INTERPOINT G913B

G913
Global Mixed-mode Technology Inc.
150mA Low-Dropout Linear Regulators
Features
General Description
„Low, 55µA No-Load Supply Current
„Guaranteed 150mA Output Current
„Dropout Voltage is 70mV @ 50mA Load
„Over-Temperature Protection and Short-Circuit
The G913 is a low supply current, low dropout linear
regulator that comes in a space saving SOT23-5 package. The supply current at no-load is 55µA. In the
shutdown mode, the maximum supply current is less
than 1µA. Operating voltage range of the G913 is from
2.5V to 5.5V. The over-current protection limit is set at
250mA typical and 150mA minimum. An overtemperature protection circuit is built-in in the G913 to
prevent thermal overload. These power saving features make the G913 ideal for use in the battery-powered applications such as notebook computers, cellular phones, and PDA’s.
Protection
„Two Modes of Operation ----
Fixed Mode: 2.84V (G913A), 3.15V (G913B),
3.30V (G913C), 3.00V (G913D)
Adjustable Mode: from 1.25V to 5.5V
„Max. Supply Current in Shutdown Mode < 1µA
„Low Output Noise at 220µVRMS
„Stability with lost cost ceramic capacitors
The G913 has two modes of operation. When the SET
pin is connected to ground, its output is a pre-set
value: 2.84V for G913A, 3.15V for G913B, and 3.30V
for G913C, and 3.00V for G913D. There is no external
components needed to decide the output voltage.
When an output other than the preset value is needed,
two external resistors should be used as a voltage
divider. The output voltage is then decided by the resistor ratio. The G913 comes in a space saving
SOT23-5 package.
Applications
„Notebook Computers
„Cellular Phones
„PDAs
„Digital still Camera and Video Recorders
„Hand-Held Devices
„Bar Code Scanners
Ordering Information
PART MARKING VOLTAGE
G913A
G913B
G913C
G913D
3A
3B
3C
3D
2.84
3.15
3.30
3.00
TEMP.
RANGE
PINPACKAGE
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
SOT 23-5
SOT 23-5
SOT 23-5
SOT 23-5
Pin Configuration
IN
SHDN
1
5
+C
SET
BATTERY
G913
IN
GND
GND
SET
G913
2
G963
IN
COUT
1µF
SHDN
_ 1µF
OUTPUT
VOLTAGE
OUT
Fixed mode
4
3
OUTPUT
VOLTAGE
OUT
IN
OUT
R1
+
G913
SOT23-5
SET
- BATTERY CIN
1µF
SHDN
GND
R2
COUT
1µF
Adjustable mode
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Ver 0.9 Preliminary
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G913
Global Mixed-mode Technology Inc.
Continuous Power Dissipation (TA = +25°C)
SOT23-5……………………………………...…..520 mW
Operating Temperature Range………...-40°C to +85°C
Junction Temperature……………………….……+150°C
(1)
θJA ….…..…………….…………….…..…..240°C/Watt
Storage Temperature Range………….-65°C to +160°C
Lead Temperature (soldering, 10sec)..…………+300°C
Absolute Maximum Ratings
VIN to GND……………………………………-0.3V to +7V
Output Short-Circuit Duration………………….….Infinite
SET to GND.……………………………..…..-0.3V to +7V
SHDN to GND…………………..………….-0.3V to +7V
SHDN to IN….…………………..…………..-7V to +0.3V
OUT to GND…………………………-0.3V to (VIN + 0.3V)
Note (1): See Recommended Minimum Footprint (Figure 3)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of
the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(VIN =+3.6V, V SHDN =VIN, TA =TJ =+25°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
Input Voltage (Note 2)
Output Voltage Accuracy
Adjustable Output Voltage Range (Note 3)
Maximum Output Current
Current Limit (Note 4)
VIN
VOUT
VOUT
Ground Pin Current
