ETC NSPB310A

No. STSE-CB2113A
<Cat.No.020823>
SPECIFICATIONS FOR NICHIA BLUE LED
MODEL : NSPB310A
NICHIA CORPORATION
-0-
Nichia STSE-CB2113A
<Cat.No.020823>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
IF
IFP
VR
PD
Topr
Tstg
Tsld
Absolute Maximum Rating
30
100
5
120
-30 ~ + 85
-40 ~ +100
265°C for 10sec.
(Ta=25°C)
Unit
mA
mA
V
mW
°C
°C
IFP Conditions : Pulse Width <
= 10msec. and Duty <
= 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Rank T
Iv
Luminous Intensity Rank S
Iv
Rank R
Iv
Condition
IF=20[mA]
VR= 5[V]
IF=20[mA]
IF=20[mA]
IF=20[mA]
Min.
1380
960
690
Typ.
3.6
1660
1160
830
(Ta=25°C)
Max.
Unit
4.0
V
50
µA
1920
mcd
1380
mcd
960
mcd
! Measurement Uncertainty of the Luminous Intensity : ± 10%
Color Rank
x
y
0.11
0.04
(IF=20mA,Ta=25°C)
Rank W
0.11
0.15
0.15
0.10
0.10
0.04
! Measurement Uncertainty of the Color Coordinates : ± 0.01
! One delivery will include up to one color rank and three luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ;
Resin(Mold) :
Leadframe :
Epoxy Resin
Ag plating Copper Alloy
-1-
Nichia STSE-CB2113A
<Cat.No.020823>
4.PACKAGING
· The LEDs are packed in cardboard boxes after packaging in anti-electrostatic bags.
According to the
total delivery amount, cardboard boxes will be used to protect the LEDs from mechanical shocks during
transportation.
Please refer to figure’s page.
The label on the minimum packing unit bag shows;
Part Number, Lot Number, Ranking, Quantity
· The boxes are not water resistant and therefore must be kept away from water and moisture.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
"#$$$$ - !%
" - Year
( 1 for 2001, 2 for 2002 )
# - Month ( 1 for Jan., 9 for Sep., A for Oct.,
$$$$ - Nichia's Product Number
! - Ranking by Color Coordinates
% - Ranking by Luminous Intensity
-2-
B for Nov.)
Nichia STSE-CB2113A
<Cat.No.020823>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Standard
Test Method
Test Conditions
Note
Number of
Damaged
1 time
0/100
1 time
over 95%
0/100
Resistance to
Soldering Heat
JEITA ED-4701
300 302
Tsld=260 ± 5°C, 10sec.
3mm from the base of the epoxy bulb
Solderability
JEITA ED-4701
300 303
Tsld=235 ± 5°C,
(using flux)
Thermal Shock
JEITA ED-4701
300 307
0°C ~ 100°C
15sec. 15sec.
100 cycles
0/100
Temperature Cycle
JEITA ED-4701
100 105
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
100 cycles
0/100
Moisture Resistance Cyclic
JEITA ED-4701
200 203
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
10 cycles
0/100
Terminal Strength
(bending test)
JEITA ED-4701
400 401
Load 5N (0.5kgf)
0° ~ 90° ~ 0° bend 2 times
No noticeable
damage
0/100
Terminal Strength
(pull test)
JEITA ED-4701
400 401
Load 10N (1kgf)
10 ± 1 sec.
No noticeable
damage
0/100
High Temperature Storage
JEITA ED-4701
200 201
Ta=100°C
1000hrs.
0/100
Temperature Humidity
Storage
JEITA ED-4701
100 103
Ta=60°C, RH=90%
1000hrs.
0/100
Low Temperature Storage
JEITA ED-4701
200 202
Ta=-40°C
1000hrs.
0/100
Steady State Operating Life
Ta=25°C, IF=30mA
1000hrs.
0/100
Steady State Operating Life
of High Humidity Heat
60°C, RH=90%, IF=20mA
500hrs.
0/100
Steady State Operating Life
of Low Temperature
Ta=-30°C, IF=20mA
1000hrs.
0/100
5sec.
(2) CRITERIA FOR JUDGING THE DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=20mA
U.S.L.*)$ 1.1
Reverse Current
IR
VR=5V
U.S.L.*)$ 2.0
Luminous Intensity
IV
IF=20mA
L.S.L.**)$ 0.7
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
-3-
Nichia STSE-CB2113A
<Cat.No.020823>
7.CAUTIONS
(1) Lead Forming
· When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Do not use the base of the leadframe as a fulcrum during lead forming.
· Lead forming should be done before soldering.
· Do not apply any bending stress to the base of the lead. The stress to the base may damage the
characteristics or it may break the LEDs.
