OTQ - 64 - 0.8 -02 1.950" Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni (min.). Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu; finish 10µ" Au over 100µ" Ni (min.) Test points: materialPhosphor Bronze; plating- Sn over 50µ" Ni. Gold flash on contact end. 1 2 3 5 1 1.950" Top View 5 0.977" assembled 0.200" 3 0.285" assembled 2 Surface-mountable leadless (-L) foot. .8mm 0.605" Side View (QFE64SA Foot Print Spec) Description: Carrier Adaptor 64 position (0.8 mm pitch) QFP Zero Insertion Force socket with test points to 64 position surface mountable QFP emulator foot. The 2 piece adaptor interconnects via gold plated (0.05" center) Mini-grid socket interface. All tolerances are ±0.005" unless otherwise specified. Materials and specifications are subject to change without notice. Board 64 Position QFP LandReleased Pattern Status: CA-QFE64SA-L-Z-T-01Target Drawing (QFE64SA Foot Print Spec) (QFE64SA Foot Print Spec) M Lund © 1995 IRONWOOD ELECTRONICS, INC. Drawing: © 1998 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 Tele: (651) 452-8100 www.ironwoodelectronics.com www.ironwoodelectronics.com File: CA-QFE064SA-L-Z-T-01 Dwg Scale 2:1 Rev: B Date: 12/15/95 Modified: 7/9/98