CC2533 www.ti.com SWRS087 – JUNE 2010 An Optimized System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 Remote Control Applications Check for Samples: CC2533 FEATURES 1 • RF/Layout – 2.4-GHz IEEE 802.15.4 Compliant RF Transceiver – Excellent Receiver Sensitivity and Robustness to Interference – Programmable Output Power Up to 4.5 dBm – Boost-Mode TX at 7 dBm – Very Few External Components – Only a Single Crystal Needed for Asynchronous Networks – Space-Saving 6-mm × 6-mm QFN40 Package – Suitable for Systems Targeting Compliance With Worldwide Radio-Frequency Regulations: ETSI EN 300 328 and EN 300 440 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T-66 (Japan) – Pin- and Software-Compatible With the CC2530Fxxx Series • Low Power – Active-Mode RX (CPU Idle): 25 mA – Active Mode TX at 0 dBm (CPU Idle): 28.5 mA – Power Mode 1 (4 ms Wake-Up): 0.2 mA – Power Mode 2 (Sleep Timer Running): 1 mA – Power Mode 3 (External Interrupts): 0.5 mA – Wide Supply-Voltage Range (2 V–3.6 V) • Microcontroller – High-Performance and Low-Power 8051 Microcontroller Core With Code Prefetch – 64- or 96-KB In-System-Programmable Flash – 4- or 6-KB RAM With Retention in All Power Modes – Hardware Debug Support • 234 • Peripherals – Powerful Five-Channel DMA – IEEE 802.15.4 MAC Timer, General-Purpose Timers (One 16-Bit, Two 8-Bit) – IR Generation Circuitry – 32-kHz Sleep Timer With Capture – CSMA/CA Hardware Support – Accurate Digital RSSI/LQI Support – Battery Monitor Comparator – Random Number Generation – AES Security Coprocessor – Two Powerful USARTs With Support for UART and SPI – I2C Interface – 23 General-Purpose I/O Pins – Watchdog Timer Development Tools – CC2533 Remote Control Development Kit for RF4CE – CC2533 Development Kit – CC2533EMK Evaluation Modules – SmartRF™ Software – Packet Sniffer – IAR Embedded Workbench™ Available APPLICATIONS • • • • ZigBee™ RF4CE Remote Control Target and Device 2.4-GHz IEEE 802.15.4 Systems Based on TIMAC or SimpliciTI™ Network Protocol Consumer Electronics Electronic Shelf Labeling 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SmartRF, SimpliciTI, RemoTI are trademarks of Texas Instruments. IAR Embedded Workbench is a trademark of IAR Systems AB. ZigBee is a trademark of ZigBee Alliance. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated CC2533 SWRS087 – JUNE 2010 www.ti.com DESCRIPTION The CC2533 is an optimized system-on-chip (SoC) solution for IEEE 802.15.4 based remote-control systems. It enables single-chip remote controls to be built with low bill-of-material cost when used as a flexible SoC. It also provides a simple path to adding RF4CE capability to a device or target when used in the wireless network processor configuration of the RemoTI™ RF4CE stack. Robust network nodes can be built with very low total bill-of-material costs. The CC2533 combines the excellent performance of a leading RF transceiver with a single-cycle 8051 compliant CPU, up to 96-KB in-system programmable flash memory, up to 6-KB RAM, and many other powerful features. The CC2533 has efficient power modes with RAM and register retention below 1 µA, making it highly suited for low-duty-cycle systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2533 provides a robust and complete ZigBee RF4CE remote-control solution. It is also ideal for implementing the target side of a remote-control system in a network processor configuration with an SPI/UART/I2C interface. The CC2533 comes complete with reference designs and example software that implement a remote control system to ensure efficient design-in. The CC2533 exists in three memory-size configurations: CC2533F32 – 32-KB Flash, 4-KB RAM CC2533F64 – 64-KB Flash, 4-KB RAM CC2533F96 – 96-KB Flash, 6-KB RAM 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 XOSC_Q2 32-MHz CRYSTAL OSC XOSC_Q1 P2_4 32.768-kHz CRYSTAL OSC P2_3 P2_2 DEBUG INTERFACE P2_1 HIGHSPEED RC-OSC DCOUPL POWER-ON RESET BROWN OUT CLOCK MUX and CALIBRATION SFR Bus RESET VDD (2 V–3.6 V) ON-CHIP VOLTAGE REGULATOR WATCHDOG TIMER RESET_N SLEEP TIMER 32-kHz RC-OSC POWER MANAGEMENT CONTROLLER P2_0 SCL 2 I C P1_7 SDA P1_6 PDATA P1_5 P1_4 8051 CPU CORE P1_3 XRAM IRAM P1_2 SFR P1_1 DMA 4/6 KB RAM FLASH 32/64/96-KB FLASH MEMORY ARBITRATOR P1_0 P0_7 RAM UNIFIED P0_6 IRQ CTRL P0_4 P0_3 P0_2 P0_1 P0_0 I/O CONTROLLER P0_5 FLASH CTRL RADIO REGISTERS BATTERY AND TEMPERATURE MONITOR CSMA/CA STROBE PROCESSOR DEMODULATOR and AGC FIFO and FRAME CONTROL USART 1 SYNTH USART 0 SFR Bus RADIO DATA INTERFACE MODULATOR TIMER 2 (IEEE 802.15.4 MAC TIMER) DIGITAL TIMER 3 (8-Bit) RECEIVE FREQUENCY SYNTHESIZER TIMER 1 (16-Bit, IR Gen) TRANSMIT ANALOG MIXED TIMER 4 (8-Bit) RF_P RF_N B0301-04 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 3 CC2533 SWRS087 – JUNE 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) Supply voltage MIN MAX –0.3 3.9 V –0.3 VDD + 0.3, ≤ 3.9 V 10 dBm –40 125 °C All pads, according to human-body model, JEDEC STD 22, method A114 2 kV According to charged-device model, JEDEC STD 22, method C101 500 V All pads excluding RF pads, according to machine model, JEDEC STD 22, method A115 200 V All supply pins must have the same voltage Voltage on any digital pin Input RF level Storage temperature range ESD (1) (2) (2) UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. CAUTION: ESD-sensitive device. Precautions should be used when handling the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT –40 125 °C 2 3.6 V Operating ambient temperature range, TA Operating supply voltage ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER Icore Core current consumption TEST CONDITIONS MIN Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. Medium CPU activity: normal flash access (1), no RAM access 3.6 32-MHz XOSC running. No radio or peripherals active. Medium CPU activity: normal flash access (1), no RAM access 6.6 32-MHz XOSC running, radio in RX mode, –50-dBm input power, no peripherals active, CPU idle 21.6 32-MHz XOSC running, radio in RX mode at –100-dBm input power (waiting for signal), no peripherals active, CPU idle 25.1 32-MHz XOSC running, radio in TX mode, 0-dBm output power, no peripherals active, CPU idle 28.5 32-MHz XOSC running, radio in TX mode, 4.5-dBm output power, no peripherals active, CPU idle 32.3 32-MHz XOSC running, radio in boost mode TX, 7-dBm output power, no peripherals active, CPU idle 38.8 Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD, and sleep timer active; RAM and register retention (1) 4 TYP MAX UNIT mA 7.7 mA mA 29.8 mA mA 40.6 mA mA 0.2 0.3 mA Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention 1 1.5 mA Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention 0.4 0.7 mA During reset with supply voltage of 1.2 V 54 mA Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 ELECTRICAL CHARACTERISTICS (continued) Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) Iperi Timer 1 Timer running, 32-MHz XOSC used 90 mA Timer 2 Timer running, 32-MHz XOSC used 90 mA Timer 3 Timer running, 32-MHz XOSC used 60 mA Timer 4 Timer running, 32-MHz XOSC used 70 mA Sleep timer Including 32.753-kHz RCOSC 0.6 mA Battery monitor When comparing 93 mA Erase 0.2 mA 6 mA Flash Burst-write peak current GENERAL CHARACTERISTICS Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKE-UP AND TIMING Power mode 1 → active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 ms Power mode 2 or 3 → active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC 0.1 ms Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF 0.6 ms Active → TX or RX With 32-MHz XOSC initially on RX/TX and TX/RX turnaround 192 ms 192 ms 2507 MHz RADIO PART RF frequency range Programmable in 1-MHz steps, 5 MHz between channels for compliance with [1] Radio baud rate As defined by [1] 250 Radio chip rate As defined by [1] 2 Flash page size 2394 kbps MChip/s 1 Flash erase cycles KB 20 K Cycles Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 5 CC2533 SWRS087 – JUNE 2010 www.ti.com RF RECEIVE SECTION Measured on Texas Instruments CC2533 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity PER = 1%, as specified by [1] [1] requires –85 dBm Saturation (maximum input level) PER = 1%, as specified by [1] [1] requires –20 dBm 10 dBm Adjacent-channel rejection, 5-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at 5 MHz, PER = 1%, as specified by [1]. [1] requires 0 dB 49 dB Adjacent-channel rejection, –5-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –5 MHz, PER = 1%, as specified by [1]. [1] requires 0 dB 49 dB Alternate-channel rejection, 10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at 10 MHz, PER = 1%, as specified by [1] [1] requires 30 dB 57 dB Alternate-channel rejection, –10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –10 MHz, PER = 1%, as specified by [1] [1] requires 30 dB 57 dB Channel rejection ≥ 20 MHz ≤ –20 MHz Wanted signal at –82 dBm. Undesired signal is an IEEE 802.15.4 modulated channel, stepped through all channels from 2405 to 2480 MHz. Signal level for PER = 1%. 