Variation from specified VOUT, IOUT=1mA
MIN TYP MAX UNITS
2.5
-2
VSET
150
ILIM
IQ
Dropout Voltage (Note 5)
VDROP
Line Regulation
∆VLNR
Load Regulation
∆VLDR
Output Voltage Noise (10Hz to 100kHz)
CONDITIONS
en
SET = GND
250
55
120
145
2
70
230 300
0.1 0.28
0.08 0.4
ILOAD = 0mA
ILOAD = 50mA
IOUT = 1mA
IOUT = 50mA
IOUT =150mA
SET=GND, VIN=V(STD)+0.1V,to 5.5V IOUT = 1mA
SET tied to OUT, VIN=2.5V to 5.5V, IOUT = 1mA
IOUT = 0mA to 150mA
VIN=4.2V,
IOUT=150mA
5.5
2
5.5
SET tied to OUT
0.02
SET = GND
0.8
1.0
COUT = 1µF
220
V
%
V
mA
mA
µA
mV
%/V
%
µVRMS
SHUTDOWN
SHDN Input Bias Current
I SHDN
Regulator enabled
Regulator shutdown
V SHDN = VIN
TA = +25°C
0.003
0.1
µA
Shutdown Supply Current
SET INPUT
IQSHDN
VOUT = 0V
TA = +25°C
0.2
1
µA
VIN = 2.5V to 5.5V,
IOUT = 1mA
VSET = 1.3V
TA = +25°C
TA = TMIN to TMAX
TA = +25°C
SHDN Input Threshold
VIH
VIL
SET Reference Voltage (Note 3)
VSET
SET Input Leakage Current (Note 3)
THERMAL PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
ISET
TSHDN
∆TSHDN
VIN-0.7
0.4
V
1.225 1.25 1.275
1.25
5
30
nA
150
15
°C
°C
V
Note 1: Limits is 100% production tested at TA= +25°C. Low duty pulse techniques are used during test to
maintain junction temperature as close to ambient as possible.
Note 2: Guaranteed by line regulation test.
Note 3: Adjustable mode only.
Note 4: Not tested. For design purposes, the current limit should be considered 150mA minimum to 420mA maximum.
Note 5: The dropout voltage is defined as (VIN-VOUT) when VOUT is 100mV below the value of VOUT for VIN = VOUT +2V,
The performance of every G913 part, see “Typical Performance Characteristics”.
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Ver 0.9 Preliminary
Jan 25, 2002
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G913
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)
Ground Current vs. Load Current
3.160
300
3.150
250
Ground Current (μA)
Output Voltage (V)
Output Voltage vs. Load Current
3.140
3.130
3.120
3.110
3.100
0
200
150
100
50
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
0
10
20
30
40
50
60
70
80
90 100 110 120 130 140 150
Load Current (mA)
Load Current (mA)
Output Voltage vs. Load Current
Supply Current vs. Input Voltage
130
3.50
120
110
No Load
Supply Current (μA)
Output Voltage (V)
3.00
2.50
2.00
1.50
1.00
0.50
100
ILOAD = 50mA
90
80
70
60
50
ILOAD = 0A
40
30
20
10
0
0.00
0
1
2
3
4
5
6
0
Input Voltage (V)
1
2
3
4
5
6
7
Input Voltage (V)
Dropout Voltage vs. Load Current
Output Noise 10HZ to 100KHZ
300
Dropout Voltage (mV)
250
200
150
100
50
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Load Current (mA)
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G913
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)
Line Transient
Load Transient
Load Transient
Load Transient
Dropout Voltage vs. Load Current by G913
Dropout Voltage vs. Temperature
300
400
TA=25°C
350
Top to Bottom
G913C
G913B
G913D
200
Dropout Voltage (mV)
Dropout Voltage (mV)
250
150
100
G913A
G913C
ILOAD=150mA
300
250
200
ILOAD=50mA
150
100
50
ILOAD=0mA
50
0
0
0
10
20
30
40
50
60
70
80
90 100 110 120 130 140 150
-40 -30 -20 -10
Load Current (mA)
0
10
20
30
40
50
60
70
80
90 100 110 120
Junction Temperature TJ (℃)
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G913
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)
Turn on Response Time
Turn off Response Time
Shutdown Pin Delay
Shutdown Response Time
