LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LDGM2043-W75 DATA SHEET DOC. NO : QW0905- LDGM2043-W75 REV. : C DATE : 12 - Jun - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 PART NO. LDGM2043-W75 Package Dimensions 3.0 4.2 3.0 4.0 5.2 Thermo-shrinking tube 4.2 5.2 1.5MAX 11±1.5 20±5 □0.5 TYP 7.0±0.5 2.54TYP + - 218+5/-0 Thermo-shrinking tube 12±1.5 30±5 Black wire Red wire 28+3/-0 75±10 10±5 2.5±0.5 + - Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LDGM2043-W75 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT DGM Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 500 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LDGM2043-W75 InGaN/GaN Lens Green Water Clear Dominant wave length λD nm Spectral halfwidth △λ nm Min. Typ. Max. Min. Max. Min. Max. 522 534 Luminous Viewing intensity angle @2mA(mcd) 2θ 1/2 (deg) Forward voltage @2mA(V) 36 2.6 3.2 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 3.9 900 2200 30 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/6 PART NO. LDGM2043-W75 Brightness Code For Standard LED Lamps DGM CHIP Group Luminous Intensity(mcd) at 2 mA Min. Max. A21 900 1100 A22 1100 1500 A23 1500 1800 A24 1800 2200 Color Code DGM CHIP Group Dominant Wavelength(nm) at 2 mA Min. Max. 1P 522 525 1Q 525 528 1R 528 531 1S 531 534 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LDGM2043-W75 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature(℃) Ambient Temperature(℃) 450 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1000 Forward Current(mA) Forward Voltage(V) Relative Intensity@20mA 100 600 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350¢XC Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120¢XC Max Preheat time: 60seconds Max Ramp-up 2¢XC/sec(max) Ramp-Down:-5¢XC/sec(max) Solder Bath:260¢XC Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(¢XC) 260¢XC3sec Max 260° 5¢X/sec max 120° 25° 0° 2¢X/sec max 0 Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11