· When mounting the LEDs onto a printed circuit board, the holes on the circuit board should be
exactly aligned with the leads of the LEDs. If the LEDs are mounted with stress at the leads,
it causes deterioration of the epoxy resin and this will degrade the LEDs.
(2) Storage
· The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Nichia and
the storage life limits are 3 months.
If the LEDs are stored for 3 months or more, they can be
stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
· Nichia LED leadframes are comprised of a silver plated copper alloy. The silver surface
may be affected by environments which contain corrosive gases and so on. Please avoid conditions
which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause
difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where
condensation can occur.
(3) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that measures
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
-4-
Nichia STSE-CB2113A
<Cat.No.020823>
(4) Soldering Conditions
· Nichia LED leadframes are comprised of a silver plated copper alloy.
This substance has a low
thermal coefficient (easily conducts heat).
Careful attention should be paid during soldering.
· Solder the LED no closer than 3mm from the base of the epoxy bulb.
Soldering beyond the base
of the tie bar is recommended.
· Recommended soldering conditions
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
Dip Soldering
100°C Max.
60 seconds Max.
260°C Max.
Temperature
Soldering Time
Position
Soldering
300°C Max.
3 seconds Max.
No closer than 3 mm from the
base of the epoxy bulb.
10 seconds Max.
No lower than 3 mm from the
base of the epoxy bulb.
· Do not apply any stress to the lead particularly when heated.
· The LEDs must not be repositioned after soldering.
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until
the LEDs return to room temperature.
· Direct soldering onto a PC board should be avoided.
Mechanical stress to the resin may be caused
from warping of the PC board or from the clinching and cutting of the leadframes.
When it is
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility
for any problems.
Direct soldering should only be done after testing has confirmed that no damage,
such as wire bond failure or resin deterioration, will occur.
Nichia’s LEDs should not be soldered
directly to double sided PC boards because the heat will deteriorate the epoxy resin.
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the LEDs.
· Cut the LED leadframes at room temperature.
Cutting the leadframes at high temperatures may
cause failure of the LEDs.
(5) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED
placement on the board, as well as other components. It is necessary to avoid intense heat generation
and operate within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
(6) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-5-
Nichia STSE-CB2113A
<Cat.No.020823>
(7) Safety Guideline for Human Eyes
· In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety
(IEC 825-1). Since then, this standard has been applied for diffused light sources (LEDs) as well
as lasers.
In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source.
In 2001 IEC 60825-1 Amendment 2 converted the laser class into 7 classes for end products.
Components are excluded from this system. Products which contain visible LEDs are now classified
as class 1. Products containing UV LEDs are class 1M. Products containing LEDs can be classified
as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the
energy emitted is high. For these systems it is recommended to avoid long term exposure.
It is also recommended to follow the IEC regulations regarding safety and labeling of products.
(8) Others
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating
when using the LEDs with matrix drive.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-6-
Nichia
STSE-CB2113A
<Cat.No.020823>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
580
y
0.5
590
0.4
600
610
0.3
620
630
490
0.2
480
0.1
470
460
W
0
0
0.1
0.2
0.3
0.4
x
-7-
0.5
0.6
0.7
0.8
3.5
100
Ta=25°C
Relative Luminosity (a.u.)
Forward Current IFP (mA)
200
50
20
10
5
1
2.5
! Ambient Temperature vs.
Forward Voltage
1.5
1.0
0.5
0
20 40 60 80 100 120
Forward Current IFP (mA)
2.0
IFP=60mA
IFP=20mA
IFP=5mA
4.2
3.8
3.4
3.0
2.6
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Relative Luminosity (a.u.)
Forward Voltage VF (V)
-8-
4.6
2.0
! Ambient Temperature vs.
Relative Luminosity
5.4
5.0
2.5
0
3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
Ta=25°C
3.0
IFP=20mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
! Duty Ratio vs.
Allowable Forward Current
Allowable Forward Current IFP (mA)
! Forward Current vs.
Relative Luminosity
200
Ta=25°C
100
50
30
20
10
1
5 10 20
50 100
Duty Ratio (%)
! Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
! Forward Voltage vs.
Forward Current
40
30
20
10
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION Title TYP.CHARACTERISTICS
No.
011130109681
<Cat.No.020823>
NSPBxxxx
Nichia STSE-CB2113A
Model
1mA(473nm)
0.09
y
5mA(472nm)
20mA(470nm)
50mA(468nm)
100mA(467nm)
0.07
0.05
0.03
0.10 0.12 0.14 0.16 0.18 0.20
-9-
Dominant Wavelength λ D (nm)
x
! Forward Current vs.