Shutdown Pin Delay
Shutdown Response Time
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Ver 0.9 Preliminary
Jan 25, 2002
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G913
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)
Shutdown Supply Current
SHDN Input Bias Current vs. Temperature
0.20
0.80
G913C
SHDN Input Bias Current ( μA)
Shutdown Supply Current ( μA)
1.00
0.60
0.40
0.20
0.00
-0.20
-0.40
-0.60
G913C
0.10
0.00
-0.10
-0.80
-0.20
-1.00
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
-40
100 110 120
-30
-20
-10
10
20
30
40
50
60
70
80
90
100 110 120
SET Reference Voltage vs. Temperature
SET Input Leakage Current vs. Temperature
60
1.260
55
G913C
50
SET Reference Voltage (V)
SET Input Leakage Current (nA)
0
Junction Temperature TJ (℃)
Junction Temperature TJ (℃)
45
40
35
30
25
20
15
10
5
G913C
ILOAD=1mA
1.255
VIN=5.5V
1.250
1.245
VIN=3.6V
1.240
VIN=2.5V
1.235
0
-5
-10
1.230
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
100 110 120
-40
-30
-20
-10
Junction Temperature TJ (℃)
10
20
30
40
50
60
70
80
90
100 110 120
Junction Temperature TJ (℃)
Output Voltage vs. Temperature
Ground Current vs. Temperature
3.340
100
Ground Current ( μ A)
G913C
ILOAD=1mA
3.330
Output Voltage (V)
0
VIN=5.5V
3.320
VIN=3.6V
3.310
3.300
VIN=3.4V
G913C
ILOAD=0A
80
60
40
20
3.290
0
3.280
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
-40
100 110 120
Junction Temperature TJ (℃)
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
100 110 120
Junction Temperature TJ (℃)
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Ver 0.9 Preliminary
Jan 25, 2002
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G913
Global Mixed-mode Technology Inc.
Pin Description
PIN NAME
1
SHDN
2
GND
3
IN
4
OUT
5
SET
FUNCTION
Active-Low Shutdown Input. A logic low reduces the supply current to less than 1µA. Connect to IN for normal
operation.
Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground plane to
maximize thermal dissipation.
Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1µF to GND
Regulator Output. Fixed or adjustable from 1.25V to +5.5V. Sources up to 150mA. Bypass with a 1µF,
<0.2Ω typical ESR capacitor to GND.
Feedback Input for Setting the Output Voltage. Connect to GND to set the output voltage to the preset
2.84V or 3.15V or 3.30V or 3.00V. Connect to an external resistor divider for adjustable-output operation.
Detailed Description
action, the error amplifier, output PMOS, and the voltage divider effectively form a unity-gain amplifier with
the feedback voltage force to be the same as the
1.25V bandgap reference. The output voltage, VOUT, is
then given by the following equation:
VOUT = 1.25 (1 + R1/R2).
(1)
Alternatively, the relationship between R1 and R2 is
given by:
R1 = R2 (VOUT /1.25 + 1).
(2)
For the reasons of reducing power dissipation and
loop stability, R2 is chosen to be 100KΩ. For G913A,
R1 is 128KΩ, and the pre-set VOUT is 2.84V. For
G913B, R1 is 152KΩ, and the pre-set VOUT is 3.15V.
For G913C, R1 is 164KΩ, and the pre-set VOUT is
3.30V. For G913D, R1 is 140KΩ, and the pre-set VOUT
is 3.00V.
The block diagram of the G913 is shown in Figure 1. It
consists of an error amplifier, 1.25V bandgap reference, PMOS output transistor, internal feedback voltage divider, mode comparator, shutdown logic, over
current protection circuit, and over temperature protection circuit.
