OKI MSM5118160B

E2G0051-17-41
¡ Semiconductor
MSM5118160B
¡ Semiconductor
This version:
Jan. 1998
MSM5118160B
Previous version: May 1997
1,048,576-Word ¥ 16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE
DESCRIPTION
The MSM5118160B is a 1,048,576-word ¥ 16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS
technology. The MSM5118160B achieves high integration, high-speed operation, and low-power
consumption because Oki manufactures the device in a quadruple-layer polysilicon/double-layer
metal CMOS process. The MSM5118160B is available in a 42-pin plastic SOJ or 50/44-pin plastic
TSOP.
FEATURES
• 1,048,576-word ¥ 16-bit configuration
• Single 5 V power supply, ±10% tolerance
• Input
: TTL compatible, low input capacitance
• Output : TTL compatible, 3-state
• Refresh : 1024 cycles/16 ms
• Fast page mode, read modify write capability
• CAS before RAS refresh, hidden refresh, RAS-only refresh capability
• Package options:
42-pin 400 mil plastic SOJ
(SOJ42-P-400-1.27)
(Product : MSM5118160B-xxJS)
50/44-pin 400 mil plastic TSOP (TSOPII50/44-P-400-0.80-K) (Product : MSM5118160B-xxTS-K)
(TSOPII50/44-P-400-0.80-L) (Product : MSM5118160B-xxTS-L)
xx indicates speed rank.
PRODUCT FAMILY
Family
Access Time (Max.)
tRAC
tAA
tCAC
tOEA
Cycle Time
Power Dissipation
(Min.)
Operating (Max.) Standby (Max.)
MSM5118160B-50
50 ns 25 ns 13 ns 13 ns
90 ns
990 mW
MSM5118160B-60
60 ns 30 ns 15 ns 15 ns
110 ns
880 mW
MSM5118160B-70
70 ns 35 ns 20 ns 20 ns
130 ns
770 mW
5.5 mW
1/16
¡ Semiconductor
MSM5118160B
PIN CONFIGURATION (TOP VIEW)
VCC 1
DQ1 2
DQ2 3
DQ3 4
DQ4 5
VCC 6
DQ5 7
DQ6 8
DQ7 9
DQ8 10
NC 11
NC 12
WE 13
42 VSS
50 VSS
VCC 1
VSS 50
1 VCC
41 DQ16
DQ1 2
49 DQ16 DQ16 49
2 DQ1
40 DQ15
DQ2 3
48 DQ15 DQ15 48
3 DQ2
39 DQ14
DQ3 4
47 DQ14 DQ14 47
4 DQ3
38 DQ13
DQ4 5
46 DQ13 DQ13 46
5 DQ4
45 VSS
6 VCC
37 VSS
VCC 6
VSS 45
36 DQ12
DQ5 7
44 DQ12 DQ12 44
7 DQ5
35 DQ11
DQ6 8
43 DQ11 DQ11 43
8 DQ6
34 DQ10
DQ7 9
42 DQ10 DQ10 42
9 DQ7
33 DQ9
DQ8 10
41 DQ9
DQ9 41
10 DQ8
32 NC
NC 11
40 NC
NC 40
11 NC
31 LCAS
30 UCAS
RAS 14
29 OE
NC 15
28 A9
NC 15
36 NC
NC 36
15 NC
NC 16
27 A8
NC 16
35 LCAS
LCAS 35
16 NC
A0 17
26 A7
WE 17
34 UCAS UCAS 34
17 WE
A1 18
25 A6
RAS 18
33 OE
OE 33
18 RAS
A2 19
24 A5
NC 19
32 A9
A9 32
19 NC
A3 20
23 A4
NC 20
31 A8
A8 31
20 NC
VCC 21
22 VSS
A0 21
30 A7
A7 30
21 A0
A1 22
29 A6
A6 29
22 A1
A2 23
28 A5
A5 28
23 A2
A3 24
27 A4
A4 27
24 A3
VCC 25
26 VSS
VSS 26
25 VCC
42-Pin Plastic SOJ
50/44-Pin Plastic TSOP
(K Type)
Pin Name
A0 - A9
RAS
Function
Address Input
Row Address Strobe
LCAS
Lower Byte Column Address Strobe
UCAS
Upper Byte Column Address Strobe
DQ1 - DQ16
Note :
50/44-Pin Plastic TSOP
(L Type)
Data Input/Data Output
OE
Output Enable
WE
Write Enable
VCC
Power Supply (5 V)
VSS
Ground (0 V)
NC
No Connection
The same power supply voltage must be provided to every VCC pin, and the same GND
voltage level must be provided to every VSS pin.
