LM2704 Micropower Step-up DC/DC Converter with 550mA Peak Current Limit General Description Features The LM2704 is a micropower step-up DC/DC in a small 5-lead SOT-23 package. A current limited, fixed off-time control scheme conserves operating current resulting in high efficiency over a wide range of load conditions. The 21V switch allows for output voltages as high as 20V. The low 400ns off-time permits the use of tiny, low profile inductors and capacitors to minimize footprint and cost in spaceconscious portable applications. The LM2704 is ideal for LCD panels requiring low current and high efficiency as well as white LED applications for cellular phone back-lighting. The LM2704 can drive up to 8 white LEDs from a single Li-Ion battery. n n n n n n n 550mA, 0.7Ω, internal switch Uses small surface mount components Adjustable output voltage up to 20V 2.2V to 7V input range Input undervoltage lockout 0.01µA shutdown current Small 5-Lead SOT-23 package Applications n n n n n LCD Bias Supplies White LED Back-Lighting Handheld Devices Digital Cameras Portable Applications Typical Application Circuit 20031501 FIGURE 1. Typical 20V Application © 2003 National Semiconductor Corporation DS200315 www.national.com LM2704 Micropower Step-up DC/DC Converter with 550mA Peak Current Limit April 2003 LM2704 Connection Diagram Top View 20031502 TJmax SOT23-5 = 125˚C, θJA = 220˚C/W (Note 2) Ordering Information Order Number Package Type NSC Package Drawing Top Mark LM2704MF-ADJ SOT23-5 MA05B S28B 1000 Units, Tape and Reel Supplied As LM2704MFX-ADJ SOT23-5 MA05B S28B 3000 Units, Tape and Reel Pin Description/Functions Pin Name 1 SW 2 GND 3 FB 4 SHDN 5 VIN Function Power Switch input. Ground. Output voltage feedback input. Shutdown control input, active low. Analog and Power input. SW(Pin 1): Switch Pin. This is the drain of the internal NMOS power switch. Minimize the metal trace area connected to this pin to minimize EMI. GND(Pin 2): Ground Pin. Tie directly to ground plane. FB(Pin 3): Feedback Pin. Set the output voltage by selecting values for R1 and R2 using: www.national.com Connect the ground of the feedback network to an AGND plane which should be tied directly to the GND pin. SHDN(Pin 4): Shutdown Pin. The shutdown pin is an active low control. Tie this pin above 1.1V to enable the device. Tie this pin below 0.3V to turn off the device. VIN(Pin 5): Input Supply Pin. Bypass this pin with a capacitor as close to the device as possible. 2 Infrared (15 sec.) (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VIN 7.5V SW Voltage 21V FB Voltage 2V SHDN Voltage ESD Ratings (Note 3) Human Body Model Machine Model (Note 4) 2kV 200V Operating Conditions 7.5V Junction Temperature (Note 5) 150˚C Maximum Junction Temp. TJ (Note 2) 220˚C −40˚C to +125˚C Supply Voltage Lead Temperature (Soldering 10 sec.) 300˚C Vapor Phase (60 sec.) 215˚C 2.2V to 7V SW Voltage Max. 20.5V Electrical Characteristics (Note 5) Specifications in standard type face are for TJ = 25˚C and those in boldface type apply over the full Operating Temperature Range (TJ = −40˚C to +125˚C). Unless otherwise specified. VIN =2.2V. Symbol IQ Parameter Conditions Min (Note 5) Typ (Note 6) Max (Note 5) Device Disabled FB = 1.3V 40 70 Device Enabled FB = 1.2V 235 300 Shutdown SHDN = 0V 0.01 2.5 Units µA VFB Feedback Trip Point 1.189 1.237 1.269 V ICL Switch Current Limit 490 420 550 610 620 mA IB FB Pin Bias Current 30 120 nA 7.0 V 0.7 1.6 Ω VIN Input Voltage Range RDSON Switch RDSON TOFF Switch Off Time ISD SHDN Pin Current FB = 1.23V (Note 7) 2.2 400 SHDN = VIN, TJ = 25˚C 0 SHDN = VIN, TJ = 125˚C 15 SHDN = GND 0 IL Switch Leakage Current VSW = 20V 0.05 UVP Input Undervoltage Lockout ON/OFF Threshold 1.8 VFB Hysteresis Feedback Hysteresis SHDN High θJA Thermal Resistance nA 5 0.7 1.1 0.7 220 µA V 8 SHDN low SHDN Threshold ns 80 mV 0.3 V ˚C/W Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature. Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Note 4: ESD susceptibility using the machine model is 150V for SW pin. Note 5: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 6: Typical numbers are at 25˚C and represent the most likely norm. Note 7: Feedback current flows into the pin. 3 www.national.com LM2704 Absolute Maximum Ratings LM2704 Typical Performance Characteristics Disable Current vs VIN (Part Not Switching) Enable Current vs VIN (Part Switching) 20031505 20031506 Efficiency vs Load Current Efficiency vs Load Current 20031510 www.national.com 20031511 4 LM2704 Typical Performance Characteristics (Continued) Efficiency vs Load Current SHDN Threshold vs VIN 20031512 20031513 Switch Current Limit vs VIN Switch RDSON vs VIN 20031515 20031514 5 www.national.com LM2704 Typical Performance Characteristics (Continued) FB Trip Point and FB Pin Current vs Temperature Output Voltage vs Load Current 20031537 20031538 Step Response Start-Up/Shutdown 20031516 VOUT = 20V, VIN = 3.0V 20031517 VOUT = 20V, VIN = 2.5V 1) Load, 1mA to 17mA to 1mA, DC 2) VOUT, 200mV/div, AC 1) SHDN, 1V/div, DC 3) IL, 500mA/div, DC 2) IL, 250mA/div, DC T = 40µs/div 3) VOUT, 20V/div, DC T = 400µs/div RL = 1.3kΩ www.national.com 6 LM2704 Operation 20031504 FIGURE 2. LM2704 Block Diagram 20031518 VOUT = 20V, VIN = 2.5V 1) VSW, 20V/div, DC 2) Inductor Current, 500mA/div, DC 3) VOUT, 100mV/div, AC T = 10µs/div FIGURE 3. Typical Switching Waveform 7 www.national.com LM2704 Operation Care should be taken when choosing an inductor. For applications that require an input voltage that approaches the output voltage, such as when converting a Li-Ion battery voltage to 5V, the 400ns off time may not be enough time to discharge the energy in the inductor and transfer the energy to the output capacitor and load. This can cause a ramping effect in the inductor current waveform and an increased ripple on the output voltage. Using a smaller inductor will cause the IPK to increase and will increase the output voltage ripple further. This can be solved by adding a 4.7pF capacitor across the RF1 feedback resistor (Figure 2) and slightly increasing the output capacitor. A smaller inductor can then be used to ensure proper discharge in the 400ns off time. (Continued) The LM2704 features a constant off-time control scheme. Operation can be best understood by referring to Figure 2 and Figure 3. Transistors Q1 and Q2 and resistors R3 and R4 of Figure 2 form a bandgap reference used to control the output voltage. When the voltage at the FB pin is less than 1.237V, the Enable Comp in Figure 2 enables the device and the NMOS switch is turned on pulling the SW pin to ground. When the NMOS switch is on, current begins to flow through inductor L while the load current is supplied by the output capacitor COUT. Once the current in the inductor reaches the peak current limit, the CL Comp trips and the 400ns One Shot turns off the NMOS switch. The SW voltage will then rise to the output voltage plus a diode drop and the inductor current will begin to decrease as shown in Figure 3. During this time the energy stored in the inductor is transferred to COUT and the load. After the 400ns off-time the NMOS switch is turned on and energy is stored in the inductor again. This energy transfer from the inductor to the output causes a stepping effect in the output ripple as shown in Figure 3. This cycle is continued until the voltage at FB reaches 1.237V. When FB reaches this voltage, the enable comparator then disables the device turning off the NMOS switch and reducing the Iq of the device to 40uA. The load current is then supplied solely by COUT indicated by the gradually decreasing slope at the output as shown in Figure 3. When the FB pin drops slightly below 1.237V, the enable comparator enables the device and begins the cycle described previously. The SHDN pin can be used to turn off the LM2704 and reduce the Iq to 0.01µA. In shutdown mode the output voltage will be a diode drop lower than the input voltage. DIODE SELECTION To maintain high efficiency, the