The mode comparator compares the SET pin voltage
with an internal 120mV reference. If the SET pin voltage is less than 120mV, the internal feedback voltage
divider’s central tap is connected to the non-inverting
input of the error amplifier. The error amplifier compares non-inverting input with the 1.25V bandgap reference. If the feedback voltage is higher than 1.25V,
the error amplifier’s output becomes higher so that the
PMOS output transistor has a smaller gate-to-source
voltage (VGS). This reduces the current carrying capability of the PMOS output transistor, as a result the
output voltage decreases until the feedback voltage is
equal to 1.25V. Similarly, when the feedback voltage
is less than 1.25V, the error amplifier causes the output PMOS to conductor more current to pull the feedback voltage up to 1.25V. Thus, through this feedback
When external voltage divider is used, as shown in
Figure 2, the SET pin voltage will be larger than
600mV. The non-inverting input of the amplifier will be
connected to the external voltage divider. However,
the operation of the feedback loop is the same, so that
the conditions of Equations 1 and 2 are still true. The
output voltage is still given by Equation 1.
IN
SHDN
-
ERROR
AMP
SHUTDOWN
LOGIC
+
OVER CURRENT
PROTECT & DYNAMIC
FEEDBACK
P
OUT
SET
-
OVER TEMP.
PROTECT
1.25V
Vref
+
R1
+
120mV
GND
MODE COMPARATOR
R2
-
Figure 1. Functional Diagram
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G913
Global Mixed-mode Technology Inc.
OUT
IN
Where (TJ–TA) is the temperature difference the G913 die
and the ambient air,θJA, is the thermal resistance of the
chosen package to the ambient air. For surface mount
device, heat sinking is accomplished by using the heat
spreading capabilities of the PC board and its copper
traces. In the case of a SOT23-5 package, the thermal
resistance is typically 240oC/Watt. (See Recommended
Minimum Footprint) [Figure 3] Refer to Figure 4 is the
G913 valid operating region (Safe Operating Area) & refer
to Figure 5 is maximum power dissipation of SOT 23-5.
OUTPUT
VOLTAGE
R1
+
G913
SET
- BATTERY CIN
1µF
SHDN
GND
R2
COUT
1µF
RL
The die attachment area of the G913’s lead frame is
connected to pin 2, which is the GND pin. Therefore, the
GND pin of G913 can carry away the heat of the G913
die very effectively. To improve the power dissipation,
connect the GND pin to ground using a large ground
plane near the GND pin.
Figure 2. Adjustable Output Using External
Feedback Resistors
Over Current Protection
The G913 use a current mirror to monitor the output current. A small portion of the PMOS output transistor’s current is mirrored onto a resistor such that the voltage
across this resistor is proportional to the output current.
This voltage is compared against the 1.25V reference.
Once the output current exceeds the limit, the PMOS
output transistor is turned off. Once the output transistor is
turned off, the current monitoring voltage decreases to
zero, and the output PMOS is turned on again. If the over
current condition persist, the over current protection circuit
will be triggered again. Thus, when the output is shorted
to ground, the output current will be alternating between 0
and the over current limit. The typical over current limit of
the G913 is set to 250mA. Note that the input bypass
capacitor of 1µF must be used in this case to filter out the
input voltage spike caused by the surge current due to the
inductive effect of the package pin and the printed circuit
board’s routing wire. Otherwise, the actual voltage at the
IN pin may exceed the absolute maximum rating.
Applications Information
Capacitor Selection and Regulator Stability
Normally, use a 1µF capacitor on the input and a 1µF
capacitor on the output of the G913. Larger input capacitor values and lower ESR provide better supply-noise
rejection and transient response. A higher- value input
capacitor (10µF) may be necessary if large, fast transients are anticipated and the device is located several
inches from the power source.
Power-Supply Rejection and Operation from Sources
Other than Batteries
The G913 is designed to deliver low dropout voltages and
low quiescent currents in battery powered systems.
Power-supply rejection is 42dB at low frequencies. As the
frequency increases above 20kHz, the output capacitor is
the major contributor to the rejection of power-supply
noise.
When operating from sources other than batteries, improve supply-noise rejection and transient response by
increasing the values of the input and output capacitors,
and using passive filtering techniques.
Over Temperature Protection
To prevent abnormal temperature from occurring, the
G913 has a built-in temperature monitoring circuit. When
it detects the temperature is above 150oC, the output
transistor is turned off. When the IC is cooled down to
below 135oC, the output is turned on again. In this way,
the G913 will be protected against abnormal junction
temperature during operation.
