ETC SP0102NC3-2

Document: SP0102N
Last Revision Date: 09-2003
Product Specification: SP0102 Series (Generation II)
This document applies the following SiSonic Model Numbers:
SP0102NC3-2
SP0102NC3-3
SiSonic microphone was developed as a cost effective
alternative to traditional electret condenser
microphones. Provided on tape-and-reel, SiSonic is
ideally suited for high volume applications. It can be
processed directly to a customer’s PCB using standard
automatic pick-and-place equipment, and surface
mounted via standard solder reflow equipment.
Microphone Dimensional Layout
Microphone Pin Output
Item
Dim.
Tol.
(+/-)
Units
Height
1.45
0.15
mm
Length
6.15
0.05
mm
Width
3.76
0.05
mm
Weight
< 0.5
grams
Coplanarity
< 0.1
mm
Recommended PCB
Land Layout
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Document: SP0102N
Last Revision Date: 09-2003
Product Specifications Test Conditions: +20ºC, 60-70% R.H.
Limits
Symbol
Directivity
Condition
Nom.
Max.
-46
-42
-38
dB
100
Ω
0.250
mA
Omni-directional
Sensitivity
S
@ 1kHz (0dB=1V/Pa)
Output impedance
ZOUT
@ 1kHz (0dB=1V/Pa)
Current Consumption
IDSS
across 1.5 to 5.5 volts
0.100
Signal to Noise Ratio
S/N
@ 1kHz (0dB=1V/Pa)
55
Typical Input Referred
Noise
ENL
A-weighted
Supply Voltage
Vs
Sensitivity Loss across
Voltage
Maximum Input Sound
Level
Unit
Min.
1.5
Change in sensitivity over
5.5v to 1.5v
59
dB
35
dBA SPL
5.5
V
No Change Across
Voltage Range
dB
At 100dB SPL, THD < 1%
At 115dB SPL, THD = < 10%
dB
Operating
Temperature
-40
+100
ºC
Storage Temperature
-40
+100
ºC
Frequency Range
100 – 10,000
Hz
Frequency Response Curve
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Document: SP0102N
Last Revision Date: 09-2003
Packaging Specifications
Carrier – Tape Detail
Model
Number
Suffix
Reel
Diameter
Qty
per
Reel
Capacitor
Config.
SP0102NC3
-2
7”
1,200
10 & 33pF
SP0102NC3
-3
13”
4,500
10 & 33pF
NOTE: All devices are lead-free, and compatible with leadfree reflow profile.
Solderability Characteristics
Tape &
Reel
Available in 7” or 13” diameter.
Leader
Length
800mm or minimum of 100
empty pockets
Label
Label applied to external
package and direct to reel. Per
JEDEC.
Storage
Life
1 year storage (original
packaging, low humidity)
Polarity of
part
“L” – direction
(** No board washing after reflow **)
Solder Reflow
260ºC for maximum 30 seconds
Terminal Pads
Gold (27u”) over Nickel (150u”) Typical
# of Reflow Passes
reference Reliability section
Reflow Profile
(Maximum Conditions)
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Document: SP0102N
Last Revision Date: 09-2003
Reliability
Thermal Shock
Microphone unit must operate when exposed to air-to-air thermal
shock 100 cycles, from –40ºC to +125ºC. (IEC 68-2-4),
High Temperature
Storage Test
Microphone unit must maintain sensitivity after storage at +105ºC for
1,000 hours. (IEC 68-2-2 Test Ba)
Low Temperature
Storage Test
Microphone unit must maintain sensitivity after storage at –40ºC for
1,000 hours. (IEC 68-2-1 Test Aa)
High Temperature
Operating Test
Microphone unit must operate within sensitivity specifications for 16
hours at 105ºC. (IEC 68-2-2 Test Ba)
Low Temperature
Operating Test
Microphone unit must operate within sensitivity specifications for 16
hours at –40ºC. (IEC 68-2-1 Test Aa)
Humidity Test
Tested under Bias at 85ºC/85% R.H. for 270 hours. (JESD22-A101A-B)
Vibration Test
Microphone unit must operate under test condition: 4 cycles, from 20
to 2,000 Hz in each direction (x,y,z), 48 minutes, using peak
acceleration of 20g (+20%, -0%). (MIL 883E, method 2007.2, A)
Electrostatic
Discharge
Tested to 8kV direct contact discharge or 15kV air discharge as
specified by IEC 1000-4-2, level 3 and level 4.
Reflow
Microphone is tested to 5 passes through reflow oven, with microphone
mounted upside-down under conditions of 260ºC for 30 seconds
maximum.
Mechanical Shock
Tested to greater than 5,000g (IEC 68-2-27, Ea).
Note:
After test conditions are performed, the sensitivity of the microphone
shall not deviate more than 3dB from its initial value.
Dotted Section
Represents SiSonic
Microphone
Recommended Interface Circuit
+ Term. 4
•
Term. 1
Term. 3
•
R1
R2
•
+
Vref
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External Gain (set by
customer) = -R1/R2
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