.15 - VDDQ + 0.3 V Input Low Voltage VIL -0.3 - VREF - 0.15 V Termination Voltage VTT VREF - 0.04 VREF VREF + 0.04 V VREF 0.49*VDDQ 0.5*VDDQ 0.51*VDDQ V VIN(DC) -0.3 - VDDQ+0.3 V Reference Voltage Input Voltage Level, CK and CK inputs Input Differential Voltage, CK and CK inputs Note 3 4 VID(DC) 0.36 - VDDQ+0.6 V 5 VI(RATIO) 0.71 - 1.4 - 6 Input Leakage Current ILI -2 - 2 uA 7 Output Leakage Current ILO -5 - 5 uA 8 IOH -16.8 - - mA IOL 16.8 - - mA IOH -13.6 - - mA IOL 13.6 - - mA V-I Matching: Pullup to Pulldown Current Ratio Output High Current Normal Strength (min VDDQ, min VREF, min VTT) Output Driver (VOUT=VTT ± 0.84) Output Low Current (min VDDQ, max VREF, max VTT) Half Strength Out- Output High Current put Driver (min VDDQ, min VREF, min VTT) (VOUT=VTT ± 0.68) Output Low Current (min VDDQ, max VREF, max VTT) Note: 1. VDDQ must not exceed the level of VDD. 2. For DDR400, VDD=2.6V ± 0.1V, VDDQ=2.6V ± 0.1V 3. VIL (min) is acceptable -1.5V AC pulse width with < 5ns of duration. 4. VREF is expected to be equal to 0.5*VDDQ of the transmitting device, and to track variations in the dc level of the same. Peak to peak noise on VREF may not exceed ± 2% of the DC value. 5. VID is the magnitude of the difference between the input level on CK and the input level on /CK. 6. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire temperature and voltage range, for device drain to source voltages from 0.25V to 1.0V. For a given output, it represents the maximum difference between pullup and pulldown drivers due to process variation. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1/7 for device drain to source voltages from 0.1 to 1.0. 7. VIN=0 to VDD, All other pins are not tested under VIN =0V. 8. DQs are disabled, VOUT=0 to VDDQ. Rev.1.1 /May. 2005 6 184pin Registered DDR SDRAM DIMMs IDD SPECIFICATION AND CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V) 512MB, 64Mb x 72 ECC Registered DIMM: HYMD564G726BF[P]8N Symbol Speed Test Condition Unit DDR400B DDR333 IDD0 One bank; Active - Precharge; tRC=tRC(min); tCK=tCK(min); DQ,DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle 2000 1910 mA IDD1 One bank; Active - Read - Precharge; Burst Length=2; tRC=tRC(min); tCK=tCK(min); address and control inputs changing once per clock cycle 2450 2270 mA IDD2P All banks idle; Power down mode; CKE=Low, tCK=tCK(min) 540 540 mA IDD2F /CS=High, All banks idle; tCK=tCK(min); CKE= High; address and control inputs changing once per clock cycle. VIN=VREF for DQ, DQS and DM 965 965 mA IDD3P One bank active; Power down mode; CKE=Low, tCK=tCK(min) 558 558 mA IDD3N /CS=HIGH; CKE=HIGH; One bank; Active-Precharge; tRC=tRAS(max); tCK=tCK(min); DQ, DM and DQS inputs changing twice per clock cycle; Address and other control inputs changing once per clock cycle 1100 1055 mA IDD4R Burst=2; Reads; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK=tCK(min); IOUT=0mA 3170 2900 mA IDD4W Burst=2; Writes; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK=tCK(min); DQ, DM and DQS inputs changing twice per clock cycle 3170 2900 mA IDD5 tRC=tRFC(min) - 8*tCK for DDR200 at 100Mhz, 10*tCK for DDR266A & DDR266B at 133Mhz; distributed refresh 3350 3170 mA IDD6 CKE=<0.2V; External clock on; tCK =tCK(min) Normal 495 495 mA Low Power 473 473 mA IDD7 Four bank interleaving with BL=4 Refer to the following page for detailed test condition 5510 