Dominant Wavelength
474
Ta=25°C
473
472
471
470
469
468
467
466
1
5 10 20
50 100
Forward Current IFP (mA)
1.2
Ta=25°C
IF=20mA
1
0.8
0.6
0.4
0.2
0
350 400 450 500 550 600 650
Wavelength λ (nm)
! Ambient Temperature vs.
Dominant Wavelength
! Directivity (NSPB310A)
474
0°
1
476
IFP=20mA
Relative Luminosity (a.u.)
Ta=25°C
0.11
Relative Emission Intensity (a.u.)
0.13
! Spectrum
Dominant Wavelength λD (nm)
! Forward Current vs.
Chromaticity Coordinate (λD)
472
470
468
466
464
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Ta=25°C
IF=20mA
10° 20°
30°
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
0.5
1
90°
NICHIA CORPORATION Title TYP.CHARACTERISTICS
No.
011130109711
<Cat.No.020823>
NSPB310A
Nichia STSE-CB2113A
Model
0°
1.5MAX.
1
3.5
φ 3.8
φ 3.1
0.75MAX.
(2.5)
Cathode
! 0.5 ± 0.05
Anode
4.4
5.4
-10-
10.4 ± 0.5
(2)
ITEM
RESIN(MOLD)
LEAD FRAME
26.9 ± 1
MATERIALS
Epoxy Resin
Ag Plating Copper Alloy
NICHIA CORPORATION
Title
No.
NSPB310A
OUTLINE DIMENSIONS
010831105701
Unit
mm
3/1
Scale
Allow
±0.2
<Cat.No.020823>
Model
Nichia STSE-CB2113A
Remark:
Bare copper alloy is exposed at tie-bar portion
after cutting.
The lamps have sharp and hard points that may
injure human eyes or fingers etc., so please pay
enough care in the handling.
Print
Cardboard
NICHIA
XXXX LED
Anti-electrostatic bag
TYPE
NxPxxxxxx
LOT
QTY
xxxxxx-!#
pcs
NICHIA CORPORATION
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
The quantity is printed on this bag.
CAUTION TO
ELECTROSTATIC DAMAGE
静電気に注意
Label
-11-
NICHIA
XXXX LED
TYPE
Cardboard
QTY
NxPxxxxxx
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
" Put this label on the cardboard box.
NICHIA CORPORATION
NxPxxxxxx
Title
PACKING
No.
020723201101
<Cat.No.020823>
" One box contains 8 bags at maximum.
Model
Nichia STSE-CB2113A
Cardboard box
360!135!215!4t
Cardboard
Print
NICHIA
Anti-electrostatic bag
XXXX LED
TYPE
NxPxxxxxx
LOT
QTY
xxxxxx-!#
pcs
NICHIA CORPORATION
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
The quantity is printed on this bag.
CAUTION TO
ELECTROSTATIC DAMAGE
静電気に注意
Cardboard box A
Label
-12-
NICHIA
XXXX LED
TYPE
QTY
NxPxxxxxx
PCS
NICHIA CORPORATION
Cardboard
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
" Put this label on the cardboard box B.
NICHIA CORPORATION
NxPxxxxxx
Title
PACKING
No.
020723201111
<Cat.No.020823>
" The cardboard box B contains
2 cardboard box A at maximum.
Model
Nichia STSE-CB2113A
Cardboard box B
360!135!215!4t
Print
Cardboard
NICHIA
Anti-electrostatic bag
XXXX LED
TYPE
NxPxxxxxx
LOT
QTY
xxxxxx-!#
pcs
NICHIA CORPORATION
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
The quantity is printed on this bag.
CAUTION TO
ELECTROSTATIC DAMAGE
静電気に注意
Label
-13-
NICHIA
Cardboard
XXXX LED
TYPE
QTY
NxPxxxxxx
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
" Put this label on the cardboard box.
Cardboard box
425!135!355!4t
Title
PACKING
No.
020723201121
<Cat.No.020823>
NICHIA CORPORATION
NxPxxxxxx
Nichia STSE-CB2113A
" One box contains 20 bags at maximum.
Model
Print
Cardboard
NICHIA
XXXX LED
Anti-electrostatic bag
TYPE
NxPxxxxxx
LOT
QTY
xxxxxx-!#
pcs
NICHIA CORPORATION
Cardboard box A
The quantity is printed on this bag.
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
CAUTION TO
ELECTROSTATIC DAMAGE
静電気に注意
-14-
Label
NICHIA
XXXX LED
Cardboard
TYPE
QTY
NxPxxxxxx
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
" Put this label on the cardboard box B.
NxPxxxxxx
Title
PACKING
No.
020723201131
" The cardboard box B contains 4 cardboard box A at maximum.
<Cat.No.020823>
NICHIA CORPORATION
Model
Nichia STSE-CB2113A
Cardboard box B
425!135!355!4t