SN74AUP2G240 www.ti.com SCES760B – DECEMBER 2009 – REVISED MARCH 2010 LOW-POWER DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS Check for Samples: SN74AUP2G240 FEATURES 1 • • • • • • • Available in the Texas Instruments NanoStar™ Package Low Static-Power Consumption (ICC = 0.9 mA Maximum) Low Dynamic-Power Consumption (Cpd = 4.2 pF Typ at 3.3 V) Low Input Capacitance (Ci = 1.5 pF Typical) Low Noise – Overshoot and Undershoot <10% of VCC Ioff Supports Partial-Power-Down Mode Operation Wide Operating VCC Range of 0.8 V to 3.6 V DCU PACKAGE (TOP VIEW) 1OE 1A 2Y GND 1 2 8 7 3 6 4 5 • • • • • • Optimized for 3.3-V Operation 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation tpd = 4.7 ns Maximum at 3.3 V Suitable for Point-to-Point Applications Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) VCC 1OE 1A 2Y GND 2OE 1Y 2A 1 8 2 7 3 6 4 5 VCC 2OE 1Y 2A YFP PACKAGE (TOP VIEW) RSE PACKAGE (TOP VIEW) DQE PACKAGE (TOP VIEW) VCC 2OE 1 1Y 2 2A 3 8 1OE 7 4 6 1A 5 2Y 1OE 1A 2Y GND A1 1 8 A2 B1 2 7 B2 C1 3 6 C2 D1 45 D2 VCC 2OE 1Y 2A GND See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). Static-Power Consumption (µA) 100% 40% 60% 3.3-V (A) Logic 40% Voltage (V) 80% 80% 60% Switching Characteristics at 25 MHz(A) Dynamic-Power Consumption (pF) 100% 3.3-V (A) Logic 20% 20% AUP AUP 0% (A) 0% AUP Single, dual, and triple gates 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 Input 0 5 (A) Figure 1. AUP – The Lowest-Power Family Output 10 15 20 25 30 Time (ns) 35 40 45 SN74AUP2Gxx data at CL = 15 pF. Figure 2. Excellent Signal Integrity 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2010, Texas Instruments Incorporated SN74AUP2G240 SCES760B – DECEMBER 2009 – REVISED MARCH 2010 www.ti.com The SN74AUP2G240 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 85°C (1) (2) (3) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) NanoStar™ – WCSP (DSBGA) 0.23-mm Large Bump – YFP (Pb-free) Reel of 3000 SN74AUP2G240YFPR ___HK_ uQFN – DQE Reel of 5000 SN74AUP2G240DQER PY QFN – RSE Reel of 5000 SN74AUP2G240RSER PY SSOP – DCU Reel of 3000 SN74AUP2G240DCUR H40_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ● = Pb-free). FUNCTION TABLE (EACH BUFFER) INPUTS OUTPUT Y OE A L H L L L H H X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1 1OE 1A 2 6 1Y 7 2OE 5 2A 3 2Y Pin numbers shown are for the DCU and DQE packages. 2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G240 SN74AUP2G240 www.ti.com SCES760B – DECEMBER 2009 – REVISED MARCH 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 4.6 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 4.6 V –0.5 VCC + 0.5 (2) UNIT VO Output voltage range in the high or low state IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±20 mA Continuous current through VCC or GND ±50 mA qJA Package thermal impedance (3) Tstg Storage temperature range DCU package 220 DQE package 261 RSE package 253 YFP package (1) (2) (3) V °C/W 132 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G240 3 SN74AUP2G240 SCES760B – DECEMBER 2009 – REVISED MARCH 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage MIN MAX 0.8 3.6 UNIT V VCC VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V 0.65 × VCC V 1.6 VCC = 3 V to 3.6 V 2 VCC = 0.8 V 0 VCC = 1.1 V to 1.95 V 0.35 × VCC VIL Low-level input voltage VI Input voltage 0 3.6 VO Output voltage 0 VCC V VCC = 0.8 V –20 mA VCC = 1.1 V –1.1 VCC = 1.4 V –1.7 VCC = 1.65 –1.9 VCC = 2.3 V –3.1 VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V IOH High-level output current IOL Low-level output current 0.9 VCC = 3 V –4 VCC = 0.8 V 20 VCC = 1.1 V 1.1 VCC = 1.4 V 1.7 VCC = 1.65 V 1.9 VCC = 2.3 V 3.1 VCC = 3 V Δt/Δv Input transition rise or fall rate TA Operating free-air temperature (1) 4 V V mA mA mA 4 VCC = 0.8 V to 3.6 V –40 200 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G240 SN74AUP2G240 www.ti.com SCES760B – DECEMBER 2009 – REVISED MARCH 2010 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS TYP TA = –40°C to 85°C MAX MIN 0.8 V to 3.6 V VCC – 0.1 VCC – 0.1 IOH = –1.1 mA 1.1 V 0.75 × VCC 0.7 × VCC IOH = –1.7 mA 1.4 V 1.11 1.03 IOH = –1.9 mA 1.65 V 1.32 1.3 2.05 1.97 2.3 V IOH = –3.1 mA IOH = –2.7 mA 3V IOH = –4 mA 1.9 1.85 2.72 2.67 2.6 2.55 V 0.8 V to 3.6 V 0.1 