KINGBOR KB6282

Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
LED Driver
Features and Benefits
ƒ 16 constant-current outputs, up to 88 mA each
ƒ LED output voltage up to 10 V
ƒ 3.0 to 5.5 V logic supply range
ƒ Schmitt trigger inputs for improved noise
immunity
ƒ Power-On Reset (POR), all register bits = 0
ƒ Low-power CMOS logic and latches
ƒ High data input rate: 30 MHz
ƒ Output current accuracy: between channels
< ±3% and between ICs ±5%, over the full
operating temperature range
ƒ Internal UVLO and thermal shutdown (TSD)
circuitry
Description
Packages:
Applications include the following:
ƒ Monocolor, multicolor, or full-color LED display
ƒ Monocolor, multicolor, or full-color LED signboard
ƒ Display backlighting
ƒ Multicolor LED lighting
The KB6282 device is designed for LED display applications. This
CMOS device includes an input shift register, accompanying
data latches, and 16 MOS constant current sink drivers.
The CMOS shift registers and latches allow direct interfacing
with microprocessor-based systems. With a 3.3 or 5 V logic
supply, typical serial data input rates can reach up to 30 MHz.
The LED drive current level can be set by a single external
resistor, selected by the application designer. A serial data
output permits cascading of multiple devices in applications
requiring additional drive lines.
The KB6282 is available in a variety of 24-terminal packages:
QFN (package ES) and eTSSOP (LP), which have an exposed
thermal pad, and SOIC (LW). All packages are lead (Pb) free
with 100% matte tin leadframe plating.
24-contact QFN
4 mm × 4 mm × 0.75 mm
(Package ES)
24-pin TSSOP
with exposed thermal pad
(Package LP)
24-pin SOIC
(Package LW)
Not to scale
Typical Application
VLED
10 —F
10 —F
SDI
SDI
CLK
CLK
LE
LE
OE
OE
OUT0
OUT15
VDD
Controller
SDI
SDO
VDD
100 nF
KB6282
GND
REXT
IC 1
OUT0
CLK
LE
OUT15
SDO
VDD
VDD
100 nF
KB6282
GND
OE
REXT
IC 2
Cascaded KB6282 devices
REV 1.1
1
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Selection Guide
Part Number
KB6282EES-T
KB6282EESTR-T
KB6282ELP-T
KB6282ELPTR-T
KB6282ELW-T
KB6282ELWTR-T
Package
Packing
92 pieces per tube
4 mm × 4 mm QFN, 24 pins, exposed thermal pad
3000 pieces per 13-in. reel
62 pieces per tube
TSSOP, 24 pins, exposed thermal pad
4000 pieces per 13 in. reel
31 pieces per tube
SOICW, 24 pins
1000 pieces per 13-in. reel
Absolute Maximum Ratings
Characteristic
Supply Voltage*
Symbol
Notes
Rating
Unit
VDD
–0.3 to 5.5
V
OUTx Current (any single output)
IO
88
mA
Input Voltage Range*
VI
–0.3 to VDD + 0.3
V
LED Load Supply Range*
VOE, VLE, VCLK, VSDI
VLED
–0.3 to 10.0
V
4.0
kV
HBM (JEDEC JESD22-A114, Human Body Model)
ESD Rating
CDM (JEDEC JESD22-C101, Charged Device Model)
Operating Temperature Range (E)
Junction Temperature
Storage Temperature Range
1.0
kV
TA
–40 to 85
°C
TJ(max)
150
°C
Tstg
–55 to 150
°C
*With respect to ground.
Thermal Characteristics
Characteristic
Package Thermal Resistance
Test Conditions1
ES package, 4-layer PCB based on JEDEC standard
LP packge, 4-layer PCB based on JEDEC standard
LW packge, 4-layer PCB based on JEDEC standard
Symbol
RșJA
Value
37
28
44
Units
°C/W
°C/W
°C/W
*Additional thermal information available on the Allegro website.
Allowable Package Power Dissipation (W)
5.0
4.0
Pa
ck
ag
e
3.0
Pa
LP
,R
QJ
ck
A =
ag
eE
S,
Pa
2.0
ck
A
=3
7°
eL
W,
R
C/
QJ
A
1.0
°C
/W
QJ
ag
28
R
=4
4°
C/
W
W
0
25
REV 1.1
50
75
100
125
Ambient Temperature (°C)
150
2
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Functional Block Diagram
VDD
UVLO and TSD
SDI
SDO
Serial - Parallel Shift Register
CLK
OE
Control Logic
Block
LE
Latches
Output Control Drivers
REXT
IO
Regulator
Exposed Pad
(ET and LP packages)
OUT15
GND OUT0 OUT1
VLED
Inputs and Outputs Equivalent Circuits
Resistor values are equivalent resistance and not tested
VDD
VDD
CLK, SDI,
¯¯E
¯
LE, O
REV 1.1
510 Ÿ
9Ÿ
SDO
3
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Pin-out Diagrams
19 OUT11
20 OUT12
21 OUT13
22 OUT14
23 OUT15
24 OE
Top-down views
GND 1
24 VDD
GND 1
24 VDD
SDI 2
23 REXT
SDI 2
23 REXT
CLK 3
22 SDO
CLK 3
22 SDO
LE 4
SDO
1
18 OUT10
REXT
2
17 OUT9
OUT0 5
PAD
LE 4
21 OE
21 OE
20 OUT15
OUT0 5
20 OUT15
19 OUT14
OUT1 6
19 OUT14
14 OUT6
OUT3 8
17 OUT12
OUT3 8
17 OUT12
CLK
6
13 OUT5
OUT4 9
16 OUT11
OUT4 9
16 OUT11
OUT5 10
15 OUT10
OUT5 10
15 OUT10
OUT6 11
14 OUT9
OUT6 11
14 OUT9
OUT7 12
13 OUT8
OUT7 12
13 OUT8
OUT4 12
5
OUT3 11
18 OUT13
SDI
OUT2 10
OUT2 7
9
18 OUT13
OUT1
OUT2 7
8
15 OUT7
7
16 OUT8
4
LE
3
GND
OUT0
VDD
OUT1 6
PAD
ES Package
LP Package
LW Package
24-contact QFN
24-pin TSSOP
24-pin SOIC
Terminal List Table
CLK
GND
LE
ES
6
4
7
Number
LP
3
1
4
LW
3
1
4
¯O
¯¯¯E¯
24
21
21
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
OUT9
OUT10
OUT11
OUT12
OUT13
OUT14
OUT15
PAD
REXT
SDI
SDO
VDD
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
–
2
5
1
3
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
–
23
2
22
24
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
n.a.
23
2
22
24
Name
REV 1.1
Description
Clock; data shift clock input terminal
Logic supply ground and load supply ground
Latch Enable input terminal
Output Enable input terminal, active low (when ¯O
¯¯¯E
¯ = high, all OUTx outputs are forced off; when ¯O
¯¯¯E
¯ = low,
on/off status of OUTx outputs is controlled by the state of the latches
Constant current outputs
Exposed pad for enhanced thermal dissipation; not connected internally, connect to GND
Reference current terminal; sets output current for all channels
Serial Data In terminal
Serial Data Out terminal
Logic Supply terminal
4
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
ELECTRICAL CHARACTERISTICS at TA1 = 25°C, VDD = 3.0 to 5.5 V, unless otherwise noted
Characteristic
Logic Supply Voltage Range
LED Load Supply Output Voltage
Undervoltage Lockout
Output Current
Output Current Shift
Output to Output Matching Error3
Output Current Regulation
Output Leakage Current
Logic Input Voltage