average current rating of the schottky diode should be larger than the peak inductor current, IPK. Schottky diodes with a low forward drop and fast switching speeds are ideal for increasing efficiency in portable applications. Choose a reverse breakdown of the schottky diode larger than the output voltage. CAPACITOR SELECTION Choose low ESR capacitors for the output to minimize output voltage ripple. Multilayer ceramic capacitors are the best choice. For most applications, a 1µF ceramic capacitor is sufficient. For some applications a reduction in output voltage ripple can be achieved by increasing the output capacitor. Local bypassing for the input is needed on the LM2704. Multilayer ceramic capacitors are a good choice for this as well. A 4.7µF capacitor is sufficient for most applications. For additional bypassing, a 100nF ceramic capacitor can be used to shunt high frequency ripple on the input. Application Information LAYOUT CONSIDERATIONS The input bypass capacitor CIN, as shown in Figure 1, must be placed close to the IC. This will reduce copper trace resistance which effects input voltage ripple of the IC. For additional input voltage filtering, a 100nF bypass capacitor can be placed in parallel with CIN to shunt any high frequency noise to ground. The output capacitor, COUT, should also be placed close to the IC. Any copper trace connections for the Cout capacitor can increase the series resistance, which directly effects output voltage ripple. The feedback network, resistors R1 and R2, should be kept close to the FB pin to minimize copper trace connections that can inject noise into the system. The ground connection for the feedback resistor network should connect directly to an analog ground plane. The analog ground plane should tie directly to the GND pin. If no analog ground plane is available, the ground connection for the feedback network should tie directly to the GND pin. Trace connections made to the inductor and schottky diode should be minimized to reduce power dissipation and increase overall efficiency. INDUCTOR SELECTION The appropriate inductor for a given application is calculated using the following equation: where VD is the schottky diode voltage, ICL is the switch current limit found in the Typical Performance Characteristics section, and TOFF is the switch off time. When using this equation be sure to use the minimum input voltage for the application, such as for battery powered applications. For the LM2704 constant-off time control scheme, the NMOS power switch is turned off when the current limit is reached. There is approximately a 200ns delay from the time the current limit is reached in the NMOS power switch and when the internal logic actually turns off the switch. During this 200ns delay, the peak inductor current will increase. This increase in inductor current demands a larger saturation current rating for the inductor. This saturation current can be approximated by the following equation: Choosing inductors with low ESR decrease power losses and increase efficiency. www.national.com 8 LM2704 Application Information (Continued) 20031509 FIGURE 4. White LED Application 20031534 FIGURE 5. Li-Ion 5V Application 20031535 FIGURE 6. Li-Ion 12V Application 9 www.national.com LM2704 Application Information (Continued) 20031536 FIGURE 7. 5V to 12V Application www.national.com 10 inches (millimeters) unless otherwise noted 5-Lead Small Outline Package (M5) For Ordering, Refer to Ordering Information Table NS Package Number MA05B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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National Semiconductor Asia Pacific Customer Support Center Fax: +65-6250 4466 Email: [email protected] Tel: +65-6254 4466 National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: [email protected] Tel: 81-3-5639-7560 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. LM2704 Micropower Step-up DC/DC Converter with 550mA Peak Current Limit Physical Dimensions