57 57 dB Co-channel rejection Wanted signal at –82 dBm. Undesired signal is 802.15.4 modulated at the same frequency as the desired signal. Signal level for PER = 1%. –2 dB –97 –93 –89 dBm Blocking/desensitization Measured according to ETSI EN 300 440-1 V1.6.1 (2010-04) blocking/desensitization. Wanted signal 3 dB above sensitivity limit, interferer at 10×, 20× and 50× bandwidth from receiver channel band edge. Limit > –45dBm for class-2 receiver. –250 MHz from band edge –100 MHz from band edge –50 MHz from band edge 50 MHz from band edge 100 MHz from band edge 250 MHz from band edge Spurious emission. Only largest spurious emission stated within each band. Conducted measurement with a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, 30 MHz–1000 MHz EN 300 440, FCC CFR47 Part 15, and ARIB STD-T-66. 1 GHz–12.75 GHz Frequency error tolerance (1) Symbol rate error tolerance (1) (2) 6 (2) -37 -35 -40 -38 -33 -32 dBm < –80 –57 dBm [1] requires minimum 80 ppm ±150 ppm [1] requires minimum 80 ppm ±1000 ppm Difference between center frequency of the received RF signal and local oscillator frequency. Difference between incoming symbol rate and the internally generated symbol rate Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 RF TRANSMIT SECTION Measured on Texas Instruments CC2533 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS Nominal output power Delivered to a single-ended 50-Ω load through a balun using 4.5 dBm output-power setting [1] requires minimum –3 dBm Boost mode Delivered to a single-ended 50-Ω load through a balun using boost mode TX settings Programmable output-power range Spurious emissions (2) UNIT 1 –3 4.5 7 8 dBm 7 dBm 27 dB dBm –45 Error vector magnitude (EVM) Optimum load impedance Differential impedance as seen from the RF port (RF_P and RF_N) towards the antenna (4) MAX –60 –60 –60 –56 –54 –48 –39 –60 Measured as defined by [1] using 4.5 dBm output-power setting [1] requires maximum 35%. (2) (3) TYP 4.5 dBm output power setting (1) 25 MHz–1000 MHz (outside restricted bands) (2) (2) 25 MHz–2400 MHz (within FCC restricted bands) (2) 25 MHz–1000 MHz (within ETSI restricted bands) (2) 1800–1900 MHz (ETSI restricted band) (2) 5150–5300 MHz (ETSI restricted band) (2) At 2 × fc and 3 × fc (FCC restricted band) (2) At 2 × fc and 3 × fc (ETSI EN 300-440 and EN 300-328) (3) 1 GHz–12.75 GHz (outside restricted bands) (2) At 2483.5 MHz and above (FCC restricted band) (2) fc= 2480 MHz (4) (2) (1) MIN 3% 69 + j29 Ω Texas Instruments CC2533 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15, and ARIB STD-T-66. Measurement conducted according to stated regulations. Only largest spurious emission stated within each band. Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground. Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower output-power setting or having less than 100% duty cycle. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 7 CC2533 SWRS087 – JUNE 2010 www.ti.com 32-MHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX 32 Crystal frequency accuracy requirement (1) UNIT MHz –40 40 ppm ESR Equivalent series resistance 6 60 Ω C0 Crystal shunt capacitance 1 7 pF CL Crystal load capacitance 10 16 pF Start-up time Power-down guard time (1) 0.3 The crystal oscillator must be in power down for a guard time before it is used again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. ms 3 ms Including aging and temperature dependency, as specified by [1] 32.768-kHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX 32.768 Crystal frequency accuracy requirement (1) –40 UNIT kHz 40 ppm ESR Equivalent series resistance 40 130 kΩ C0 Crystal shunt capacitance 0.9 2 pF CL Crystal load capacitance 12 16 pF Start-up time 0.4 (1) s Including aging and temperature dependency, as specified by [1] 32-kHz RC OSCILLATOR Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Calibrated frequency (1) 32.753 Frequency accuracy after calibration ±0.2% Temperature coefficient (2) MAX UNIT kHz 0.4 %/°C Supply-voltage coefficient (3) 3 %/V Calibration time (4) 2 ms (1) (2) (3) (4) 8 The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. Frequency drift when temperature changes after calibration Frequency drift when supply voltage changes after calibration When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is 0. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 16-MHz RC OSCILLATOR Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP Frequency (1) MAX Uncalibrated frequency accuracy ±18% Calibrated frequency accuracy ±0.6% MHz ±1% Start-up time 10 Initial calibration time (2) (1) (2) UNIT 16 ms 50 ms The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0. RSSI/CCA CHARACTERISTICS Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP RSSI range MAX UNIT 100 dB Absolute uncalibrated RSSI/CCA accuracy ±4 dB RSSI/CCA offset 73 dB 1 dB Step size (LSB value) FREQEST CHARACTERISTICS Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP FREQEST range FREQEST accuracy MAX UNIT ±250 kHz ±40 kHz FREQEST offset 20 kHz Step size (LSB value) 7.8 kHz FREQUENCY SYNTHESIZER CHARACTERISTICS Measured on Texas Instruments CC2533 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz PARAMETER TEST CONDITIONS Phase noise, unmodulated carrier MIN TYP At ±1-MHz offset from carrier –110 At ±2-MHz offset from carrier –117 At ±5-MHz offset from carrier –122 MAX UNIT dBc/Hz BATTERY MONITOR CHARACTERISTICS Measured on Texas Instruments CC2533 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP Settling time Step size Calibrated accuracy MAX 2 For voltages up to 2.5 V 24 For voltages above 2.5 V 169 UNIT µs mV mV Across 1.95 V to 2.5 V, with single-point calibration at 1.95 V 2 20 mV Across 2.5 V to 3.6 V, with single-point calibration at 1.95 V 10 55 mV TYP MAX UNIT 32 MHz CONTROL INPUT AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER System clock, fSYSCLK tSYSCLK = 1/fSYSCLK TEST CONDITIONS MIN The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. 16 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 9 CC2533 SWRS087 – JUNE 2010 www.ti.com CONTROL INPUT AC CHARACTERISTICS (continued) TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RESET_N low duration See item 1, Figure 1. This is the shortest pulse that is recognized as a complete reset-pin request. Note that shorter pulses may be recognized but might not lead to complete reset of all modules within the chip. 1 ms Interrupt pulse duration See item 2, Figure 1.This is the shortest pulse that is recognized as an interrupt request. 20 ns RESET_N 1 2 Px.n T0299-01 Figure 1. Control Input AC Characteristics 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 SPI AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS MIN TYP MAX 250 UNIT SCK period Master, RX and TX SCK duty cycle Master ns t2 SSN low to SCK Master 63 t3 SCK to SSN high Master 63 t4 MOSI early out Master, load = 10 pF 7 ns t5 MOSI late out Master, load = 10 pF 10 ns t6 MISO setup Master 90 ns t7 MISO hold Master 10 ns t1 SCK period Slave, RX and TX 250 ns 50% ns ns SCK duty cycle Slave t2 SSN low to SCK Slave 63 t3 SCK to SSN high Slave 63 t8 MISO early out Slave, load = 10 pF t9 MISO late out Slave, load = 10 pF t10 MOSI setup Slave 35 ns t11 MOSI hold Slave 10 ns Operating frequency 50% ns ns ns 0 ns 95 ns Master, TX only 8 Master, RX and TX 4 Slave, RX only 8 Slave, RX and TX 4 MHz SCK t2 t3 SSN t4 D0 MOSI t6 MISO X t5 X D1 t7 D0 X T0478-01 Figure 2. SPI Master AC Characteristics Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 11 CC2533 SWRS087 – JUNE 2010 www.ti.com SCK t2 t3 SSN t8 D0 MISO X t10 MOSI X t9 D1 t11 D0 X T0479-01 Figure 3. SPI Slave AC Characteristics 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 DEBUG INTERFACE AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 12 MHz fclk_dbg Debug clock frequency (see Figure 4) t1 Allowed high pulse on clock (see Figure 4) 35 ns t2 Allowed low pulse on clock (see Figure 4) 35 ns t3 RESET_N low to first falling edge on debug clock (see Figure 5) 167 ns t4 Falling edge on clock to RESET_N high (see Figure 5) 83 ns t5 RESET_N high to first debug command (see Figure 5) 83 ns t6 Debug data setup (see Figure 6) 2 ns t7 Debug data hold (see Figure 6) 4 t8 Clock-to-data delay (see Figure 6) ns Load = 10 pF 30 ns Time DEBUG_ CLK P2_2 t1 t2 1/fclk_dbg T0436-01 Figure 4. Debug Clock – Basic Timing Time DEBUG_ CLK P2_2 RESET_N t3 t4 t5 T0437-01 Figure 5. Data Setup and Hold Timing Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 13 CC2533 SWRS087 – JUNE 2010 www.ti.com Time DEBUG_ CLK P2_2 DEBUG_DATA (to CC253x) P2_1 DEBUG_DATA (from CC253x) P2_1 t6 t8 t7 T0438-01 Figure 6. Debug Enable Timing TIMER INPUT AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER Input capture pulse duration 14 TEST CONDITIONS MIN Synchronizers determine the shortest input pulse that can be recognized. The synchronizers operate at the current system clock rate (16 MHz or 32 MHz). Submit Documentation Feedback TYP MAX UNIT tSYSCLK 1.5 Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 DC CHARACTERISTICS TA = 25°C, VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP MAX Logic-0 input voltage Logic-1 input voltage V 50 nA 2.5 Logic-0 input current Input equals 0 V –50 Logic-1 input current Input equals VDD –50 I/O-pin pullup and pulldown resistors V 50 20 Logic-0 output voltage, 4-mA pins Output load 4 mA Logic-1 output voltage, 4-mA pins Output load 4 mA Logic-0 output voltage, 20-mA pins Output load 20 mA Logic-1 output voltage, 20-mA pins Output load 20 mA UNIT 0.5 nA kΩ 0.5 2.4 V V 0.5 2.4 V V DEVICE INFORMATION PIN DESCRIPTIONS The CC2533 pinout is shown in