LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only INFRARED EMITTING DIODES LHIR3333-T50 DATA SHEET DOC. NO : QW0905-LHIR3333-T50 REV. : A A DATE : 08 - Dec - 2004 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/4 PART NO. LHIR3333-T50 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Features: 1. High radiant intensity. 2. Suitable for pulse applications. 3. Low average degradation. Descriptions: The LHIR3333-T50 series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in water clear plastic T-1 3/4 package individually Device Selection Guide: PART NO MATERIAL LENS COLOR LHIR3333-T50 AlGaAs Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/4 PART NO. LHIR3333-T50 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT HIR Forward Current IF 50 mA Peak Forward Current (300PPS,1 μs Pulse) IFP 3 A Power Dissipation PD 100 mW Reverse Voltagev Vr 5 V Operating Temperature Topr -55 ~ +100 ℃ Storage Temperature Tstg -55 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Electrical Optical Characteristics (Aa=25℃) SYMBOL Min. Typ. Radiant Intensity Le 20 Aperture Radiant Incidence Ee 3.3 PARAMETER Max. UNIT TEST CONDITION 40 mW/sr IF=50mA 5.5 mW/cm IF=50mA λpeak 850 nm IF=50mA △λ 50 nm IF=50mA Forward Voltage VF 1.5 2.0 V IF=50mA Reverse Current IR 100 μA VR=5V Peak Wavelength Spectral Line Half Width Viewing Angle 2θ1/2 2 20 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. deg LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHIR3333-T50 Page3/4 Typical Electro-Optical Characteristics Curve HIR CHIP Fig.1 Forward Current vs. Rorward Voltage Fig.2 Relative Radiant Power vs. Wavelength 1.0 Relative Radiant Power Normalize @20mA Forward Current[mA] 1000 100 10 1 0.1 0.0 1.0 2.0 3.0 4.0 0.5 0.0 800 850 Wavelength[nm] Forward Voltage[V] Fig.3 Relative Radiant Power vs. Forward DC Current Fig.4 Relative Radiant Power vs. Forward Peak Current 10.0 Relative Radiant Power Normalize @100 mA Relative Radiant Power Normalize @20mA 10.0 1.0 0.1 1 10 1.0 0.1 10 100 100 Fig.6 Relative Radiant Power vs. Temperature Fig.5 Forward DC Voltage vs. Temperature 1.1 1.0 0.9 -20 0 20 40 60 80 Ambient Temperature[℃] 100 Relative Radiant Power Normalize @ 20mA, 25 ℃ 1.2 0.8 -40 1000 IFPK [mA] IFDC [mA] Forward DC Voltage Normalize @20mA, 25 ℃ 950 900 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature[ ℃] 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/4 PART NO. LHIR3333-T50 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11