Load Transient Considerations
The G913 load-transient response graphs show two
components of the output response: a DC shift of the
output voltage due to the different load currents, and the
transient response. Typical overshoot for step changes in
the load current from 0mA to 100mA is 12mV. Increasing
the output capacitor's value and decreasing its ESR attenuates transient spikes.
Shutdown Mode
When the SHDN pin is connected a logic low voltage,
the G913 enters shutdown mode. All the analog circuits
are turned off completely, which reduces the current
consumption to only the leakage current. The output is
disconnected from the input. When the output has no
load at all, the output voltage will be discharged to ground
through the internal resistor voltage divider.
Input-Output (Dropout) Voltage
A regulator's minimum input-output voltage differential (or
dropout voltage) determines the lowest usable supply
voltage. In battery-powered systems, this will determine
the useful end-of-life battery voltage. Because the G913
use a P-channel MOSFET pass transistor, their dropout
voltage is a function of RDS(ON) multiplied by the load current.
Operating Region and Power Dissipation
Since the G913 is a linear regulator, its power dissipation
is always given by P = IOUT (VIN – VOUT). The maximum
power dissipation is given by:
PD(MAX) = (TJ–TA)/θJA,=150oC-25oC/240oC/W= 520mW
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G913
Global Mixed-mode Technology Inc.
Layout Guide
An input capacitance of ≅ 1µF is required between the
G913 input pin and ground (the amount of the capacitance may be increased without limit), This capacitor
must be located a distance of not more than 1cm from
the input and return to a clean analog ground.
The output capacitor also must be located a distance
of not more than 1cm from output to a clean analog
ground. Because it can filter out the output spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s
routing wire. Figure 6 is adjustable mode of G913 PCB
layout. Figure 7 is a PCB layout of G913 fixed mode.
Input capacitor can filter out the input voltage spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s
routing wire. Otherwise, the actual voltage at the IN
pin may exceed the absolute maximum rating.
Figure 3. Recommended Minimum Footprint
Safe Operating Area of G913 [Power Dissipation Limit]
Maximum Power Dissipation of SOT-23-5
200
0.7
150
Mounted on recommend mimimum footprint (RθJA=240°C/W)
0.5
Power Dissipation (W)
Output Current (mA)
Still Air
1oz Copper on SOT-23-5 Package
0.6
Maximum Recommended Output Current
TA=25℃
100
TA=55℃
TA=85℃
TA=25°C,Still Air
1oz Copper on SOT-23-5 Package
Mounted on recommended mimimum footprint (RθJA=240°C/W)
50
0.4
0.3
0.2
Figure 4 Safe Operating Area
0
0.1
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
25
Input-Output Voltage Differential VIN-VOUT (V)
35
45
55
65
75
85
95
105
115
125
Amibent Temperature TA (°C)
Note : VIN(max) <=5.5V
Figure 4 Safe Operating Area
Figure 5 Power Dissipation vs. Temperature
Figure 6. Adjustable Mode
Figure 7. Fixed Mode
*Distance between pin & capacitor must no more than 1cm
*Distance between pin & capacitor must no more than 1cm
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G913
Global Mixed-mode Technology Inc.
Package Information
C
D
L
E
H
θ1
e1
e
A
A2
A1
b
Note:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
3. Coplanarity: 0.1000mm
4. Dimension L is measured in gage plane
SYMBOLS
DIMENSIONS IN MILLIMETERS
NOM
MIN
A
A1
A2
b
C
D
E
e
e1
H
L
θ1
1.00
0.00
0.70
0.35
0.10
2.70
1.40
--------2.60
0.37
1º
1.10
----0.80
0.40
0.15
2.90
1.60
1.90(TYP)
0.95
2.80
-----5º
MAX
1.30
0.10
0.90
0.50
0.25
3.10
1.80
--------3.00
----9º
Taping Specification
Feed Direction
SOT23-5 Package Orientation
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Ver 0.9 Preliminary
Jan 25, 2002
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