ETC AS4C1M16F5-50JC

AS4C1M16F5
®
5V 1M×16 CMOS DRAM (fast-page mode)
Features
• Organization: 1,048,576 words × 16 bits
• High speed
- 50/60 ns RAS access time
- 20/25 ns fast page cycle time
- 13/17 ns CAS access time
• Low power consumption
- Active:
880 mW max (AS4C1M16E0-60)
- Standby: 11 mW max, CMOS DQ
• Fast page mode
• 1024 refresh cycles, 16 ms refresh interval
- RAS-only or CAS-before-RAS refresh
• Read-modify-write
• TTL-compatible, three-state DQ
• JEDEC standard package and pinout
- 400 mil, 42-pin SOJ
- 400 mil, 44/50-pin TSOP II
• 5V power supply
• Industrial and commercial temperature available
Pin arrangement
Pin designation
TSOP II
SOJ
Vcc
DQ1
DQ2
DQ3
DQ4
Vcc
DQ5
DQ6
DQ7
DQ8
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
Vcc
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
VSS
DQ16
DQ15
DQ14
DQ13
VSS
DQ12
DQ11
DQ10
DQ9
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
VSS
VCC
DQ1
DQ2
DQ3
DQ4
VCC
DQ5
DQ6
DQ7
DQ8
NC
1
2
3
4
5
6
7
8
9
10
11
50
49
48
47
46
45
44
43
42
41
40
VSS
DQ16
DQ15
DQ14
DQ13
VSS
DQ12
DQ11
DQ10
DQ9
NC
NC
NC
15
16
17
18
19
20
21
22
23
24
25
36
35
34
33
32
31
30
29
28
27
26
NC
WE
RAS
NC
NC
A0
A1
A2
A3
VCC
LCAS
UCAS
OE
Pin(s)
Description
A0 to A9
Address inputs
RAS
Row address strobe
DQ1 to DQ16
Input/output
OE
Output enable
WE
Write enable
UCAS
Column address strobe, upper byte
LCAS
Column address strobe, lower byte
VCC
Power
VSS
Ground
A9
A8
A7
A6
A5
A4
VSS
Selection guide
Symbol
AS4C1M16F5-50
AS4C1M16F5-60
Unit
Maximum RAS access time
tRAC
50
60
ns
Maximum column address access time
tAA
25
30
ns
Maximum CAS access time
tCAC
13
17
ns
Maximum output enable (OE) access time
tOEA
13
15
ns
Minimum read or write cycle time
tRC
84
104
ns
Minimum fast page mode cycle time
tPC
20
25
ns
Maximum operating current
ICC1
170
160
mA
Maximum CMOS standby current
ICC5
2.0
2.0
mA
4/11/01; v.0.9.1
Alliance Semiconductor
P. 1 of 21
Copyright © Alliance Semiconductor. All rights reserved.
AS4C1M16F5
®
Functional description
The AS4C1M16F5 is a high performance 16-megabit CMOS Dynamic Random Access Memory (DRAM) organized as
1,048,576 words × 16 bits. The AS4C1M16F5 is fabricated using advanced CMOS technology and innovative design
techniques resulting in high speed, extremely low power and wide operating margins at component and system levels. The
Alliance 16Mb DRAM family is optimized for use as main memory in personal and portable PCs, workstations, and multimedia
and router switch applications.
The AS4C1M16F5 features high speed page mode operation where read and write operations within a single row (or page)
can be executed at very high speed (15 ns from XCAS)by toggling column addresses within that row. Row and column
addresses are alternately latched into input buffers using the falling edge of RAS and xCAS inputs respectively. Also, RAS is used
to make the column address latch transparent, enabling application of column addresses prior to xCAS assertion. The
AS4C1M16F5 provides dual UCAS and LCAS for independent byte control of read and write access.
Refresh on the 1024 address combinations of A0 to A9 must be performed every 16 ms using:
• RAS-only refresh: RAS is asserted while xCAS is held high. Each of the 1024 rows must be strobed. Outputs remain high impedence.
• Hidden refresh: xCAS is held low while RAS is toggled. Outputs remain low impedence with previous valid data.
• CAS-before-RAS refresh (CBR): At least one xCAS is asserted prior to RAS. Refresh address is generated internally.
Outputs are high-impedence (OE and WE are don't care).
• Normal read or write cycles refresh the row being accessed.
The AS4C1M16F5 is available in the standard 42-pin plastic SOJ and the 44/50-pin TSOP II packages, respectively. It operates
with a single power supply of 5V ± 0.5V. The device provides TTL compatible inputs and outputs.
Refresh
controller
Logic block diagram
GND
UCAS
RAS clock
generator
CAS clock
generator
LCAS
WE
WE clock
generator
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
Address buffers
RAS
Column decoder
Sense amp
Data
DQ
buffers
DQ1 to DQ16
OE
Row decoder
VCC
1024 × 1024 × 16
Array
(16,777,216)
Substrate bias
generator
Recommended operating conditions
Parameter
Supply voltage
Input voltage
Ambient operating temperature
AS4C1M16F5
AS4C1M16F5
Symbol
Min
Nominal
Max
Unit
VCC
4.5
5.0
5.5
V
GND
0.0
0.0
0.0
V
VIH
2.4
–
VCC
V
–0.5
–
0.8
V
0
–
70
-40
–
85
VIL
Commercial
Industrial
TA
†
°C
†
VIL min -3.0V for pulse widths less than 5 ns.
Recommended operating conditions apply throughout this document unlesss otherwise specified.
4/11/01; v.0.9.1
Alliance Semiconductor
P. 2 of 21
AS4C1M16F5
®
Absolute maximum ratings
Parameter
Symbol
Min
Max
Unit
Input voltage
Vin
-1.0
+7.0
V
Input voltage (DQs)
VDQ
-1.0
VCC + 0.5
V
Power supply voltage
VCC
-1.0
+7.0
V
Storage temperature (plastic)
TSTG
-55
+150
°C
Soldering temperature × time
TSOLDER
–
260 × 10
o
Power dissipation
PD
–
1
W
Short circuit output current
Iout
–
50
mA
C × sec
DC electrical characteristics
-50
Parameter
Symbol
Test conditions
Input leakage current
IIL
Output leakage current
-60
Min
Max
Min
Max
Unit
0V ≤ Vin ≤ +5.5V,
Pins not under test = 0V
-5
+5
-5
+5
µA
IOL
DOUT disabled, 0V ≤ Vout ≤ +5.5V
-5
+5
-5
+5
µA
Operating power
supply current
ICC1
RAS, UCAS, LCAS, Address cycling;
tRC=min
–
170
–
160
mA
TTL standby power
supply current
ICC2
RAS = UCAS = LCAS ≥ VIH
–
2.5
–
2.5
mA
Average power supply
current, RAS refresh mode ICC3
or CBR
RAS cycling, UCAS = LCAS ≥ VIH,
tRC = min of RAS low after XCAS low.
–
170
–
160
mA
1
Fast page mode average
power supply current
ICC4
RAS = VIL, UCAS or LCAS,
address cycling: tPC = min
–
120
–
110
mA
1, 2
CMOS standby power
supply current
ICC5
RAS = UCAS = LCAS = VCC - 0.2V
–
2.0
–
2.0
mA
VOH
IOUT = -5.0 mA
2.4
–
2.4
–
V
VOL
IOUT = 4.2 mA
–
0.4
–
0.4
V
ICC6
RAS, UCAS or LCAS cycling, tRC = min
–
170
–
160
mA
Output voltage
CAS before RAS refresh
current
4/11/01; v.0.9.1
Alliance Semiconductor
Notes
1,2
P. 3 of 21
AS4C1M16F5
®
AC parameters common to all waveforms
-50
-60
Symbol
Parameter
Min
Max
Min
Max
Unit Notes
tRC
Random read or write cycle time
84
–
104
–
ns
tRP
RAS precharge time
30
–
40
–
ns
tRAS
RAS pulse width
50
10K
60
10K
ns
tCAS
CAS pulse width
8
10K
10
10K
ns
tRCD
RAS to CAS delay time
15
35
15
43
ns
6
tRAD
RAS to column address delay time
12
25
12
30
ns
7
tRSH
CAS to RAS hold time
10
–
10
–
ns
tCSH
RAS to CAS hold time
40
–
50
–
ns
tCRP
CAS to RAS precharge time
5
–
5
–
ns
tASR
Row address setup time
0
–
0
–
ns
tRAH
Row address hold time
8
–
10
–
ns
tT
Transition time (rise and fall)
1
50
1
50
ns
4,5
tREF
Refresh period
–
16
–
16
ms
3
tCP
CAS precharge time
8
–
10
–
ns
tRAL
Column address to RAS lead time
25
–
30
–
ns
tASC
Column address setup time
0
–
0
–
ns
tCAH
Column address hold time
8
10
–
ns
Read cycle
-50
Symbol
Parameter
tRAC
-60
Min
Max
Min
Max
Access time from RAS
–
50
–
60
ns
6
tCAC
Access time from CAS
–
13
–
17
ns
6,13
tAA
Access time from address
–
25
–
30
ns
7,13
tRCS
Read command setup time
0
–
0
–
ns
tRCH
Read command hold time to CAS
0
–
0
–
ns
9
tRRH
Read command hold time to RAS
0
–
0
–
ns
9
4/11/01; v.0.9.1
Alliance Semiconductor
Unit Notes
P. 4 of 21
AS4C1M16F5
®
Write cycle
-50
Symbol
Parameter
tWCS
-60
Min
Max
Min
Max
Unit
Notes
Write command setup time
0
–
0
–
ns
11
tWCH
Write command hold time
10
–
10
–
ns
11
tWP
Write command pulse width
10
–
10
–
ns
tRWL
Write command to RAS lead time
10
–
10
–
ns
tCWL
Write command to CAS lead time
8
–
10
–
ns
tDS
Data-in setup time
0
–
0
–
ns
12
tDH
Data-in hold time
8
–
10
–
ns
12
Read-modify-write cycle
-50
-60
Symbol
Parameter
Min
Max
Min
Max
Unit
Notes
tRWC
Read-write cycle time
113
–
135
–
ns
tRWD
RAS to WE delay time
67
–
77
–
ns
11
tCWD
CAS to WE delay time
32
–
35
–
ns
11
tAWD
Column address to WE delay time
42
–
47
–
ns
11
Notes
Refresh cycle
-50
Symbol
Parameter
tCSR
-60
Min
Max
Min
Max
Unit
CAS setup time (CAS-before-RAS)
5
–
5
–
ns
3
tCHR
CAS hold time (CAS-before-RAS)
8
–
10
–
ns
3
tRPC
RAS precharge to CAS hold time
0
–
0
–
ns
10
–
ns
tCPT
CAS precharge time
(CBR counter test)
4/11/01; v.0.9.1
10
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P. 5 of 21
AS4C1M16F5
®
Fast page mode cycle
-50
Symbol
Parameter
tCPA
Access time from CAS precharge
tRASP
-60
Min
Max
Min
Max
Unit
–
28
–
35
ns
RAS pulse width
50
100K
60
100K
ns
tPC
Read-write cycle time
30
–
35
–
ns
tCP
CAS precharge time (fast page)
10
–
10
–
ns
tPCM
Fast page mode RMW cycle
80
–
85
–
ns
tCRW
Page mode CAS pulse width (RMW)
54
–
60
–
ns
Notes
13
Output enable
-50
Symbol
Parameter
tCLZ
-60
Min
Max
Min
Max
Unit
CAS to output in Low Z
0
–
0
–
ns
tROH
RAS hold time referenced to OE
8
–
10
–
ns
tOEA
OE access time
–
13
–
15
ns
tOED
OE to data delay
13
–
15
–
ns
tOEZ
Output buffer turnoff delay from OE
0
13
0
15
ns
tOEH
OE command hold time
10
–
10
–
ns
tOLZ
OE to output in Low Z
0
–
0
–
ns
tOFF
Output buffer turn-off time
0
13
0
15
ns
4/11/01; v.0.9.1
Alliance Semiconductor
Notes
8
8
8,10
P. 6 of 21
AS4C1M16F5
®
Notes
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
ICC1, ICC3, and ICC4 are dependent on frequency.
