LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only BAR DIGIT LED DISPLAY LBD336B-XX DATA SHEET DOC. NO : QW0905- LBD336B-XX REV. : A DATE : 20 - Aug. - 2008 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD336B-XX Page 1/10 Package Dimensions 33.0(1.30") 11.0 (0.43") 11.0 (0.43") Y E G Y B LBD336B -XX LIGITEK 6.4 (0.25") 4.0±0.5 Ø0.45 TYP 2.54*6=15.24(0.6") PIN NO. 1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. .3.Film:temperature-resistant≦100° C. 7.62 (0.3") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/10 PART NO.LBD336B-XX Internal Circuit Diagram LBD336B-XX 8 a b c d 1 14 2 4 A B C D E F G DP 9 10 3 5 12 13 11 7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/10 PART NO.LBD336B-XX Electrical Connection PIN NO. LBD336B-XX 1. Cathode a 2. Cathode c 3. Cathode C 4. Cathode d 5. Cathode D 6. NC 7. Cathode DP 8. Common Anode 9. Cathode A 10. Cathode B 11. Cathode G 12. Cathode E 13. Cathode F 14. Cathode b LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/10 PART NO. LBD336B -XX Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT Y E G SBI Forward Current Per Chip IF 20 30 30 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 80 120 120 70 mA Power Dissipation Per Chip PD 60 100 100 120 mW 50 μA 500 V Reverse Current Per Any Chip Electrostatic Discharge( * ) 10 Ir ESD --- Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * Static glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Part Selection And Application Information(Ratings at 25℃) Electrical CHIP PART NO Material common λP λD △λ Vf(v) Iv(mcd) IV-M cathode (nm) (nm) (nm) or anode Emitted Min. Typ. Max. Min. Typ GaAsP/GaP Yellow GaAsP/GaP Orange LBD336B-XX GaP InGaN/SiC Green Blue Common Anode 585 --- 35 1.7 2.1 2.6 --- --- 635 --- 45 1.7 2.1 2.6 --- --2:1 565 --- 30 1.7 2.1 2.6 --- --- 430 465 65 --- 3.8 4.7 3.05 5.0 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD336B-XX Page 5/10 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=10mA Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA Dominant Wavelength λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/10 PART NO. LBD336B-XX Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 1000 Forward Current(mA) Forward Voltage(V) -40 100 700 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/10 PART NO. LBD336B-XX Typical Electro-Optical Characteristics Curve E CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 3.0 2.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 700 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 750 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD336B-XX Page8/10 Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD336B-XX Page 9/10 Typical Electro-Optical Characteristics Curve SBI CHIP Fig.2 Relative Intensity vs. Wavelength 30 1.0 Relative Intensity(%) Forward Current(mA DC) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 2 1 3 4 0.5 0 380 5 Forward Voltage(V) 100 Relative Intensity Relative Intensity(%) 580 630 680 10 75 50 25 0 5 10 15 20 25 30 35 40 45 Fig.5 Forward Current vs. Ambient Temperature 40 30 20 10 0 25 50 75 Ambient Temperature ( ℃) 1 0 0 25 50 75 Lead Temperature ( ℃) Forward Current (mA DC) Forward Current (mA DC) 530 Fig.4 Relative Intensity vs. Lead Temperature 125 0 480 Wavelength (nm) Fig.3 Relative Intensity vs. Forward Current 0 430 100 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/10 PART NO. LBD336B-XX Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11