2/16
¡ Semiconductor
MSM5118160B
BLOCK DIAGRAM
WE
RAS
OE
Timing
Generator
I/O
Controller
LCAS
UCAS
I/O
Controller
10
Column
Address
Buffers
10
Internal
Address
Counter
A0 - A9
10
Refresh
Control Clock
Row
Address 10
Buffers
Row
Decoders
8
Output
Buffers
8
Input
Buffers
8
8
Input
Buffers
8
8
DQ1 - DQ8
Column Decoders
Sense Amplifiers
I/O
Selector
16
16
Memory
Cells
Word
Drivers
DQ9 - DQ16
8
Output
Buffers
8
VCC
On Chip
VBB Generator
On Chip
IVCC Generator
VSS
FUNCTION TABLE
Input Pin
DQ Pin
Function Mode
RAS
LCAS
UCAS
WE
OE
DQ1 - DQ8
DQ9 - DQ16
H
*
H
*
*
High-Z
High-Z
L
*
H
Refresh
H
*
L
High-Z
L
*
H
High-Z
L
DOUT
High-Z
Lower Byte Read
L
H
L
H
L
High-Z
DOUT
Upper Byte Read
L
L
L
H
L
DOUT
DOUT
Word Read
L
L
H
L
H
DIN
Don't Care
DIN
Lower Byte Write
Don't Care
Standby
Upper Byte Write
L
H
L
L
H
L
L
L
L
H
DIN
DIN
Word Write
H
High-Z
High-Z
—
L
L
L
H
*: "H" or "L"
3/16
¡ Semiconductor
MSM5118160B
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Symbol
Rating
Unit
Voltage on Any Pin Relative to VSS
VIN, VOUT
–0.5 to VCC + 0.5
V
Voltage on VCC Supply Relative to VSS
VCC
–0.5 to 7
V
Short Circuit Output Current
IOS
50
mA
Parameter
Power Dissipation
PD*
1
W
Operating Temperature
Topr
0 to 70
°C
Storage Temperature
Tstg
–55 to 150
°C
*: Ta = 25°C
Recommended Operating Conditions
(Ta = 0°C to 70°C)
Parameter
Power Supply Voltage
Input High Voltage
Input Low Voltage
Symbol
Min.
Typ.
Max.
Unit
VCC
4.5
5.0
5.5
V
VSS
0
0
0
V
VIH
2.4
—
VCC + 0.5*1
V
VIL
–0.5*2
—
0.8
V
Notes : *1. The input voltage is VCC + 2.0 V when the pulse width is less than 20 ns (the pulse width
is with respect to the point at which VCC is applied).
*2. The input voltage is VSS – 2.0 V when the pulse width is less than 20 ns (the pulse width
is with respect to the point at which VSS is applied).
Capacitance
(VCC = 5 V ±10%, Ta = 25°C, f = 1 MHz)
Parameter
Input Capacitance (A0 - A9)
Input Capacitance
(RAS, LCAS, UCAS, WE, OE)
Output Capacitance (DQ1 - DQ16)
Symbol
Typ.
Max.
Unit
CIN1
—
5
pF
CIN2
—
7
pF
CI/O
—
7
pF
4/16
¡ Semiconductor
MSM5118160B
DC Characteristics
Parameter
(VCC = 5 V ±10%, Ta = 0°C to 70°C)
Symbol
Condition
Output High Voltage
VOH IOH = –5.0 mA
Output Low Voltage
VOL IOL = 4.2 mA
MSM5118160 MSM5118160 MSM5118160
B-50
B-60
B-70
Unit Note
Min.
Max.
Min.
Max.
Min.
Max.
