LIGITEK LSD355-6SBKS-XX-S3

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SINGLE DIGIT LED DISPLAY (0.39Inch)
Pb
Lead-Free Parts
LSD355/6SBKS-XX/S3
DATA SHEET
DOC. NO
: QW0905- LSD355/6SBKS-XX/S3
REV.
: A
DATE
: 03 - Jun.-2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/6SBKS-XX/S3
Page 1/8
Package Dimensions
LSD355/6SBKS-XX/S3
LIGITEK
PIN NO.1
7.0(0.275")
9.85(0.39")
7.62
12.9
(0.506")
10.0
(0.394")
ψ1.2
11.0±0.5
3.38±0.5
0.45
TYP.
7.62
(0.3")
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
2.54X4=
10.16
(0.4")
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/6SBKS-XX/S3
Page 2/8
Internal Circuit Diagram
LSD355SBKS-XX/S3
3,8
A B
10 9
C D
7
5
E
F
4
2
G DP
1
6
LSD356SBKS-XX/S3
3,8
A B
10 9
C D
7
5
E
F
4
2
G DP
1
6
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LSD355/6SBKS-XX/S3
Electrical Connection
PIN NO.1
LSD355SBKS-XX/S3
PIN NO.1
LSD356SBKS-XX/S3
1
Anode G
1
Cathode G
2
Anode F
2
Cathode F
3
Common Cathode
3
Common Anode
4
Anode E
4
Cathode E
5
Anode D
5
Cathode D
6
Anode DP
6
Cathode DP
7
Anode C
7
Cathode C
8
Common Cathode
8
Common Anode
9
Anode B
9
Cathode B
10
Anode A
10
Cathode A
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/6SBKS-XX/S3
Page 4/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
SBKS
Forward Current Per Chip
IF
30
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
100
mA
Power Dissipation Per Chip
PD
120
mW
Ir
50
μA
Electrostatic Discharge( * )
ESD
500
V
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Part Selection And Application Information(Ratings at 25℃)
common
cathode
or
anode
Material Emitted
CHIP
PART NO
△λ
Vf(v)
(nm)
Iv(mcd)
Typ.
Max.
3.5
4.2
IV-M
Min. Typ.
Common
Cathode
LSD355SBKS-XX/S3
475
InGaN/SiC Bule
LSD356SBKS-XX/S3
Electrical
λD
(nm)
26
Common
Anode
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
7.2
12.8
2:1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/6SBKS-XX/S3
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
λD
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Dominant Wavelength
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/6SBKS-XX/S3
Page 6/8
Typical Electro-Optical Characteristics Curve
SBK-S CHIP
Fig.2 Relative Intensity vs. Forward Current
30
1.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
25
20
15
10
5
0
1
2
3
4
1.25
1.0
0.75
0.5
0.25
0
5
0
5
Relative Intensity@20mA
Forward Current@20mA
40
30
20
10
0
50
75
Ambient Temperature( ℃)
20
25
30
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Temperature
25
15
Forward Current(mA)
Forward Voltage(V)
0
10
100
1.0
0.5
0
380
430
480
530
580
Wavelength (nm)
630
680
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/6SBKS-XX/S3
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 °C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260 °C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/6SBKS-XX/S3
Page 8/8
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11