4790 mA Note * Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap. Rev.1.1 /May. 2005 7 184pin Registered DDR SDRAM DIMMs IDD SPECIFICATION AND CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V) 1GB, 128Mb x 72 ECC Registered DIMM: HYMD512G726BF[P]4N Symbol Speed Test Condition Unit DDR400B DDR333 IDD0 One bank; Active - Precharge; tRC=tRC(min); tCK=tCK(min); DQ,DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle 3350 3170 mA IDD1 One bank; Active - Read - Precharge; Burst Length=2; tRC=tRC(min); tCK=tCK(min); address and control inputs changing once per clock cycle 4250 3890 mA IDD2P All banks idle; Power down mode; CKE=Low, tCK=tCK(min) 630 630 mA IDD2F /CS=High, All banks idle; tCK=tCK(min); CKE= High; address and control inputs changing once per clock cycle. VIN=VREF for DQ, DQS and DM 1280 1280 mA IDD3P One bank active; Power down mode; CKE=Low, tCK=tCK(min) 666 666 mA IDD3N /CS=HIGH; CKE=HIGH; One bank; Active-Precharge; tRC=tRAS(max); tCK=tCK(min); DQ, DM and DQS inputs changing twice per clock cycle; Address and other control inputs changing once per clock cycle 1550 1460 mA IDD4R Burst=2; Reads; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK=tCK(min); IOUT=0mA 5510 4970 mA IDD4W Burst=2; Writes; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK=tCK(min); DQ, DM and DQS inputs changing twice per clock cycle 5510 4970 mA IDD5 tRC=tRFC(min) - 8*tCK for DDR200 at 100Mhz, 10*tCK for DDR266A & DDR266B at 133Mhz; distributed refresh 6050 5690 mA IDD6 CKE=<0.2V; External clock on; tCK =tCK(min) Normal 540 540 mA Low Power 495 495 mA IDD7 Four bank interleaving with BL=4 Refer to the following page for detailed test condition 10370 8930 mA Note * Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap. Rev.1.1 /May. 2005 8 184pin Registered DDR SDRAM DIMMs AC OPERATING CONDITIONS (TA=0 to 70 oC, Voltage referenced to VSS = 0V) Symbol Min Max Unit Input High (Logic 1) Voltage, DQ, DQS and DM signals Parameter VIH(AC) VREF + 0.31 - V Note Input Low (Logic 0) Voltage, DQ, DQS and DM signals VIL(AC) - VREF - 0.31 V Input Differential Voltage, CK and /CK inputs VID(AC) 0.7 VDDQ + 0.6 V 1 Input Crossing Point Voltage, CK and /CK inputs VIX(AC) 0.5*VDDQ-0.2 0.5*VDDQ+0.2 V 2 Note: 1. VID is the magnitude of the difference between the input level on CK and the input on /CK. 2. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same. AC OPERATING TEST CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V) Value Unit Reference Voltage Parameter VDDQ x 0.5 V Termination Voltage VDDQ x 0.5 V AC Input High Level Voltage (VIH, min) VREF + 0.31 V AC Input Low Level Voltage (VIL, max) VREF - 0.31 V Input Timing Measurement Reference Level Voltage VREF V Output Timing Measurement Reference Level Voltage VTT V Input Signal maximum peak swing 1.5 V 1 V/ns Input minimum Signal Slew Rate Termination Resistor (RT) 50 Ω Series Resistor (RS) 25 Ω Output Load Capacitance for Access Time Measurement (CL) 30 pF OUTPUT LOAD CIRCUIT VTT RT=50Ω Output Zo=50Ω VREF CL=30pF Rev.1.1 /May. 2005 9 184pin Registered DDR SDRAM DIMMs CAPACITANCE (TA=25oC, f=100MHz) 512GB: HYMD564G726BF[P]8N Output/Input Pins Symbol Min Max Unit A0 ~ A12, BA0, BA1 CIN1 7 12 pF /RAS, /CAS, /WE CIN2 7 12 pF CKE0 CIN3 7 12 pF CS0 CIN4 7 12 pF CK0, /CK0 CIN5 7 14 pF DM0 ~ DM8 CIN6 6 11 pF DQ0 ~ DQ63, DQS0 ~ DQS8 CIO1 6 11 pF CB0 ~ CB7 CIO2 6 11 pF 