2.4
0
VCC
2.4
0
VCC
0.4
2.4
0
VCC
0.4
0.4
V
V
–10
10
–10
10
–10
10
mA
–10
10
–10
10
–10
10
mA
—
180
—
160
—
140
mA
1, 2
—
2
—
2
—
2
mA
1
—
1
—
1
—
1
—
180
—
160
—
140
mA
1, 2
—
5
—
5
—
5
mA
1
—
180
—
160
—
140
mA
1, 2
—
170
—
150
—
130
mA
1, 3
0 V £ VI £ 6.5 V;
Input Leakage Current
ILI
All other pins not
under test = 0 V
Output Leakage Current
ILO
Average Power
Supply Current
ICC1
(Operating)
Power Supply
Current (Standby)
ICC2
Current (Standby)
(CAS before RAS Refresh)
Average Power
Supply Current
(Fast Page Mode)
RAS, CAS = VIH
RAS, CAS
ICC3 CAS = VIH,
tRC = Min.
RAS = VIH,
ICC5 CAS = VIL,
DQ = enable
Average Power
Supply Current
RAS, CAS cycling,
tRC = Min.
RAS cycling,
(RAS-only Refresh)
Power Supply
0 V £ VO £ 5.5 V
≥ VCC –0.2 V
Average Power
Supply Current
DQ disable
ICC6
RAS cycling,
CAS before RAS
RAS = VIL,
ICC7 CAS cycling,
tPC = Min.
Notes : 1. ICC Max. is specified as ICC for output open condition.
2. The address can be changed once or less while RAS = VIL.
3. The address can be changed once or less while CAS = VIH.
5/16
¡ Semiconductor
MSM5118160B
AC Characteristics (1/2)
(VCC = 5 V ±10%, Ta = 0°C to 70°C) Note 1, 2, 3
Parameter
Random Read or Write Cycle Time
Read Modify Write Cycle Time
Fast Page Mode Cycle Time
Fast Page Mode Read Modify Write
Cycle Time
Access Time from RAS
Symbol
MSM5118160 MSM5118160 MSM5118160
B-60
B-50
B-70
Unit Note
Min.
Max.
Min.
Max.
Min.
Max.
90
131
—
—
110
—
130
155
185
—
—
ns
ns
35
—
40
—
—
45
—
ns
tPRWC
76
—
85
—
100
—
ns
tRC
tRWC
tPC
tRAC
—
50
—
60
—
70
ns
4, 5, 6
Access Time from CAS
tCAC
Access Time from Column Address
Access Time from CAS Precharge
tAA
tCPA
—
—
13
25
—
—
15
30
—
—
20
35
ns
ns
4, 5
4, 6
—
30
—
35
—
40
ns
4, 12
Access Time from OE
Output Low Impedance Time from CAS
tOEA
tCLZ
—
0
13
—
—
0
15
—
—
0
20
—
ns
ns
4
4
CAS to Data Output Buffer Turn-off Delay Time
OE to Data Output Buffer Turn-off Delay Time
Transition Time
Refresh Period
tOFF
tOEZ
tT
tREF
0
0
3
—
13
13
50
16
0
0
3
—
15
15
50
16
0
0
3
—
20
20
50
16
ns
ns
ns
ms
7
7
3
RAS Precharge Time
tRP
30
—
40
—
50
—
ns
RAS Pulse Width
tRAS
50
10,000
60
10,000
70
10,000
ns
RAS Pulse Width (Fast Page Mode)
tRASP
50
100,000
60
100,000
70
100,000
ns
RAS Hold Time
RAS Hold Time referenced to OE
tRSH
tROH
13
13
—
—
15
15
—
—
20
20
—
—
ns
ns
CAS Precharge Time (Fast Page Mode)
tCP
7
—
10
—
10
—
ns
CAS Pulse Width
tCAS
13
10,000
15
10,000
20
10,000
ns
CAS Hold Time
CAS to RAS Precharge Time
tCSH
tCRP
50
—
—
60
5
—
—
70
5
—
—
ns
5
ns
12
RAS Hold Time from CAS Precharge
30
17
—
37
ns
ns
12
25
30
40
20
15
—
50
12
35
20
15
—
45
RAS to Column Address Delay Time
tRHCP
tRCD
tRAD
35
ns
6
Row Address Set-up Time
tASR
0
—
0
—
0
—
ns
Row Address Hold Time
tRAH
7
—
10
—
10
—
ns
Column Address Set-up Time
tASC
0
—
0
—
0
—
ns
11
Column Address Hold Time
Column Address to RAS Lead Time
tCAH
tRAL
7
25
—
—
10
30
—
—
15
35
—
—
ns
ns
11
Read Command Set-up Time
tRCS
0
—
0
—
0
—
ns
11
Read Command Hold Time
tRCH
0
—
0
—
0
—
ns
8, 11
Read Command Hold Time referenced to RAS
tRRH
0
—
0
—
0
—
ns
8
RAS to CAS Delay Time
14
5
6/16
¡ Semiconductor
MSM5118160B
AC Characteristics (2/2)
(VCC = 5 V ±10%, Ta = 0°C to 70°C) Note 1, 2, 3
Parameter
Symbol
MSM5118160 MSM5118160 MSM5118160
B-50
B-60
B-70
Unit Note
Min. Max.
