LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LSGM13733 DATA SHEET DOC. NO : QW0905- LSGM13733 REV. : A DATE : 11 - Jul. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/5 PART NO. LSGM13733 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LSGM13733 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SGM Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 100 mW Ir 50 μA Electrostatic Discharge( * ) ESD 1000 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted LSGM13733 Luminous Peak Dominant Spectral Forward Viewing wave intensity angle wave halfwidth voltage length @20 mA(mcd) 2θ 1/2 @20mA(V) length △λ nm λP nm λD nm (deg) Lens InGaN/SiC Green Water Clear Typ. Max. Min. Typ. 518 525 35 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.2 700 1100 40 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 PART NO. LSGM13733 Typical Electro-Optical Characteristics Curve SGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Forward Current vs. Relative Intensity 2.5 Forward Current(mA) Forward Current(mA) 30 20 10 2.0 1.5 1.0 0.5 0.0 0 1.0 1.5 2.5 2.0 3.0 3.5 4.0 0 10 Relative Intensity@20mA Normalize @25℃ Forward Current@20mA 60 50 40 30 20 10 0 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) 50 2.0 1.5 1.0 0.5 0.0 20 30 40 50 Ambient Temperature( ℃) Ambient Temperature( ℃) 450 40 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Current vs. Temperature 20 30 Relative Intensity Normalize @20mA Forward Voltage(V) 0 20 600 60 70 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM13733 Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 50 100 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM13733 Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11