1GB: HYMD512G726BF[P]4N Symbol Min Max Unit A0 ~ A13, BA0, BA1 Output/Input Pins CIN1 7 12 pF /RAS, /CAS, /WE CIN2 7 12 pF CKE0 CIN3 7 12 pF CS0 CIN4 7 12 pF CK0, /CK0 CIN5 7 14 pF DQ0 ~ DQ63, DQS0 ~ DQS17 CIO1 6 11 pF CB0 ~ CB7 CIO2 6 11 pF Rev.1.1 /May. 2005 10 184pin Registered DDR SDRAM DIMMs AC CHARACTERISTICS (note: 1 - 9 / AC operating conditions unless otherwise noted) Parameter Symbol DDR400B DDR333 DDR266A DDR266B DDR200 Min Max Min Max Min Max Min Max Min Max UNIT Row Cycle Time tRC 55 - 60 - 65 - 65 - 70 - ns Auto Refresh Row Cycle Time tRFC 70 - 72 - 75 - 75 - 80 - ns Row Active Time tRAS 40 70K 42 70K 45 120K 45 120K 50 120K ns tRAP tRCD or tRASmin - tRCD or tRASmin - tRCD or tRASmin - tRCD or tRASmin - tRCD or tRASmin - ns Row Address to Column Address Delay tRCD 15 - 18 - 20 - 20 - 20 - ns Row Active to Row Active Delay tRRD 10 - 12 - 15 - 15 - 15 - ns Column Address to Column Address Delay tCCD 1 - 1 - 1 - 1 - 1 - tCK Row Precharge Time tRP 15 - 18 - 20 - 20 - 20 - ns Write Recovery Time tWR 15 - 15 - 15 - 15 - 15 - ns Internal Write to Read Command Delay tWTR 2 - 1 - 1 - 1 - 1 - tCK tDAL (tWR/ tCK) + (tRP/tCK) - (tWR/ tCK) + (tRP/tCK) - (tWR/ tCK) + (tRP/tCK) - (tWR/ tCK) + (tRP/tCK) - (tWR/ tCK) + (tRP/tCK) - tCK 5 10 - - - - - - - - - - 6 12 7.5 12 7.5 12 8.0 12 ns - - 7.5 12 7.5 12 10 12 10 12 ns Active to Read with Auto Precharge Delay Auto Precharge Write Recovery + Precharge Time22 CL = 3 System Clock Cycle CL = 2.5 Time24 CL = 2 tCK Clock High Level Width tCH 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK Clock Low Level Width tCL 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK Data-Out edge to Clock edge Skew tAC -0.7 0.7 -0.7 0.7 -0.75 0.75 -0.75 0.75 -0.75 0.75 ns -0.55 0.55 -0.6 0.6 -0.75 0.75 -0.75 0.75 -0.75 0.75 ns tDQSQ - 0.4 - 0.4 - 0.5 - 0.5 - 0.6 ns tQH tHP -tQHS - tHP -tQHS - tHP -tQHS - tHP -tQHS - tHP -tQHS - ns tHP min (tCL,tCH) - min (tCL,tCH) - min (tCL,tCH) - min (tCL,tCH) - min (tCL,tCH) - ns tQHS - 0.5 - 0.5 - 0.75 - 0.75 - 0.75 ns DQS-Out edge to Clock tDQSCK edge Skew DQS-Out edge to DataOut edge Skew21 Data-Out hold time from DQS20 Clock Half Period19,20 Data Hold Skew Factor20 Valid Data Output Window Rev.1.1 /May. 2005 tDV tQH-tDQSQ tQH-tDQSQ tQH-tDQSQ tQH-tDQSQ tQH-tDQSQ ns 11 184pin Registered DDR SDRAM DIMMs - Continue Parameter Symbol DDR400B DDR333 DDR266A DDR266B DDR200 UNIT Min Max Min Max Min Max Min Max Min Max tHZ -0.7 0.7 -0.7 0.7 -0.75 0.75 -0.75 0.75 -0.8 0.8 ns tLZ -0.7 0.7 -0.7 0.7 -0.75 0.75 -0.75 0.75 -0.8 0.8 ns tIS 0.6 - 0.75 - 0.9 - 0.9 - 1.1 - ns tIH 0.6 - 0.75 - 0.9 - 0.9 - 1.1 - ns tIS 0.7 - 0.8 - 1.0 - 1.0 - 1.1 - ns tIH 0.7 - 0.8 - 1.0 - 1.0 - 1.1 - ns tIPW 2.2 - 2.2 - 2.2 - 2.2 - 2.5 - ns Write DQS High Level Width tDQSH 0.35 - 0.35 - 0.35 - 0.35 - 0.35 - tCK Write DQS Low Level Width tDQSL 0.35 - 0.35 - 0.35 - 0.35 - 0.35 - tCK Clock to First Rising edge of DQSIn tDQSS 0.72 1.25 0.75 1.25 0.75 1.25 0.75 1.25 0.75 1.25 tCK DQS falling edge to CK setup time tDSS 0.2 - 0.2 - 0.2 - 0.2 - 0.2 - tCK DQS falling edge hold time from CK tDSH 0.2 - 0.2 - 0.2 - 0.2 - 0.2 - tCK DQ & DM input setup time25 tDS 0.4 - 0.45 - 0.5 - 0.5 - 0.6 - ns DQ & DM input hold time25 tDH 0.4 - 0.45 - 0.5 - 0.5 - 0.6 - ns DQ & DM Input Pulse Width17 tDIPW 1.75 - 1.75 - 1.75 - 1.75 - 2 - ns Read DQS Preamble Time tRPRE 0.9 1.1 0.9 1.1 0.9 1.1 0.9 1.1 