Min.
Max.
Min.
Max.
Write Command Set-up Time
tWCS
0
—
0
—
0
—
ns
9, 11
Write Command Hold Time
tWCH
7
—
10
—
15
—
ns
11
Write Command Pulse Width
OE Command Hold Time
Write Command to RAS Lead Time
Write Command to CAS Lead Time
tWP
tOEH
7
13
—
—
10
15
—
—
10
20
—
—
ns
ns
tRWL
13
—
15
—
tCWL
13
—
15
—
20
20
—
—
ns
ns
Data-in Set-up Time
tDS
Data-in Hold Time
OE to Data-in Delay Time
CAS to WE Delay Time
Column Address to WE Delay Time
RAS to WE Delay Time
tDH
tOED
—
—
—
—
—
—
0
10
15
40
55
85
—
—
—
—
—
—
0
15
20
—
—
—
50
65
100
—
—
tRWD
0
7
13
36
48
73
—
ns
ns
ns
ns
ns
ns
CAS Precharge WE Delay Time
tCWD
tAWD
13
10, 11
10, 11
9
9
9
tCPWD
53
—
60
—
70
—
ns
9
CAS Active Delay Time from RAS Precharge
tRPC
5
—
5
—
5
—
ns
11
RAS to CAS Set-up Time (CAS before RAS)
RAS to CAS Hold Time (CAS before RAS)
tCSR
tCHR
10
10
—
—
10
10
—
—
10
10
—
—
ns
ns
11
12
7/16
¡ Semiconductor
Notes:
MSM5118160B
1. A start-up delay of 200 µs is required after power-up, followed by a minimum of eight
initialization cycles (RAS-only refresh or CAS before RAS refresh) before proper device
operation is achieved.
2. The AC characteristics assume tT = 5 ns.
3. VIH (Min.) and VIL (Max.) are reference levels for measuring input timing signals.
Transition times (tT) are measured between VIH and VIL.
4. This parameter is measured with a load circuit equivalent to 2 TTL loads and 100 pF.
5. Operation within the tRCD (Max.) limit ensures that tRAC (Max.) can be met.
tRCD (Max.) is specified as a reference point only. If tRCD is greater than the specified
tRCD (Max.) limit, then the access time is controlled by tCAC.
6. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met.
tRAD (Max.) is specified as a reference point only. If tRAD is greater than the specified
tRAD (Max.) limit, then the access time is controlled by tAA.
7. tOFF (Max.) and tOEZ (Max.) define the time at which the output achieves the open
circuit condition and are not referenced to output voltage levels.
8. tRCH or tRRH must be satisfied for a read cycle.
9. tWCS, tCWD, tRWD, tAWD and tCPWD are not restrictive operating parameters. They are
included in the data sheet as electrical characteristics only. If tWCS ≥ tWCS (Min.), then
the cycle is an early write cycle and the data out will remain open circuit (high
impedance) throughout the entire cycle. If tCWD ≥ tCWD (Min.) , tRWD ≥ tRWD (Min.),
tAWD ≥ tAWD (Min.) and tCPWD ≥ tCPWD (Min.), then the cycle is a read modify write
cycle and data out will contain data read from the selected cell; if neither of the above
sets of conditions is satisfied, then the condition of the data out (at access time) is
indeterminate.
