Data Sheet June 29, 2009 EHW015A0A Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Features RoHS Compliant Applications Distributed Power Architectures Wireless Network Infrastructure Access and Optical Network Equipment Enterprise Networks, including Power over Ethernet (PoE) Options Negative Remote On/Off logic Over current/Over temperature/Over voltage protections (Auto-restart) Surface Mount version (-S) Compliant to RoHS EU Directive 2002/95/EC (-Z versions) Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) High efficiency 92% at 5.0V full load (Vin=48Vdc) Industry standard, DOSA compliant footprint 58.4mm x 22.8mm x 7.77mm (2.30 in x 0.9 in x 0.306 in) Low profile height and reduced component skyline Wide input voltage range: 36-75 Vdc Tightly regulated output Constant switching frequency Positive remote On/Off logic Input under/over voltage protection Output overcurrent and overvoltage protection Over-temperature protection Remote sense No reverse current during output shutdown Output Voltage adjust: 90% to 112% of Vo,nom Wide operating temperature range (-40°C to 85°C) Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module UL*Recognized to UL60950-1, CAN/CSA† C22.2 No.60950-1, and EN60950-1(VDE ‡ 0805-1) Licensed CE mark meets 2006/95/EC directive Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1 2250 Vdc Isolation tested in compliance with IEEE ¤ 802.3 PoE standards ISO 9001 and ISO 14001 certified manufacturing facilities § ** Description The EHW015A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 15A of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN = 36 75Vdc). The modules achieve typical full load efficiency of 92%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards Document No: DS08-003 ver. 1.01 PDF name: ehw015_ds.pdf Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Continuous All VIN -0.3 80 Vdc Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc All TA -40 85 °C Storage Temperature All Tstg -55 125 °C I/O Isolation voltage (100% factory Hi-Pot tested) All ⎯ ⎯ 2250 Vdc Input Voltage Operating Ambient Temperature (see Thermal Considerations section) Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Operating Input Voltage Maximum Input Current (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current (VIN = VIN, nom, IO = 0, module enabled) Input Stand-by Current Device Symbol Min Typ Max Unit All VIN 36 48 75 Vdc All IIN,max 2.75 3.0 Adc All IIN,No load 70 IIN,stand-by 2.5 All (VIN = VIN, nom, module disabled) 2 It mA 5.0 mA 0.5 As 2 Inrush Transient All Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) All 20 mAp-p Input Ripple Rejection (120Hz) All 65 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. LINEAGE POWER 2 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit All VO, set 4.90 5.0 5.10 Vdc All VO 4.85 ⎯ 5.15 % VO, set All All All ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ±0.2 ±0.2 ±0.2 % VO, set % VO, set % VO, set All ⎯ 15 25 mVrms All ⎯ 40 75 mVpk-pk Nominal Output Voltage Set-point VIN=VIN, min, IO=IO, max, TA=25°C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance All CO 500 ⎯ 4,700 μF Output Current Output Current Limit Inception (Hiccup Mode ) (VO= 90% of VO, set) Output Short-Circuit Current (VO≤250mV) ( Hiccup Mode ) Efficiency All IO 0 ⎯ 15 Adc All IO, lim 105 120 130 % Io All IO, s/c 5 Arms VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set All η 92.0 % VIN= VIN, nom, TA=25°C, IO=0.5IO, max , VO= VO,set All η 90.0 % All fsw 400 kHz All Vpk ⎯ 2 ⎯ % VO, set All ts ⎯ 200 ⎯ μs All Vpk ⎯ 2 ⎯ % VO, set All ts ⎯ 200 ⎯ μs Unit Switching Frequency Dynamic Load Response (dIo/dt=0.1A/μs; VIN = VIN, nom; TA=25°C, Co=Co,min) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) (dIo/dt=1.0A/μs; VIN = VIN, nom; TA=25°C, Co=Co,min) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) Isolation Specifications Parameter Device Symbol Min Typ Max Isolation Capacitance All Ciso ⎯ 2000 ⎯ pF Isolation Resistance All Riso 100 ⎯ ⎯ MΩ I/O Isolation Voltage (100% factory Hi-pot tested) All All ⎯ ⎯ 2250 Vdc Device Symbol Min Typ Max All FIT 244.1 10 /Hours All MTBF 4,097,359 Hours General Specifications Parameter Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm, 90% confidence) Weight (Open Frame) All ⎯ Weight (with Heatplate) All ⎯ LINEAGE POWER 19 (0.67) 31 (1.09) Unit 9 ⎯ ⎯ g (oz.) g (oz.) 3 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off ⎯ 0.3 1.0 mA Logic Low - On/Off Voltage All Von/off -0.7 ⎯ 1.2 Vdc Logic High Voltage – (Typ = Open Collector) All Von/off ⎯ 5 Logic High maximum allowable leakage current All Ion/off ⎯ ⎯ 10 μA All Tdelay ― ― 50 msec All Tdelay ― ― 50 msec All Trise ― 5 12 msec ― 3 % VO, set Vdc Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25 C) Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = from instant at which VIN=VIN, min until VO = 10% of VO, ) Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (Tdelay from instant at which VIN = VIN, min until Vo=10% of VO,set) Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) Output voltage overshoot – Startup o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C All Remote Sense Range All Output Voltage Adjustment Range All VSENSE 90 10 % VO, set 112 % VO, set Vdc Output Overvoltage Protection All VO, limit 5.75 ⎯ 7.0 Overtemperature Protecdtion – Hiccup Auto Restart All Tref ⎯ 130 ⎯ O Input Undervoltage Lockout All VUVLO Vdc C Turn-on Threshold ⎯ 33 36 Turn-off Threshold 27 28 ⎯ Vdc Hysterisis 3 5.5 ⎯ Vdc LINEAGE POWER 4 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Characteristic Curves o 88 85 Vin=75V 82 Vin=48V 79 Vin=36V 76 73 70 0 3 6 9 12 15 VO (V) (100mV/div) EFFICIENCY, η (%) 91 Io(A) (5A/div) 94 OUTPUT CURRENT OUTPUT VOLTAGE The following figures provide typical characteristics for the EHW015A0A (5.0V, 15A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT, IO (A) TIME, t (200µs/div) OUTPUT VOLTAGE VOn/Off (V) (5V/div) VO (V) (2V/div) Figure 4. Transient Response to 1.0A/µS Dynamic Load Change from 50% to 75% to 50% of full load (VIN = VIN,NOM). On/Off VOLTAGE VO (V) (20mV/div) OUTPUT VOLTAGE Figure 1. Converter Efficiency versus Output Current. TIME, t (20ms/div) INPUT VOLTAGE VIN (V) (20V/div) OUTPUT VOLTAGE VO (V) (2V/div) Io(A) (5A/div) VO (V) (100mV/div) Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = VIN,NOM, Io = Io,max). OUTPUT CURRENT OUTPUT VOLTAGE TIME, t (2μs/div) Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Io,max). TIME, t (200µs/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load (VIN = VIN,NOM). LINEAGE POWER TIME, t (20ms/div) Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Io = Io,max). 5 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE LTES T Vin+ BATTERY 12μH CS 33-100μF 220μF E.S.R.<0.1Ω @ 20°C 100kHz Safety Considerations Vin- NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12μH. Capacitor C S offsets possible battery impedance. Measure current as shown above. Figure 7. Input Reflected Ripple Current Test Setup. COPPER STRIP V O (+) RESISTIVE LOAD 1uF 10uF SCOPE V O (– ) GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 8. Output Ripple and Noise Test Setup. Rdistribution Rcontact Rcontact Vin+ Rdistribution RLOAD VO Rcontact Rcontact Vin- Rdistribution Vout+ VIN Rdistribution Vout- NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 9. Output Voltage and Efficiency Test Setup. VO. IO Efficiency η = LINEAGE POWER VIN. IIN x 100 % The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7, a 33-100μF electrolytic capacitor (ESR<0.7Ω at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE0805-1(IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness. For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead. 6 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Feature Description Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. Vin+ Vout+ increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). SENSE(+) SENSE(–) SUPPLY II VI(+) VO(+) VI(-) VO(–) CONTACT RESISTANCE Ion/off IO LOAD CONTACT AND DISTRIBUTION LOSSE ON/OFF TRIM Von/off Figure 11. Circuit Configuration for remote sense . Input Undervoltage Lockout Vin- Vout- Figure 10. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the typical maximum Von/off generated by the module is 15V, and the maximum allowable leakage current at Von/off = 5V is 1μA. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-). Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be LINEAGE POWER At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. Overtemperature Protection To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point Tref (Figure 13), exceeds 130oC (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature. Output Overvoltage Protection The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be 7 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Feature Descriptions (continued) restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% IO, max. Output Voltage Programming Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin. determines the required external resistor value to obtain a percentage output voltage change of Δ%: ⎤ ⎡ 5.11 × Vo , set × (100 + Δ %) 511 Rtrim − up = ⎢ − − 10 .22 ⎥ ΚΩ 1 . 225 % % × Δ Δ ⎦ ⎣ Where ⎛V − V o , set Δ % = ⎜⎜ desired V o , set ⎝ ⎞ ⎟ × 100 ⎟ ⎠ For example, to trim-up the output voltage of the module by 5% to 5.25V, Rtrim-up is calculated is as follows: Δ% = 5 R trim − up ⎡ 5 . 11 × 5 . 0 × (100 + 5 ) 511 ⎤ =⎢ − − 10 . 22 ⎥ ΚΩ 1 . 225 × 5 5 ⎣ ⎦ Rtrim − up = 325 .6 ΚΩ VIN(+) VO(+) Rtrim-up ON/OFF LOAD VOTRIM Rtrim-down VIN(-) VO(-) Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the VO(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of Δ% R trim − down ⎡ 511 ⎤ = ⎢ − 10 . 22 ⎥ ΚΩ ⎣ Δ% ⎦ Where Δ % = ⎛⎜ V o , set − V desired ⎜ V o , set ⎝ ⎞ ⎟ × 100 ⎟ ⎠ For example, to trim-down the output voltage of the module by 8% to 4.6V, Rtrim-down is calculated as follows: Δ% = 8 ⎡ 511 ⎤ Rtrim − down = ⎢ − 10 .22 ⎥ ΚΩ ⎣ 8 ⎦ R trim − down = 53 . 6 ΚΩ Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equation LINEAGE POWER The voltage between the VO(+) and VO(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage setpoint adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = VO,set x IO,max). Thermal Considerations The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference point, Tref used in the specifications for open frame modules is shown in Figure 13. For reliable operation this temperature should not exceed 117oC. The thermal reference point, Tref used in the specifications for modules with heatplate is shown in Figure 14. For reliable operation this temperature o should not exceed 105 C. 8 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figures 16 -19. Thermal Considerations (continued) AIRFLOW Figure 13. Tref Temperature Measurement Location for Open Frame Module. OUTPUT CURRENT, IO (A) 16 14 12 10 3.0 m/s (600 LFM) 2.0 m/s (400 LFM) 1.0 m/s (200 LFM) 0.5 m/s (100 LFM) 8 6 4 2 NC 0 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. AIRFLOW Figure 14. Tref Temperature Measurement Location for Module with Heatplate. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by the open frame module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figure 15. OUTPUT CURRENT, IO (A) 16 14 12 10 3.0 m/s (600 LFM) 2.0 m/s (400 LFM) 1.0 m/s (200 LFM) 0.5 m/s (100 LFM) 8 6 4 2 NC 0 20 40 50 60 70 80 90 o Figure 17. Output Current Derating for the Module with Heatplate and 0.25 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. 14 12 10 3.0 m/s (600 LFM) 8 16 2.0 m/s (400 LFM) 6 1.0 m/s (200 LFM) 4 0.5 m/s (100 LFM) 2 NC 0 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. For additional power, the module is available with an optional heatplate (-H), that allows for the use of heat sinks to improve the thermal derating. Derating curves showing the maximum output current that can be delivered by the heatplate module with different heat sink heights versus local ambient temperature (TA) for LINEAGE POWER OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) 30 AMBIENT TEMEPERATURE, TA ( C) 16 14 12 10 3.0 m/s (600 LFM) 2.0 m/s (400 LFM) 1.0 m/s (200 LFM) 0.5 m/s (100 LFM) 8 6 4 2 NC 0 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 18. Output Current Derating for the Module with Heatplate and 0.5 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. 9 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Thermal Considerations (continued) Surface Mount Information OUTPUT CURRENT, IO (A) 16 Pick and Place 14 The EHW015A0A-S modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures o of up to 300 C. The label also carries product information such as product code, serial number and the location of manufacture. 12 10 2.0 m/s (400 LFM) 1.0 m/s (200 LFM) 0.5 m/s (100 LFM) 8 6 4 NC 2 0 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Please refer to the Application Note “Thermal Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. Figure 23. Pick and Place Location. Heat Transfer via Conduction Nozzle Recommendations The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown in Figure 20. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 21. The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. The surface mountable modules in the EHW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 24 shows the new CP connector before and after reflow soldering onto the end-board assembly. Figure 20. Cold Wall Mounting OUTPUT CURRENT, IO (A) 16 14 12 EHW B oa rd 10 8 6 In su lato r 4 So lde r Ba ll 2 20 30 40 50 60 70 80 90 End assem bly P CB o COLDPLATE TEMEPERATURE, TC ( C) Figure 21. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; Vin=48V. LINEAGE POWER Figure 24. Column Pin Connector Before and After Reflow Soldering . 10 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current REFLOW TIME (S) Surface Mount Information (continued) The EHW015A0A power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak o reflow temperatures are limited to less than 235 C. o Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. 230 225 220 215 210 205 200 0 10 20 30 40 50 60 Lead Free Soldering The –Z version of the EHW015A0A modules are leadfree (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect longterm reliability. Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 27. MSL Rating The EHW015A0A modules have a MSL rating of 2. 300 P eak Temp 235oC 250 REFLOW TEMP (°C) 235 Figure 26. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process Tin Lead Soldering 200 240 MAX TEMP SOLDER (°C) The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag/Cu (SAC) solder for –Z codes. The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. Figure 25. Reflow Profile for Tin/Lead (Sn/Pb) process. Heat zo ne max 4oCs -1 Storage and Handling Co o ling zo ne 1-4oCs -1 150 100 50 So ak zo ne 30-240s P reheat zo ne max 4oCs -1 Tlim above 205oC The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is 0 LINEAGE POWER 11 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Surface Mount Information (continued) broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). Through-Hole Lead-Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3°C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210°C. For Pb solder, the recommended pot temperature is 260°C, while the Pb-free solder pot is 270°C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details. 300 Per J-STD-020 Rev. C Peak Temp 260°C Reflow Temp (°C) 250 200 * Min. Time Above 235°C 15 Seconds 150 Heating Zone 1°C/Second Cooling Zone *Time Above 217°C 60 Seconds 100 50 0 Reflow Time (Seconds) Figure 27. Recommended linear reflow profile using Sn/Ag/Cu solder. LINEAGE POWER 12 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current EMC Considerations The circuit and plots in Figure 28 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Level [dBµV] 80 70 60 50 x 40 x x x x 30 20 10 0 150k x x MES MES Level 300k 500k 1M 2M 3M 4M 5M Frequency [Hz] CE0526091159_fin CE0526091159_pre 7M 10M 30M QP PK [dBµV] 80 70 60 50 + 40 + + + + 30 + 20 10 0 150k + + MES MES 300k 500k 1M 2M 3M 4M 5M Frequency [Hz] CE0526091159_fin CE0526091159_pre 7M 10M 30M AV AV Figure 28. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). LINEAGE POWER 13 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in. ± 0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View† † Bottom side label includes Lineage Power name, product designation and date code. Pin 1 2 3 4 5 6 7 8 LINEAGE POWER Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+) 14 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] + Top side label includes Lineage Power name, product designation and date code. Top View+ Side View Bottom View Pin 1 2 3 4 5 6 7 8 LINEAGE POWER Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+) 15 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View† † Bottom side label includes Lineage Power name, product designation and date code. Pin 1 2 3 4 5 6 7 8 LINEAGE POWER Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+) 16 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] Pin 1 2 3 4 5 6 7 8 Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) LINEAGE POWER 17 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Packaging Details The open frame through hole versions of the EHW015A0A and surface mount versions of the EHW015A0A (suffix –S) are supplied as standard in the plastic trays shown in Figures 28 and 29. Tray Specification Material Max surface resistivity Color Capacity Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box for the EHW015A0A through hole module will contain 2 full trays plus one empty hold down tray giving a total number of 24 power modules; and each shipping box for the EHW015A0A (suffix –S) surface mount module will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules. Antistatic coated PVC 1012Ω/sq Clear 12 power modules Figure 28. Through Hole Packaging Tray Figure 29. Surface Mount Packaging Tray LINEAGE POWER 18 Data Sheet June 29, 2009 EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Ordering Information Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Codes EHW015A0A1 48V (36-75Vdc) Output Voltage 5.0V EHW015A0A41Z 48V (36-75Vdc) 5.0V 15A Negative Through hole CC109141818 EHW015A0A41-HZ 48V (36-75Vdc) 5.0V 15A Negative Through hole CC109146387 EHW015A0A41-SZ 48V (36-75Vdc) 5.0V 15A Negative Surface mount CC109146395 Product Codes Input Voltage Output Current 15A On/Off Logic Negative Connector Type Through hole CC109150587 Comcodes Ratings Table 2. Device Coding Scheme and Options Characteristic Form Factor Family Designator Input Voltage Output Current Output Voltage Pin Length Character and Position E H W W = Wide Input Voltage Range, 36V -75V 015A0 = 015.0 Amps Rated Output Current A = 5.0 Vout Nominal Omit = No Pin Trim 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Omit = Latching Mode 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic 1 = Negative Logic 015A0 A 6 8 Action following Protective Shutdown Options Definition E = Eighth Brick On/Off logic Customer Specific Mechanical Features RoHS 4 1 XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module H H = Heat plate (not available with –S option) S S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used Z Z = RoHS 6/6 Compliant, Lead free Asia-Pacific Headquarters Tel: +65 6416 4283 World Wide Headquarters Lineage Power Corporation 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626) www.lineagepower.com e-mail: [email protected] Europe, Middle-East and Africa Headquarters Tel: +49 898 780 672 80 India Headquarters Tel: +91 80 28411633 Lineage Power reserves the right to m ake changes to t he product(s) or inf ormation contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. © 2008 Lineage Pow er C orporation, (Mesquite, Texas) All I nternational Rights Res erved. Document No: DS08-003 ver. 1.01 PDF name: ehw015_ds.pdf