LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PLCC TYPE LED LAMPS LRGB9Q53/R1/TR1-J DATA SHEET DOC. NO : QW0905-LRGB9Q53/R1/TR1-J REV. : A DATE : 22 - Oct. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/9 PART NO. LRGB9Q53/R1/TR1-J Package Dimensions 5.4 5.0 PIN NO.1 1 6 2 5 3 4 1.0 0.7 5.0 0.7 1.0 B 0.8 1.95 1 G 2 2.5 1.0 1.0 1.0 R 3 6 5 4 1.Cathode Blue 2.Cathode Green 3.Cathode Red 4.Anode Red 5.Anode Green 6.Anode Blue Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0± 0.2 8.0±0.2 2.0 1.5 0.3 1.75 5.5±0.2 12.0±0.3 5.6 5.2 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. 2.15 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9Q53/R1/TR1-J Page 2/9 Reel Dimensions 180± 1.5 ψ13.0±0.5 6.0±1.0 13.5±1.0 17.5±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/9 PART NO. LRGB9Q53/R1/TR1-J Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Symbol Parameter UNIT URF DGM DBK Forward Current IF 50 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 130 100 100 mA Power Dissipation PD 120 120 120 mW Reverse Current @5V Ir 10 50 50 μA Electrostatic Discharge ESD 2000 1000 1000 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP LRGB9Q53/R1/TR1-J InGaN/GaN Blue Spectral halfwidth △λnm Water Clear Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Typ. Max. Min. Typ. Lens Red InGaN/GaN Green Dominant wave length λDnm 630 20 1.5 ---- 2.4 80 200 120 525 36 ---- 3.5 4.0 125 320 120 470 30 ---- 3.5 4.0 80 200 120 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9Q53/R1/TR1-J Page 4/9 Typical Electro-Optical Characteristics Curve URF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 10 1000 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 Forward Voltage@20mA Normalize @25℃ 100 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directive Radiation Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 0° -30° 1.0 30 ° -60 ° 0.5 0 100% 75% 50% 550 600 650 Wavelength (nm) 700 60° 25% 0 25% 50% 75% 100% 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/9 PART NO. LRGB9Q53/R1/TR1-J Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 2.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directive Radiation Fig.5 Relative Intensity vs. Wavelength 0° 1.0 Relative Intensity@20mA 100 -30° 30° -60° 0.5 0.0 100% 75% 50% 450 500 550 Wavelength (nm) 600 60 ° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9Q53/R1/TR1-J Page 6/9 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 1 5.0 10 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 1000 Forward Current(mA) Forward Voltage(V) -40 100 80 100 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directive Radiation Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 0° -30 ° 1.0 30° -60° 60° 0.5 0.0 100% 75% 50% 400 450 500 Wavelength (nm) 550 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9Q53/R1/TR1-J Page 7/9 Soldering Iron: Basic spec is ≦5 sec when 260℃. If temperature is higher, time should be shorter(+10 ℃ → -1sec). Power dissipation of iron should be smaller than 15W,and temperature should be controllable. Surface temperature of the device should be under 230 ℃. Soldering heat Soldering heat Max. 260 ℃ 245±5℃ within 5 sec 120 ~ 150 ℃ Preheat 120 ~ 180 sec Reflow Temp/Time Temp. (℃) 220 Rising +5 ℃/sec 150 Cooling -5℃/sec Preheat 120 60 ~ 120 sec 5sec Time LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9Q53/R1/TR1-J Page 8/9 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/9 PART NO. LRGB9Q53/R1/TR1-J Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta=65 ℃±5 ℃ 3.RH=90 %~95% 4.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 Endurance Test 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃±5℃& -40 ℃±5℃ (10min) (10min) 3.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell Time= 10 ±1sec. MIL-STD-202F: 210A MIL-STD-750D: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=235 ℃±5 ℃ 2.Immersion time 2 ±0.5sec 3.Immersion rate 25 ±2.5mm/sec 4.Immersion rate 25 ±2.5mm/sec 5.Coverage ≧95% of the dipped surface MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 1.105 ℃ ~ 25 ℃ ~ 55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Ramp-up rate(183 ℃ to Peak) +3 ℃ second max Temp. maintain at 125( ±25)℃ 120 seconds max Temp. maintain above 183 ℃ 60-150 seconds Peak temperature range 235 ℃+5-0 ℃ Time within 5 ℃ of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate +6 ℃/second max MIL-STD-750D:2031.2 J-STD-020 Thermal Shock Test Environmental Test Temperature Cycling Solderability Test