Logic Input Voltage Hysteresis
Logic Input Current
SDO Voltage
Supply Current4
Symbol
Test Conditions
VDD
Operating
VLED
Operating
VDD 0 ĺ 5.0 V
VDD(UV)
VDD 5 ĺ 0.0 V
VDD = 4.5 to 5.5 V, VDS(x) = 1 V,
REXT = 351 :
VDD = 3.0 to 3.6 V, VDS(x) = 1 V,
REXT = 351 :
IO
VDD = 4.5 to 5.5 V, VDS(x) = 1 V,
REXT = 885 :
VDD = 3.0 to 3.6 V, VDS(x) = 1 V,
REXT = 885 :
VDD = 5.5 V, VDS(x) = 1 V, REXT = 885 Ÿ,
TA = 25°C; between one output on and
%¨IO
all outputs on
VDS = 1 V, REXT = 351 :, all outputs on
Err
VDS = 1 V, REXT = 885 :, all outputs on
VDD = 5.5 V, VDS(x) = 1 to 3 V,
REXT = 351 :, all outputs on
VDD = 5.5 V, VDS(x) = 1 to 3 V,
REXT = 885 :, all outputs on
%IO(reg)
VDD = 3.6 V, VDS(x) = 1 to 3 V,
REXT = 351 :, all outputs on
VDD = 3.6 V, VDS(x) = 1 to 3 V,
REXT = 885 :, all outputs on
VOH = 10 V
IDSS
VIH
VIL
VIhys
All digital inputs
All digital inputs
II
VOL
IOL = 1 mA
VOH
IOH = –1 mA
REXT = OPEN , VOE = 5 V
IDD(OFF) REXT = 490 :, VOE = 5 V
REXT = 245 :, VOE = 5 V
All outputs on, REXT = 885 :, VO = 1 V,
data transfer 25 MHz
IDD(ON)
All outputs on, REXT = 351 :, VO = 1 V,
data transfer 25 MHz
Min.
3.0
–
2.5
2.3
Typ.2
5.0
–
2.7
2.5
Max.
5.5
10.0
2.9
2.7
Unit
V
V
V
V
46.4
50.1
54.5
mA
46.5
50.1
53.5
mA
18.3
20.0
22.8
mA
18.0
20.0
22.5
mA
–
–
±1
%
–
–
+1.0
+1.0
+3.0
+3.0
%
%
–
1.7
3
%/V
–
2.4
4
%/V
–
1.2
2
%/V
–
1.8
3
%/V
–
0.7×VDD
GND
250
–1
–
VDD – 0.5
–
–
–
–
–
–
–
–
–
–
–
–
–
1.0
VDD
0.3×VDD
900
1
0.5
–
4
12
25
—A
V
V
mV
—A
V
V
mA
mA
mA
–
–
12
mA
–
–
25
mA
Continued on the next page…
REV 1.1
5
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
ELECTRICAL CHARACTERISTICS (continued), at TA1 = 25°C, VDD = 3.0 to 5.5 V, unless otherwise noted
Characteristic
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Reference Voltage at External
Resistor REXT
Symbol
Test Conditions
TJTSD
Temperature increasing
TJTSDhys
VEXT
REXT = 374 :
Min.
–
–
Typ.2
165
15
Max.
–
–
Unit
°C
°C
–
1.21
–
V
1Tested
at 25°C. Specifications are assured by design and characterization over the operating temperature range of –40°C to 85°C.
data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for
individual units, within the specified maximum and minimum limits.
3Err = (I (min or max) – I (av)) / I (av). I (av) is the average current of all outputs. I (min or max) is the output current with the greatest
O
O
O
O
O
difference from IO(av).
4Recommended operating range: V = 1.0 to 3.0 V.
O
2Typical
SWITCHING CHARACTERISTICS at TA1 = 25°C, VDD = VIH = 5.0 V, VDS = 1 V, VIL = 0 V, REXT = 885 ȍ, IO = 20.1 mA, VL = 2 V,
RL = 51 ȍ, CL = 15 pF (see also Timing Diagrams section)
Characteristic
Symbol
Test Conditions
Clock Frequency
fCLK
CLK
Clock Frequency (cascaded devices)
fCLKC
Min.
Typ.2
Max.