ICC1 and ICC4 depend on output loading. Specified values are obtained with the output open.
An initial pause of 200 µs is required after power-up followed by any 8 RAS cycles before proper device operation is achieved. In the case of an internal
refresh counter, a minimum of 8 CAS-before-RAS initialization cycles instead of 8 RAS cycles are required. 8 initialization cycles are required after
extended periods of bias without clocks (greater than 8 ms).
AC Characteristics assume tT = 2 ns. All AC parameters are measured with a load equivalent to two TTL loads and 100 pF, VIL (min) ≥ GND and VIH
(max) ≤ VCC.
VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Transition times are measured between VIH and VIL.
Operation within the tRCD (max) limit insures that tRAC (max) can be met. tRCD (max) is specified as a reference point only. If tRCD is greater than the
specified tRCD (max) limit, then access time is controlled exclusively by tCAC.
Operation within the tRAD (max) limit insures that tRAC (max) can be met. tRAD (max) is specified as a reference point only. If tRAD is greater than the
specified tRAD (max) limit, then access time is controlled exclusively by tAA.
Assumes three state test load (5 pF and a 380 Ω Thevenin equivalent).
Either tRCH or tRRH must be satisfied for a read cycle.
tOFF (max) defines the time at which the output achieves the open circuit condition; it is not referenced to output voltage levels. tOFF is referenced from
rising edge of RAS or CAS, whichever occurs last.
tWCS, tWCH, tRWD, tCWD and tAWD are not restrictive operating parameters. They are included in the datasheet as electrical characteristics only.
If tWS ≥ tWS (min) and tWH ≥ tWH (min), the cycle is an early write cycle and data out pins will remain open circuit, high impedance, throughout the
cycle. If tRWD ≥ tRWD (min), tCWD ≥ tCWD (min) and tAWD ≥ tAWD (min), the cycle is a read-write cycle and the data out will contain data read from the
selected cell. If neither of the above conditions is satisfied, the condition of the data out at access time is indeterminate.
These parameters are referenced to CAS leading edge in early write cycles and to WE leading edge in read-write cycles.
Access time is determined by the longest of tCAA or tCAC or tCPA
tASC ≥ tCP to achieve tPC (min) and tCPA (max) values.
These parameters are sampled and not 100% tested.
These characteristics apply to AS4C1M16F5 5V devices.