0.9 1.1 tCK Read DQS Postamble Time tRPST 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK 0 - 0 - 0 - 0 - 0 - ns - 0.25 - 0.25 - 0.25 - 0.25 - tCK Data-out high-impedance window from CK,/CK10 Data-out low-impedance window from CK, /CK10 Input Setup Time (fast slew rate)14,16-18 Input Hold Time (fast slew rate)14,16-18 Input Setup Time (slow slew rate)15-18 Input Hold Time (slow slew rate)15-18 Input Pulse Width17 Write DQS Preamble Setup Time12 tWPRES Write DQS Preamble Hold Time 11 tWPREH 0.25 Write DQS Postamble Time tWPST 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK Mode Register Set Delay tMRD 2 - 2 - 2 - 2 - 2 - tCK tXSNR 75 - 75 - 75 - 75 - 80 - ns tXSRD 200 - 200 - 200 - 200 - 200 - tCK tREFI - 7.8 - 7.8 - 7.8 - 7.8 - 7.8 us Exit Self Refresh to non-Read command23 Exit Self Refresh to Read command Average Periodic Refresh Interval13,25 Rev.1.1 /May. 2005 12 184pin Registered DDR SDRAM DIMMs Note: 1. All voltages referenced to Vss. 2. Tests for ac timing, IDD, and electrical, ac and dc characteristics, may be conducted at nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. 3. Below figure represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended to be either a precise representation of the typical system environment nor a depiction of the actual load presented by a production tester. System designers will use IBIS or other simulation tools to correlate the timing reference load to a system environment. Manufacturers will correlate to their production test conditions (generally a coaxial transmission line terminated at the tester electronics). VDDQ Output (VOUT) 50 Ω 30 pF Figure: Timing Reference Load 4. AC timing and IDD tests may use a VIL to VIHswing of up to 1.5 V in the test environment, but input timing is still referenced to VREF (or to the crossing point for CK, /CK), and parameter specifications are guaranteed for the specified ac input levels under normal use conditions. The minimum slew rate for the input signals is 1 V/ns in the range between VIL(ac) and VIH(ac). 5. The ac and dc input level specifications are as defined in the SSTL_2 Standard (i.e., the receiver will effectively switch as a result of the signal crossing the ac input level and will remain in that state as long as the signal does not ring back above (below) the dc input LOW (HIGH) level. 6. Inputs are not recognized as valid until VREF stabilizes. Exception: during the period before VREF stabilizes, CKE < 0.2VDDQ is recognized as LOW. 7. The CK, /CK input reference level (for timing referenced to CK, /CK) is the point at which CK and /CK cross; the input reference level for signals other than CK, /CK is VREF. 8. The output timing reference voltage level is VTT. 9. Operation or timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down and then restarted through the specified initialization sequence before normal operation can continue. 10. tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referenced to a specific voltage level but specify when the device output is no longer driving (HZ), or begins driving (LZ). 11. The maximum limit for this parameter is not a device limit. The device will operate with a greater value for this parameter, but system performance (bus turnaround) will degrade accordingly. 