0.1 IOL = 1.1 mA 1.1 V 0.3 × VCC 0.3 × VCC IOL = 1.7 mA 1.4 V 0.31 0.37 IOL = 1.9 mA 1.65 V 0.31 0.35 0.31 0.33 0.44 0.45 0.31 0.33 2.3 V IOL = 3.1 mA IOL = 2.7 mA 3V IOL = 4 mA 0.44 0.45 0 V to 3.6 V 0.1 V 0.5 mA Ioff VI or VO = 0 V to 3.6 V 0V 0.2 0.6 mA ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.2 0.6 mA ICC VI = GND or (VCC to 3.6 V), IO = 0 0.8 V to 3.6 V 0.5 0.9 mA ΔICC VI = VCC – 0.6 V (1), IO = 0 3.3 V 40 50 mA Ci VI = VCC or GND Co VO = GND (1) A or B input VI = GND to 3.6 V UNIT MAX IOL = 20 mA IOL = 2.3 mA II MIN IOH = –20 mA IOH = –2.3 mA VOL TA = 25°C VCC 0V 1.5 3.6 V 1.5 0V pF 3 pF One input at VCC – 0.6 V, other input at VCC or GND SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) VCC TA = 25°C MIN 0.8 V tpd A or B Y TYP TA = –40°C to 85°C MAX MIN MAX UNIT 18 1.2 V ± 0.1 V 2.6 7.3 12.8 2.1 15.6 1.5 V ± 0.1 V 1.4 5.2 8.7 0.9 10.3 1.8 V ± 0.15 V 1 4.2 6.6 0.5 8.2 2.5 V ± 0.2 V 1 3 4.4 0.5 5.5 3.3 V ± 0.3 V 1 2.4 3.5 0.5 4.3 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G240 ns 5 SN74AUP2G240 SCES760B – DECEMBER 2009 – REVISED MARCH 2010 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 25°C VCC MIN TYP 1.2 V ± 0.1 V 1.5 8.5 0.8 V tpd A or B Y TA = –40°C to 85°C MAX MIN MAX 14.7 1 17.2 UNIT 21 1.5 V ± 0.1 V 1 6.2 10 0.5 11.3 1.8 V ± 0.15 V 1 5 7.7 0.5 9 2.5 V ± 0.2 V 1 3.6 5.2 0.5 6.1 3.3 V ± 0.3 V 1 2.9 4.2 0.5 4.7 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 25°C VCC MIN TYP 0.8 V tpd A or B Y TA = –40°C to 85°C MAX MIN MAX UNIT 24 1.2 V ± 0.1 V 3.6 9.9 16.3 3.1 19.9 1.5 V ± 0.1 V 2.3 7.2 11.1 1.8 13.2 1.8 V ± 0.15 V 1.6 5.8 8.7 1.1 10.6 2.5 V ± 0.2 V 1 4.3 5.9 0.5 7.3 3.3 V ± 0.3 V 1 3.4 4.8 0.5 5.9 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) VCC TA = 25°C MIN 0.8 V tpd A or B Y TYP TA = –40°C to 85°C MAX MIN MAX UNIT 32.8 1.2 V ± 0.1 V 4.9 13.1 20.9 4.4 25.5 1.5 V ± 0.1 V 3.4 9.5 14.2 2.9 16.9 1.8 V ± 0.15 V 2.5 7.7 11 2 13.5 2.5 V ± 0.2 V 1.8 5.7 7.6 1.3 9.4 3.3 V ± 0.3 V 1.5 4.7 6.2 1 7.5 ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd 6 Power dissipation capacitance TEST CONDITIONS f = 10 MHz Submit Documentation Feedback VCC TYP 0.8 V 4 1.2 V ± 0.1 V 4 1.5 V ± 0.1 V 4 1.8 V ± 0.15 V 4 2.5 V ± 0.2 V 4.1 3.3 V ± 0.3 V 4.3 UNIT pF Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G240 SN74AUP2G240 www.ti.com SCES760B – DECEMBER 2009 – REVISED MARCH 2010 PARAMETER MEASUREMENT INFORMATION (Propagation Delays, Setup and Hold Times, and Pulse Width) From Output Under Test CL (see Note A) 1 MΩ LOAD CIRCUIT CL VM VI VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC tw VCC Input VCC/2 VCC/2 VI VM Input 0V VM VOLTAGE WAVEFORMS PULSE DURATION 0V tPHL tPLH VOH VM Output VM VOL tPHL VCC Timing Input 0V tPLH tsu VOH Output VCC/2 VM th VCC VM VOL Data Input VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, for propagation delays tr/tf = 3 ns, for setup and hold times and pulse width tr/tf = 1.2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLH and tPHL are the same as tpd. F. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G240 7 SN74AUP2G240 SCES760B – DECEMBER 2009 – REVISED MARCH 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) 2 x V CC S1 5 kΩ From Output Under Test GND CL (see Note A) 5 kΩ TEST S1 tPLZ/tPZL tPHZ/tPZH 2 x V CC GND LOAD CIRCUIT CL VM VI V∆ VCC = 0.8 V VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.15 V 5, 10, 15, 30 pF VCC/2 VCC 0.15 V 5, 10, 15, 30 pF VCC/2 VCC 0.3 V VCC Output Control VCC/2 0V Output Waveform 1 S1 at 2 xV CC (see Note B) tPZL tPLZ VCC VCC/2 tPZH Output Waveform 2 S1 at GND (see Note B) VCC/2 VOL + V ∆ VOL tPHZ VCC/2 VOH - V ∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf = 3 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPLH and tPHL are the same as tpd. G. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G240 PACKAGE OPTION ADDENDUM www.ti.com 12-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AUP2G240DCUR ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP2G240DQER ACTIVE X2SON DQE 8 5000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM SN74AUP2G240RSER ACTIVE UQFN RSE 8 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP2G240YFPR ACTIVE DSBGA YFP 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated