Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current RoHS Compliant Features Compliant to RoHS EU Directive 2002/95/EC (-Z versions) Compliant to RoHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) Delivers up to 7A output current High efficiency – 92% at 6.5VOUT, full load Small size and low profile: 33.0 mm x 22.9 mm x 8.5 mm (1.30 in x 0.9 in x 0.335 in) Applications Semiconductor Testing Equipment Options Negative Remote On/Off logic Over current/Over temperature/Over voltage protections (latching shutdown) Industry standard DOSA footprint Surface Mount, Tape and Reel (-SR Suffix) Output voltage adjustment trim Remote On/Off Remote Sense No reverse current during output shutdown Over temperature protection (non-latching) Output overcurrent/overvoltage protection (nonlatching) Wide operating temperature range (-40°C to 85°C) Meets the voltage isolation requirements for ETSI 300-132-2 and complies with and is licensed for Basic Insulation rating per EN60950-1 CE mark meets 73/23/EEC and 93/68/EEC directives§ (PENDING APPROVAL) UL* 60950-1Recognized, CSA† C22.2 No. ‡ 60950-1-03 Certified, and VDE 0805:2001-12 (EN60950-1) Licensed ISO** 9001 and ISO 14001 certified manufacturing facilities Description The KE007 (Sixteenth-brick) series power modules are isolated dc-dc converters that operate over an input voltage range of 43.2 to 57.6Vdc and provide a single precisely regulated output. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, typical efficiency of 92% for 6.5V/7A output. This open frame modules is available in surface-mount, tape and reeled (-SR) package. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards ‡ Document No: DS06-118 ver. 1.01 PDF name: ke007_ds.pdf Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit S6R5 VIN S6R5 TA -0.3 60 Vdc -40 85 °C Storage Temperature S6R5 Tstg -55 125 °C I/O Isolation voltage (100% factory Hi-Pot tested) S6R5 ⎯ ⎯ 1500 Vdc Input Voltage Continuous Operating Ambient Temperature (see Thermal Considerations section) Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min 43.2 Typ Max Unit Operating Input Voltage S6R5 VIN 48 57.6 Vdc Maximum Input Current S6R5 IIN,max 1.7 2.0 Adc S6R5 IIN,No load 55 mA S6R5 IIN,stand-by 35 mA Inrush Transient S6R5 It Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) S6R5 Input Ripple Rejection (120Hz) S6R5 (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current (VIN = VIN, nom, IO = 0, module enabled) Input Stand-by Current (VIN = VIN, nom, module disabled) EMC, EN55022 2 0.1 30 50 60 2 As mAp-p 100 dB See EMC Considerations section CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. LINEAGE POWER 2 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Electrical Specifications (continued) Parameter Output Voltage Set-point Device Symbol Min Typ Max Unit S6R5 VO, set 6.40 6.50 6.60 Vdc S6R5 VO 6.30 ⎯ 6.70 Vdc S6R5 VO,adj 5.20 7.15 Vdc (VIN=VIN, min, IO=IO, max, TA=25°C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range Selected by an external resistor Output Regulation Line (VIN=VIN, min to VIN, max) S6R5 ⎯ ⎯ 0.1 % VO, set Load (IO=IO, min to IO, max) S6R5 ⎯ ⎯ 0.1 % VO, set Temperature (Tref=TA, min to TA, max) S6R5 ⎯ ⎯ 1.0 % VO, set S6R5 ⎯ ⎯ 25 75 50 150 mVrms mVpk-pk Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance S6R5 CO, max 0 ⎯ 10,000 μF Output Current S6R5 IO 0 ⎯ 7 Adc S6R5 IO, lim 8.05 8.4 8.75 Adc S6R5 IO, s/c ⎯ 3 ⎯ Arms S6R5 η S6R5 fsw 190 200 235 kHz Peak Deviation S6R5 Vpk ⎯ 130 ⎯ mV Settling Time (Vo<10% peak deviation) S6R5 ts ⎯ 200 ⎯ μs Load Change from Io= 50% to 75% or 25% to 50% of Io,max; Peak Deviation S6R5 Vpk ⎯ 130 ⎯ mV Settling Time (Vo<10% peak deviation) S6R5 ts ⎯ 200 ⎯ μs Output Current Limit Inception (Hiccup Mode ) (VO= 90% of VO, set) Output Short-Circuit Current (VO≤250mV) ( Hiccup Mode ) Efficiency VIN= VIN, nom, TA=25°C IO=IO, max , VO= VO,set Switching Frequency 92.0 % Dynamic Load Response (dIo/dt=0.1A/μs; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max; (dIo/dt=1A/μs; VIN = VIN, nom; TA=25°C) LINEAGE POWER 3 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Isolation Specifications Parameter Device Symbol Min Typ Max Isolation Capacitance S6R5 Isolation Resistance S6R5 I/O Isolation Voltage S6R5 Unit Ciso ⎯ 1000 ⎯ pF Riso 10 ⎯ ⎯ MΩ ⎯ ⎯ 1500 Vdc Min Typ Max Unit General Specifications Parameter Device Calculated MTBF Based upon Telcordia SR-332 Issue 1: Method 1 Case 3, (IO=80%IO, max, TA=40°C, Airflow = 200 lfm) S6R5 Powered Random Vibration (VIN=VIN, min, IO=IO, max, TA=25°C, 0 to 5000Hz, 10Grms) S6R5 Weight S6R5 1,400,450 Hours 90 Minutes 11.3 (0.4) ⎯ g (oz.) ⎯ Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit mA Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current S6R5 Ion/off ⎯ ⎯ 1.0 Logic Low - On/Off Voltage S6R5 Von/off -0.7 ⎯ 1.2 V Logic High Voltage – (Typ = Open Collector) S6R5 Von/off ⎯ 5 V Logic High maximum allowable leakage current S6R5 Ion/off ⎯ ⎯ 10 μA S6R5 Tdelay ― 15 20 msec Case 2: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = from instant at which VIN=VIN, min until VO = 10% of VO, set). S6R5 Tdelay ― 3 5 msec Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) S6R5 Trise ― 5 10 msec ― 6.7 Vdc 0.65 Vdc ⎯ 8.5 V Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25 C) Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (delay from instant at which VIN = VIN, min until Vo=10% of Vo,set) Output voltage overshoot – Startup o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Remote Sense Range S6R5 Output Overvoltage Protection S6R5 VO, limit Turn-on Threshold S6R5 Vuv/on ⎯ 42 43 V Turn-off Threshold S6R5 Vuv/off 39 40 ⎯ V Hysterisis S6R5 Vhyst 2 ⎯ ⎯ V 7.7 Input Undervoltage Lockout LINEAGE POWER 4 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Characteristic Curves The following figures provide typical characteristics for the KE007A0S6R5 (6.5V, 7A) at 25oC. The figures are identical for either positive or negative remote On/Off logic. 95 8 Vin =43.2V 7 OUTPUT CURRENT, Io (A) EFFICIENCY, η (%) 90 85 Vin =57.6V 80 Vin =48.0V 75 70 0 1 2 3 4 5 6 7 LINEAGE POWER 2 2.0 m/s (400 LFM) 1 0 30 40 50 60 70 O AMBIENT TEMPERATURE, TA C 80 90 On/Off VOLTAGE VOn/off (V) (5V/div) VO (V) (2V/div) OUTPUT VOLTAGE VIN (V) (20V/div) Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = VIN,NOM, Io = Io,max). INPUT VOLTAGE TIME, t (100 μs /div) Figure 3. Transient Response to Dynamic Load Change from 75% to 50% to 75% of full load. 1.0 m/s (200 LFM) 3 TIME, t (5ms/div) VO (V) (2V/div) VO (V) (100mV/div) Io (A) (2A/div) OUTPUT CURRENT, OUTPUT VOLTAGE Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Io,max). 0.5 m/s (100 LFM) 4 Figure 4. Derating Output Current versus Local Ambient Temperature and Airflow. OUTPUT VOLTAGE VO (V) (20mV/div) OUTPUT VOLTAGE TIME, t (1μs/div) NC 5 20 OUTPUT CURRENT, IO (A) Figure 1. Converter Efficiency versus Output Current. 6 TIME, t (5ms/div) Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Io = Io,max). 5 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE LTEST Vin+ BATTERY 12μH CS 220μF 33μF E.S.R.<0.1Ω @ 20°C 100kHz Vin- Safety Considerations NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12μH. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 7. Input Reflected Ripple Current Test Setup. COPPER STRIP VO (+) RESISTIVE LOAD SCOPE V O (–) 0.1uF 10uF GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 8. Output Ripple and Noise Test Setup. Rdistribution Rcontact Rcontact Vin+ Rdistribution RLOAD VO Rcontact Rcontact Vin- Rdistribution Vout+ VIN Rdistribution Vout- NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 9. Output Voltage and Efficiency Test Setup. VO. IO Efficiency η = LINEAGE POWER VIN. IIN x 100 % The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 33μF electrolytic capacitor (ESR<0.1Ω at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA C22.2 No. 6095000, and VDE 0805:2001-12 (IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness. For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 5 A time-delay fuse in the ungrounded lead. 6 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Feature Description Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. Vin+ Vout+ SENSE(+) SENSE(–) SUPPLY II VI(+) VO(+) VI(-) VO(–) CONTACT RESISTANCE IO LOAD CONTACT AND DISTRIBUTION LOSSES Figure 11. Circuit Configuration for remote sense . Ion/off ON/OFF TRIM Von/off Vin- increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). Vout- Figure 10. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the typical maximum Von/off generated by the module is 15V, and the maximum allowable leakage current at Von/off = 5V is 1μA. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-). Input Undervoltage Lockout At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. Overtemperature Protection To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point Tref (Figure 13), exceeds 135oC (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature. Remote Sense Output Overvoltage Protection Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would LINEAGE POWER Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off 7 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current For increasing the output voltage: Feature Descriptions (continued) following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% IO, max. Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin. VO(+) Rtrim-up ON/OFF LOAD VOTRIM Rtrim-down VIN(-) VO(-) Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the Vo(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of Δ% For decreasing the output voltage: ⎡ 511 ⎤ R trim − down = ⎢ − 10 . 22 ⎥ ΚΩ ⎣ Δ% ⎦ Where Δ % = ⎛⎜ V o , set − V desired ⎜ V o , set ⎝ For example, to trim-up the output voltage by 5% to 6.825V, Rtrim-up is calculated is as follows: Δ% = 5 ⎡ 5 .11 × 1 . 2 × (100 + 5 ) 511 ⎤ − − 10 .22 ⎥ ΚΩ R trim − up = ⎢ 0 .6 × 5 5 ⎣ ⎦ Rtrim − up = 102 .2 ΚΩ Output Voltage Programming VIN(+) ⎡ 5.11 × Vo , set × (100 + Δ %) 511 ⎤ − − 10 .22 ⎥ ΚΩ Rtrim − up = ⎢ Δ% 1.225 × Δ % ⎣ ⎦ ⎞ ⎟ × 100 ⎟ ⎠ The voltage between the Vo(+) and Vo(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). Thermal Considerations The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference point, Tref used in the specifications is shown in Figure 13. For reliable operation this temperature should not exceed 120oC. For example, to trim-down the output voltage by 8% to 5.98V, Rtrim-down is calculated as follows: Δ% = 8 ⎡ 511 ⎤ Rtrim − down = ⎢ − 10 .22 ⎥ ΚΩ ⎣ 8 ⎦ R trim − down = 53 . 655 ΚΩ Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equations determine the required external resistor value to obtain a percentage output voltage change of Δ%: LINEAGE POWER Figure 13. Tref Temperature Measurement Locations. 8 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current EMC Considerations The KE series modules are designed to meet the conducted emission limits of EN55022 class A with no filter at the input of the module. The module shall also meet limits of EN55022 Class B with a recommended single stage filter. Figure 14 and 15 show EMC performance for the KW015A0F module, which is a very similar code to the KE007. Please contact your Lineage Power Sales Representative for further information. product information such as product code, serial number and the location of manufacture. Level [dBµV] 80 70 60 50 40 30 20 Figure 16. Pick and Place Location. 10 0 150k 300k 500k 1M 2M Frequency [Hz] 3M 5M 7M 10M 30M Nozzle Recommendations MES CE0921041009_pre PK LIM EN 55022A V QP Voltage QP Limit The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. Figure 14. KW015A0F Quasi Peak Conducted Emissions with EN 55022 Class A limits, no external filter (VIN = VIN,NOM, Io = 0.85 Io,max) Level [dBµV] 80 70 + 60 50 40 30 20 Tin Lead Soldering 10 0 + 150k 300k 500k 1M 2M Frequency [Hz] 3M 5M 7M 10M 30M MES CE0921041009_fin AV MES CE0921041009_pre AV LIM EN 55022A V AV Voltage AV Limit Figure 15. KW015A0F Average Conducted Emissions with EN 55022 Class A limits, no external filter (VIN = VIN,NOM, Io = 0.85 Io,max). Surface Mount Information Pick and Place The KE007 modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow o temperatures of up to 300 C. The label also carries LINEAGE POWER The KE007 power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than o o 235 C. Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For 9 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Surface Mount Information (continued) reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 19. MSL Rating The KE007 modules have a MSL rating of 1. 300 Storage and Handling P eak Temp 235oC REFLOW TEMP (°C) 250 200 The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Co o ling zo ne 1-4oCs -1 Heat zo ne max 4oCs -1 150 So ak zo ne 30-240s 100 50 Tlim above 205oC P reheat zo ne max 4oCs -1 0 REFLOW TIME (S) Figure 17. Reflow Profile for Tin/Lead (Sn/Pb) process Post Solder Cleaning and Drying Considerations 240 MAX TEMP SOLDER (°C) 235 Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). 230 225 220 215 210 205 200 0 10 20 30 40 50 300 60 Per J-STD-020 Rev. C o Figure 18. Time Limit Curve Above 205 C for Tin/Lead (Sn/Pb) process 250 Lead Free Soldering 200 Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). LINEAGE POWER Reflow Temp (°C) The –Z version of the KE007 modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Peak Temp 260°C 150 * Min. Time Above 235°C 15 Seconds Heating Zone 1°C/Second Cooling Zone *Time Above 217°C 60 Seconds 100 50 0 Reflow Time (Seconds) Figure 19. Recommended linear reflow profile using Sn/Ag/Cu solder. 10 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Mechanical Outline for Surface Mount Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] Top View Side View Bottom View PIN FUNCTION 1 VIN(+) 2 On/Off 3 VIN(-) 4 Vo(-) 5 Sense(-) 6 Trim 7 Sense(+) 8 Vo(+) LINEAGE POWER 11 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] SMT Recommended Pad Layout (Component Side View) Packaging Details Tape Dimensions Dimensions are in millimeters and [inches]. The Sixteenth-brick SMT versions are supplied in tape & reel as standard. Details of tape dimensions are shown above. Modules are shipped in quantities of 140 modules per reel. LINEAGE POWER 12 Data Sheet March 26, 2008 KE007A0S6R5-SR (Sixteenth-Brick) Power Modules: 43.2 – 57.6Vdc Input; 6.5Vdc Output; 7.0A Output Current Ordering Information Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Code Product Codes Input Voltage KE007A0S6R541-SR 48V (43.2-57.6Vdc) Output Voltage 6.5V Output Current 7A On/Off Logic Negative Connector Type Surface mount Comcode CC109125275 -Z Indicated RoHS Compliant Modules Table 2. Device Options Option* Negative remote on/off logic Auto Re-start (for Over Current / Over voltage Protections) Surface mount connections (Tape & Reel) Suffix** 1 4 -SR Asia-Pacific Headquarters Tel: +65 6416 4283 World Wide Headquarters Lineage Power Corporation 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626) www.lineagepower.com e-mail: [email protected] Europe, Middle-East and Africa Headquarters Tel: +49 89 6089 286 India Headquarters Tel: +91 80 28411633 Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. © 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved. Document No: DS06-118 ver. 1.01 PDF name: ke007_ds.pdf