12. The specific requirement is that DQS be valid (HIGH, LOW, or at some point on a valid transition) on or before this CK edge. A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in progress on the bus, DQS will be transitioning from High-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS. 13. A maximum of eight AUTO REFRESH commands can be posted to any given DDR SDRAM device. 14. For command/address input slew rate ≥ 1.0 V/ns. 15. For command/address input slew rate ≥ 0.5 V/ns and < 1.0 V/ns 16. For CK & /CK slew rate ≥ 1.0 V/ns (single-ended) 17. These parameters guarantee device timing, but they are not necessarily tested on each device. They may be guaranteed by device design or tester correlation. 18. Slew Rate is measured between VOH(ac) and VOL(ac). 19. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this value can be greater than the minimum specification limits for tCL and tCH). For example, tCL and tCH are = 50% of the period, less the half period jitter (tJIT(HP)) of the clock source, and less the half period jitter due to crosstalk (tJIT(crosstalk)) into the clock traces. Rev.1.1 /May. 2005 13 184pin Registered DDR SDRAM DIMMs 20.tQH = tHP - tQHS, where: tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS accounts for 1) The pulse duration distortion of on-chip clock circuits; and 2) The worst case push--out of DQS on one transition followed by the worst case pull--in of DQ on the next transition, both of which are, separately, due to data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers. 21. tDQSQ: Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers for any given cycle. 22. tDAL = (tWR/tCK) + (tRP/tCK) For each of the terms above, if not already an integer, round to the next highest integer. Example: For DDR266B at CL=2.5 and tCK=7.5 ns tDAL = ((15 ns / 7.5 ns) + (20 ns / 7.5 ns)) clocks = ((2) + (3)) clocks = 5 clocks 23. In all circumstances, tXSNR can be satisfied using tXSNR = tRFCmin + 1*tCK 24. The only time that the clock frequency is allowed to change is during self-refresh mode. 25. If refresh timing or tDS/tDH is violated, data corruption may occur and the data must be re-written with valid data before a valid READ can be executed. Rev.1.1 /May. 2005 14 184pin Registered DDR SDRAM DIMMs SYSTEM CHARACTERISTICS CONDITIONS for DDR SDRAMS The following tables are described specification parameters that required in systems using DDR devices to ensure proper performannce. These characteristics are for system simulation purposes and are guaranteed by design. Input Slew Rate for DQ/DM/DQS AC CHARACTERISTICS (Table a.) DDR400 DDR333 DDR266 DDR200 PARAMETER Symbol min max min max min max min max DQ/DM/DQS input slew rate measured between VIH(DC), VIL(DC) and VIL(DC), VIH(DC) DCSLEW 0.5 4.0 0.5 4.0 0.5 4.0 0.5 4.0 UNIT Note V/ns 1,12 Address & Control Input Setup & Hold Time Derating (Table b.) Input Slew Rate Delta tIS Delta tIH UNIT Note 0.5 V/ns 0 0 ps 9 0.4 V/ns +50 0 ps 9 0.3 V/ns +100 0 ps 9 DQ & DM Input Setup & Hold Time Derating (Table c.) Input Slew Rate Delta tDS Delta tDH UNIT Note 0.5 V/ns 0 0 ps 11 0.4 V/ns +75 0 ps 11 0.3 V/ns +150 0 ps 11 DQ & DM Input Setup & Hold Time Derating for Rise/Fall Delta Slew Rate Input Slew Rate Delta tDS Delta tDH UNIT Note ± 0.0 ns/V 0 0 ps 10 ± 0.25 ns/V +50 +50 ps 10 ± 0.5 ns/V +100 +100 ps 10 Output Slew Rate Characteristics (for x4, x8 Devices) Slew Rate Characteristic Typical Range (V/ns) Minimum (V/ns) Maximum (V/ns) (Table d.) (Table e.) Note Pullup Slew Rate 1.2 - 2.5 1.0 4.5 1,3,4,6,7,8 Pulldown Slew Rate 1.2 - 2.5 1.0 4.5 2,3,4,6,7,8 Output Slew Rate Characteristics (for x16 Device) (Table f.) Slew Rate Characteristic Typical Range (V/ns) Minimum (V/ns) Maximum (V/ns) Note Pullup Slew Rate 1.2 - 2.5 1.0 4.5 1,3,4,6,7,8 Pulldown Slew Rate 1.2 - 2.5 1.0 4.5 2,3,4,6,7,8 Output Slew Rate Matching Ratio Characteristics Slew Rate Characteristic DDR266A (Table g.) DDR266B DDR200 Parameter min max min max min max Output Slew Rate Matching Ratio (Pullup to Pulldown) - - - - 0.71 1.4 Rev.1.1 /May. 2005 Note 5,12 15 184pin Registered DDR SDRAM DIMMs Note: 1. Pullup slew rate is characterized under the test conditions as shown in below Figure. Test Point Output (VOUT) 50 Ω VSSQ Figure: Pullup Slew rate 2. Pulldown slew rate is measured under the test conditions shown in below Figure. VDDQ Output (VOUT) 50Ω Test Point Figure: Pulldown Slew rate 3. Pullup slew rate is measured between (VDDQ/2 - 320 mV ± 250mV) Pulldown slew rate is measured between (VDDQ/2 + 320mV ± 250mV) Pullup and Pulldown slew rate conditions are to be met for any pattern of data, including all outputs switching and only one output switching. Example: For typical slew, DQ0 is switching For minimum slew rate, all DQ bits are switching worst case pattern For maximum slew rate, only one DQ is switching from either high to low, or low to high. The remaining DQ bits remain the same as for previous state. 4. Evaluation conditions Typical: 25 oC (Ambient), VDDQ = nominal, typical process Minimum: 70 oC (Ambient), VDDQ = minimum, slow-slow process Maximum: 0 oC (Ambient), VDDQ = Maximum, fast-fast process 5. The ratio of pullup slew rate to pulldown slew rate is specified for the same temperature and voltage, over the entire temperature and voltage range. For a given output, it represents the maximum difference between pullup and pulldown drivers due to process variation. 6. Verified under typical conditions for qualification purposes. 7. TSOP-II package devices only. 8. Only intended for operation up to 256 Mbps per pin. 9. A derating factor will be used to increase tIS and tIH in the case where the input slew rate is below 0.5 V/ns as shown in Table b. The Input slew rate is based on the lesser of the slew rates determined by either VIH(AC) to VIL(AC) or VIH(DC) to VIL(DC), similarly for rising transitions. 10. A derating factor will be used to increase tDS and tDH in the case where DQ, DM, and DQS slew rates differ, as shown in Tables c & d. Input slew rate is based on the larger of AC-AC delta rise, fall rate and DC-DC delta rise, fall rate. Input slew rate is based on the lesser of the slew rates determined by either VIH(AC) to VIL(AC) or VIH(DC) to VIL(DC), similarly for rising transitions. The delta rise/fall rate is calculated as: {1/(Slew Rate1)} - {1/(slew Rate2)} For example: If Slew Rate 1 is 0.5 V/ns and Slew Rate 2 is 0.4 V/ns, then the delta rise, fall rate is -0.5 ns/V. Using the table given, this would result in the need for an increase in tDS and tDH of 100ps. 11. Table c is used to increase tDS and tDH in the case where the I/O slew rate is below 0.5 V/ns. The I/O slew rate is based on the lesser of the AC-AC slew rate and the DC-DC slew rate. The input slew rate is based on the lesser of the slew rates determined by either VIH(ac) to VIL(AC) or VIH(DC) to VIL(DC), and similarly for rising transitions. 12. DQS, DM, and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times. Signal transitions through the DC region must be monotonic. Rev.1.1 /May. 2005 16 184pin Registered DDR SDRAM DIMMs SIMPLIFIED COMMAND TRUTH TABLE Command CKEn-1 CKEn /CS /RAS /CAS /WE Extended Mode Register Set H X L L L L OP code 1,2 Mode Register Set H X OP code 1,2 X 1 Device Deselect L L L L H X X X L H H H ADDR A10/AP BA Note H X H X L L H H H X L H L H CA H X L H L L CA H X L L H L X Read Burst Stop H X L H H L X 1 Auto Refresh H H L L L H X 1 H L No Operation Bank Active Read Read with Autoprecharge Write Write with Autoprecharge Precharge All Banks Precharge selected Bank Entry Self Refresh Precharge Power Down Mode Active Power Down Mode Exit L H Entry H L Exit L H Entry H L Exit L H L L L H H X X X L H H H H X X X RA V L H L H V V H X L V 1 1 1,3 1 1,4 1,5 1 1 X 1 1 L H H H H X X X 1 L H H H 1 H X X X 1 L V V V X 1 X 1 X 1 ( H=Logic High Level, L=Logic Low Level, X=Don’t Care, V=Valid Data Input, OP Code=Operand Code, NOP=No Operation ) Note: 1. DM states are Don’t Care. Refer to below Write Mask Truth Table. 2. OP Code(Operand Code) consists of A0~A12 and BA0~BA1 used for Mode Registering during Extended MRS or MRS. Before entering Mode Register Set mode, all banks must be in a precharge state and MRS command can be issued after tRP period from Precharge command. 3. If a Read with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+tRP). 4. If a Write with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+1+tWR+tRP). Write Recovery Time(tWR) is needed to guarantee that the last data has been completely written. 5. If A10/AP is High when Row Precharge command being issued, BA0/BA1 are ignored and all banks are selected to be precharged. WRITE MASK TRUTH TABLE Function CKEn-1 CKEn /CS, /RAS, /CAS, /WE DM ADDR A10/AP BA Note Data Write H X X L X 1 Data-In Mask H X X H X 1 Note: 1. Write Mask command masks burst write data with reference to LDQS/UDQS(Data Strobes) and it is not related with read data. In case of x16 data I/O, LDM and UDM control lower byte(DQ0~7) and Upper byte(DQ8~15) respectively. Rev.1.1 /May. 2005 17 184pin Registered DDR SDRAM DIMMs PACKAGE DIMENSIONS 512MB, 64Mb x 72 ECC Registered DIMM: HYMD564G726BF[P]8N Unit: Front Millimeters Inches 133.35 5.25 131.35 5.171 128.95 Register (2X)4.00 0.157 5.077 Register 28.575 1.125 3.0 0.118 (2) 0 2.50 0.098 17.80 0.700 PLL 2.99 Side 0.110max 4.00 0.157 Back : (Single-sided) 1.27+/-0.10 0.05+/-0.004 Note) All dimension are typical unless otherwise stated. Rev.1.1 /May. 2005 Millimeters Inches 18 184pin Registered DDR SDRAM DIMMs PACKAGE DIMENSIONS 1GB, 128Mb x 72 ECC Registered DIMM: HYMD512G726BF[P]4N Unit: Front Millimeters Inches 133.35 5.25 131.35 5.171 128.95 (2X)4.00 0.157 5.077 PLL 28.575 Register 3.0 0.118 (2) 0 2.50 0.098 17.80 0.700 1.125 Side Back 3.99 4.00 0.157 0.157max Register 1.27+/-0.10 0.05+/-0.004 Note) All dimension are typical unless otherwise stated. Rev.1.1 /May. 2005 Millimeters Inches 19 184pin Registered DDR SDRAM DIMMs REVISION HISTORY Revision History Date 1.0 First Version Release - Datasheet coverage is changed from an individual module part to a component based module family Feb. 2005 1.1 Corrected PIN DESCRIPTION and PIN ASSIGNMENT Tables May. 2005 Rev.1.1 /May. 2005 Remark 20