Figure 7 and a short description of the pins follows. P1_6 P1_7 P2_0 P2_1 P2_2 P2_3/ XOSC32K_Q2 P2_4/ XOSC32K_Q1 39 38 37 36 35 34 33 32 AVDD6 DVDD1 40 31 30 RBIAS 2 29 AVDD4 SDA 3 28 AVDD1 NC 4 27 AVDD2 P1_5 5 26 RF_N P1_4 6 25 RF_P P1_3 7 24 AVDD3 P1_2 8 23 XOSC_Q2 9 DCOUPL CC2533 RHA Package (Top View) 22 12 13 14 15 16 17 18 19 P0_3 P0_2 P0_1 P0_0 21 20 XOSC_Q1 AVDD5 RESET_N 10 11 P0_4 DVDD2 P0_5 P1_1 GND Ground Pad P0_6 SCL P0_7 1 P1_0 NC P0076-04 NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip. Figure 7. Pinout Top View Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 15 CC2533 SWRS087 – JUNE 2010 www.ti.com Table 1. Pin Descriptions PIN NAME PIN PIN TYPE DESCRIPTION AVDD1 28 Power (analog) 2-V–3.6-V analog power-supply connection AVDD2 27 Power (analog) 2-V–3.6-V analog power-supply connection AVDD3 24 Power (analog) 2-V–3.6-V analog power-supply connection AVDD4 29 Power (analog) 2-V–3.6-V analog power-supply connection AVDD5 21 Power (analog) 2-V–3.6-V analog power-supply connection AVDD6 31 Power (analog) 2-V–3.6-V analog power-supply connection DCOUPL 40 Power (digital) 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. DVDD1 39 Power (digital) 2-V–3.6-V digital power-supply connection DVDD2 10 Power (digital) 2-V–3.6-V digital power-supply connection GND — Ground The ground pad must be connected to a solid ground plane. NC 1, 4 Unused pins No connect P0_0 19 Digital I/O Port 0.0 P0_1 18 Digital I/O Port 0.1 P0_2 17 Digital I/O Port 0.2 P0_3 16 Digital I/O Port 0.3 P0_4 15 Digital I/O Port 0.4 P0_5 14 Digital I/O Port 0.5 P0_6 13 Digital I/O Port 0.6 P0_7 12 Digital I/O Port 0.7 P1_0 11 Digital I/O Port 1.0 – 20-mA drive capability P1_1 9 Digital I/O Port 1.1 – 20-mA drive capability P1_2 8 Digital I/O Port 1.2 P1_3 7 Digital I/O Port 1.3 P1_4 6 Digital I/O Port 1.4 P1_5 5 Digital I/O Port 1.5 P1_6 38 Digital I/O Port 1.6 P1_7 37 Digital I/O Port 1.7 P2_0 36 Digital I/O Port 2.0 P2_1 35 Digital I/O Port 2.1 P2_2 34 Digital I/O Port 2.2 P2_3/ XOSC32K_Q2 33 Digital I/O, analog I/O Port 2.3/32.768 kHz XOSC P2_4/ XOSC32K_Q1 32 Digital I/O, analog I/O Port 2.4/32.768 kHz XOSC RBIAS 30 Analog I/O External precision bias resistor for reference current RESET_N 20 Digital input Reset, active-low RF_N 26 RF I/O Negative RF input signal to LNA during RX Negative RF output signal from PA during TX RF I/O Positive RF input signal to LNA during RX Positive RF output signal from PA during TX 25 RF_P 2 I2C clock or digital I/O Can be used as I2C clock pin or digital I/O. Leave floating if not used. 3 I2C clock or digital I/O Can be used as I2C data pin or digital I/O. Leave floating if not used. XOSC_Q1 22 Analog I/O 32-MHz crystal oscillator pin 1 or external clock input XOSC_Q2 23 Analog I/O 32-MHz crystal oscillator pin 2 SCL SDA 16 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 CIRCUIT DESCRIPTION XOSC_Q2 32-MHz CRYSTAL OSC XOSC_Q1 P2_4 32.768-kHz CRYSTAL OSC P2_3 P2_2 DEBUG INTERFACE P2_1 HIGHSPEED RC-OSC DCOUPL POWER-ON RESET BROWN OUT CLOCK MUX and CALIBRATION SFR Bus RESET VDD (2 V–3.6 V) ON-CHIP VOLTAGE REGULATOR WATCHDOG TIMER RESET_N SLEEP TIMER 32-kHz RC-OSC POWER MANAGEMENT CONTROLLER P2_0 SCL 2 I C P1_7 SDA P1_6 PDATA P1_5 P1_4 8051 CPU CORE P1_3 XRAM IRAM P1_2 SFR P1_1 DMA 4/6 KB RAM FLASH 32/64/96-KB FLASH MEMORY ARBITRATOR P1_0 P0_7 RAM UNIFIED P0_6 IRQ CTRL P0_4 P0_3 P0_2 P0_1 P0_0 I/O CONTROLLER P0_5 FLASH CTRL RADIO REGISTERS BATTERY AND TEMPERATURE MONITOR CSMA/CA STROBE PROCESSOR DEMODULATOR and AGC FIFO and FRAME CONTROL USART 1 SYNTH USART 0 SFR Bus RADIO DATA INTERFACE MODULATOR TIMER 2 (IEEE 802.15.4 MAC TIMER) DIGITAL RECEIVE TIMER 3 (8-Bit) FREQUENCY SYNTHESIZER TIMER 1 (16-Bit, IR Gen) TRANSMIT ANALOG MIXED TIMER 4 (8-Bit) RF_P RF_N B0301-04 Figure 8. CC2533 Block Diagram Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 17 CC2533 SWRS087 – JUNE 2010 www.ti.com A block diagram of the CC2533 is shown in Figure 8. The modules can be roughly divided into one of three categories: CPU- and memory-related modules; modules related to peripherals, clocks, and power management; and radio-related modules. In the following subsections, a short description of each module that appears in Figure 8 is given. For more details about the modules and their usage, see the corresponding chapters in the CC253x User's Guide (SWRU191). CPU and Memory The 8051 CPU core used in the CC253x device family is a single-cycle 8051-compatible core. It has three different memory-access buses (SFR, DATA, and CODE/XDATA) with single-cycle access to SFR, DATA, and the main SRAM. It also includes a debug interface and an 18-input extended interrupt unit. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. Any interrupt service request is serviced also when the device is in idle mode by going back to active mode. Some interrupts can also wake up the device from sleep mode (power modes 1–3). The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory access points, access of which can map to one of three physical memories: an 8-KB SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The 4- or 6-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The 6-KB SRAM is an ultralow-power SRAM that retains its contents even in the lowest power modes (PM2/3). This is an important feature for low-power applications. The 64- or 96-KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. In addition to holding program code and constants, the non-volatile memory allows the application to save data that must be preserved such that it is available after restarting the device. Using this feature, one can, e.g., use saved network-specific data to avoid the need for a full start-up and network find-and-join process. Clocks and Power Management The digital core and peripherals are powered by a 1.8-V low-dropout voltage regulator. It provides power management functionality that enables low-power operation for long battery life using different power modes. Five different reset sources exist to reset the device. Peripherals The CC2533 includes many different peripherals that allow the application designer to develop advanced applications. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to perform an erasure of the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute supplied instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in-circuit debugging and external flash programming elegantly. The device contains flash memory for storage of program code. The flash memory is programmable from the user software and through the debug interface. The flash controller handles writing and erasing the embedded flash memory. The flash controller allows page-wise erasure and 4-bytewise programming. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. CPU interrupts can be enabled on each pin individually. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications. 18 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface) achieve highly efficient operation by using the DMA controller for data transfers between SFR or XREG addresses and flash/SRAM. Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR Generation Mode, where it counts Timer 3 periods and the output is ANDed with the output of Timer 3 to generate modulated consumer IR signals with minimal CPU interaction. Timer 2 (the MAC Timer) is specially designed for supporting an IEEE 802.15.4 MAC or other time-slotted protocol in software. The timer has a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends, as well as two 16-bit output compare registers and two 24-bit overflow compare registers that can send various command strobes (start RX, start TX, etc.) at specific times to the radio modules. Timer 3 and Timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as a PWM output. The sleep timer is an ultralow-power timer that counts 32-kHz crystal oscillator or 32-kHz RC oscillator periods. The sleep timer runs continuously in all operating modes except power mode 3 (PM3). Typical applications of this timer are as a real-time counter or as a wake-up timer to come out of power mode 1 (PM1) or 2 (PM2). The battery monitor comparator enables simple voltage monitoring in the devices that do not include an ADC. It is designed such that it is accurate in the voltage areas around 2 V, with lower resolution at higher voltages. The random-number generator uses a 16-bit LFSR to generate pseudorandom numbers, which can be read by the CPU or used directly by the command strobe processor. It can be seeded with random data from noise in the radio ADC. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The core is able to support the security operations required by IEEE 802.15.4 MAC security, the ZigBee network layer, and the application layer. A built-in watchdog timer allows the CC2533 to reset itself in case the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. It can alternatively be configured for use as a general 32-kHz timer. USART 0 and USART 1 are each configurable as either a SPI master/slave or a UART. They provide double buffering on both RX and TX, as well as hardware flow control, and are thus well suited to high-throughput full-duplex applications. Each has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. The I2C module provides a digital peripheral connection with two pins and supports both master and slave operation. Radio The CC2533 features an IEEE 802.15.4-compliant radio transceiver. The RF core controls the analog radio modules. In addition, it provides an interface between the MCU and the radio which makes it possible to issue commands, read status, and automate and sequence radio events. The radio also includes a packet-filtering and address-recognition module. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 19 CC2533 SWRS087 – JUNE 2010 www.ti.com TYPICAL CHARACTERISTICS OUTPUT POWER vs TEMPERATURE 6 6 5.5 5 5 4 Output Power (dBm) Output Power (dBm) OUTPUT POWER vs FREQUENCY 4.5 4 3.5 3 2394 3 2 1 2414 2434 2454 2474 Frequency (MHz) 0 -40 2494 2507 0 40 Temperature (°C) 80 G001 120 G002 Figure 9. Figure 10. SENSITIVITY vs FREQUENCY SENSITIVITY vs TEMPERATURE -95 -92 -93 -96 Sensitivity (dBm) Sensitivity (dBm) -94 -97 -98 -95 -96 -97 -98 -99 -99 -100 2394 2414 2434 2454 2474 Frequency (MHz) 2494 2507 -100 -40 0 40 Temperature (°C) G003 Figure 11. 20 80 120 G004 Figure 12. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 TYPICAL CHARACTERISTICS (continued) SENSITIVITY vs SUPPLY VOLTAGE SENSITIVITY vs ERROR VECTOR MAGNITUDE -94 -90 -95 -92 Sensitivity (dBm) Sensitivity (dBm) -96 -97 -94 -96 -98 -98 -99 -100 -100 2 2.4 2.8 Supply Voltage (V) 3.2 3.6 0 5 10 15 20 25 30 35 Error Vector Magnitude (%) 40 45 G005 G006 Figure 13. Figure 14. SENSITIVITY vs FREQUENCY OFFSET ALTERNATE CHANNEL REJECTION (802.15.4 INTERFERER) vs CARRIER LEVEL 70 0 -10 65 Alternate Channel Rejection (dB) -20 Sensitivity (dBm) -30 -40 -50 -60 -70 -80 60 55 50 45 -90 -100 -400 -300 -200 -100 0 100 200 Frequency Offset (ppm) 300 400 40 -95 -85 -75 -65 Carrier Level (dBm) -55 -50 G007 Figure 15. G008 Figure 16. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 21 CC2533 SWRS087 – JUNE 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) POWER MODE 3 CURRENT vs TEMPERATURE 75 4 50 3 Power Mode 3 Current (µA) Interferer Rejection (dB) INTERFERER REJECTION (802.15.4 INTERFERER) vs INTERFERER FREQUENCY (CARRIER AT –82 dBm, 2440 MHz) 25 0 -25 2400 2 1 2420 2440 2460 Interferer Frequency (MHz) 2480 0 -40 0 40 Temperature (°C) G009 80 120 G010 Figure 17. Figure 18. Recommended RF Settings This section contains a summary of the register settings that must be updated from their default value to have optimal performance. The following settings should be set for both RX and TX. Although not all settings are necessary for both RX and TX, it is recommended for simplicity (allowing one set of settings to be written at the initialization of the code). Table 2. Recommended RF Register Settings 22 Register Name Value FRMCTRL0 0x43 FRMCTRL1 0x00 TXFILTCFG 0x09 FSCAL1 0x00 IVCTRL 0x0F FSCTRL 0x55 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 Boost-Mode TX Settings This section contains the register settings for boost-mode TX. Note that it is recommended to add two additional components (a capacitor and an inductor) adjacent to the capacitor C253 in Figure 19 in order to reduce third-harmonic spurious emission to simplify passing regulations. There are three do not mount pads on the EM reference design. Two of these should be used to mount the additional components. The capacitor (0.9 pF) should be mounted to the pad on the chip side of C253 (to the left of C253 in Figure 19). The inductor (4.3 nH) should be mounted between C253 and the antenna on the pad closest to C253 (to the right of C253 in Figure 19). Using this filter lowers the output power 0.12 dB when using boost-mode TX and 0.4 dB at regular full power. Table 3. Boost Mode TX Register Settings Register Name Value FRMCTRL0 0x43 FRMCTRL1 0x00 TXFILTCFG 0x09 FSCAL1 0x00 IVCTRL 0x0F FSCTRL 0xF5 TXCTRL 0x74 TXPOWER 0xFD Table 4. Recommended Output Power Settings (1) (1) TXPOWER Register Setting Typical Output Power (dBm) Typical Current Consumption (mA) Boost mode TX 7 38.8 0xEC 4.5 32.3 0xDC 3 30.4 0xCC 1.7 29.6 0xBC 0.3 28.5 0xAC –1 27.9 0x9C –2.8 26.7 0x8C –4.1 26.3 0x7C –5.9 25.8 0x6C –7.7 25.5 0x5C –9.9 25.3 0x4C –12.4 25.1 0x3C –14.9 25.0 0x2C –16.6 24.9 0x1C –18.7 24.9 0x0C –20.4 23.3 Measured on Texas Instruments CC2533 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. See Table 2 for recommended register settings. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 23 CC2533 SWRS087 – JUNE 2010 www.ti.com APPLICATION INFORMATION Few external components are required for the operation of the CC2533. A typical application circuit is shown in Figure 19. Typical values and description of external components are shown in Table 5. 