Unit
–
–
30
MHz
CLK
–
–
25
MHz
Clock Pulse Duration
twh0
CLK = high
16
–
–
ns
LE Pulse Duration
twh1
LE = high
20
–
–
ns
tsu0
SDI to CLKĹ
10
–
–
ns
tsu1
CLKĹ to LEĹ
10
–
–
ns
Setup Time
Hold Time
Rise Time
Fall Time
Propagation Delay Time
Output Enable Pulse Duration
th0
CLKĹ to SDI
10
–
–
ns
th1
LEĻ to CLKĹ
10
–
–
ns
tr0
SDO, 10/90% points (measurement circuit A)
–
–
16
ns
tr1
OUTx, VDD = 5 V,10/90% points (measurement circuit B)
–
10
30
ns
tf0
SDO, 10/90% points (measurement circuit A)
–
–
16
ns
tf1
OUTx, VDD = 5 V,10/90% points (measurement circuit B)
–
10
30
ns
tpd0
CLKĹ to SDOĹĻ (measurement circuit A)
–
–
30
ns
tpd1
¯O
¯¯¯E
¯ Ļ to OUTxĹĻ (measurement circuit B)
–
–
60
ns
tpd2
LEĹ to OUTxĹĻ (measurement circuit B)
–
–
60
ns
(see Timing Diagrams section)
60
–
–
ns
tw(OE)
1Tested
at 25°C. Specifications are assured by design and characterization over the operating temperature range of –40°C to 85°C.
2Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for
individual units, within the specified maximum and minimum limits.
Parameter Measurement Circuits
VL
RL
SDO
OUTx
CL
15 pF
(A) Circuit for tf0 , tpd0 , and tr0
REV 1.1
(B) Circuit for tf1 , tpd1 , tpd2 , and tr1 .
6
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Timing Diagrams
Normal Operation
t wh0
CLK
t
su0
t h0
SDI
t pd0
t
t
r0
f0
90%
50%
10%
SDO
t
t wh1
su1
LE
Low = All Outputs Enabled
OE
t pd2
H ig h = O u tp u t o n
OUTx
(current)
Low = Output off
Disabling Outputs
t w (OE)
50%
50%
OE
t pd1
OUTx
(current)
t pd1
t
f1
t
r1
90%
50%
10%
REV 1.1
7
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Operating Characteristics
Channel Maximum Constant Output Current
versus External Reference Resistance
Channel Output Current versus Output Voltage
VDD = 5.0 V
60
50
45
REXT = 444 Ÿ
50
40
35
40
4.5 to 5.0
3.0 to 3.6
IO (mA)
IO(max) (mA)
VDD (V)
30
30
25
REXT = 885 Ÿ
20
20
15
10
10
5
0
0.3
0
1.0
2.0
3.0 4.0 5.0
0
0.3 0.6
0.9 1.2
1.5 1.8 2.1
2.4 2.7
3.0
VDS (V)
REXT (kŸ)
Input-Output Truth Table
Serial
Data
Input
(SDI)
Shift Register Contents
Clock
Input
(CLK)
I0
I1
I2
…
I15
Serial
Data
Out
(SDO)
H
H R0 R1 …
R15
R14
L
L R0 R1 …
R15
R14
X
R0 R1 R2 …
R15
R15
X
X
X X
…
P0 P1 P2 …
P15
Latch
Enable
Input
(LE)
X
L
P15
H
Latch Contents
I0
I1
I2
…
R0 R1 R2 …
I15
P0 P1 P2 …
X X
…
Output Contents
I15
L
(Outputs on)
P15
I0
I1
I2
…
R15
P15
X
Output
Enable
Input
¯¯¯E¯ )
(¯O
X
H
(Outputs off)
P0 P1 P2 …
H
H H …
H
L = Low logic (voltage) level, H = High logic (voltage) level, X = Don’t care, P = Present state, R = Previous state
REV 1.1
8
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Functional Description
The maximum channel output current can be calculated as:
Normal Operation
Serial data present at the SDI (Serial Data In) input is transferred
IO(max) = (17800/ R EXT) , for V DD = 3.0 to 3.6 V ,
to the shift register on the transition from logic 0 to logic 1 of the
CLK (Clock) input pulse. On succeeding CLK pulses, the register
shifts data towards the SDO (Serial Data Out) output. The serial
data must appear at the input prior to the rising edge of the CLK
waveform.
Data present in any register is transferred to the respective latch
when the LE (Latch Enable) input is high (serial-to-parallel conversion). The latches continue to accept new data as long as LE is
held high (level triggered).
Applications where the latches are bypassed (LE tied high)
¯ (Output Enable) input be high during serial
require that the ¯O¯¯¯E
¯ is high, the output sink drivers are disabled
data entry. When ¯O¯¯¯E
(off). The data stored in the latches is not affected by the state
¯
¯ . With ¯O¯¯¯E
¯ active (low), the outputs are controlled by the
of ¯
O¯¯
E
state of their respective latches.
Setting Maximum Channel Current
The maximum output current per channel is set by a single external resistor, REXT, which is placed between the REXT pin and
GND. The voltage on REXT, VEXT, is set by an internal band gap
and is 1.21 V, typical.
REV 1.1
where REXT is the value of the user-selected external resistor,
which should not be less than 180 Ÿ.
A chart of the maximum per channel (OUT0 to OUT15) constant
output current, IO(max), at various values of REXT , is shown in
the Operating Characteristics section.
Undervoltage Lockout
The KB6282 includes an internal undervoltage lockout (UVLO)
circuit that disables the outputs in the event that the logic supply
voltage drops below a minimum acceptable level. This feature
prevents the display of erroneous information, a necessary function for some critical applications. Upon recovery of the logic
supply voltage after a UVLO event, all internal shift registers and
latches are set to 0. The KB6282 is then in normal mode.
Thermal Shutdown Protection
If the junction temperature exceeds the threshold temperature,
TJTSD , 165°C typical, the outputs will be turned off until the junction temperature cools down through the thermal shutdown hysteresis, 15°C typical. The shift register and output latches register
will remain active during a thermal shutdown event. Therefore,
there is no need to reset the data in the output latches.
,287˄P$˅
56(7˄¡˅
,287˄P$˅
56(7˄¡˅
9
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Application Information
Load Supply Voltage (VLED)
This device is designed to operate with driver voltage drops (VDS)
of 1.0 to 3.0V. If higher voltages are dropped across the driver,
package power dissipation will increase. To minimize package
power dissipation, it is recommended to use the lowest possible
load supply voltage, VLED, or to set a series voltage drop, VDROP ,
according to the following formula:
VDROP = VLED – VF – VDS ,
where VF is the LED forward voltage. For reference, typical LED
forward voltages are:
LED Type
VF (V)
White
Blue
Green
Yellow
Amber
Red
Infrared
UV
3.3 to 3.9
3.0 to 3.9
1.8 to 2.5
2.0 to 2.5
1.9 to 3.0
1.5 to 2.5
1.2 to 1.8
3.0 to 4.0
1. Place the REXT resistor as close as possible to the REXT
pin and GND pin. This will minimize parasitic inductance and
capacitance.
2. Use a separate line to the device GND pin for REXT, and separate lines for the decoupling capacitors. The lines should join at
ground. This star grounding will improve output load regulation
and minimize any chance of oscillation.
The REXT ground line should carry only the small current from
the internal voltage reference at REXT. The high AC currents
flowing through the decoupling capacitors and their resistive and
inductive PCB lines cause noise (ground bounce) on the capacitor
ground lines. Such noise could disturb the reference voltage at
REXT and promote oscillation. Connect the exposed thermal pad
of the ES and LP packages to the power ground, along with the
decoupling capacitors, and not to the ground line for REXT.
3. Keep the output drive lines (OUT0 through OUT15) away
from the REXT pin to avoid coupling of the output signal into
the reference for the current sources. Output lines should not run
adjacent to the REXT pin or directly under the REXT pin.
VDROP = IO× RDROP for a single driver, for a Zener diode (VZ),
or for a series string of silicon diodes (approximately 0.7 V per
diode) for a group of drivers (these configurations are shown
in the figure below). If the available voltage source will cause
unacceptable power dissipation and series resistors or diodes are
undesirable, a voltage regulator can be used to provide VLED.
4. Use decoupling capacitors on the VDD pin and the LED supply bus. Place the logic decoupling capacitor (0.1 —F, one for
each KB6282) as close as possible to the VDD pin. Use at least one
10 —F capacitor from the LED supply line to device ground for at
least every two KB6282s.
Pattern Layout
To save pins and board space, the KB6282 uses one pin for both
logic ground and power ground. Therefore, achieving optimal
performance requires careful attention to layout. Following the
suggestions below will improve the analog performance and logic
noise immunity.
Package Power Dissipation
The maximum allowable package power dissipation based on
package type is determined by:
VLED
VLED
VLED
VDROP
VDROP
VDROP
VF
VF
VF
VDS
VDS
VDS
Typical application voltage drops
REV 1.1
5. Use multilayer boards if possible.
PD(max) = (150 – TA) / RTJA ,
where RTJA is the thermal resistance of the package, determined
experimentally. Power dissipation levels based on the package are
shown in the Thermal Characteristics table.
The actual package power dissipation is determined by:
PD(act) = DC × (VDS × IO× 16) + (VDD× IDD) ,
where DC is the duty cycle. The value 16 is the maximum
number of available device outputs, representing the worst-case
scenario (displaying all 16 LEDs). When the load supply voltage,
VLED, is greater than 3 to 5 V, and PD(act) > PD(max), an external
voltage reducer (VDROP) must be used (figure at left). Reducing
DC will also reduce power dissipation. The ES and LP packages
contain an exposed thermal pad on the bottom of the package
for enhanced heat dissipation. Connect this pad to a large power
ground plane using thermal vias. JEDEC documents JESD51-3
and JESD51-5 give suggestions for PCB and thermal via designs.
10
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Package ES, 4 mm x 4 mm, 24-pin QFN with Exposed Thermal Pad
0.30
4.00 ±0.15
0.50
24
24
1
2
0.90
1
2
A
2.10
4.00 ±0.15
4.10
2.10
4.10
25X
D
SEATING
PLANE
0.08 C
+0.05
0.25 –0.07
0.75 ±0.05
0.50
C
C
PCB Layout Reference View
For Reference Only
(reference JEDEC MO-220WGGD)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Exposed thermal pad (reference only, terminal #1
identifier appearance at supplier discretion)
+0.15
0.40 –0.10
B
2.10
2
1
C Reference land pattern layout (reference IPC7351
QFN50P400X400X80-25W6M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
D Coplanarity includes exposed thermal pad and terminals
24
2.10
REV 1.1
11
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Package LP, 24-pin TSSOP with Exposed Thermal Pad
0.65
7.80 ±0.10
0.45
4° ±4
24
+0.05
0.15 –0.06
B
3.00
4.40 ±0.10
6.40 ±0.20
A
1
3.00
0.60 ±0.15
6.10
(1.00)
2
4.32
0.25
24X
SEATING
PLANE
0.10 C
+0.05
0.25 –0.06
0.65
1.20 MAX
0.15 MAX
C
SEATING PLANE
GAUGE PLANE
1.65
4.32
C
PCB Layout Reference View
For reference only
(reference JEDEC MO-153 ADT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Exposed thermal pad (bottom surface)
C Reference land pattern layout (reference IPC7351
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
REV 1.1
12
Kingbor Technology Co.,Ltd
KB6282
TEL:(86)0755-26508846 FAX:(86)0755-26509052
16-Channel Constant-Current LED Driver
Package LW, 24-pin SOICW
15.40±0.20
4° ±4
24
+0.07
0.27 –0.06
2.20
10.30±0.33
7.50±0.10
9.60
A
+0.44
0.84 –0.43
1
2
0.65
0.25
24X
SEATING
PLANE
0.10 C
0.41 ±0.10
1.27
2.65 MAX
0.20 ±0.10
C
SEATING PLANE
GAUGE PLANE
1.27
B PCB Layout Reference View
For reference only
(Reference JEDEC MS-013 AD)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Reference pad layout (reference IPC SOIC127P1030X265-24M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
Kingbor Technology
TEL:(86) 0755-26508846 FAX: (86) 0755-26509052 www.kingbor.com
13