10. These parameters are referenced to the UCAS and LCAS, leading edges in an early
write cycle, and to the WE leading edge in an OE control write cycle, or a read modify
write cycle.
11. These parameters are determined by the falling edge of either UCAS or LCAS,
whichever is earlier.
12. These parameters are determined by the rising edge of either UCAS or LCAS,
whichever is later.
13. tCWL should be satisfied by both UCAS and LCAS.
14. tCP is determined by the time both UCAS and LCAS are high.
8/16
E2G0091-17-41D
,
,,
,
,,,,
¡ Semiconductor
MSM5118160B
TIMING WAVEFORM
Read Cycle
tRC
tRP
tRAS
VIH –
RAS
VIL –
tCRP
tCSH
tCRP
CAS
tRCD
VIH –
VIL –
tRAD
tASR
Address
VIH –
VIL –
tRSH
tCAS
tRAH tASC
tRAL
tCAH
Column
Row
tRCS
WE
OE
VIH –
VIL –
tAA
tROH
tOEA
VIH –
VIL –
tCAC
tRAC
DQ
tRCH
tRRH
VOH –
tOEZ
Open
VOL –
tOFF
Valid Data-out
tCLZ
"H" or "L"
Write Cycle (Early Write)
tRC
tRP
tRAS
RAS
VIH –
VIL –
tCRP
tCRP
VIH –
CAS
VIL –
WE
OE
VIH –
VIL –
tASC
Row
tCAS
tCAH
tRAL
Column
tWCS
VIH –
tWCH
tCWL
tWP
VIL –
tRWL
VIH –
VIL –
tDS
DQ
tRSH
tRAD
tRAH
tASR
Address
tCSH
tRCD
VIH –
VIL –
tDH
Valid Data-in
Open
"H" or "L"
9/16
,
,,
¡ Semiconductor
MSM5118160B
Read Modify Write Cycle
tRWC
tRAS
RAS
VIH –
VIL –
tRP
tCRP
tCSH
tCRP
tRCD
tRSH
tCAS
VIH –
CAS
VIL –
tASR
VIH –
Address
VIL –
WE
VIH –
VIL –
OE
VIH –
VIL –
tRAH
tASC
tCAH
Column
Row
tRAD
tRWD
tAA
tAWD
tRCS
tOEA
tOED
tCAC
tRAC
DQ
VI/OH–
VI/OL–
tCWL
tRWL
tWP
tCWD
tCLZ
tOEZ
Valid
Data-out
tOEH
tDS
tDH
Valid
Data-in
"H" or "L"
10/16
,,
,
,
,,,
¡ Semiconductor
MSM5118160B
Fast Page Mode Read Cycle
tRASP
VIH –
RAS V –
IL
VIH –
CAS
VIL –
Address
WE
VIH –
VIL –
tRHCP
tCRP
tPC
tRCD
tRAD
tASR
tRAH tASC
tCP
tCAS
tCSH
tCAH
tASC
Column
Row
tCAH
tRCH
VIH –
VIL –
Column
tRCH
tRCS
tOFF
tCAC
tOEA
tOFF
tCAC
tOEZ
tRRH
tCPA
tOEA
tRAC
tRCH
tAA
tAA
tCPA
tOEA
tCAC
tOEZ
tCLZ
Valid
Data-out
tCLZ
tRAL
tCAH
tASC
tRCS
tAA
VOH –
VOL –
tCAS
Column
tRCS
tCRP
tRSH
tCP
tCAS
VIH –
OE
VIL –
DQ
tRP
tOFF
tCLZ
tOEZ
Valid
Data-out
Valid
Data-out
"H" or "L"
Fast Page Mode Write Cycle (Early Write)
tRASP
tPC
VIH –
RAS V –
IL
tCRP
VIH –
CAS
VIL –
Address
VIH –
VIL –
tCAS
tASR
tRAH tASC
Row
tRAD
tWCS
tDS
VIH –
VIL –
tRHCP
tRSH
tRCD
VIH –
WE
