LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LSGM3333-PF DATA SHEET DOC. NO : QW0905- LSGM3333-PF REV. : A DATE : 23 - May - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 1/5 Package Dimensions 5.0 5.9 7.6 8.6 1.5 MAX 25.0MIN □0.5 TYP 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LSGM3333-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SGM Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 100 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 1000 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted Luminous Peak Dominant Spectral Forward wave intensity wave halfwidth voltage length length △λ nm @20mA(V) @20mA(mcd) λ P nm λD nm Lens LSGM3333-PF InGaN/SiC Green Water Clear Typ. Max. Min. 518 525 35 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Viewing angle 2θ 1/2 (deg) Typ. 4.2 1500 2700 12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 PART NO. LSGM3333-PF Typical Electro-Optical Characteristics Curve SGM CHIP Fig.2 Forward Current vs. Relative Intensity Fig.1 Forward current vs. Forward Voltage 2.5 Forward Current(mA) Forward Current(mA) 30 20 10 2.0 1.5 1.0 0.5 0.0 0 1.0 1.5 2.5 2.0 3.0 3.5 0 4.0 10 60 50 40 30 20 10 0 40 80 60 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 500 550 Wavelength (nm) 50 2.0 1.5 1.0 0.5 0.0 20 30 40 50 Ambient Temperature( ℃) Ambient Temperature( ℃) 0.0 450 40 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Current@20mA Fig.3 Forward Current vs. Temperature 20 30 Relative Intensity Normalize @20mA Forward Voltage(V) 0 20 600 60 70 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 4/5 Wave soldering Profile Temp(°C) 245° C 5sec Max 245° 5°/sec max 120° 25° 3°/sec max Soldering Soldering Iron:30W Max Temperature 300 ° C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Dip Soldering Preheat: 120 °C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3° C/sec(max) Ramp-Down:-5 ° C/sec(max) Solder Bath:245 °C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) Preheat 120 Seconds Max Wave Soldering Profile (Pb Free) Temp(°C) 265°C 5sec Max 265° 5°/sec max 140° 25° Soldering Soldering Iron:30W Max Temperature:350 °CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) 3° /sec max Preheat 120 Seconds Max Dip Soldering Preheat: 140°C Max Preheat time: 120seconds Max Time(sec) Ramp-up 3°C/sec(max) Ramp-Down:-5 ° C/sec(max) Solder Bath:265 ° C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGM3333-PF Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 PACKING SPECIFICATION 1. 500PCS / BAG 2. 10 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W : N, , W G, S PC s g k s kg H