LIGITEK LHRFSBKS2093

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DUAL COLOR TYPE LED LAMPS
LHRFSBKS2093
DATA SHEET
DOC. NO :
QW0905- LHRFSBKS2093
REV.
:
B
DATE
: 16 - Nov. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LHRFSBKS2093
Package Dimensions
3.0
4.2
4.0
5.2
6.7±0.5
1.5
MAX
SBKS
HRF
□0.5
TYP
18.0MIN
1
2
3
1.ANODE BLUE
2.COMMON CATHODE
2.0MIN 3.ANODE RED
2.0MIN
2.54TYP
1 2 3
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
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Page 2/5
PART NO. LHRFSBKS2093
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HRF
SBKS
Forward Current
IF
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
90
100
mA
Power Dissipation
PD
75
120
mW
ESD
2000
500
V
Reverse Current @5V
Ir
10
50
μA
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Soldering Temperature
Tsol
Electrostatic Discharge( * )
Max 260 ℃ for 5 sec Max
(2mm from body)
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
AlGaInP
Dominant Spectral
wave
halfwidth
length
△λnm
λDnm
Lens
Red
Forward
voltage
@20mA(V)
Luminous
Viewing
intensity
angle
@20mA(mcd) 2θ 1/2
(deg)
Min. Typ. Max. Min.
Typ.
630
20
1.5
----
2.4
160
300
30
475
26
----
3.5
4.2
160
350
30
Water Clear
LHRFSBKS2093
InGaN/SiC Blue
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/5
PART NO. LHRFSBKS2093
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0
0.1
1.0
1.5
2.0
2.5
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize@25℃
1.2
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
100
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
100
1.0
0.5
0
550
600
650
Wavelength (nm)
700
2.5
2.0
1.5
1.0
0.5
0
-40
-20
-0
20
40
60
80
Ambient Temperature( ℃)
100
LIGITEK ELECTRONICS CO.,LTD.
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Page 4/5
PART NO. LHRFSBKS2093
Typical Electro-Optical Characteristics Curve
SBK-S CHIP
Fig.2 Relative Intensity vs. Forward Current
30
1.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
25
20
15
10
5
0
1
2
3
4
1.25
1.0
0.75
0.5
0.25
0
5
0
5
Relative Intensity@20mA
Forward Current@20mA
40
30
20
10
0
50
75
Ambient Temperature( ℃)
20
25
30
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Temperature
25
15
Forward Current(mA)
Forward Voltage(V)
0
10
100
1.0
0.5
0
380
430
480
530
580
Wavelength (nm)
630
680
LIGITEK ELECTRONICS CO.,LTD.
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Page 5/5
PART NO. LHRFSBKS2093
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11