AC test conditions
- Access times are measured with output reference levels
of VOH = 2.4V and VOL = 0.4V,
VIH = 2.4V and VIL = 0.8V
- Input rise and fall times: 2 ns
Dout
100 pF*
+5V
R1 = 828Ω
R2 = 295Ω
*including scope
and jig capacitance
GND
Figure A: Equivalent output load
Key to switching waveforms
Rising input
4/11/01; v.0.9.1
Falling input
Alliance Semiconductor
Undefined output/don’t care
P. 7 of 21
AS4C1M16F5
®
Read waveform
tRC
tRAS
tRCD
tRSH
tRP
RAS
tCSH
tCRP
tCAH
tCAS
tASC
tRCS
UCAS,
LCAS
tRAD
Address
tRAL
tRAH
tASR
Row address
Column address
tRRH
tRCH
WE
tROH
tWEZ
tROH
OE
tOEZ
tRAC
tAA
tOFF (see note 11)
tOEA
tCAC
tREZ
tCLZ
DQ
Data out
tOLZ
Upper byte read waveform
tRC
tRAS
tRP
RAS
tRCD
tRSH
tCSH
tCRP
tCRP
tCAS
UCAS
tRPC
tCRP
LCAS
tRAH
tRAL
tRAD
tASC
tASR
Address
Row
tCAH
Column
tRCH
tRRH
tRCS
WE
tROH
tWEZ
OE
tOLZ
tRAC
tOEA
tREZ
tOEZ
tAA
tCAC
tCLZ
Upper DQ
tOFF
Data out
Lower DQ
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P. 8 of 21
AS4C1M16F5
®
Lower byte read waveform
tRC
tRAS
tRP
RAS
tRCD
tRSH
tCSH
tCRP
tCRP
tCAS
LCAS
tCRP
tRPC
UCAS
tASC
tRAH
tRAL
tRAD
tASR
tCAH
Address
Row
Column
tRCH
tRRH
tRCS
WE
tROH
tWEZ
OE
Upper DQ
tRAC
tREZ
tOEA
tOLZ
tOEZ
tAA
tCAC
tOFF
tCLZ
Lower DQ
Data out
Early write waveform
tRC
tRAS
tRP
RAS
tCSH
tRSH
tCRP
tRCD
tCAS
UCAS,
tRAD
LCAS
tRAL
tASC
tASR
Address
tRAH
tCAH
Row address
Column address
tCWL
tRWL
tWP
tWCS
tWCH
WE
OE
tDS
DQ
4/11/01; v.0.9.1
tDH
Data in
Alliance Semiconductor
P. 9 of 21
AS4C1M16F5
®
Upper byte early write waveform
tRC
tRAS
tRP
RAS
tASR
tRAD
tRAL
tRAH
Address
Row address
Column address
tCAH
tRSH
tASC
tRCD
tCSH
tCAS
tCRP
tCRP
UCAS
tCRP
tRPC
LCAS
tCWL
tWCH
tWCS
tRWL
tWP
WE
OE
tDS
tDH
Upper DQ
Data in
Lower DQ
Lower byte early write waveform
tRC
tRAS
tRP
RAS
tRAD
tASR
Address
tRAL
tRAH
Row address
Column address
tCRP
tRPC
UCAS
tASC
tRCD
tCAH
tCAS
tCSH
tRSH
tCRP
tCRP
LCAS
tRWL
tCWL
tWCH
tWP
tWCS
WE
OE
Upper DQ
tDS
Lower DQ
4/11/01; v.0.9.1
tDH
Data in
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P. 10 of 21
AS4C1M16F5
®
Write waveform
OE controlled
tRC
tRAS
tRP
RAS
tCSH
tRSH
tCRP
tRCD
tCAS
UCAS,
LCAS
tRAL
tRAD
tRAH
tASR
tASC
tCAH
Row address
Address
Column address
tRWL
tCWL
tWP
WE
tOEH
OE
tDS
tOED
tDH
Data in
DQ
Upper byte write waveform
OE controlled
tRC
tRAS
tRP
RAS
tRAD
tASR
tRAL
tRAH
Row address
Address
Column address
tCSH
tRSH
tRCD
tCAH
tCRP
tASC
tCAS
tCRP
UCAS
tCRP
tRPC
LCAS
tCWL
tRWL
tWP
WE
tOEH
OE
tDS
Upper DQ
tDH
Data in
tOED
Lower DQ
4/11/01; v.0.9.1
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P. 11 of 21
AS4C1M16F5
®
Lower byte write waveform
OE controlled
tRC
tRAS
tRP
RAS
tRAD
tASR
tRAL
tRAH
Address
Row address
Column address
tCAH
tCAS
tRCD
tCSH
tCRP
tRSH
tACS
tCRP
LCAS
tCRP
tRPC
UCAS
tCWL
tRWL
tWP
WE
tOEH
OE
Upper DQ
tDH
tDS
Lower DQ
Data in
Read-modify-write waveform
tRWC
tRAS
tRP
RAS
tCAS
tCRP
tRCD
tRSH
tCSH
UCAS,
LCAS
tAR
tRAL
tRAD
tRAH
tASR
Address
tASC
tCAH
Row address
Column address
tRWD
tRWL
tAWD
tRCS
WE
tCWL
tCWD
tOEA
tOEZ
tWP
tOED
OE
tRAC
tAA
tCAC
tCLZ
DQ
Data out
tDS
tDH
Data in
tOLZ
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P. 12 of 21
AS4C1M16F5
®
Upper byte read-modify-write waveform
tRWC
tRAS
tRP
RAS
tCSH
tRCD
tCAS
tRSH
tCRP
UCAS
tCRP
tCRP
tRPC
LCAS
tASR
tRAD
tACS
tRAL
tCAH
tRAH
Address
Column address
tRWD
Row
tCWL
tRWL
tAWD
tCWD
tRCS
WE
tWP
tOEA
OE
Upper input
tDS
tOED
tOLZ
tCLZ
tCAC
tAA
tDH
Data in
tOEZ
tRAC
Upper output
Data out
tOED
Lower input
Lower output
Lower byte read-modify-write waveform
tRWC
tRAS
tRP
RAS
tCRP
tRPC
UCAS
tCSH
tCAS
tRSH
tRCD
tCRP
tCRP
LCAS
tRAD
tRAL
tACS
tASR
tCAH
tRAH
Address
Row
Column address
tCWL
tRWD
tRWL
tWP
tAWD
tRCS
tCWD
WE
tOEA
OE
Upper input
Upper output
tOLZ
tOED
tDH
tDS
tOED
Lower input
tRAC
tAA
tCAC
tCLZ
Data in
tOEZ
Lower output
Data out
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AS4C1M16F5
®
Fast page mode read waveform
tRASP
tRP
RAS
tCSH
tCRP
tRSH
tRCD
tCAS
tCP
tPC
CAS
tAR
tRAD
tASR
tRAL
tASC
tRAH
Row
Address
Column
tRCS
tCAH
Column
Column
tRCS
tRCH
tRRH
tRCH
WE
tOEA
tOEA
OE
tRAC
tOEZ
tCLZ
tCAP
tOFF
tAA
tCAC
Data out
I/O
Data out
Data out
Fast page mode byte write waveform
tRASP
tRP
RAS
tPCM
tCSH
tRCD
CAS
tCAS
tCP
tCRP
tRAD
tASR
tRAL
tRAH
tCAH
Address
Row
tCAH
Column
Column
tRWD
tRCS
tCAH
Column
tCWL
tCWD
tRWL
tCWD
tCWD
tAWD
tCWL
tAWD
tWP
WE
tOEA
tOEZ
tOED
tOEA
OE
tAA
tDH
tRAC
tCLZ
tCAC
Data in
I/O
Data out
4/11/01; v.0.9.1
tDS
tDS
tCAP
tCLZ
tCLZ
tCAC
tCAC
Data in
Data out
Alliance Semiconductor
Data in
Data out
P. 14 of 21
AS4C1M16F5
®
Fast page mode early write waveform
tRASP
tRAH
tRWL
RAS
tCRP
tRCD
tPC
tCSH
tCAH
tASC
tCAS
tCP
tWCS
tRSH
CAS
tRAL
tAR
tASR
Address
tRAD
Row
Column
Column
Column
tCWL
tWP
tWCH
tOEH
WE
OE
tHDR
tOED
tDH
tDS
I/O
Data In
Data in
Data in
CAS before RAS refresh waveform
WE = VIH
tRC
tRP
tRAS
RAS
tRPC
tCHR
tCP
tCSR
UCAS,
LCAS
OPEN
DQ
RAS only refresh waveform
WE = OE = VIH or VIL
tRC
tRAS
tRP
RAS
tCRP
tRPC
UCAS,
LCAS
Address
4/11/01; v.0.9.1
tASR
tRAH
Row address
Alliance Semiconductor
P. 15 of 21
AS4C1M16F5
®
Hidden refresh waveform (read)
tRC
tRC
tRAS
tRP
tRAS
tRP
RAS
tCRP
tCHR
tRCD
tRSH
tCRP
CAS
tAR
tRAD
tCAH
tRAH
tASC
tASR
Row
Address
Col address
tRCS
tRRH
WE
tOEA
OE
tRAC
tOFF
tAA
tCAC
tCLZ
tOEZ
Data out
DQ
Hidden refresh waveform (write)
tRC
tRAS
tRP
RAS
tCRP
tRCD
tRSH
tCHR
UCAS,
tAR
LCAS
tRAD
tRAL
tRAH
tASR
Address
tASC
tCAH
Row address
Col address
tRWL
tWCR
tWP
tWCS
tWCH
WE
tDS
tDH
tDHR
DQ
Data in
OE
4/11/01; v.0.9.1
Alliance Semiconductor
P. 16 of 21
AS4C1M16F5
®
CAS before RAS refresh counter test waveform
tRAS
tRSH
tRP
RAS
tCSR
UCAS,
tCPT
tCAS
tCHR
LCAS
tRAL
tASC
tCAH
Address
Col address
tAA
tCAC
tCLZ
Read cycle
DQ
tOFF
tOEZ
Data out
tRRH
tRCH
tRCS
WE
tROH
tOEA
OE
tRWL
tCWL
tWP
tWCH
Write cycle
tWCS
WE
tDH
tDS
DQ
Data in
OE
tRWL
tWP
tRCS
tCWD
tAWD
tCWL
Read-Write cycle
WE
tOEA
tOED
OE
t AA
tCLZ
tCAC
DQ
4/11/01; v.0.9.1
tDH
tOEZ
tDS
Data out
Alliance Semiconductor
Data in
P. 17 of 21
AS4C1M16F5
®
Package dimensions
42-pin SOJ
400 mil
Min Max
D
e
A
A1
A2
B
b
c
D
E
E1
E2
e
c
E1 E2
SOJ
Pin 1
E
B
A2
A
A1
Seating
Plane
b
c
36 35 34 33 32 31 30 29 28 27 26
50 49 48 47 46 45 44 43 42 41 40
TSOP II
E He
15 16 17 18 19 20 21 22 23 24 25
1 2 3 4 5 6 7 8 9 10 11
0.128 0.148
0.025
0.105 0.115
0.026 0.032
0.015 0.020
0.007 0.013
1.070 1.080
0.370 NOM
0.395 0.405
0.435 0.445
0.050 NOM
d
l
A
A1
A2
b
c
d
E
He
e
l
50-pin TSOP II
Min
Max
(mm)
(mm)
1.2
0.05
0.95
1.05
0.30
0.45
0.12
0.21
20.85
21.05
10.03
10.29
11.56
11.96
0.80 (typical)
0.40
0.60
A2
A
A1
b
4/11/01; v.0.9.1
e
0–5°
Alliance Semiconductor
P. 18 of 21
AS4C1M16F5
®
Typical DC and AC characteristics
1.5
1.1
1.0
0.9
0.8
4.0
170
4.5
5.0
5.5
Supply voltage (V)
Typical supply current ICC
vs. supply voltage VCC
Supply current (mA)
Supply current (mA)
-50
140
-60
130
120
110
4.5
5.0
5.5
Supply voltage (V)
0.9
Typical refresh current ICC3
vs. supply voltage VCC
50
Typical supply current ICC
vs. ambient temperature Ta
80
60
-60
120
4.5
5.0
5.5
Supply voltage (V)
4/11/01; v.0.9.1
6.0
25
20
15
10
5
0.0
2
3.5
-50
-60
100
80
60
20
0.0
250
Typical power-on current IPO
vs. cycle rate 1/tRC
35
–10
35
80
125
Ambient temperature (°C)
40
40
100
150
200
Load capacitance (pF)
30
-50
130
120
-50
50
30
160
-60
-60
60
Typical refresh current ICC3
vs. Ambient temperature Ta
-50
100
-70
70
–10
35
80
125
Ambient temperature (°C)
140
140
120
80
40
150
100
–55
6.0
Refresh current (mA)
Refresh current (mA)
1.0
110
140
20
4.0
1.1
160
150
160
1.2
170
160
100
4.0
1.3
0.8
–55
6.0
Typical access time
1.2
90
Power-on current (mA)
1.3
Ta = 25°C
Typical access time tRAC
vs. load capacitance CL
100
1.4
Normalized access time
Normalized access time
1.4
Normalized access time tRAC
vs. ambient temperature Ta
4
6
8
Cycle rate (MHz)
10
Typical TTL stand-by current ICC2
vs. supply voltage VCC
3.0
Stand-by current (mA)
1.5
Normalized access time tRAC
vs. supply voltage VCC
2.5
2.0
1.5
1.0
0.5
0
20
40
60
80
Ambient temperature (°C)
Alliance Semiconductor
4.0
4.5
5.0
5.5
Supply voltage (V)
6.0
P. 19 of 21
AS4C1M16F5
®
70
Output sink current (mA)
Stand-by current (mA)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Hyper page mode current (mA)
Typical hyper page mode current ICC4
vs. ambient temperature Ta
140
120
100
-50
80
-60
60
40
20
0.0
0
20
40
60
80
Ambient temperature (°C)
50
40
30
20
10
Input capacitance
DQ capacitance
Typical output source current IOH
vs. output voltage VOH
60
50
40
30
20
10
0.0
0.5
1.0
1.5
Output voltage (V)
2.0
0.0
1.0
2.0
3.0
Output voltage (V)
4.0
Typical hyper page mode current ICC4
vs. supply voltage VCC
140
120
-50
100
-60
80
60
40
20
0.0
4.0
4.5
5.0
5.5
Supply voltage (V)
Capacitance 15
Parameter
70
60
0.0
0.0
20
40
60
80
Ambient temperature (°C)
Hyper page mode current (mA)
0
Typical output sink current IOL
vs. output voltage VOL
Output source current (mA)
3.5
Typical TTL stand-by current ICC2
vs. ambient temperature Ta
6.0
Symbol
Signals
ƒ = 1 MHz, Ta = Room temperature
Test conditions
Max
Unit
CIN1
A0 to A9
Vin = 0V
5
pF
CIN2
RAS, UCAS, LCAS, WE, OE
Vin = 0V
7
pF
CDQ
DQ0 to DQ15
Vin = Vout = 0V
7
pF
AS4C1M16F5 ordering information
Package \ RAS access time
50 ns
60 ns
Plastic SOJ, 400 mil, 42-pin
5V
AS4C1M16F5-50JC
AS4C1M16F5-50JI
AS4C1M16F5-60JC
AS4C1M16F5-60JI
TSOP II, 400 mil, 44/50-pin
5V
AS4C1M16F5-50TC
AS4C1M16F5-50TI
AS4C1M16F5-60TC
AS4C1M16F5-60TI
4/11/01; v.0.9.1
Alliance Semiconductor
P. 20 of 21
AS4C1M16F5
®
AS4C1M16F5 part numbering system
AS4
DRAM prefix
C
C = 5V CMOS
4/11/01; v.0.9.1
1M16E0
–XX
Device number RAS access time
X
X
Package:
Temperature range
C=Commercial, 0°C to 70°C
J = 42-pin SOJ 400 mil
T=44/50-pin TSOP II 400 mil I=Industrial, -40°C to 85°C
Alliance Semiconductor
P. 21 of 21