VIL –
DQ
tRP
tCSH
tCAH
Column
tCWL
tWCH
tWP
tDH
Valid Data-in
tCP
tCRP
tCP
tCAS
tASC
tCAH
tASC
Column
tCWL
tWCS
tWCH
tWP
tDS
tDH
Valid
Data-in
tCAS
tCAH
tRAL
Column
tRWL
tCWL
tWCS
tWCH
tWP
tDS
tDH
Valid
Data-in
Note: OE = "H" or "L"
"H" or "L"
11/16
¡ Semiconductor
MSM5118160B
,,,
,
,
,
,
Fast Page Mode Read Modify Write Cycle
tRASP
VIH –
RAS
VIL –
tRP
tCSH
tPRWC
tRCD
VIH –
CAS
VIL –
tASR
VIH –
VIL –
tASC
tCAH
tASC
Column
Row
tCRP
tCAS
tCWD
tRCS
V
WE IH –
VIL –
tASC
tCAH
tCAH
Column
Column
tRCS
tCPWD
tCWD
tRWD
tCWL
tAWD
tCWL
tWP
tDH
VI/OH–
VI/OL –
Out
tCLZ
tOEA
tOED
tOEZ
tCAC
In
tDH
tDS
tOEA
tOEZ
tCAC
tWP
tCPA
tAA
tOED
VIH –
OE V –
IL
tCWL
tROH
tWP
tDH
tDS
tOEA
tRWL
tAWD
tCPA
tAA
tAA
tRAL
tRCS
tCPWD
tCWD
tAWD
tDS
tRAC
DQ
tCP
tCAS
tRAD
tRAH
Address
tCP
tCAS
tRSH
Out
tOED
In
tCLZ
tOEZ
tCAC
Out
In
tCLZ
"H" or "L"
RAS-Only Refresh Cycle
tRC
RAS
CAS
Address
VIH –
VIL –
VIH –
VIL –
VIH –
VIL –
tRP
tRAS
tCRP
tASR
tRPC
tRAH
Row
tOFF
DQ
VOH –
VOL –
Open
Note: WE, OE = "H" or "L"
"H" or "L"
12/16
,,
,
,,
¡ Semiconductor
MSM5118160B
CAS before RAS Refresh Cycle
tRC
tRP
RAS
VIH –
VIL –
tRAS
tRPC
tRPC
tCSR
tCP
CAS
DQ
tRP
VIH –
VIL –
tCHR
tOFF
VOH –
VOL –
Open
Note: WE, OE, Address = "H" or "L"
"H" or "L"
Hidden Refresh Read Cycle
tRC
tRAS
RAS
tRP
VIL –
VIH –
VIL –
VIH –
VIL –
tRSH
tRCD
tRAD
tASC
tRAH
tASR
Address
tRAS
tRP
VIH –
tCRP
CAS
tRC
Row
tCHR
tCAH
Column
tRCS
tRAL
VIH –
WE V
IL –
tRRH
tAA
tROH
tOEA
VIH –
OE V
IL –
tRAC
DQ
VOH –
VOL –
tCAC
tCLZ
tOFF
tOEZ
Valid Data-out
"H" or "L"
13/16
,
,,
,
¡ Semiconductor
MSM5118160B
Hidden Refresh Write Cycle
tRC
tRP
tRAS
RAS
tRP
VIL –
VIH –
VIH –
VIL –
tRSH
tRCD
tRAD
tASC
tRAH
VIL –
tASR
Address
tRAS
VIH –
tCRP
CAS
tRC
tCHR
tCAH t
RAL
Column
Row
tWCS
VIH –
WE V –
IL
tWCH
tWP
VIH –
OE V
IL –
tDS
DQ
VIH –
VIL –
tDH
Valid Data-in
"H" or "L"
14/16
¡ Semiconductor
MSM5118160B
PACKAGE DIMENSIONS
(Unit : mm)
SOJ42-P-400-1.27
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.86 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
15/16
¡ Semiconductor
MSM5118160B
(Unit : mm)
TSOPII50/44-P-400-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.60 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
16/16