2-V to 3.6-V Power Supply Optional 32-kHz Crystal C331 XTAL C401 3 SDA AVDD6 31 P2_4/XOSC32K_Q1 32 P2_2 34 P2_1 35 P2_0 36 P1_7 37 P1_6 38 2 SCL P2_3/XOSC32K_Q2 33 1 NC DVDD1 39 DCOUPL 40 C321 R301 RBIAS 30 AVDD4 29 AVDD1 28 4 NC L252 C251 Antenna (50 W) C252 AVDD2 27 C253 5 P1_5 RF_N 26 L251 CC2533 6 P1_4 RF_P 25 L261 DIE ATTACH PAD 7 P1_3 AVDD3 24 XOSC_Q2 23 9 P1_1 XOSC_Q1 22 18 P0_1 19 P0_0 16 P0_3 17 P0_2 14 P0_5 15 P0_4 13 P0_6 11 P1_0 10 DVDD2 20 RESET_N 8 P1_2 12 P0_7 C261 C262 AVDD5 21 XTAL Power-Supply Decoupling Capacitors Are Not Shown Digital I/O Not Connected C221 C231 S0383-02 Figure 19. CC2533 Application Circuit Table 5. Overview of External Components (Excluding Supply Decoupling Capacitors) Component 24 Description Value C221 32-MHz xtal loading capacitor 27 pF C231 32-MHz xtal loading capacitor 27 pF C251 Part of the RF matching network 18 pF C252 Part of the RF matching network 1 pF C253 Part of the RF matching network 2.2 pF C261 Part of the RF matching network 18 pF C262 Part of the RF matching network 1 pF C321 32-kHz xtal loading capacitor 15 pF C331 32-kHz xtal loading capacitor 15 pF C401 Decoupling capacitor for the internal digital regulator 1 mF L252 Part of the RF matching network 2 nH Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 CC2533 www.ti.com SWRS087 – JUNE 2010 Table 5. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued) Component Description Value L261 Part of the RF matching network 2 nH R301 Resistor used for internal biasing 56 kΩ Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252. If a balanced antenna such as a folded dipole is used, the balun can be omitted. Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See the 32-MHz Crystal Oscillator section for details. The load capacitance seen by the 32-MHz crystal is given by: 1 CL = + Cparasitic 1 1 + C221 C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by: 1 CL = + Cparasitic 1 1 + C321 C331 (2) A series resistor may be used to comply with the ESR requirement. On-Chip 1.8-V Voltage-Regulator Decoupling The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation. Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely. REFERENCES 1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 2. CC253x User's Guide – CC253x System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 and ZigBee Applications (SWRU191) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 25 CC2533 SWRS087 – JUNE 2010 www.ti.com ADDITIONAL INFORMATION Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy! The following subsections point to where to find more information. Texas Instruments Low-Power RF Web Site Texas Instruments’ Low-Power RF Web site has all our latest products, application and design notes, FAQ section, news and events updates, and much more. Just go to www.ti.com/lprf. Low-Power RF Online Community • • • Forums, videos, and blogs RF design help E2E interaction Join us today at www.ti.com/lprf-forum. Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: • RF circuit, low-power RF, and ZigBee design services • Low-power RF and ZigBee module solutions and development tools • RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools? Search the Low-Power RF Developer Network to find a suitable partner. www.ti.com/lprfnetwork Low-Power RF eNewsletter The Low-Power RF eNewsletter keeps you up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up today on www.ti.com/lprfnewsletter 26 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CC2533 PACKAGE OPTION ADDENDUM www.ti.com 7-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CC2533F32RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR CC2533F32RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR CC2533F64RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR CC2533F64RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR CC2533F96RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CC2533F96RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-3-260C-168 HR Call TI Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-Mar-2012 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 7-Mar-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC2533F32RHAT VQFN RHA 40 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2533F64RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2533F96RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2533F96RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Mar-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2533F32RHAT VQFN RHA 40 250 336.6 336.6 28.6 CC2533F64RHAT VQFN RHA 40 250 336.6 336.6 28.6 CC2533F96RHAR VQFN RHA 40 2500 336.6 336.6 28.6 CC2533F96RHAT VQFN RHA 40 250 336.6 336.6 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated